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North American Company Profiles - Smithsonian - The Chip Collection

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AMD <strong>North</strong> <strong>American</strong> <strong>Company</strong> <strong>Profiles</strong><br />

Advanced Micro Devices Advanced Micro Devices<br />

5204 East Ben White Boulevard 5204 East Ben White Boulevard<br />

Austin, Texas 78741 Austin, Texas 78741<br />

Telephone: (512) 385-8542 Telephone: (512) 385-8542<br />

Fab 10 Fab 14<br />

Cleanroom size: 22,000 square feet (Class 100) Cleanroom size: 22,000 square feet (Class 10)<br />

Capacity (wafers/week): 4,500 Capacity (wafers/week): 3,500<br />

Wafer size: 125mm Wafer size: 150mm<br />

Process: CMOS Process: CMOS<br />

Products: PLDs Products: Flash memories, EPROMs<br />

Feature size: 0.9μm Feature size: 0.8μm<br />

Advanced Micro Devices Advanced Micro Devices<br />

5204 East Ben White Boulevard 901 Thompson Place<br />

Austin, Texas 78741 Sunnyvale, California 94088<br />

Telephone: (512) 385-8542 Telephone: (408) 732-2400<br />

Fab 15 Fab 17 and Submicron Development Center<br />

Cleanroom size: 22,000 square feet (Class 10) Cleanroom size: 42,500 square feet (Class 1)<br />

Capacity (wafers/week): 3,500 Capacity (wafers/week): 2,000<br />

Wafer size: 150mm Wafer size: 150mm<br />

Process: CMOS Process: CMOS<br />

Products: Logic, telecom, and network ICs; Products: R&D, MPUs, flash memories<br />

MPUs; microperipheral ICs Feature sizes: 0.35μm-0.8μm<br />

Feature size: 0.7μm<br />

Advanced Micro Devices AMD Saxony Manufacturing GmbH<br />

5204 East Ben White Boulevard Dresden, Saxony, Germany<br />

Austin, Texas 78741 Fab 30<br />

Telephone: (512) 385-8542 Cleanroom size: 90,000 square feet<br />

Fab 25 Capacity (wafers/week): 6,000<br />

Cleanroom size: 86,700 square feet (Class 1) Wafer size: 200mm<br />

Capacity (wafers/week): 6,000 Process: CMOS<br />

Wafer size: 200mm Products: MPUs, logic ICs, R&D<br />

Process: CMOS Feature size: 0.25μm (0.18μm capability)<br />

Products: MPUs, logic ICs, flash memories (Expected to start production by the end of 1998.)<br />

Feature sizes: 0.35μm, 0.5μm (0.25μm capability)<br />

1-26<br />

INTEGRATED CIRCUIT ENGINEERING CORPORATION

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