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North American Company Profiles - Smithsonian - The Chip Collection

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8x8 <strong>North</strong> <strong>American</strong> <strong>Company</strong> <strong>Profiles</strong><br />

Management<br />

Joseph L. Parkinson Chairman and Chief Executive Officer<br />

Y. W. Sing Vice Chairman<br />

Keith Barraclough President and Chief Operating Officer<br />

Paul Voois Executive Vice President<br />

Sandra Abbott Vice President, Finance and Chief Financial Officer<br />

David Harper Vice President, European Operations<br />

Bryan Martin Vice President, Engineering and Chief Technical Officer<br />

Chris McNiffe Vice President, Sales and Marketing<br />

Michael Noonen Vice President, Business Development<br />

Samuel Wang Vice President, Process Technology<br />

Doug Bailey Director, Worldwide Sales<br />

Kevin Deierling Director, Marketing<br />

Products and Processes<br />

8x8 Inc. develops highly integrated programmable single-chip compression and decompression ICs and related<br />

software for video phone and video conferencing equipment.<br />

<strong>The</strong> company’s family of processors include the following:<br />

• Video Communications Processor (VCP) is a single-chip programmable video subsystem and multimedia<br />

communications processor for conferencing over ISDN telephone lines. In early 1997, the company<br />

introduced a simple and inexpensive video phone, dubbed ViaTV Phone, that contains the VCP device.<br />

• Low-bit-rate Videophone Processor (LVP) is a single-chip programmable video-phone processor for<br />

conferencing over ordinary telephone lines.<br />

• Multimedia Encode Processor (MEP) for powering a PCI video capture and compression board using Intel’s<br />

wavelet-based Indeo interactive video compression technology.<br />

<strong>The</strong> company’s video compression semiconductors are based on its proprietary architecture, which combines a<br />

RISC microprocessor, an advanced DSP core, specialized video processing circuitry, and SRAM technology.<br />

1-2<br />

INTEGRATED CIRCUIT ENGINEERING CORPORATION

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