Design for Reliability: PCBs - DfR Solutions
Design for Reliability: PCBs - DfR Solutions
Design for Reliability: PCBs - DfR Solutions
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In Circuit Test w/ OSP – test via challengesooProbing through HT OSP is not recommended.Solder paste is printed over OSP test pads/vias (leaving flux residue with no-cleanpaste).OSPMetallic FinishesFlux residue onsurface (smallissue)Test PadFlux residue poolsin dimple and limitsprobe contact.Test Via© 2004 - 2007 2010Space constraints on PCB make it difficult to eliminate test vias.