Design for Reliability: PCBs - DfR Solutions

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ExampleoAnother example might be the desire to use ENIG <strong>for</strong> aPb-free product where shock is a concern.ooOne solution might be to underfill critical components sensitive toshock (cost adder).Another might be to dampen the shock by better design of theenclosure (possible cost adder).© 2004 - 2007 2010
SummaryoooooThe surface finish you select will have a largeinfluence on quality, reliability and cost.It is a complex decision that impacts many areas ofthe business.Select a finish that optimal <strong>for</strong> the business (and notjust one function).Know that there are engineering tricks to improve onweak areas of each finish.Stay current in this field because new developmentscontinue to be made.© 2004 - 2007 2010
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Design for Reliability: PCBsNorth T
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Course OutlineINTRODUCTIONSooIntro
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Why Design for Reliability (DfR)?o
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Physics of Failure DefinitionsoFail
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A Word on Quality, Reliability & Cl
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PCB Materials / Laminate Selectiono
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Laminate DatasheetsooOut-of-plane C
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Glass StyleoooPCB laminates (and pr
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Laminate Properties (cont.)oMore re
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Thermal Parameters and IPC Slash Sh
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PTV Degradation due to Assembly© 2
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PCB Materials: StackupoMaximum stre
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PCB ViasPlated Through Holes© 2004
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How to Design a Reliable PTV?PTH Ar
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PCB Industry PTV Capability95% of I
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IPC TR-579oRound Robin Reliability
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IPC TR-579 (cont.)oDetermine strain
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IPC TR-579 (cont.)o Iteratively cal
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The Effect of Design Parameters (He
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Effect of Design Parameters (cont.)
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Plating (Thickness and Material Pro
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Case Study: Microvia Fill and PTV R
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Plating Mechanical PropertiesoIndus
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Cycles to FailureThe Reality of PTV
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Post-Plating MeasurementsoHardness
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Other Platings (cont.)oS. Neumann,
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Test / Qualify PTVoQualifying PTV i
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Simulation and ModelingoSecond step
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Initial Qualification (PCQR2)oQuali
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Lot QualificationoInterconnect stre
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ConclusionoThe base knowledge and u
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CAF: ExamplesInfluenced by electric
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Strain Flexure Issues & Pad Crateri
Page 67 and 68: Strain & Flexure: Pad CrateringoCra
Page 69 and 70: Potential Mitigations to Pad Crater
Page 71 and 72: Pad Geometry• Pad design influenc
Page 73 and 74: Future of Contamination / Cleanline
Page 75 and 76: Failure ModeoWhy do you care about
Page 77 and 78: ECM MechanismsoooSome ECM Mechanism
Page 79 and 80: Nominal Ionic LevelsooooBare printe
Page 81 and 82: Process Material Qualification - SI
Page 83 and 84: Importance of Surface FinishooooThe
Page 85 and 86: Surface Finish Selection Approachoo
Page 87 and 88: Surface Finish Selection GuidelineA
Page 89 and 90: OSP Issues: Plated Through-Hole Fil
Page 91 and 92: Surface Finish Selection GuidelineP
Page 93 and 94: ImAg Trace EtchingSolder maskGalvan
Page 95 and 96: Typical Creep Corrosion• Corrosio
Page 97 and 98: Wetting Force ( mN/mm)Impact of Tar
Page 99 and 100: Immersion Sn (ImSn)• A single mat
Page 103 and 104: ENIG - Ni Interface Issues w/ SACBr
Page 105 and 106: Unreliability, F(t)ENIG: Mechanical
Page 109 and 110: Pb-Free HASL: Ni-modified SnCuoAllo
Page 111 and 112: Newer Finishes to the MarketProduct
Page 113 and 114: Newer Finishes to the MarketProduct
Page 115 and 116: Examples of Best Application Fitsoo
Page 117: What to do if there is no SF fit?oo
Page 121 and 122: ConclusionsoooDesign for Reliabilit
Page 123: Contact Information• Questions?
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