FORUM 1Organizer:Co-organizer:Committee:Sunday February 22 nd , 8:00 AMF1: High-Speed Interleaved ADCsStéphane Le Tual, STmicroelectronics, Crolles, FranceBorivoje Nikolic, University of California, Berkeley, CATetsuya Iizuka, University of Tokyo, Tokyo, JapanIchiro Fujimori, Broadcom, Irvine, CATime-interleaved ADCs have become critical components in high-speed wireline and wirelesscommunication systems. This forum will deliver a comprehensive treatment of state-of-theart design techniques for high-speed interleaved ADCs. Topics include transistor-level designtechniques, calibration (estimation & correction), as well as the link between systemspecifications and required ADC performance.TimeTopic8:00 AM BreakfastAgenda8:20 AM Introduction by Chair8:30 AM Interleaved ADCs Through the AgesKen Poulton, Keysight Laboratories, Santa Clara, CA9:20 AM Mismatch Error Correction for High-Resolution,GS/s time-Interleaved ADCsPer Löwenborg, Signal Processing Devices, Linköping, Sweden10:10 AM Break10:35 AM Highly Accurate Adaptive Digital Calibration for High-SpeedHigh-Resolution Time-Interleaved ADCsTakashi Oshima, Hitachi, Tokyo, Japan11:25 AM ADC Interleaving Errors Corrected by Adaptive Post-ProcessingAsad Abidi, University of California, Los Angeles, CA12:15 PM Lunch1:20 PM Specifications vs. Applications: Driving Architectural ChoicesAaron Buchwald, Entropic, Irvine, CA2:10 PM GS/s Time-Interleaved ADCs for Broadband Multi-CarrierSignal ReceptionKostas Doris, NXP, Eindhoven, The Netherlands3:00 PM Break3:20 PM Embedded CMOS ADCs for Optical CommunicationsYuriy M. Greshishchev, Ciena, Ottawa, Canada4:10 PM PanelModerators: Bora Nikolic (UC Berkeley)Dave Robertson (ADI)5:00 PM Closing remarks by Chair8
FORUM 2Sunday February 22 nd , 8:00 AMF2: Memory Trends: From Big Data to Wearable DevicesOrganizer:Committee:Jonathan Chang, TSMC, Hsinchu, TaiwanJonathan Chang, TSMC, Hsinchu, TaiwanLeland Chang, IBM, Yorktown Heights, NYAntoine Dupret, CEA Leti-LIST, Gif-sur-Yvette, FranceChulwoo Kim, Korea University, Seoul, KoreaFatih Hamzaoglu, Intel, Hillsboro, ORTakefumi Yoshikawa, Panasonic, Kyoto, JapanMemory continues to be a critical element in the full range of VLSI applications - from bigdata to mobile applications to wearable devices. Recent trends, including process technologyscaling limits, new memory applications, and evolving high-performance and low-powerrequirements, have driven the development of emerging memories. As both discrete andembedded memory scaling becomes ever more challenging, there is a widespread effort tolook for alternative memory technologies to replace the entrenched SRAM, DRAM, or Flash.This forum will bring together systems designers to discuss memory needs for futureapplications and memory designers to describe the latest developments in emerging and nextgeneration memories.AgendaTimeTopic8:00 AM Breakfast8:20 AM Introduction8:30 AM Memory Requirement Trends and Challenges: Servers to DevicesSuresh Chittor, Intel, Hillsboro, OR9:20 AM Memory System Requirements for the Big-Data ApplicationData-Centric ComputingKen Takeuchi, Chuo University, Tokyo, Japan10:10 AM Break10:35 AM Memory and Storage Requirement and Trend for ChromeOSEric Shiu, Google, Mountain View, CA11:25 AM Emerging Memories in Embedded Systems: Opportunities for theDigital Architect, Challenges for the DesignersFabien Clermidy, CEA-Leti, Grenoble, France12:15 PM Lunch1:20 PM 3D NAND Flash: from Enterprise to Embedded StoragesKi-Tae Park, Samsung, Hwasung, Korea2:10 PM Addressing Future Memory Challenges with Device AbstractionJ. Thomas Pawlowski, Micron, Boise, ID3:00 PM Break3:20 PM Technology Trends and Applications of MRAMfrom Big Data to Wearable DevicesShinobu Fujita, Toshiba, Kawasaki, Japan4:10 PM RRAM for Data Abundant System Technology:Managing Expectations and Minimizing DisappointmentsMalgorzata Jurczak, IMEC, Leuven, Belgium5:00 PM Conclusion9
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