Commercial Connectors - TTI Inc.

VHDM ® *
I-Trac
• Data rates scalable to 12 Gb/s
• Available in 7, 11, and 15-row versions
• Differential pair density up to 69 pairs per inch
• Broadside-coupled, skew equalized design provides
superior impedance control, lower cross-talk and lower
insertion loss
• Designed for both standard and orthogonal backplane
architectures using the same connector part numbers
• Open pin field design allows for pin-by-assignment flexibility
The Very High Density Metric (VHDM) connector system is designed
for applications that require high interconnect density and high speed
signal integrity . It is available in both 6 row and 8 row configurations
with ground planes between columns . The grid of the mating face is 2mm
between columns and 2 .25mm between rows . The ground planes are
interstitial to the signal grid . Standard VHDM connectors support data
rates of 2 .5Gb/s with less than 5% crosstalk .
The daughter card connector is made from wafers . Each wafer has a
column of signal contacts plus a ground plane . The wafers are then
mounted onto a rugged stainless steel stiffener to make a robust
monoblock connector . The connector can include signal wafers, guide
blocks, and power modules .
On the backplane side, headers are available in lengths of 10 and 25
columns . There are open and guide pin versions available . Extremely
robust free standing guide pins are also available . These are mounted
directly into the backplane PCB and can accommodate heavier daughter
cards .
Features & Benefits:
• 6 and 8-row versions offer 72 or 100 real signals per 25mm
• Internal ground planes control impedance and minimize crosstalk
• Press-fit construction avoids solder-related defects
• Can be used on the same stiffener with HSD 6 and 8-row to achieve
desired performance at the most economical cost
• Modular construction combines signal, power, and guidance in one connector
• 10A power blades allows 120A per 25mm power density
• Dual identical source with Amphenol TCS ensures trouble-free mixing
of Molex and Amphenol TCS connectors
VHDM ® * Lite
• Speeds up to 1 .5Gb/s bandwidth per signal pair
• Lower cost than the VHDM family
• Open pin field version of the VHDM System
• Press-fit construction combines signal, power, and
guidance in one connector
• Uses the same stiffener as the VHDM allowing designers
to use VHDM, VHDM-HSD, and VHDM-L all-in-one
connector .
*Note: VHDM, HDM, GbX and VHDM-HSD are trademarks or registered trademarks of Amphenol Corporation .
www.ttiinc.com • 1-800-CALL-TTI
VHDM-HSD *
• Up to 5 .0Gb/s bandwidth per signal pair
• Differential pair architecture
• 50% less crosstalk than VHDM
• 2 by 2 .25mm ( .079 by .089") pitch
• Press fit construction combines signal, power, and guidance
in one connector
• Provides real signal density of 10 differential pairs for
5-row and 6-row and 15 differential pairs for 8-row per
centimeter
GbX ® *
Molex
Applications:
• Test Systems: Semiconductor Test Equipment
• Internetworking: Routers, Switches, Hubs
• Servers: High End, Low End, Mid Range
• Memory Storage Systems: High End Telcom
Switches and Transmission
• Data rate options up to 10 .0Gb/s able to support
future daughtercard speed upgrades
• Bifurcated contact beams in receptacle
• Greater reliability with two points of contact
• Custom, cost-effective receptacle assemblies
• Optimized differential pair contacts
• Easier board trace routing
• Up to 69 real differential pairs per linear inch
(27 real differential pairs per 10mm)
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