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HIMax System 9 Life Cycle<br />
Figure 20: Securing the Connector Board with Captive Screws<br />
9.1.6 Considerations about Heat<br />
The increased integration level of electronic components causes a corresponding lost heat.<br />
This depends on the external load of HIMax modules. Depending on the structure, the device<br />
installation and ventilation are thus of importance.<br />
Observe the environmental requirements when mounting the devices. Low operating temperature<br />
increases the product life and the reliability of the electronic components within the<br />
<strong>system</strong>s.<br />
HI 801 001 E Rev. 3.00 Page 87 of 104
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