Catalogue - Delphi - Global Connection System

Tooling
Application Tooling
Delphi E-Z Pack Die:
Reliable
Flexible
E-Z Pack Die can best be described as an advanced and
flexible terminal application system.
Features:
• This die consists of a die base, quick
change module (terminal specific), and
a conversion kit that adapts the base to
various presses.
• This die may be installed in Delphi’s 3 or
5-ton press, or into other manufacturers’
presses with an adapter kit.
• This die may be bench mounted or installed
on wire processing cutter equipment.
Advantages:
• Reduces changeover time and downtime.
• Die changes are performed quickly and
easily, without a need for special tools.
Simply remove the tool module and insert
the next module into the die base.
Quick and easy
die changes
E-Z Pack Dies may be purchased, leased or rented.
Contact your account representative.
Please see cross reference sheet for terminal-to-die
information. See Page 10.14.
Efficient
Automatic cutter
cycle
Optional tape
dispenser
Delphi Low Profile Splice Die
and Stand:
This air operated press and die allows splicing of two or
more wire leads and provides good visibility to crimping
area.
Die and stand sold as a unit.
Portable
stand
Specifications:
Overall height:
Overall width:
Overall depth:
1143mm (45 inches)
914mm (36 inches)
610mm (24 inches)
Low noise
level
Requires minimal
floor space
Optional liquid
solder pot
NOTE: Specifications in this catalog are for general reference only and are subject to change without notice. To verify product information, please contact a Delphi representative.
http://connectors.delphi.com 10.3
Application Tooling