Commercial Connectors - TTI Inc.
Commercial Connectors - TTI Inc.
Commercial Connectors - TTI Inc.
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AdvancedMC • AMC .0 B+ style connector<br />
• ATCA and telecom applications<br />
• Press-fit technology for easy, reliable board termination<br />
• Proven contact interface, similar to SFP products with<br />
GBX-style compliant pin<br />
• Supports 12 .5Gb/s data transmission with less than<br />
3% cross-talk per simulation<br />
• Available with or without PCB alignment pegs<br />
KK ® /C-GRID ® /SL <br />
Features & Benefits:<br />
• Complete range of 2 .54mm ( .100") and 3 .96mm ( .156") products for<br />
board-to-board and wire-to-board applications<br />
• Full line of headers:<br />
° Single and dual row<br />
° Shrouded and unshrouded<br />
° Friction lock and positive lock<br />
° Vertical and right angle<br />
• Full line of crimp terminals for 18 to 30AWG wire<br />
• Full line of IDT ribbon cable connectors for 18 to 28AWG wire<br />
• RoHS compliant<br />
• Pb-free process compatible options<br />
• Tin and gold plating options<br />
• Current rating up to 7A<br />
• Custom product capability<br />
Applications:<br />
• Automotive<br />
• Telecom<br />
• Computers<br />
• Business Machines<br />
• HVAC<br />
• Industrial<br />
• Medical<br />
• Consumer<br />
• White Goods<br />
Plateau HS Mezz <br />
• Supports high-speed differential signaling 10Gb/s with<br />
100 ±10Ω impedance at 50/sec<br />
• Contacts on 1 .20mm ( .047") centerline<br />
• Two points of contact on each signal ensures high<br />
reliability<br />
• Multiple stack heights from 10-25mm (0 .354 to 0 .984")<br />
• Available in 6, 12, 24, and 36 differential pair sizes<br />
(12, 24, 48, and 72 total contacts)<br />
www.ttiinc.com • 1-800-CALL-<strong>TTI</strong><br />
Crimp Terminal Housings<br />
Solder Tail <strong>Connectors</strong><br />
Header<br />
2 .5mm (0 .098")<br />
Center Spacing<br />
2 .5mm (0 .098")<br />
Center Spacing<br />
2 .5mm (0 .098")<br />
Center Spacing<br />
2 .54mm (0 .100")<br />
Center Spacing<br />
2 .54mm (0 .100")<br />
Center Spacing<br />
2 .54mm (0 .100")<br />
Center Spacing<br />
1.0mm Mezz<br />
• Multiple stack heights 8-15mm<br />
• Terminal protected during mating and handling<br />
• 30µ" gold plating on contact giving high reliability with<br />
100 cycles durability<br />
• LCP housing compatible with standard SMT reflow<br />
processes<br />
• Anti-flux intrusion feature compatible with no-wash<br />
soldering processes<br />
3 .96mm (0 .156")<br />
Center Spacing<br />
3 .96mm (0 .156")<br />
Center Spacing<br />
3 .96mm (0 .156")<br />
Center Spacing<br />
HD Mezz <br />
Molex<br />
5 .08mm (0 .200")<br />
Center Spacing<br />
5 .08mm (0 .200")<br />
Center Spacing<br />
5 .08mm (0 .200")<br />
Center Spacing<br />
• Unique, patented solder attach method<br />
• Data rates of up to 12 .5Gb/s<br />
2<br />
• 14 differential pairs per cm<br />
• More cost-effective, reliable than BGA attach methods<br />
• Excellent signal clarity with a plethora of bandwidth for<br />
customer requirements in high speed designs<br />
• Allows for multiple stack heights and circuit sizes<br />
• Useful for space constrained designs with limited PCB<br />
real estate<br />
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