Design for Reliability: PCBs - DfR Solutions

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Instructor Biography• Cheryl Tulkoff has over 22 years of experience in electronics manufacturing with an emphasis onfailure analysis and reliability. She has worked throughout the electronics manufacturing life cyclebeginning with semiconductor fabrication processes, into printed circuit board fabrication andassembly, through functional and reliability testing, and culminating in the analysis and evaluation offield returns. She has also managed no clean and RoHS-compliant conversion programs and hasdeveloped and managed comprehensive reliability programs.• Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is apublished author, experienced public speaker and trainer and a Senior member of both ASQ andIEEE. She has held leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women InEngineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections. She chaired theannual IEEE ASTR workshop for four years is an ASQ Certified Reliability Engineer and a member ofSMTA and iMAPS.• She has a strong passion for pre-college STEM (Science, Technology, Engineering, and Math) outreachand volunteers with several organizations that specialize in encouraging pre-college students topursue careers in these fields.© 2004 - 2007 2010
Contact Information• Questions?• Contact Cheryl Tulkoff, ctulkoff@dfrsolutions.com,512-913-8624• askdfr@dfrsolutions.com• www.dfrsolutions.com• Connect with me in LinkedIn as well!© 2004 - 2007 2010
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Design for Reliability: PCBsNorth T
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Course OutlineINTRODUCTIONSooIntro
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Why Design for Reliability (DfR)?o
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Physics of Failure DefinitionsoFail
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A Word on Quality, Reliability & Cl
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PCB Materials / Laminate Selectiono
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Laminate DatasheetsooOut-of-plane C
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Glass StyleoooPCB laminates (and pr
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Laminate Properties (cont.)oMore re
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Thermal Parameters and IPC Slash Sh
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PTV Degradation due to Assembly© 2
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PCB Materials: StackupoMaximum stre
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PCB ViasPlated Through Holes© 2004
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How to Design a Reliable PTV?PTH Ar
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PCB Industry PTV Capability95% of I
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IPC TR-579oRound Robin Reliability
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IPC TR-579 (cont.)oDetermine strain
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IPC TR-579 (cont.)o Iteratively cal
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The Effect of Design Parameters (He
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Effect of Design Parameters (cont.)
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Plating (Thickness and Material Pro
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Case Study: Microvia Fill and PTV R
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Plating Mechanical PropertiesoIndus
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Cycles to FailureThe Reality of PTV
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Post-Plating MeasurementsoHardness
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Other Platings (cont.)oS. Neumann,
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Test / Qualify PTVoQualifying PTV i
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Simulation and ModelingoSecond step
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Initial Qualification (PCQR2)oQuali
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Lot QualificationoInterconnect stre
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ConclusionoThe base knowledge and u
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CAF: ExamplesInfluenced by electric
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Strain Flexure Issues & Pad Crateri
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Strain & Flexure: Pad CrateringoCra
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Potential Mitigations to Pad Crater
Page 71 and 72: Pad Geometry• Pad design influenc
Page 73 and 74: Future of Contamination / Cleanline
Page 75 and 76: Failure ModeoWhy do you care about
Page 77 and 78: ECM MechanismsoooSome ECM Mechanism
Page 79 and 80: Nominal Ionic LevelsooooBare printe
Page 81 and 82: Process Material Qualification - SI
Page 83 and 84: Importance of Surface FinishooooThe
Page 85 and 86: Surface Finish Selection Approachoo
Page 87 and 88: Surface Finish Selection GuidelineA
Page 89 and 90: OSP Issues: Plated Through-Hole Fil
Page 91 and 92: Surface Finish Selection GuidelineP
Page 93 and 94: ImAg Trace EtchingSolder maskGalvan
Page 95 and 96: Typical Creep Corrosion• Corrosio
Page 97 and 98: Wetting Force ( mN/mm)Impact of Tar
Page 99 and 100: Immersion Sn (ImSn)• A single mat
Page 103 and 104: ENIG - Ni Interface Issues w/ SACBr
Page 105 and 106: Unreliability, F(t)ENIG: Mechanical
Page 109 and 110: Pb-Free HASL: Ni-modified SnCuoAllo
Page 111 and 112: Newer Finishes to the MarketProduct
Page 113 and 114: Newer Finishes to the MarketProduct
Page 115 and 116: Examples of Best Application Fitsoo
Page 117 and 118: What to do if there is no SF fit?oo
Page 119 and 120: SummaryoooooThe surface finish you
Page 121: ConclusionsoooDesign for Reliabilit
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