Design for Reliability: PCBs - DfR Solutions

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PCB Materials and Plated Through Via <strong>Reliability</strong>oHistorically, two material properties of concerno Out-of-plane coefficient of thermal expansion (CTE z )o Out-of-plane elastic modulus (‘stiffness’)(E z )oKey Assumption: No exposure to temperatures above theglass transition temperature (Tg)oThe two material properties(CTE and E) are driven bychoices in resin, glass style,and filler© 2004 - 2007 2010
Laminate DatasheetsooOut-of-plane CTE (CTEz) is almost always provided onthe laminate datasheetoSometimes in ppm/C above and below the Tgo Sometimes in % between 50-260C1/E laminate = V epoxy /E epoxy + V fiber /E fiberOut-of-plane modulus (Ez) is almost never provided onthe laminate datasheetoRequires calculation based on in-plane laminate properties,glass fiber properties, glass fiber volume fraction, andRule-of-Mixtures / Halpin-Tsai models© 2004 - 2007 2010
Page 1 and 2: Design for Reliability: PCBsNorth T
Page 3 and 4: Course OutlineINTRODUCTIONSooIntro
Page 5 and 6: Why Design for Reliability (DfR)?o
Page 7 and 8: Physics of Failure DefinitionsoFail
Page 9 and 10: A Word on Quality, Reliability & Cl
Page 11: PCB Materials / Laminate Selectiono
Page 15 and 16: Glass StyleoooPCB laminates (and pr
Page 17 and 18: Laminate Properties (cont.)oMore re
Page 19 and 20: Thermal Parameters and IPC Slash Sh
Page 21 and 22: PTV Degradation due to Assembly© 2
Page 23 and 24: PCB Materials: StackupoMaximum stre
Page 25 and 26: PCB ViasPlated Through Holes© 2004
Page 27 and 28: How to Design a Reliable PTV?PTH Ar
Page 29 and 30: PCB Industry PTV Capability95% of I
Page 31 and 32: IPC TR-579oRound Robin Reliability
Page 33 and 34: IPC TR-579 (cont.)oDetermine strain
Page 35 and 36: IPC TR-579 (cont.)o Iteratively cal
Page 37 and 38: The Effect of Design Parameters (He
Page 39 and 40: Effect of Design Parameters (cont.)
Page 41 and 42: Plating (Thickness and Material Pro
Page 43 and 44: Case Study: Microvia Fill and PTV R
Page 45 and 46: Plating Mechanical PropertiesoIndus
Page 47 and 48: Cycles to FailureThe Reality of PTV
Page 49 and 50: Post-Plating MeasurementsoHardness
Page 51 and 52: Other Platings (cont.)oS. Neumann,
Page 53 and 54: Test / Qualify PTVoQualifying PTV i
Page 55 and 56: Simulation and ModelingoSecond step
Page 57 and 58: Initial Qualification (PCQR2)oQuali
Page 59 and 60: Lot QualificationoInterconnect stre
Page 61 and 62: ConclusionoThe base knowledge and u
Page 63 and 64:
CAF: ExamplesInfluenced by electric
Page 65 and 66:
Strain Flexure Issues & Pad Crateri
Page 67 and 68:
Strain & Flexure: Pad CrateringoCra
Page 69 and 70:
Potential Mitigations to Pad Crater
Page 71 and 72:
Pad Geometry• Pad design influenc
Page 73 and 74:
Future of Contamination / Cleanline
Page 75 and 76:
Failure ModeoWhy do you care about
Page 77 and 78:
ECM MechanismsoooSome ECM Mechanism
Page 79 and 80:
Nominal Ionic LevelsooooBare printe
Page 81 and 82:
Process Material Qualification - SI
Page 83 and 84:
Importance of Surface FinishooooThe
Page 85 and 86:
Surface Finish Selection Approachoo
Page 87 and 88:
Surface Finish Selection GuidelineA
Page 89 and 90:
OSP Issues: Plated Through-Hole Fil
Page 91 and 92:
Surface Finish Selection GuidelineP
Page 93 and 94:
ImAg Trace EtchingSolder maskGalvan
Page 95 and 96:
Typical Creep Corrosion• Corrosio
Page 97 and 98:
Wetting Force ( mN/mm)Impact of Tar
Page 99 and 100:
Immersion Sn (ImSn)• A single mat
Page 101 and 102:
Page 103 and 104:
ENIG - Ni Interface Issues w/ SACBr
Page 105 and 106:
Unreliability, F(t)ENIG: Mechanical
Page 107 and 108:
Page 109 and 110:
Pb-Free HASL: Ni-modified SnCuoAllo
Page 111 and 112:
Newer Finishes to the MarketProduct
Page 113 and 114:
Newer Finishes to the MarketProduct
Page 115 and 116:
Examples of Best Application Fitsoo
Page 117 and 118:
What to do if there is no SF fit?oo
Page 119 and 120:
SummaryoooooThe surface finish you
Page 121 and 122:
ConclusionsoooDesign for Reliabilit
Page 123:
Contact Information• Questions?
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Design for Reliability: PCBs - DfR Solutions

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