LTC6945 - Ultralow Noise and Spurious 0.35GHz to 6GHz Integer-N ...

PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
4.50 � 0.05
3.10 � 0.05
2.50 REF
5.00 � 0.10
(2 SIDES)
2.65 � 0.05
PIN 1
TOP MARK
(NOTE 6)
3.65 � 0.05
0.25 �0.05
0.50 BSC
3.50 REF
4.10 � 0.05
5.50 � 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 � 0.10
(2 SIDES)
UFD Package
28-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1712 Rev B)
0.70 �0.05
PACKAGE OUTLINE
0.75 � 0.05
3.50 REF
0.200 REF
0.00 – 0.05
R = 0.05
TYP
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation
that the interconnection of its circuits as described herein will not infringe on existing patent rights.
BOTTOM VIEW—EXPOSED PAD
LTC6945
2.50 REF
R = 0.115
TYP
PIN 1 NOTCH
R = 0.20 OR 0.35
� 45� CHAMFER
27 28
3.65 � 0.10
2.65 � 0.10
0.40 � 0.10
1
2
(UFD28) QFN 0506 REV B
0.25 � 0.05
0.50 BSC
6945f
27