Design for Reliability: PCBs - DfR Solutions

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Examples of Best FitsoooImAgooImSnoooFully enclosed hand held electronicsBasic consumer electronics – low power and airflowSimple consumer electronics (not fully enclosed)Simple medical or aerospace applications (1 side)Low to moderate volume peripheral componentsLF HASLooThick LF <strong>PCBs</strong> going into business environments (servers, telecomequipment)Complex Pb-Free medical or aerospace?© 2004 - 2007 2010
What to do if there is no SF fit?ooIf no SF fits your specific requirements, designmodifications may be required and tradeoffs made.For example, I need low cost, high volume, corrosionresistant, with good ICT capability.ooOne solution might be to use ImAg but plug the vias withsoldermask to protect from corrosion (but some cost is sacrificed).Another is to use OSP but implement cleaning to remove fluxresidue <strong>for</strong> probing (cost is again sacrificed).© 2004 - 2007 2010
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Design for Reliability: PCBsNorth T
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Course OutlineINTRODUCTIONSooIntro
Page 5 and 6:
Why Design for Reliability (DfR)?o
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Physics of Failure DefinitionsoFail
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A Word on Quality, Reliability & Cl
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PCB Materials / Laminate Selectiono
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Laminate DatasheetsooOut-of-plane C
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Glass StyleoooPCB laminates (and pr
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Laminate Properties (cont.)oMore re
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Thermal Parameters and IPC Slash Sh
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PTV Degradation due to Assembly© 2
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PCB Materials: StackupoMaximum stre
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PCB ViasPlated Through Holes© 2004
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How to Design a Reliable PTV?PTH Ar
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PCB Industry PTV Capability95% of I
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IPC TR-579oRound Robin Reliability
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IPC TR-579 (cont.)oDetermine strain
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IPC TR-579 (cont.)o Iteratively cal
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The Effect of Design Parameters (He
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Effect of Design Parameters (cont.)
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Plating (Thickness and Material Pro
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Case Study: Microvia Fill and PTV R
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Plating Mechanical PropertiesoIndus
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Cycles to FailureThe Reality of PTV
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Post-Plating MeasurementsoHardness
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Other Platings (cont.)oS. Neumann,
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Test / Qualify PTVoQualifying PTV i
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Simulation and ModelingoSecond step
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Initial Qualification (PCQR2)oQuali
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Lot QualificationoInterconnect stre
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ConclusionoThe base knowledge and u
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CAF: ExamplesInfluenced by electric
Page 65 and 66: Strain Flexure Issues & Pad Crateri
Page 67 and 68: Strain & Flexure: Pad CrateringoCra
Page 69 and 70: Potential Mitigations to Pad Crater
Page 71 and 72: Pad Geometry• Pad design influenc
Page 73 and 74: Future of Contamination / Cleanline
Page 75 and 76: Failure ModeoWhy do you care about
Page 77 and 78: ECM MechanismsoooSome ECM Mechanism
Page 79 and 80: Nominal Ionic LevelsooooBare printe
Page 81 and 82: Process Material Qualification - SI
Page 83 and 84: Importance of Surface FinishooooThe
Page 85 and 86: Surface Finish Selection Approachoo
Page 87 and 88: Surface Finish Selection GuidelineA
Page 89 and 90: OSP Issues: Plated Through-Hole Fil
Page 91 and 92: Surface Finish Selection GuidelineP
Page 93 and 94: ImAg Trace EtchingSolder maskGalvan
Page 95 and 96: Typical Creep Corrosion• Corrosio
Page 97 and 98: Wetting Force ( mN/mm)Impact of Tar
Page 99 and 100: Immersion Sn (ImSn)• A single mat
Page 103 and 104: ENIG - Ni Interface Issues w/ SACBr
Page 105 and 106: Unreliability, F(t)ENIG: Mechanical
Page 109 and 110: Pb-Free HASL: Ni-modified SnCuoAllo
Page 111 and 112: Newer Finishes to the MarketProduct
Page 113 and 114: Newer Finishes to the MarketProduct
Page 115: Examples of Best Application Fitsoo
Page 119 and 120: SummaryoooooThe surface finish you
Page 121 and 122: ConclusionsoooDesign for Reliabilit
Page 123: Contact Information• Questions?
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Design for Reliability: PCBs - DfR Solutions

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