The Circuit Designer's Companion - diagramas.diagram...

vi Contents2.2 Design rules 452.2.1 Track width and spacing 472.2.2 Hole and pad size 502.2.3 Track routing 512.2.4 Ground and power distribution 522.2.5 Copper plating and finishing 552.2.6 Solder resist 552.2.7 Terminations and connections 562.3 Board assembly: surface mount and through hole 582.3.1 Surface mount design rules 602.3.2 Package placement 622.3.3 Component identification 632.4 Surface protection 632.4.1 Guarding 642.4.2 Conformal coating 652.5 Sourcing boards and artwork 672.5.1 Artwork 672.5.2 Boards 68Chapter 3Passive components 703.1 Resistors 703.1.1 Resistor types 703.1.2 Tolerancing 733.1.3 Temperature coefficient 743.1.4 Power 753.1.5 Inductance 763.1.6 Pulse handling 763.1.7 Extreme values 773.1.8 Fusible and safety resistors 793.1.9 Resistor networks 793.2 Potentiometers 803.2.1 Trimmer types 813.2.2 Panel types 823.2.3 Pot applications 823.3 Capacitors 853.3.1 Metallised film & paper 853.3.2 Multilayer ceramics 893.3.3 Single-layer ceramics 903.3.4 Electrolytics 913.3.5 Solid tantalum 933.3.6 Capacitor applications 943.3.7 Series capacitors and dc leakage 963.3.8 Dielectric absorption 973.3.9 Self resonance 973.4 Inductors 993.4.1 Permeability 993.4.2 Self-capacitance 101