Catalogue - Delphi - Global Connection System

UNSEALED
U
U N S E A L E D
064 Series
064 Series Unsealed Specifications
MicroHVT & Micro64 Mating Terminals
Female Terminal
Application Guidelines MicroHVT Micro64
064 Series
Typical Cable Applications 0.35 mm 2 - 0.50 mm 2 TWP (SAE J-1128) 0.35 mm 2 - 0.50 mm 2 TWP (SAE J-1128)
0.75 mm 2 FLRY-A (DIN 72551) 0.75 mm 2 FLRY-A (DIN 72551)
0.80 mm 2 TXL Reduced Wall (SAE J-1128) 0.80 mm 2 TXL Reduced Wall (SAE J-1128)
Current Range 0 - 7 amps 0 - 5 amps
Temperature Range -40°C to +85°C -40°C to +85°C
Resistance <20 mΩ @ 20 mV <20 mΩ @ 20 mV
Voltage Drop <20 mV/amp <20 mV/amp
Centerline Spacing 2.54 mm (terminal-to-terminal and row-to-row) 2.54 mm (terminal-to-terminal and row-to-row)
Header Pin 0.64 mm square, tin-plated 0.64 mm square, tin-plated
Temperature Rise/Derating Curves
MicroHVT
Micro64
Steady State Temperature Rise (°C) above Ambient
30
25
20
15
10
5
Temperature Rise vs. Current*
0.64 mm square tin-plated pin mated to MicroHVT terminal –
0.50 mm 2 cable
Maximum Recommended
Continuous Current
0
0 1 2 3 4 5 6 7
Steady State Current (Amps)
Steady State Temperature Rise (°C) above Ambient
Temperature Rise vs. Current*
0.64 mm square tin-plated pin mated to Micro64 terminal -
0.50 mm 2 cable
30
25
20
15
10
5
Maximum Recommended
Continuous Current
0
0 1 2 3 4 5
Steady State Current (Amps)
Maximum Current (Amps)
Temperature Derating Curve*
0.64 mm square tin-plated pin mated to MicroHVT terminal –
0.50 mm 2 cable
Assumes 85°C maximum operating temperature
13
12
11
10
9
8
7
6
5
4 Maximum Recommended
3 Continuous Current
2
1
0
25 35 45 55 65 75 85
Ambient Temperature (°C)
Maximum Current (Amps)
8
7
6
5
4
3
2
1
Temperature Derating Curve*
0.64 mm square tin-plated pin mated to Micro64 terminal –
0.50 mm 2 cable
Assumes 85°C maximum operating temperature
Maximum Recommended
Continuous Current
0
25 35 45 55 65 75 85
Ambient Temperature (°C)
* Data based on laboratory testing of a single circuit in free air. The lab test does not account for all of the variables that would be present in an actual application.
4.4
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