North American Company Profiles - Smithsonian - The Chip Collection

North American Company Profiles 8x8 

Regional Headquarters/Representative Locations 

8X8 

8x8, Inc. 

2445 Mission College Boulevard 

Santa Clara, California 95054 

Telephone: (408) 727-1885 

Fax: (408) 980-0432 

Web Site: www.8x8.com 

Fabless IC Supplier 

Europe: 8x8, Inc. • Bucks, England 

Telephone: (44) (1628) 890984 • Fax: (44) (1628) 890938 

Financial History ($M), Fiscal Year Ends March 31 

1992 1993 1994 1995 1996 

Sales 36 31 34 20 29 

Net Income 5 (1) (0.3) (6) (3) 

R&D Expenditures 7 7 7 8 8 

Employees 114 100 105 110 81 

Company Overview and Strategy 

8x8, Inc. was founded originally as Integrated Information Technology, Inc. (IIT) in 1987 to supply math 

coprocessors for 286 and later 386 microprocessor chips. Since June 1995, the company has been 

discontinuing all efforts unrelated to video conferencing, including dropping product lines and development 

efforts in math coprocessors, x86-compatible microprocessors, graphics ICs, and MPEG decoders. 

Along with the new business strategy came the new name, 8x8 Inc., in early 1996. The 8x8 name reflects the 

company’s focus on programmable integrated circuits for video conferencing applications in a wide range of 

consumer and PC multimedia products. An 8x8 block of picture elements (pixels) is the basis of many video 

compression algorithms. 

8x8 continues to place greater emphasis on its video compression semiconductors, which for fiscal year 1996 

represented 63 percent of total sales, compared to only 12 percent in 1994. The company is planning reliance on 

a new line of cost effective VideoCommunicators for the consumer video conferencing market. 

The company launched its initial public offering in November of 1996. Export sales accounted for almost half of 

8x8’s revenue in fiscal 1996. 

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-1

8x8 North American Company Profiles 

Management 

Joseph L. Parkinson Chairman and Chief Executive Officer 

Y. W. Sing Vice Chairman 

Keith Barraclough President and Chief Operating Officer 

Paul Voois Executive Vice President 

Sandra Abbott Vice President, Finance and Chief Financial Officer 

David Harper Vice President, European Operations 

Bryan Martin Vice President, Engineering and Chief Technical Officer 

Chris McNiffe Vice President, Sales and Marketing 

Michael Noonen Vice President, Business Development 

Samuel Wang Vice President, Process Technology 

Doug Bailey Director, Worldwide Sales 

Kevin Deierling Director, Marketing 

Products and Processes 

8x8 Inc. develops highly integrated programmable single-chip compression and decompression ICs and related 

software for video phone and video conferencing equipment. 

The company’s family of processors include the following: 

• Video Communications Processor (VCP) is a single-chip programmable video subsystem and multimedia 

communications processor for conferencing over ISDN telephone lines. In early 1997, the company 

introduced a simple and inexpensive video phone, dubbed ViaTV Phone, that contains the VCP device. 

• Low-bit-rate Videophone Processor (LVP) is a single-chip programmable video-phone processor for 

conferencing over ordinary telephone lines. 

• Multimedia Encode Processor (MEP) for powering a PCI video capture and compression board using Intel’s 

wavelet-based Indeo interactive video compression technology. 

The company’s video compression semiconductors are based on its proprietary architecture, which combines a 

RISC microprocessor, an advanced DSP core, specialized video processing circuitry, and SRAM technology. 

1-2 

INTEGRATED CIRCUIT ENGINEERING CORPORATION

North American Company Profiles ACC Micro 


ACC MICRO 

ACC Microelectronics Corporation 

2500 Augustine Drive 


Telephone: (408) 980-0622 

Fax: (408) 980-0626 


ACC Microelectronics Corporation (ACC Micro) was established in 1987 to design, develop, and market a variety 

of VLSI circuit devices for computer system control, computer system board integration, and communication 

applications. The company's flagship products are a line of single-chip solutions targeted at the desktop, 

notebook, and subnotebook computer industries. 

Management 

Wei-Tau Chiang, Ph.D. President and Chief Executive Officer 

Mark Shieu Vice President, Engineering 


ACC Micro supplies chipsets and controller chips for 386/486-based and Pentium-based computers. Other 

products include buffer chips, power management chips, and single-device floppy-disk controllers. 

Semiconductor Fabrication Facilities 

ACC Micro has second-source licensing agreements with Motorola to support delivery schedules. 


Actel North American Company Profiles 


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ACTEL 

Actel Corporation 

955 East Arques Avenue 

Sunnyvale, California 94086-4533 

Telephone: (408) 739-1010 

Fax: (408) 739-1540 

Web Site: www.actel.com 


Europe: Actel Europe Ltd. • Basingstoke, Hampshire, England 

Telephone: (44) (1256) 29209 

Financial History ($M), Fiscal Year Ends December 31 

1992 1993 1994 1995 1996 

Sales 41 56 76 109 149 

Net Income (0.3) 5 8 (1) 15 


Foundry Fab Investment — — 4 3 4 

Employees 168 211 245 320 356 


Founded in 1985, Actel Corporation designs, develops, and markets field programmable gate arrays (FGPAs) and 

associated software development systems and programming hardware. Its products are used by designers of 

computer and computer peripheral, telecommunications, military, aerospace, industrial control, and other 

electronic systems. 

Military/Aerospace 

11% 

Computers/ 

Peripherals 

21% 

Industrial Control 

22% 

Communications/ 

Networking 

46% 

1996 Sales by End-Use Market 

Japan 

10% 

Europe 

18% 

ROW 

5% 

United States 

67% 

1996 Sales by Geographic Region 


North American Company Profiles Actel 

Actel is a leader in the development of antifuse-based FPGAs and believes it was the first company to achieve 

volume production of such devices. The company's objective is to become the leading supplier of FPGAs by fully 

exploiting the capabilities of its proprietary antifuse and circuit architectures. 

In April 1995, Actel completed the acquisition of the antifuse FPGA business of Texas Instruments, which was the 

only second-source supplier of Actel’s products. 

Management 

Development Systems 

3% 

FPGAs 

97% 

1996 Sales by Product Type 

John C. East President and Chief Executive Officer 

Esmat Z. Hamdy Senior Vice President, Technology and Operations 

Jeffrey M. Schlageter Senior Vice President, Engineering 

David M. Sugishita Senior Vice President, Finance and Administration, and Chief Financial Officer 

Michelle A. Begun Vice President, Human Resources 

Douglas D. Goodyear Vice President, Worldwide Sales 

Dennis F. Nye Vice President, Marketing 

Robert Smith, Ph.D. Vice President, Software 

David L. Van De Hey Vice President and General Counsel 

Warren Miller Director, Silicon Planning and Strategic Applications 

Robert Nalesnik Director, Product Marketing 

David Stieg Director, North American Distribution Sales 


Value Series 

• The ACT1 family consists of two devices, a 1,200-gate part and a 2,000-gate (6,000 PLD equivalent gates) 

part, and offers system performance of up to 25MHz. This family of circuits utilizes 1.0μm or 0.9μm CMOS 

technology. 

• The ACT2 family consists of three devices ranging from 2,500 to 8,000 gates (20,000 PLD equivalent gates) 

and offers system performance of up to 50MHz. This family of circuits utilizes 1.0μm CMOS technology. 


Actel North American Company Profiles 

Accelerator Series 

• The ACT3 family consists of devices ranging from 1,500 to 10,000 gates (25,000 PLD equivalent gates) and 

on-chip performance of up to 250MHz (system performance up to 75MHz). This family of circuits is based on 

0.8μm double-level-metal CMOS technology. 

• The ACT3 PCI family consists of fully PCI-compliant devices with 4,000 to 10,000 usable gates and on-chip 

performance of up to 250MHz. This family of circuits is based on 0.6μm double-level-metal CMOS technology. 

Integrator Series 

• The 1200XL family features parts ranging from 2,500 to 8,000 gates and offers system performance of up to 

60MHz. This family of circuits is based on 0.65μm CMOS technology. 

• The 3200DX family is Actel’s newest series of FPGAs with capacities ranging from 6,500 gates to 40,000 gates 

and offering system performance of up to 100MHz. These high-performance FPGAs offer fast dual-port 

SRAM, fast decode, and data path circuitry based on 0.65μm double-level-metal CMOS technology. 

Reprogrammable SPGAs 

• Actel’s ES family of system programmable gate arrays (SPGAs) are non-antifuse PLDs designed to address the 

system-on-a-chip market. The fine-grained array of logic module blocks enables gate counts from 50,000 

gates up to 400,000 gates. The SRAM-based SPGAs permit the integration of complex intellectual property 

(IP) cores and support in-system programmability (ISP). Actel jointly developed the SPGA technology with the 

Silicon Architects Group of Synopsys. 

Radiation-Hardened FPGAs 

• Actel’s RadHard family of FPGAs currently consists of radiation-hardened versions of its 2,000-gate ACT1 

device and its 8,000-gate ACT2 device. These devices were first shipped in 1996 and ramped more quickly 

than any other product in the company’s history. The RadHard family is based on 0.8μm double-level-metal 

epitaxial bulk CMOS technology jointly developed with Lockheed-Martin Federal Systems. 

Mask Programmed Gate Arrays (MPGAs) 

• Offered as an alternative to traditional gate array conversions, Actel’s MPGAs provide significant cost 

reductions for high-volume applications. An Actel FPGA used for prototyping and initial production can be 

replaced by a corresponding MPGA (masked version of the device). 

To support its FPGA products, Actel offers software products, including its CoreHDL IP portfolio consisting of 

telecommunications cores, industrial cores, a Universal Serial Bus (USB) interface, and Actel-developed CorePCI 

models, as well as proprietary and third-party design automation software. In addition, Actel provides programming 

and test hardware and a diagnostic option that provides special in-circuit debug and diagnostic capabilities. 

1-6 


North American Company Profiles Actel 


Actel's FPGAs are manufactured by Chartered Semiconductor, Lockheed-Martin Federal Systems, Matsushita, 

Texas Instruments, and Winbond. 

The company’s first foundry suppliers were Matsushita and TI. As part of the 1995 acquisition of TI’s FPGA 

business, Actel signed a three-year manufacturing agreement (1.0μm design rules). 

Also in 1995, Actel and Matsushita extended their five-year manufacturing relationship (0.8μm, 0.9μm, and 1.0μm 

design rules). In addition, Matsushita is assisting Actel in developing next-generation antifuse technology. 

Actel’s relationship with Chartered began in 1994 when the company purchased a minority equity interest in 

Chartered. In return, Actel is guaranteed access to Chartered’s advanced 200mm wafer capacity (0.6μm design 

rules). 

Since being signed on in 1994, Winbond has become one of Actel’s largest fab partners, providing the company 

with advanced wafer production services (0.8μm and 0.6μm design rules). 

Lockheed-Martin Federal Systems is the sole source of Actel’s rad-hard FPGAs, which are being jointly developed 

by the two companies (0.8μm design rules). 

Key Agreements 

• In 4Q96, Actel signed a multi-year agreement with Swiss IP provider, Inicore AG, for several 

telecommunications and industrial control cores. The cores have been optimized for Actel’s ACT3, ACT3 PCI, 

1200XL, and 3200DX families of FPGAs, as well as the ES family of SPGAs. 

• Actel and Synopsys announced an agreement in mid-1996 to jointly develop Actel’s SPGAs, which combine 

the features of FPGAs and mask programmed ASICs in a single chip. Under the agreement, Actel licensed the 

cell-based array (CBA) architecture of the Silicon Architects Group of Synopsys for use in the maskprogrammed 

portion of the SPGAs. 

• In 2Q96, Actel signed an agreement with IP provider, Technical Data Freeway, Inc., giving Actel and its 

customers access to over 90 synthesizable DSP, telecommunications, multimedia, and MCU cores. 

• Actel completed an agreement with Lockheed-Martin Federal Systems Company in Manassas, Virginia, in 1H95 

to jointly develop radiation-hardened FPGAs. Lockheed Martin FSC is manufacturing the devices. 


Allegro MicroSystems North American Company Profiles 


1-8 

ALLEGRO MICROSYSTEMS 

Allegro MicroSystems, Inc. 

115 Northeast Cutoff 

Worcester, Massachusetts 01615-0036 

Telephone: (508) 853-5000 

Fax: (508) 856-7434 

Web Site: www.allegromicro.com 

IC Manufacturer 

Europe: Allegro MicroSystems Europe Ltd. • Annecy, France 

Telephone: (33) (4) 50-51-2359 • Fax: (33) (4) 50-51-2083 

Financial History ($M) 

1992 1993 1994 1995 1996 

Sales 115 124 161 181 201 

Capital Expenditures 13 10 14 61 n/a 

Employees 2,000 


Allegro MicroSystems is the former semiconductor branch of Sprague Technologies, Inc. In 1990, Sprague was 

purchased by Japan's Sanken Electric and renamed Allegro MicroSystems. Today, Allegro is functionally and 

structurally an independently operating organization as a wholly owned subsidiary of Sanken Electric. 

Allegro MicroSystems specializes in the design, manufacture, and marketing of advanced mixed-signal ICs. The 

company is the world leader in Hall-effect sensor ICs and a prominent supplier of power and smart power ICs. 

Allegro's customers are OEM's primarily serving the automotive and industrial markets, but also the consumer, 

telecommunications, computer mass storage, and printer markets. 


North American Company Profiles Allegro MicroSystems 

Management 

Telecommunications 

5% 

EDP 

8% 

Consumer 

14% 

Automotive 

26% 

Industrial 

47% 


Far East 

15% 

Europe 

19% 

United States 

52% 

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-9 

Japan 

14% 


Allan S. Kimball President 

Dan Ax Vice President, Business Development 

Dennis Fitzgerald Vice President, Quality Systems 

John Kokulis Vice President, Finance and Chief Financial Officer 

Andy Labrecque Vice President, Operations 

John MacDougell Vice President, Research and Development 

Steven W. Miles Vice President, Product Development 

Fred Windover Vice President and General Counsel 

Marybeth Perry Director, Human Resources 


Allegro's product offering is outlined below by end-use market segment. 

Automotive Market EDP Printer and Communication Markets 

Magnetic field sensors Printer head driver 

Power driver ICs Paper transport motor driver 

Signal processing ICs Battery management 

Radio components 

Computer Mass Storage Market Industrial and Consumer Markets 

Spindle motor controller/driver Chip supply for hybrids 

Servo/voice-coil motor driver Smoke detector electronics 

Combination drivers 

Switch Mode Power Supply Market 

AC-DC converter (>10W to

Allegro MicroSystems North American Company Profiles 

Allegro exited the discrete market in December 1996 and sold its inventory of discrete semiconductor diodes and 

transistors. In recent years, sales of discrete products has represented about 6 percent of Allegro’s total 

revenues. 

The semiconductor processes used by Allegro range from standard bipolar to CMOS, power DMOS (doublediffused 

MOS), and combinations of all of them. 


Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. 

115 Northeast Cutoff 3900 Welsh Grove Road 

Worcester, Massachusetts 01615-0036 Willow Grove, Pennsylvania 19090 

Cleanroom size: 20,000 square feet Cleanroom size: 15,000 square feet 

Capacity (wafers/week): 5,000 Capacity (wafers/week): 3,000 

Wafer size: 100mm Wafer size: 100mm 

Processes: Bipolar, CMOS, BiCMOS, DMOS Processes: Bipolar, CMOS, BiCMOS, DMOS 

Products: Power and smart power ICs, Products: Power and smart power ICs, 

signal processing ICs, sensors ASICs (mixed-signal), sensors 

Feature sizes: 1.5μm-8.0μm Feature sizes: 1.5μm-8.0μm 

Allegro plans to invest $80 million to expand wafer capacity at its Worcester fab facility. A 150mm wafer line will be 

added to support 1.5μm production of its power and smart power ICs and sensor products. Allegro is also 

planning to double the capacity at its Willow Grove facility. 

1-10 


North American Company Profiles Alliance Semiconductor 


ALLIANCE SEMICONDUCTOR 

Alliance Semiconductor Corporation 

3099 North First Street 

San Jose, California 95134-2006 

Telephone: (408) 383-4900 

Fax: (408) 383-4999 

Web Site: www.alsc.com 


1993 1994 1995 1996 1997 

Sales 22 55 119 201 83 

Net Income 2 9 24 11 (17) 

R&D Expenditures 2 4 8 15 n/a 

Foundry Fab Investment — — 7 95 n/a 

Employees 35 40 74 130 150 


Founded in 1985, Alliance Semiconductor designs, develops, and markets memory products and memory 

intensive logic products for high-performance applications. Such applications are in the desktop and portable 

personal computer, networking, telecommunications, and instrumentation markets. 

The company originally manufactured its own devices in a fab facility near Kansas City, Missouri, leased from AT&T. 

However, high overhead costs and low demand in its product markets caused the plant to operate at a significant 

loss until its closure in February 1990. The company filed for Chapter 11 bankruptcy protection in March 1991 and 

then emerged with a new business strategy to operate as a fabless supplier of high-performance SRAMs and 

other memory products. 

The majority of Alliance’s revenues historically have been from sale of fast SRAMs in the PC marketplace. 

Recently, the company has placed greater emphasis on diversifying its product offerings. Its newest product lines 

include high-performance DRAMs, flash memories, and multimedia user interface (MMUI) accelerators. 


Alliance Semiconductor North American Company Profiles 

1-12 

MMUI Accelerators 

5% 

SRAMs 

95% 


Asia 

25% 

Europe 

18% 

North America 

57% 


In 1995, Alliance abandoned its “fabless” IC supplier strategy, to a certain extent. The company announced plans 

in that year calling for a substantial portion of the company’s future wafer capacity to come from fabs in which it has 

partial ownership. As a result, Alliance made a number of substantial investments in wafer manufacturing facilities, 

including an equity investment in Chartered Semiconductor (see Semiconductor Fabrication Facilities below). 

Management 

N. Damodar Reddy Chairman, President, and Chief Executive Officer 

C.N. Reddy Senior Vice President, Engineering and Operations 

Charles Alvarez Vice President, Finance and Administration, and Chief Financial Officer 

Kamal Gunsagar Vice President, Contract Manufacturing 

Angela Kupps Vice President, Human Resources 

Ken Poteet Vice President, Integrated Memory Products 

Phil Richards Vice President, Sales 

Sunit Saxena Vice President, Product Engineering 

Bharat Shastri Vice President, Systems Engineering 

Ritu Shrivastava Vice President, Technology Development 

Datar Lalvani Director, Marketing 


SRAMs 

Alliance Semiconductor offers a variety of high-speed asynchronous and synchronous CMOS SRAMs for 

networking, telecommunications, modem, and mainframe computer applications. Its asynchronous SRAM 

products range from 5V 64K devices with speeds as fast as 8ns to 3.3V 1M and 4M devices with speeds as fast as 

12ns. Its 3.3V synchronous SRAM products include 1M (32K x 32) and 2M (64K x 32) pipeline burst SRAMs 

designed for high-performance Pentium applications with access times as low as 5ns. 

DRAMs 

Volume production of a new line of high-speed fast page mode and EDO 4M and 16M DRAMs began in mid- and 

late-1996, respectively. 


North American Company Profiles Alliance Semiconductor 

Flash Memories 

Alliance’s flash memory products include 1M and 2M 5.0 volt-only NOR-type devices that are compatible with AMD 

and Intel flash chips, and 4M 5.0 volt-only devices that are compatible with AMD and Atmel flash chips. 

MMUI Accelerators 

The company's first foray beyond memory chip markets came in late 1994, when it unveiled its line of ProMotion 

MMUI accelerators. The ProMotion line includes the ProMotion-6410 64-bit MMUI accelerator, the ProMotion- 

6422 MMUI accelerator with integrated DAC, and the ProMotion-AT24 128-bit accelerator with integrated DAC. 

The fourth-generation ProMotion device, the AT3D chip, was introduced in late 1996. The AT3D is a 3D/2D/video 

accelerator that integrates a 128-bit internal drawing engine, DVD, and live video input port with support for various 

software drivers. 

Currently, most of Alliance’s products are manufactured using 0.45μm CMOS technology, with many of its newest 

products being developed using a 0.35μm process. The company’s SRAMs are based on a two-poly, one-metal 

CMOS process and its DRAMs on a three-poly, one-metal CMOS process. 


Alliance’s IC products are manufactured through a combination of independent foundry suppliers and joint 

venture facilities. The independent foundry suppliers Alliance uses for the manufacture of its ICs include Rohm 

and TSMC. 

In October 1995, Alliance entered an agreement with UMC and other parties to form a separate Taiwanese 

company, United Silicon Inc. (USI), for the purpose of building and managing a semiconductor manufacturing 

facility in Taiwan. The investment by Alliance will total approximately $60 million, representing an initial equity 

ownership of about 10 percent. In return for its investment, Alliance will receive 12.5 percent of the manufacturing 

capacity in the USI fab, which is expected to move into production in 1Q98. 

Earlier in 1995, Alliance entered into a partnership with UMC and S3 Incorporated to establish a new jointly owned 

wafer foundry company in Taiwan called United Semiconductor Corporation (USC). Alliance’s investment in USC 

will total approximately $70 million, representing an equity ownership of 19 percent. In return for its investment, 

Alliance will receive 25 percent of the manufacturing capacity in the USC fab. The fab will be a 200mm wafer, 

0.35μm plant capable of producing 5,000 to 6,250 wafers per week. The fab started manufacturing wafers for 

Alliance, S3, and other semiconductor companies in 3Q96. 

Also in 1995, Alliance announced a $52 million investment in Chartered Semiconductor to obtain a minority 

ownership stake in the company and a guaranteed portion of the capacity in Chartered’s Fab II facility that began 

production of 200mm wafers in 4Q95. 

Alliance’s equity investments in UMC and Chartered so far total about $200 million. By the end of 1997, the 

company expects wafers from the UMC and Chartered fabs it has invested in will represent more than 50 percent 

of its capacity. 


Alliance Semiconductor North American Company Profiles 


• Alliance and UMC signed an agreement in 4Q95 calling for UMC to expand allocation of wafer fabrication 

capacity to Alliance for the manufacture of Alliance’s DRAM products. In return, Alliance granted UMC a license 

to produce for itself a certain number of Alliance DRAM products. As discussed above, UMC and Alliance are 

also cooperating in the manufacture of ICs through two new IC foundry companies in Taiwan. 

• Alliance signed an agreement with 3Dfx Interactive, Inc. in late 1995 to work together on ensuring compatibility 

between Alliance’s ProMotion multimedia chips and 3Dfx Interactive’s Voodoo Graphics three dimensional 

graphics accelerator designed for 3D entertainment applications. 

• Alliance licensed Aspec Technology's Portfolio family of ASIC design tools in 2Q95. These tools will allow 

the company to create low-cost ASIC gate array and embedded memory array products. 

• Alliance entered into a joint development, manufacturing, and marketing agreement with Japan's Rohm Co., 

Ltd. in mid-1994 calling for Rohm to furnish Alliance with fab capacity for the production of SRAMs. Rohm will 

also help Alliance sell and market the products in Japan; Alliance will, in turn, assist Rohm in developing highperformance, 

low-power SRAMs. 

1-14 


North American Company Profiles Altera 


ALTERA 

Altera Corporation 

2610 Orchard Parkway 


Telephone: (408) 894-7000 

Fax: (408) 435-1394 

Web Site: www.altera.com 


Japan: Altera Japan Ltd. • Shinjuku-ku, Tokyo, Japan 

Telephone: (81) (3) 3340-9480 • Fax: (81) (3) 3340-9487 

Europe: Altera U.K. Limited • Buckinghamshire, United Kingdom 

Telephone: (44) (1494) 602000 • Fax: (44) (1494) 602001 

Asia-Pacific: Altera Hong Kong • Kowloon, Hong Kong 

Telephone: (852) 2538-6895 • Fax: (852) 2538-6896 


1992 1993 1994 1995 1996 

Sales 101 140 199 402 497 

Net Income 12 21 15 87 109 


Foundry Fab Investment 4 — 1 1 93 

Employees 477 527 667 881 918 


Altera Corporation, founded in 1983, is a leading supplier of high-performance, high-density CMOS 

programmable logic devices (PLDs) and associated development tools. Its broad line of "off-the-shelf" userconfigurable 

chips, together with Altera-developed software, enable system manufacturers to create custom logic 

functions in-house for a wide variety of applications. Altera believes its products and services provide its 

customers with faster time-to-market than custom (ASIC) solutions. The company's name was derived from the 

word Alterable. 

Altera products are used in a variety of applications, including telephone switching systems, computer networking, 

multimedia boards, broadcast video and video conferencing, and medical instrumentation. 


Altera North American Company Profiles 

Management 

1-16 

Development Software 

and Hardware 

6% 

CMOS Programmable 

Logic Chips 

94% 


Asia-Pacific 

7% 

Japan 

19% 

Europe 

21% 

Military 

4% 

Industrial 

14% 

Computer 

19% 


53% 


Consumer 

4% 

Other 

1% 

Communications 

58% 


Rodney Smith Chairman, President, and Chief Executive Officer 

Denis Berlan Executive Vice President and Chief Operating Officer 

Clive McCarthy Senior Vice President, Development Engineering 

Erik Cleage Vice President, Marketing 

Jack Fitzhenry Vice President, Human Resources 

Thomas J. Nicoletti Vice President, Business Development and Investor Relations 

Nathan Sarkisian Vice President, Finance 

Peter Smyth Vice President, Sales 

Chris Henry Director, Customer Marketing 


Altera's PLD products extend from 24 to 599 pins with usable gate counts up to 130,000 gates and process 

technologies advancing to 0.35μm through its fabrication partners. The company has released some details 

regarding its next major family of PLDs. Code-named Michelangelo, the new family of devices will be pin 

compatible with the MAX 7000 Family, Altera’s most popular line. Michelangelo PLDs, ranging from 32 macrocells 

on the low end to 1,008 on the high end, will start shipping in the first half of 1998. 


North American Company Profiles Altera 

FLEX 10K Family FLEX 10KA Family 

• 10,000-100,000 usable gates • 10,000-250,000 usable gates 

• In-circuit reconfigurable • In-circuit reconfigurable 

• 84-503 pins • 84-599 pins 

• Performance: 104MHz • Performance: 104MHz 

• SRAM-based CMOS technology • SRAM-based CMOS technology 

• 5V operation • 3.3V operation 

• MultiVolt interface supports 3.3V • MultiVolt interface supports 5V and 2.5V 

• 0.5μm • Megafunction support 

• 0.35μm 

FLEX 8000 Family MAX 9000 Family 

• 2,500-16,000 usable gates • 6,000-12,000 usable gates 

• In-circuit reconfigurable • In-system programmable 

• 84-304 pins • 84-356 pins 

• Performance: 125MHz • Performance: 125MHz 

• SRAM-based CMOS technology • EEPROM-based CMOS technology 

• MultiVolt interface supports 3.3V • MultiVolt interface supports 3.3V 

• 0.5μm • 0.5μm-0.65μm 

MAX 7000/E Family MAX 7000/S Family 

• 600-5,000 usable gates • 600-5,000 usable gates 

• High pin-to-gate ratio • In-system programmable 

• 44-208 pins • High pin-to-gate ratio 

• Performance: 178MHz • 44-208 pins 

• In-system programmable • Performance: 178MHz 

• EEPROM-based CMOS technology • EEPROM-based CMOS technology 

• 0.65μm-0.8μm • 0.5μm-0.65μm 

MAX 5000 Family Classic Family 

• 600-3,750 usable gates • 200-900 usable gates 

• High register count • Zero-standby power 

• 24-100 pins • 24-68 pins 

• Performance: 83.3MHz • Performance: 100MHz 

• 0.65μm • 0.65μm 

The company also offers 64K, 213K, and 1M EPROMs designed to configure its FLEX devices, as well as maskprogrammed 

logic devices (MPLDs) for high-volume applications. MPLDs are pin-, function-, and timingcompatible 

with Altera’s PLDs and are available for all families. 


Altera North American Company Profiles 

Coinciding with the company’s migration from 0.8μm to 0.6μm in 1993, Altera moved from two to three layers of 

metal. Today, the FLEX10KA Family is based on a 0.35μm triple-layer metal process, and is expected to add a 

fourth layer of metal in 1997. The Michelangelo PLDs will be implemented in a 0.35μm EEPROM-based CMOS 

process with four-layers of metal. For future products with gate densities reaching 250,000 usable gates and 

above, Altera is developing a 0.25μm, five-layer metal process. 

Altera supplies proprietary software development systems (MAX+PLUS II) to support its PLD products. 


Altera has foundry agreements with Sharp, TSMC, Cypress, and Intel. It owns 17 percent of Cypress 

Semiconductor's wafer fab in Round Rock, Texas. Through this ownership, Altera has the right to buy a 

percentage of the wafers produced by Cypress approximately equal to the percentage of its ownership. 

In November 1995, Altera signed a letter of intent for joint ownership of a TSMC joint venture fab facility, located in 

Camas, Washington. Under the terms, Altera will invest $140 million to take an 18 percent equity stake in, and also 

gain the rights to 27 percent of the output from the new fab. Construction on the facility, called WaferTech, began 

in July 1996. Potential output from the plant is expected to be 7,500 200mm wafers per week, with production 

scheduled to start in 1998. Design rules will start at 0.35μm and migrate to 0.25μm. 


• In February 1996, Altera purchased a minority stake in I-Cube Inc., a privately held supplier of programmable 

switching and interconnect devices (PSIDs). 

1-18 


North American Company Profiles AMCC 


APPLIED MICRO CIRCUITS (AMCC) 

Applied Micro Circuits Corporation 

6195 Lusk Boulevard 

San Diego, California 92121-2729 

Telephone: (619) 450-9333 

Fax: (619) 450-9885 

Web Site: www.amcc.com 


Europe: Applied Micro Circuits Corporation • Munich, Germany 

Telephone: (49) (89) 92404-136 • Fax: (49) (89) 81213-180 


1992 1993 1994 1995 1996 

Sales 39 47 50 51 60 

Employees 275 300 310 270 255 


Established in 1979, Applied Micro Circuits Corporation (AMCC) develops, manufactures, and markets standard 

and application-specific high-speed, high-performance interface ICs for the communications, computer, 

instrumentation, and military markets. The privately-held company also offers a comprehensive line of low EMI, low 

skew precision clock products. 

AMCC is a leader in bipolar manufacturing and bipolar ECL logic arrays, the company’s focus in recent years has 

been shifting from ASICs to standard products, particularly chips for the telecommunications and networking 

markets, areas where bipolar’s high frequency characteristics can be exploited. 

Management 

David Rickey President and Chief Executive Officer 

Joel O. Holliday Chief Financial Officer 

Anil Bedi Vice President, Marketing 

Laszlo Gal Vice President, Engineering 

Darwin Slindee Vice President, Operations 

Thomas Tullie Vice President, Sales 

Brent Little Director, ASIC Products 

Carol Oster Director, Quality Assurance 


AMCC North American Company Profiles 


AMCC produces and sells bipolar and BiCMOS gate array and standard cell ASICs, custom bipolar IC products, and 

standard bipolar and CMOS products. 

The company’s portfolio of ASSPs for high-performance networking, clock/timing, and bus interface applications, 

and ASICs include the following: 

Sonet/SDH Interface Circuits PCI Bus Controllers 

Fibre Channel Interface Circuits Crosspoint Switches 

HiPPI Source and Destination Interface Circuits Clock Generators/Synthesizers 

Gigabit Ethernet Interface Circuits Clock Drivers 

ATM Interface Circuits ECL Terminator 

Q20000 Series ECL/TTL “Turbo” Logic Arrays 

MicroPower 3V, low power, bipolar, standard cell ASICs 

As part of its push into communications markets, AMCC redesigned its G3.0 bipolar process, obtained through a 

technology alliance with Plessey, to allow for 3.3V operation. Parts derived from the 1.0μm process can be 

operated at up to 2.4GHz. 


AMCC operates from a 120,000 square foot facility in San Diego, California, that includes a design center for 

customer design use and training, a Class 10 cleanroom for bipolar IC production, and an assembly and test facility. 

The company has established strategic foundry partners to augment its wafer supply. 

Applied Micro Circuits Corporation 

6195 Lusk Boulevard 

San Diego, California 92121 

Cleanroom size: 10,000 square feet (Class 10) 

Capacity (wafers/week): 1,200 

Wafer size: 100mm 

Processes: Bipolar, BiCMOS 

Products: ASICs, ASSPs, custom ICs 

Feature sizes: 1.0μm, 2.0μm, 3.0μm 

AMCC's capacity is only about half utilized and the company expects its current manufacturing resources to reach 

maximum levels in a few years. 

1-20 


North American Company Profiles AMD 


ADVANCED MICRO DEVICES (AMD) 

Advanced Micro Devices, Inc. 

One AMD Place 

P.O. Box 3453 


Telephone: (408) 732-2400 

Fax: (408) 774-7216 

Web Site: www.amd.com 


Europe: Advanced Micro Devices (UK) Ltd. • Firmley, United Kingdom 

Telephone: (44) (1276) 803100 • Fax: (44) (1276) 803102 

Japan: Advanced Micro Devices • Shinjuku-ku, Tokyo, Japan 

Telephone: (81) (3) 3346-7550 • Fax: (81) (3) 3342-5685 

Asia-Pacific: Advanced Micro Devices Far East Ltd. • Kowloon, Hong Kong 

Telephone: (852) 2956-0388 • Fax: (852) 2956-0588 


1992 1993 1994 1995 1996 

Sales 1,514 1,648 2,155 2,468 1,953 

Net Income 234 208 271 216 (69) 


Capital Expenditures 224 390 586 650 494 

Employees 11,674 12,203 11,994 12,981 12,181 


Advanced Micro Devices (AMD) was founded in 1969 and is today one of the largest U.S.-based merchant 

manufacturers of integrated circuits. With a focus on the personal and networked computing and communications 

markets, the company produces microprocessors and related peripherals, flash memories, programmable logic 

devices, and circuits for telecommunications and networking applications. 

AMD’s strategy is to be competitive only in those markets where it can be a leading factor. The company has been 

a major supplier of microprocessors since 1975, it is a leading supplier of non-volatile memories, a leader in ICs for 

local area networks and linecards for public communications applications, and is one of the largest suppliers of 

programmable logic devices. 


AMD North American Company Profiles 

In a move to significantly enhance its core competency in advanced microprocessor design, AMD acquired 

NexGen, Inc. for nearly $1 billion in early 1996. The acquisition brought together the engineering resources of 

NexGen and AMD’s sub-0.35μm process technology and manufacturing capability to enable AMD to offer future 

generations of microprocessors in a competitive timeframe. 

To address the unique requirements of the market for programmable logic devices (PLDs), AMD spun off its PLD 

operations in the second half of 1996 to form a new subsidiary business unit called Vantis Corporation (a separate 

profile of Vantis is included in this publication). Vantis will continue to rely on AMD for manufacturing services and 

plans to eventually become an independent company. 

AMD is organized into three product groups: the Communications and Components Group (CCG), the 

Computation Products Group (CPG), and Vantis Corporation. CCG products include flash memory devices, 

EPROMs, voice and data communications products, embedded processors, I/O devices, and network products. 

CPG products include microprocessors. Vantis products are high-speed PLDs. 

1-22 

Computation 

Products 

17% 

Management 

Vantis 

13% 


and Components 

70% 

1996 Sales by Product Group 

Asia-Pacific 

26% 

Europe 

27% 


47% 


W.J. Sanders III Chairman and Chief Executive Officer 

Richard Previte President and Chief Operating Officer 

Marvin Burkett Senior Vice President, Chief Financial and Administrative Officer and Treasurer 

Gene Conner Senior Vice President, Operations 

S. Atiq Raza Senior Vice President and Chief Technical Officer 

Stanley Winvick Senior Vice President, Human Resources 

Stephen Zelencik Senior Vice President and Chief Marketing Executive 

Donald M. Brettner Group Vice President, Manufacturing Services Division 

Vinod Dham Group Vice President, Computation Products Group 

Richard Forte Group Vice President, Communications and Components Group, and 

President and Chief Executive Officer, Vantis 

Gary O. Heerssen Group Vice President, Wafer Fabrication Group 

William Siegle Group Vice President, Technology Development Group, and Chief Scientist 

Terryll R. Smith Group Vice President, Sales and Marketing 

Benjamin M. Anixter Vice President, External Affairs 

Gary Ashcraft Vice President and GM, Communication Products Division 

Kathryn Brandt Vice President, Business Systems 

Randy Burdick Vice President, Information Technology Management 



Susan T. Daniel Vice President, Human Resource Operations 

James Doran Vice President, Technical Operations 

Tom Eby Vice President, Strategic Marketing, Communications and Components Group 

Curt Francis Vice President, Corporate Planning and Development 

Robert R. Herb Vice President, Strategic Marketing, Computation Products Group 

Larry Hollatz Vice President and GM, Texas Microprocessor Division 

Mike Johnson Vice President, Advanced Research and Development 

Robert M. Krueger Vice President and GM, Network Products Division 

Gerald A. Lynch Vice President, Sales and Marketing, Asia/Pacific-Japan 

Walid Maghribi Vice President and GM, Non-Volatile Memory Products Division 

Robert McConnell Vice President and GM, Logic Products Division 

Thomas M. McCoy Vice President, General Counsel, and Secretary 

Giuliano Meroni Vice President, Sales and Marketing, Europe 

Daryl Ostrander Vice President, Austin Wafer Fabrication 

Geoff Ribar Vice President, Finance, and Corporate Controller 

Jack Saltich Vice President and GM, European Microelectronics Center, Dresden 

Danne Smith Vice President, Corporate Quality 

Tom Stites Vice President, Communications 

Michael Van Buskirk Vice President, Engineering, Non-Volatile Memory Products Division 

Jerry Vogel Vice President and GM, California Microprocessor Division 


MOS MEMORY ANALOG 

DRAM Amplifier 

SRAM ✔ Interface 

✔ Flash Memory Consumer/Automotive 

✔ EPROM Voltage Regulator/Reference 

ROM ✔ Data Conversion 

EEPROM ✔ Comparator 

✔ Other (Including Non-Volatile RAM) Other (Includes Telecom) 

MOS LOGIC DIGITAL BIPOLAR 

✔ General Purpose Logic ✔ Bipolar Memory 

Gate Array ✔ General Purpose Logic 

Standard Cell Gate Array/Standard Cell 

✔ Field Programmable Logic ✔ Field Programmable Logic 

Other Special Purpose Logic Other Special Purpose Logic 

MOS MICROCOMPONENT 

✔ MPU/MCU/MPR 

✔ MPU OTHER 

✔ MCU Full Custom IC 

✔ MPR Discrete 

DSP Optoelectronic 



Microprocessor Products 

AMD-K6 MMX Microprocessors—Shipments of AMD’s sixth-generation K6 MMX microprocessor, the second 

member of AMD’s K86 family of superscalar RISC MPUs, began in the second quarter of 1997. The K6 has been 

designed to be competitive in performance with Intel’s forthcoming single-chip version of its Pentium Pro 

microprocessor, which is expected to be introduced in 1997. The 8.8-million-transistor device is based on AMD’s 

0.35μm five-layer-metal CMOSCS34 technology. The first versions in the K6 family operate at 166MHz, 200MHz, 

and 233MHz. A 266MHz version is expected in 2H97. In order to reach 300MHz, AMD plans to migrate the K6 to 

a 0.25μm process by the end of 1997, at the earliest. 

AMD-K5 Microprocessors—The first member of AMD’s K86 family, the K5 is a fifth-generation alternative to 

Intel’s Pentium. It is based on 0.35μm CMOS technology and is offered in five speed versions, the PR75, PR100, 

PR133, PR150, and PR166. The PR nomenclature suggests which specific higher-clock-rate Intel Pentium each 

of the members best compete with. Unfortunately, AMD was late in getting its K5 processor to market, and thus 

does not expect it to generate the levels of revenues achieved by the Am486 microprocessor over its product life. 

Am5x86 Microprocessors—The 5x86 is said to offer Pentium-class performance using a fourth-generation 

architecture. It is based on a 0.35μm CMOS process and runs at a quadrupled clock rate of 133MHz. 

Am486 Microprocessors—AMD’s 486DX4 microprocessors offer clock-tripled performance speeds of up to 

120MHz and feature “enhanced” power management capabilities. 

Embedded Processor Products 

For processing/control applications in communications, mobile computing, networking, mass storage, or industrial 

control systems, AMD offers its E86 Family of x86-compatible embedded processor products. The E86 family 

ranges from 16-bit MCUs to 32-bit MPUs, general purpose processors to “PCs on a chip.” The E86 family includes 

several versions of Am186/188 16-bit microcontrollers, Am386SX/DX and AM486DX 32-bit microprocessors, 

ElanSC300/310 32-bit microcontrollers based on a 386 core, and ElanSC400/410 32-bit microcontrollers based 

on a 486 core. 

With the success of its E86 family, AMD is putting less emphasis on its venerable 29K family of embedded RISC 

processors. AMD will continue to support current product designs and customers using its 29K products. 

However, development of new 29K devices has been discontinued. AMD cited the high cost of supporting the 

proprietary architecture as the reason for putting an end to the product line. 

Communications, Network, 

1-24 

and I/O Products 

AMD’s communications and networking products include ICs for public infrastructure, including subscriber line 

interface circuits (SLICs), subscriber line audio-processing circuits (SLACs), and ISDN controllers; ICs for 

networking, including FDDI chips and PCnet Ethernet LAN devices; ICs for data communications, including PCI 

small computer systems interface (SCSI) circuits, serial communications controllers (SCCs), and TAXIchip 

devices; and ICs for wireless communications, including CT2 PhoX controllers for digital cordless telephones 

and PCnet-Mobile devices for wireless LANs. 



Non-Volatile Memory Products 

Am29Fxxx Flash Memories—5.0V-only sector-erase flash memory devices available in densities ranging from 1M 

to 16M. Some devices are available in bare die form. 

Am29LVxxx Flash Memories—2.7V-only sector-erase flash memory devices available in densities ranging from 2M 

to 8M. Some devices are available in bare die form. 

Am29LLxxx Flash Memories—AMD’s new family of “zero-power” flash chips that incorporate new power 

management circuitry to lower current consumption in sleep mode to only 75nA. The first member of the 2.2Vonly 

sector-erase flash family is an 8M part. 

Am28Fxxx Flash Memories—This is the company’s first generation family of 5.0V/12.0V bulk-erase flash memory 

devices. They are available in densities ranging from 256K to 2M. 

EPROM Products—AMD’s CMOS UV and OTP EPROMs are offered in densities ranging from 64K to 4M. Lowvoltage 

versions are available in 1M and 2M densities. 

ExpressROM Products—These are standard EPROM die that are pre-programmed and then encapsulated in 

plastic packaging before delivery. They are offered in densities ranging from 64K to 8M. 

Programmable Logic Products 

The PLD products of Vantis include a variety of CMOS and bipolar programmable array logic (PAL) devices and its 

line of MACH (Macro Array CMOS High-Density) advanced complex PLDs (CPLDs). See individual profile of Vantis 

Corporation. 

Other IC Products 

The company’s other IC products include bipolar PROMs and RAMs, FIFO memories, high-performance CMOS 

and bipolar bus interface devices, transmission line drivers and receivers, and dynamic memory management 

circuits. 


AMD is building a $1.9 billion sub-half-micron semiconductor manufacturing facility in Dresden, Germany, for the 

manufacture of its K86 microprocessors. Groundbreaking took place in the fourth quarter of 1996, with 

production scheduled to start by the end of 1998. 

AMD and Fujitsu broke ground in late 1995 on their second joint-venture manufacturing facility in Japan, a $1.2 

billion fab for the production of flash memories. Initial output is expected in early 1998. 



Advanced Micro Devices Advanced Micro Devices 

5204 East Ben White Boulevard 5204 East Ben White Boulevard 

Austin, Texas 78741 Austin, Texas 78741 

Telephone: (512) 385-8542 Telephone: (512) 385-8542 

Fab 10 Fab 14 

Cleanroom size: 22,000 square feet (Class 100) Cleanroom size: 22,000 square feet (Class 10) 



Process: CMOS Process: CMOS 

Products: PLDs Products: Flash memories, EPROMs 

Feature size: 0.9μm Feature size: 0.8μm 

Advanced Micro Devices Advanced Micro Devices 

5204 East Ben White Boulevard 901 Thompson Place 

Austin, Texas 78741 Sunnyvale, California 94088 


Fab 15 Fab 17 and Submicron Development Center 





Products: Logic, telecom, and network ICs; Products: R&D, MPUs, flash memories 

MPUs; microperipheral ICs Feature sizes: 0.35μm-0.8μm 

Feature size: 0.7μm 

Advanced Micro Devices AMD Saxony Manufacturing GmbH 

5204 East Ben White Boulevard Dresden, Saxony, Germany 

Austin, Texas 78741 Fab 30 

Telephone: (512) 385-8542 Cleanroom size: 90,000 square feet 

Fab 25 Capacity (wafers/week): 6,000 

Cleanroom size: 86,700 square feet (Class 1) Wafer size: 200mm 

Capacity (wafers/week): 6,000 Process: CMOS 

Wafer size: 200mm Products: MPUs, logic ICs, R&D 

Process: CMOS Feature size: 0.25μm (0.18μm capability) 

Products: MPUs, logic ICs, flash memories (Expected to start production by the end of 1998.) 

Feature sizes: 0.35μm, 0.5μm (0.25μm capability) 

1-26 



Fujitsu AMD Semiconductor Ltd. (FASL) Fujitsu AMD Semiconductor Ltd. (FASL) 

Aizuwakamatsu, Fukushima Prefecture, Japan Aizuwakamatsu, Fukushima Prefecture, Japan 

FASL I FASL II 

Cleanroom size: 69,900 square feet (Class 1) Cleanroom size: 88,000 square feet 




Products: Flash memories Products: Flash memories 

Feature sizes: 0.35μm, 0.5μm Feature sizes: 0.25μm, 0.35μm 

(upgrading 0.5μm lines to 0.35μm) (Expected to start production in early 1998.) 

AMD’s back-end manufacturing facilities are located in Penang, Malaysia; Bangkok, Thailand; and Singapore. In 

1996, AMD began the construction of a new assembly and test facility in Suzhou, China. 


• Micron, Motorola, and AMD joined together with DuPont Photomasks Inc. (DPI) in 1996 to form a technology 

venture, called DPI Reticle Technology Center, to develop advanced mask technology and provide pilot line 

fabrication of leading-edge reticles. 

• AMD and Intel signed a new five-year cross-licensing agreement in early 1996 that gives the two companies 

rights to use each other’s patents and certain copyrights, excluding microprocessor microcode beyond the 486 

generation. 

• Fujitsu and AMD opened a large flash memory fabrication facility, called Fujitsu-AMD Semiconductor Ltd. 

(FASL), in Japan in September 1994. Production of flash memory chips began in 1Q95. FASL is currently 

building its second fab, also to be dedicated to flash memory production. The partnership also involves joint 

development of flash devices. 


AMI North American Company Profiles 


1-28 

AMERICAN MICROSYSTEMS (AMI) 

American Microsystems, Inc. 

2300 Buckskin Road 

Pocatello, Idaho 83201 

Telephone: (208) 233-4690 

Fax: (208) 234-6795 

Web Site: www.amis.com 


Japan: AMI-Japan • Nerima-ku, Tokyo, Japan 

Telephone: (81) (3) 5399-7831 • Fax: (81) (3) 5399-7834 

Europe: AMI-GmbH • Dresden, Germany 

Telephone: (49) (351) 31-99-1500 • Fax: (49) (351) 31-99-1501 


1992 1993 1994 1995 1996 

Sales 135 150 171 221 256 

Employees 1,685 1,657 1,265 1,265 1,439 


Established in 1966, American Microsystems Inc. (AMI) was a pioneer in the development of application specific 

ICs (ASICs). Today, the company's products and services range from digital and mixed-signal ASICs, to CMOS 

foundry services, application-specific standard products (ASSPs), and high-level integrated solutions through 

multichip modules. AMI currently specializes in producing both digital and mixed-signal systems on a chip and is 

the number one U.S. manufacturer of mask ROMs. 

The company is comprised of three business units and two divisions: the Mixed-Signal Business Unit, the Digital 

ASIC Business Unit, the Foundry Business Unit, the Standard Products Division, and the Multichip Products 

Division, which specializes in contract manufacturing solutions utilizing multichip modules. Each of the five units 

has the responsibility, along with the marketing and engineering resources needed, to sell its respective products 

and services. 

Recently, AMI's sales strategy underwent a significant shift from a primary focus on direct sales to increased 

reliance on the company's growing international network of manufacturer's representatives, distributors, and 

design centers. This network markets AMI's cell-based and gate array ASICs as well as its ROMs. 


North American Company Profiles AMI 

Standard 

Products 

9% 

Standard 

Cell 

9% 

Mixed Signal 

16% 

Multichip 

Products 

1% 

Gate Array 

31% 

Foundry 

34% 

1996 Sales by Business Segment 

In 1997, AMI released several wireless IC devices targeting the direct sequence spread spectrum (DSSS) IC 

market. The three devices include a transceiver, receiver-only, and a transmit-only device, and are designed for 

various applications including security systems and remote medical devices. 

Also during 1997, AMI acquired Focus Semiconductor, which is located in Gwynedd, Pennsylvania. Focus 

Semiconductor is a mixed-signal IC vendor who has used AMI as a foundry in the past. Focus will be folded into 

AMI as a separate business unit and remain in Pennsylvania. 

AMI's products serve markets such as telecommunications, consumer electronics, computer peripherals, military, 

industrial, and automotive equipment. 

Automotive 

6% 

Industrial 

9% 

Medical 

4% 

Consumer 

11% 

Military 

14% 

Other 

1% 


32% 

EDP 

23% 


Japan 

1% 

Europe 

3% 


95% 


ROW 

1% 

1996 Sales by Geographic Region

AMI North American Company Profiles 

Management 

Gerald "Jerry" E. Homstad President and Chief Executive Officer 

Harold Blomquist Senior Vice President, Business Operations 

Randy Cook Vice President, Multichip Products Division 

Paul Pimentel Vice President, Finance/Purchasing 

Tom Schiers Vice President, Digital ASICs 

Dan Schroeder Vice President, Operations 

Bob Smith Vice President, Standard Products Division 

Grant Hulse Director, New Business Development 

Chris Laytun Director, Mixed-Signal 

Al Morrison Director, Foundry 

Troy Murray Manager, Site Services 

John Rankin Manager, Japanese and Southeast Asian Sales 

Marv Yancey Manager, Sub-Micron Program 


AMI offers the following products and services: 

• Standard-cell and gate array digital ASICs 

• Mixed-signal ASIC development services 

• Mask programmable ROMs (16K to 16M density) 

• Digital and mixed-signal ASIC design software 

• Wireless ICs (include mask programmable system devices) 

• Foundry services 

• Contract design and manufacturing 

• Multichip modules 

• Custom packaging 

AMI's digital ASIC standard library, which supports both gate arrays and standard cells, contains over 500 cells and 

operates from 2.5V to 5.5V. The company’s arrays have up to 464,000 usable gates. 

AMI's mixed-signal processes allow the analog voltage to run from –5V to +5V or from 0V to 12V, and will 

accommodate a wide range of functions. 

The company's semiconductor products are fabricated using CMOS and NMOS process technologies, with 

geometries as fine as 0.35μm. 

1-30 


North American Company Profiles AMI 


AMI AMI 

2300 Buckskin Road Pocatello, Idaho 

Pocatello, Idaho 83201 Fab 10 




Processes: CMOS, NMOS Process: CMOS 

Products: ASICs, ROMs, telecom and datacom ICs, Feature sizes: 0.35μm-0.8μm 

MCMs, foundry services (Operations began in mid-1997) 

Feature sizes: 0.6μm-5.0μm CMOS; 

3.0μm-5.0μm NMOS 

AMI's facility in the Philippines performs sort and final testing, while assembly work is contracted out. 


• AMI has an alliance with WSI Inc. to jointly develop mask-programmable versions of WSI's line of microcontroller 

peripherals and both companies are separately marketing the complete range of devices. AMI is manufacturing 

the parts. 


Anadigics North American Company Profiles 


1-32 

ANADIGICS 

Anadigics, Inc. 

35 Technology Drive 

Warren, New Jersey 07059-5197 

Telephone: (908) 668-5000 

Fax: (908) 668-5068 

Web Site: www.anadigics.com 


Europe: Anadigics, Inc. • Somerset, England 

Telephone: (44) (1935) 822611 • Fax: (44) (1935) 826696 


1992 1993 1994 1995 1996 

Sales 20 29 35 51 69 

Net Income (2) 2 2 7 12 


Capital Expenditures 2 5 9 16 

Employees 115 200 270 320 430 


Anadigics was founded in 1985 when it initiated macrocell development. A year later, it completed construction of 

its wafer fab, and in 1987, started GaAs IC production with the introduction of both MMIC and fiber optic IC 

products. Today, the company is a leading designer and producer of GaAs ICs for high-volume, high-frequency 

receiver applications. The company launched its initial public offering in April 1995. 

The company had originally relied on defense contracts to survive. However, with lucrative military pacts becoming 

more of a rarity, Anadigics looked to the commercial and consumer electronics marketplaces to sell its products. 

Today, Anadigics has established itself as a leading supplier of high-volume, low-cost, high-performance analog 

GaAs ICs for applications including direct broadcast satellite (DBS) systems, cable TV systems, cellular phones, 

fiber optic communications, and personal communication systems (PCS). 


North American Company Profiles Anadigics 

Fiber Optics/ATM 

17% 

Management 

Engineering Services 

5% 

Cable TV 

20% 

Wireless 

35% 

Direct 

Broadcast Systems 

23% 


Asia-Pacific 

29% 


35% 

Europe 

36% 


Ron Rosenzweig President and Chief Executive Officer 

George Gilbert Executive Vice President and Chief Operating Officer 

Charles Huang, Ph.D. Executive Vice President, Market Research and Business Development 

John F. Lyons Senior Vice President and Chief Financial Officer 

Robert Baytuns Vice President, Research and Technology 

Sheo Khetan Vice President, Manufacturing 

Javed S. Patel Vice President, Marketing and Sales 

Phillip Wallace Vice President, Product Development 


Among the company's GaAs IC products are low-noise block converters and tuners for DBS systems, upconverter 

chips for use in cable TV converters, cellular telephone power amplifiers and receivers, and fiber optic (SONET) 

transimpedence amplifiers. Anadigics produces all of its ICs using its GaAs MESFET process. 


In October 1996, the company began to convert its existing fab from 3in to 100mm wafers and expects to 

complete the conversion by the end of 1997. The company is also in the process of constructing an additional 

facility for both manufacturing and administration purposes. The building, also located in Warren, New Jersey, will 

house a 12,000 square-foot Class 100 cleanroom that will manufacture 100mm GaAs wafers. Production at the 

new facility is not expected to begin before 4Q97. 

Anadigics, Inc. Anadigics, Inc. 

35 Technology Drive 141 Mt. Bethel Road 

Warren, New Jersey 07059-5197 Warren, New Jersey 07059 


Capacity (wafers/week): 500 Capacity (wafers/week): 500 


Process: GaAs MESFET Process: GaAs MESFET 

Feature size: 0.5μm (Production to begin in late 1997 or early 1998.) 


Analog Devices North American Company Profiles 


1-34 

ANALOG DEVICES (ADI) 

Analog Devices, Inc. 

One Technology Way 

P.O. Box 9106 

Norwood, Massachusetts 02062-9106 

Telephone: (617) 329-4700 

Fax: (617) 326-8703 

Web Site: www.analog.com 


Europe: Analog Devices, GmbH • Munich, Germany 

Telephone: (49) (89) 57005-0 • Fax: (49) (89) 57005-527 

Japan: Analog Devices, K.K. • Minato-ku, Tokyo, Japan 

Telephone: (81) (3) 5402-8210 • Fax: (81) (3) 5402-1063 

Asia-Pacific: Analog Devices Hong Kong, Ltd. • Hong Kong 

Telephone: (852) 2506-9336 • (852) 2506-4755 

Financial History ($M), Fiscal Year Ends October 31 

1992 1993 1994 1995 1996 

Sales 567 666 773 942 1,194 

Net Income 15 44 74 119 172 



Foundry Fab Investment — — — 14 49 

Employees 5,200 5,300 5,400 6,000 6,900 


Analog Devices, Inc. (ADI) was founded in 1965 and is today a leading designer and manufacturer of highperformance 

linear, mixed-signal, and digital integrated circuits that address a wide range of real-world signal 

processing applications. 

The company's products are typically incorporated by OEMs in equipment and systems for a variety of 

applications, including communications equipment; computers and computer peripherals; engineering, medical, 

and scientific instruments; factory automation equipment; military/aerospace systems; high-end consumer 

electronic products; and automotive equipment. 


North American Company Profiles Analog Devices 

Japan 

14% 

ROW 

13% 

Europe 

31% 


42% 


Analog Devices’ products can be divided into three groups: general purpose, standard-function linear and mixedsignal 

ICs (SLICs), including amplifiers and data converters; system-level ICs, including general-purpose digital 

signal processors (DSPs), special-purpose linear and mixed-signal ICs, and hard disk drive ICs; and assembled 

products such as hybrids and multichip modules. Integrated circuits accounted for 95 percent of the company's 

total revenues in fiscal 1996. 

Assembled Products 

5% 

System-Level ICs 

and DSP ICs 

38% 

Standard 

Linear ICs 

57% 


ADI's strategy is to focus on major opportunities for DSPs and system-level ICs as its primary sources of revenue 

growth, while at the same time, continuing its efforts to sell traditional SLIC product lines. Revenues from the 

company’s assembled products group has been declining for several years, primarily due to shrinking demand for 

hybrid devices. 

In addition, the company plans to continue to extend its core technologies to include new technologies, such as 

RF/IF signal processing for wireless communications applications and surface micromachining for automobile air 

bag system accelerometers. To support its move into the wireless communications market, Analog Devices 

acquired RF/IF circuits designer Mosaic Microsystems Ltd. of Kent, England, and its U.S. subsidiary Mosaic, Inc. in 

mid-1996. 



Management 

Ray Stata Chairman 

Jerald G. Fishman President and Chief Executive Officer 

Ross Brown Vice President, Human Resources 

Dennis Buss Vice President, Technology Development 

David D. French Vice President and General Manager, Computer Products Division 

Russell K. Johnsen Vice President and General Manager, Communications Division 

Robert R. Marshall Vice President, Worldwide Manufacturing 

Robert McAdam Vice President and General Manager, Standard Linear Products Division 

Brian P. McAloon Vice President, Sales 

Joseph E. McDonough Vice President, Finance, and Chief Financial Officer 

Joe Reichbach Vice President, Sales, North America 

Volkmar Schaldach Vice President, Sales and Marketing, Europe 

Shozo Sugiguchi Vice President, Sales and Marketing, Japan 

H. Goodloe Suttler Vice President, Marketing, Quality, and Planning 

Geoffrey R.M. Thomas Vice President and Manufacturing General Manager, ADSC 

Franklin Weigold Vice President and General Manager, Transportation and 

Industrial Products Division 


Analog Devices offers high-performance linear, digital, and mixed-signal ICs such as data converters, amplifiers, 

voltage references and comparators, signal processors and conditioners, application-specific ICs for the 

consumer, disk drive, telecommunications, and automotive industries, and temperature and accelerometer 

sensors. 

SLICs 

Analog Devices principal SLIC products are high-performance amplifiers and data converters. Other SLIC 

products include analog signal processing devices, voltage references, and comparators. High-speed 

products introduced in 1996 included the company’s first RF and IF SLICs, which operate at up to 2GHz. The 

company continues to expand its SLIC product line to include offerings in areas where it traditionally has had 

limited focus, primarily interface circuits and power management ICs, and to include a much larger number of 

products designed to operate from single-supply 3-volt or 5-volt power sources. 

System-Level ICs 

ADI’s system-level ICs include general-purpose DSPs and multi-function devices that feature high levels of 

functional integration on a single chip. All of the company’s DSPs share a common architecture and code 

compatibility. The company is aggressively pursuing the 32-bit floating-point DSP market with its line of 

SHARC products. In early 1997, its first low-priced SHARC DSP was announced. The ADSP-21061 

features high performance of 120 MFLOPS, 1M of on-chip dual-port SRAM, and 240 Mbytes/sec I/O 

bandwidth. 

1-36 

Most of the company’s other system-level ICs are mixed-signal devices (with some incorporating a DSP core) 

and special-purpose linear ICs generally designed to meet the needs of a specific application. The company 

also offers sensors and surface micromachined ICs. 



Assembled Products 

The company’s assembled products consist of hybrids, multichip modules (MCMs), and printed-board modules 

(primarily I/O modules used in industrial control and factory automation equipment). 

In addition to utilizing standard bipolar and CMOS process technologies, ADI employs a number of proprietary 

processes specifically tailored for use in manufacturing high-performance linear and mixed-signal SLICs and 

system-level ICs. 


Analog Devices meets most of its need for wafers fabricated using linear and mixed-signal processes with 

company-owned production facilities and uses third-party wafer fabricators for most wafers that can be produced 

on industry-standard digital processes. Its two principal foundries are Taiwan Semiconductor Manufacturing 

(TSMC) and Singapore’s Chartered Semiconductor Manufacturing. 

During 1995 and 1996, Analog Devices expanded its relationships with TSMC and Chartered in response to the 

rapid growth of its systems IC business. These transactions included an equity investment in Chartered, 

advanced payments to both Chartered and TSMC in order to secure access to future wafer capacity, and most 

significantly, the announcement of a joint venture agreement with TSMC and other investors to construct and 

operate a fab facility in Camas, Washington. ADI agreed to invest $140 million in the joint venture, called 

WaferTech, in return for an 18 percent equity ownership and up to 27 percent of the plant’s total output. 

Recent expansions of company-owned fabs have included the conversion of its Wilmington, Massachusetts, 

fabrication facility from 100mm to 150mm wafer production for high-speed linear devices. In addition, ADI is 

upgrading and modernizing the fab in Sunnyvale, California, it acquired from Performance Semiconductor in 

1995. Production at the fab was scheduled to begin in late 1996, but was delayed because of the slowdown in 

the market. 

In 1996, Analog Devices established a wafer fabrication facility in Cambridge, Massachusetts, dedicated to the 

development and production of the company’s surface micromachined ICs. The fab is located in a building 

previously used by Polaroid Corporation as an R&D fab. 

Analog Devices, Inc. Analog Devices, Inc. 

Semiconductor Division PMI Division 

804 Woburn Street 1500 Space Park Drive 

Wilmington, Massachusetts 01887 Santa Clara, California 95052 

Cleanroom size: 34,000 square feet Capacity (wafers/week): 1,750 

Capacity (wafers/week): 2,500 Wafer size: 100mm 

Wafer sizes: 100mm, 150mm Processes: CMOS, BiCMOS, bipolar 

Processes: CMOS, BiCMOS, bipolar Products: Linear and mixed-signal ICs 

Products: Linear and mixed-signal ICs, DSPs, ASICs Feature size: 1.5μm 

Feature sizes: 1.0μm CMOS 

1.5μm BiCMOS, bipolar 

4.0μm BiCMOS, complementary bipolar 



Analog Devices, Inc. Analog Devices Ireland, Ltd. 

610 East Weddell Drive Bay F-1, Raheen Industrial Estate 

Sunnyvale, California 94089 Limerick, Ireland 



Wafer size: 150mm Wafer sizes: 100mm, 150mm 

Processes: BiCMOS, complementary bipolar Processes: CMOS, BiCMOS 

Products: Linear ICs Products: Linear and mixed-signal ICs, ASICs 

(Acquired from Performance Semiconductor in 1995) Feature sizes: 0.6μm, 1.0μm, 2.0μm 

WaferTech, LLC 

Camas, Washington 



Process: CMOS 

Products: Foundry 

Feature sizes: 0.25μm, 0.35μm 

(Joint venture between TSMC, Analog Devices, Altera, 

and ISSI. ADI owns 18 percent. Scheduled to begin 

operations in late 1998.) 

Analog Devices has its own test and assembly facilities located in California, Massachusetts, North Carolina, 

Ireland, the Philippines, and Taiwan. 


• In early 1997, Analog Devices licensed TEMIC Semiconductors its ADSP-21020 DSP architecture. TEMIC will 

build radiation-tolerant versions of the high-performance 32-bit floating-point DSP. 

• ADI licensed its ADSP-21xx 16-bit digital signal processor core to AMD and Acer Laboratories (Taiwan) in early 

1996. AMD will embed the core in communications-related ICs and Acer Labs will use it for future PC telephony 

and telephone-answering devices. 

• Analog Devices announced a license agreement with Hitachi in February 1996 for Hitachi’s 16-bit 

microprocessor H8/300H core. ADI also has the option of licensing Hitachi’s next-generation H8S/2000 core. 

The core will be used by ADI’s Wireless Communications Division. 

• In early 1996, Aspec Technology licensed to Analog Devices its high-density ASIC architectures. The 

agreement includes Aspec’s family of embedded array and standard cell architectures, as well as associated 

design tools. 

• Analog devices entered an agreement with Noise Cancellation Technologies Inc. (NCT) to provide design and 

foundry services for NCT's first line of custom chipsets. 

1-38 



• Analog Devices is working with DSP Group to provide DSP Group's TrueSpeech voice compression 

technology on ADI's digital signal processors. 

• Analog Devices has an alliance with IBM in the joint design, production, and marketing of mixed-signal and RF 

ICs based on IBM's silicon-germanium (SiGe) process technology. 

• Analog Devices is developing surface micromachined accelerometers with Delco Electronics and Lockheed- 

Martin for both defense and commercial applications. 


Array Microsystems North American Company Profiles 

Employees 41 


1-40 

ARRAY MICROSYSTEMS 

Array Microsystems, Inc. 

1420 Quail Lake Loop 

Colorado Springs, Colorado 80906 

Telephone: (719) 540-7900 

Fax: (719) 540-7950 


Array Microsystems, a privately-held company, was founded in 1990 to design, develop, and market highperformance 

digital signal processing (DSP) products with a focus on video compression technologies and 

system level designs for multimedia applications. Array’s mission is to become the leading supplier of optimum 

performance, low-cost digital video chipset solutions for consumer and professional markets. 

Management 

Surendar S. Magar, Ph.D. President and Chief Executive Officer 

Tom Kopet Vice President, Systems Technology 

Matt Ready Vice President, Sales 

E. Flint Seaton Vice President and Chief Financial Officer 

Shannon Shen, Ph.D. Vice President, IC Technology 

David W. Still Vice President, Engineering 

Roger Westberg Vice President, Marketing 


Array Microsystems has developed a complete line of processor and controller ICs, SRAM memory modules, 

software simulators, and processor boards. The company's first product family, the a66, includes proprietary VLSI 

chipsets, development tools, and array processor boards that set industry performance standards for frequency 

domain processing. Array's two-chip video compression chipset, based on unique vector data flow architecture, 

forms the core of the VideoFlow product family. One of the chips is called an image compression coprocessor 

(ICC) and the other a motion estimation coprocessor (MEC). 


Array Microsystems is a fabless IC supplier. The company's devices are produced by other companies, including 

Samsung and Atmel. 


North American Company Profiles Array Microsystems 


• Array Microsystems has a technology development pact with Samsung that provides Array with a strong 

foundry partnership. The two companies codeveloped the initial VideoFlow video compression technology. 

The deal provides Array with access to Samsung's advanced 0.5μm and 0.35μm CMOS fab capacity for the 

manufacture of its products. In 1993, Samsung secured a 20 percent equity ownership position in Array 

Microsystems, and in mid-1995, Samsung increased its stake to 37 percent. 


Atmel North American Company Profiles 


1-42 

ATMEL 

Atmel Corporation 

2325 Orchard Parkway 

San Jose, California 95131 

Telephone: (408) 441-0311 

Fax: (408) 436-4200 

Web Site: www.atmel.com 


Japan: Atmel Japan K.K. • Chuo-ku, Tokyo, Japan 

Telephone: (81) (3) 5641-0211 • Fax: (81) (3) 5641-0217 

Europe: Atmel U.K. Ltd. • Camberley, Surrey, England 

Telephone: (44) (1276) 686677 • Fax: (44) (1276) 686697 

Asia-Pacific: Atmel Asia, Ltd. • Kowloon, Hong Kong 

Telephone: (852) 2721-9778 • Fax: (852) 2722-1369 


1992 1993 1994 1995 1996 

Sales 140 222 375 634 1,070 

Net Income 14 30 59 114 202 



Employees 998 1,250 1,900 2,900 3,900 


Atmel designs, manufactures, and markets a broad array of high-performance CMOS memory, logic, and analog 

integrated circuits. Founded in 1984, the company serves the manufacturers of communications equipment, 

computers, and computer peripherals as well as producers of instrumentation, consumer, automotive, military, and 

industrial equipment. Much of Atmel's ICs are based on its proprietary non-volatile memory technology. The 

company's name was derived from Advanced technology: memory and logic. 


North American Company Profiles Atmel 

Networking 

10% 

Consumer 

15% 

Military 

10% 

Computer 

Peripherals 

25% 


40% 


Europe 

20% 

North 

America 

39% 


Japan 

19% 

Asia 

22% 


Atmel is a leading supplier of EPROM, EEPROM, and flash memory components. Nevertheless, the company is 

shifting its focus away from being primarily a memory company toward having a balanced portfolio of memory and 

logic products. Still, the company hopes to continue expanding its share of the memory market even as logic 

products take over a larger share of its production capacity. 

EPROM 

21% 

MPR 

15% 

Logic 

(PLD, FPGA, ASIC) 

22% 

In-System 

Programmable 

Non-Volatile 

Memories* 

42% 

*Flash and EEPROMs 

1996 Sales by Device Type 

Atmel has made several acquisitions over the past few years in support of its core product lines, non-volatile 

memory and logic ICs. The company bought out FPGA supplier Concurrent Logic in 1993, acquired Seeq 

Technology's EEPROM product line in early 1994, and made a minority investment in SRAM producer Paradigm 

Technology in 1995 in return for certain SRAM product rights. In 1996, Atmel acquired an 8-bit RISC 

microcontroller architecture and design team from Nordic VLSI in Trondheim, Norway. Also in 1996, the company 

acquired DSP architecture and development from an organization called TSMC in Berkeley, California. 

The company’s most substantial acquisition came in April 1995, when it purchased a majority interest (75 percent) 

in the French IC manufacturer ES2. By the end of 1995, Atmel increased its ownership of the company to more 

than 90 percent and renamed it Atmel-ES2. Atmel is expanding Atmel-ES2’s existing fab facility and is 

constructing a new 0.35μm, 200mm wafer fab at the site that will be operational by late 1997.


Management 

George Perlegos Chairman, President, and Chief Executive Officer 

Gust Perlegos Executive Vice President and General Manager 

Tsung-Ching Wu Executive Vice President, Technology 

Bernard Pruniaux Chief Executive Officer, Atmel-ES2 Operations 

Chih Jen Senior Vice President and General Manager, Asian Operations 

Ralph Bohannon Vice President, Manufacturing 

Kris Chellam Vice President, Finance and Administration, and Chief Financial Officer 

James Hu Vice President, Process Development 

B. Jeffrey Katz Vice President, Marketing 

Ken Kwong Vice President, North American Sales 

Krish Panu Vice President, MCU, PLD, FPGA Operations 

Jack Peckham Vice President and General Manager, ASIC Operations 

Steve Schumann Vice President, Non-Volatile Products 

Mikes Sisois Vice President, Planning and Information Systems 

Graham Turner Vice President, European Operations 

Tashiki Wada Vice President, Atmel Japan 


Atmel's products are outlined below. 

NonVolatile Memory ICs 

• EPROMs—Standard, high-speed, and low-voltage parts ranging in density from 256K to 8M. 

• EEPROMs—Serial-interface parts ranging in density from 1K to 256K. 

—Parallel-interface parts ranging in density from 4K to 4M. 

• Flash memories—Single voltage supply (5V or 2.7V) parts ranging in density from 256K to 8M. 

Programmable Logic Devices and Field Programmable Gate Arrays 

• PLDs—Generic PAL-type ICs including fast, low-power, and 3V flash-based versions of the standard 

22V10, 16V8, and 20V8. 

—Complex PLDs with densities to 5,000 gates. 

• FPGAs—SRAM-based devices with 2,000 to 40,000 usable gates and very low power. Partial or full 

reconfiguration, in system, during normal operation. 

ASIC Devices 

• Gate arrays—High speed with up to 1.2 million routable gates. 

• RFID ASICs—Analog, digital, and memory on a single-chip ASIC. 

• Cell based ASICs—Mixed-technology. 

Other Products 

• Microcontrollers—Combine Intel's 80C51 core logic or Atmel’s proprietary AVR 8-bit RISC core logic with 

1K, 2K, 4K or 8K of Atmel's flash memory. 

• Standard logic devices—Multimedia system, controllers/chipsets. 

• Flash memory cards. 

• Spread spectrum cordless phone chipset. 

1-44 


North American Company Profiles Atmel 

Atmel uses proprietary CMOS and BiCMOS technologies for the processing of its chips. Most products are 

produced with 0.6μm and 0.5μm line widths. The company's newest Colorado Springs fab facility is capable of 

producing ICs with 0.35μm feature sizes, as is the not yet commissioned fab in Rousset, France. 


Atmel announced plans to build its next sub-half micron CMOS wafer fab facility, to be called Fab 8, adjacent to its 

existing Colorado Springs, Colorado facilities. The facility will house a 75,000 square-foot cleanroom. 

Atmel Corporation Atmel Corporation 

1150 East Cheyenne Mountain Boulevard 1150 East Cheyenne Mountain Boulevard 

Colorado Springs, Colorado 80906 Colorado Springs, Colorado 80906 


Fab 3 Fab 5 




Processes: CMOS, BiCMOS Process: CMOS 

Products: EEPROMs, EPROMs, flash memories, Products: EEPROMs, flash memories, EPROMs 

PLDs, FPGAs, ASICs, MCUs, linear ICs Feature size: 0.4μm 


Atmel-ES2 Atmel-ES2 

Zone Industrielle Zone Industrielle 

13106 Rousset Cedex 13106 Rousset Cedex 

France France 

Telephone: (33) (4) 42-33-40-0 Telephone: (33) (4) 42-33-40-0 

Fab 6 Fab 7 





Products: Cell-based ASICs, MCUs Products: Cell-based ASICs, MCUs 

Feature sizes: 0.6μm, 0.8μm, 1.0μm Feature sizes: 0.35μm, 0.6μm 

(Scheduled to start production by 3Q97) 

Atmel maintains a facility for IC test and qualification at its headquarters in San Jose and assembly work is 

performed offshore. 




• Atmel licensed “Oak” and “Pine” DSP core logic and development tools from DSP Group in 1996. 

• Atmel-ES2 licensed from Advanced RISC Machines in mid-1995, the ARM7DMI 32-bit RISC processor core 

and associated software tools. The company will develop standard Flash-based MCUs using this architecture. 

• Atmel and Paradigm Technology formed an alliance in May 1995 concerning Paradigm's SRAM products. 

Atmel provides manufacturing capacity for Paradigm's SRAMs in exchange for product rights. Atmel also 

purchased approximately 19 percent of Paradigm. The companies are developing new-generation SRAMs 

with speeds below 8ns. 

• Atmel has a cross-licensing and product exchange agreement with Philips Semiconductors covering several of 

each company's proprietary PLDs. 

• Atmel established an agreement with Wireless Logic Inc. of Hong Kong in 1994 that calls for the 

codevelopment and joint marketing of special-purpose DSP and microcontroller chipsets for the spreadspectrum 

wireless communications market. 

• Fuji Film Microdevices and Atmel are collaborating in the development of flash memory-based products such as 

ATA-interface memory cards. 

1-46 


North American Company Profiles Austin Semiconductor 


AUSTIN SEMICONDUCTOR 

Austin Semiconductor, Inc. 

8701 Cross Park Drive 

Austin, Texas 78754-4566 

Telephone: (512) 339-1188 

Fax: (512) 339-6641 

Web Site: austinsemi.com 


1993 1994 1995 1996 

Sales 7 14 19 21 

Employees 60 110 114 150 


Austin Semiconductor, Inc. (ASI) was founded in 1988 to supply high-reliability semiconductors and microcircuit 

devices to the military and aerospace industries. In 1993, privately-held ASI acquired the Micron Semiconductor 

Military Products Group, and now supplies standard memory chips to those industries. 

The company's business is currently divided into two distinct groups: a custom product line and a standard 

product line (consisting primarily of the former Micron products). At the end of 1996, about 70 percent of ASI's 

business was in memory products, with the balance in custom products. 

Management 

Roger C. Minard President and Chief Executive Officer 

H. Donald Ludwig Vice President and General Manager, Operations 

Marty Lanning Vice President, Marketing 

Ed Walker Director, Sales 


ASI's standard IC products include: 64K to 16M DRAMs, 64K to 4M SRAMs, and 1M VRAMs, as well as 

EEPROMs, flash memories, and SCSI interface processors. ASI also has the right to introduce military-grade 

versions of Micron's new products as they are brought out. 


Austin Semiconductor North American Company Profiles 

ASI's custom product capabilities include testing and packaging of a wide array of custom memory products, 

including DRAMs, SRAMs, EEPROMs, and flash memories, interface devices, and analog/digital communications 

products. ASI also offers devices manufactured using a silicon-on-sapphire (SOS) process. 


ASI is a fabless IC supplier, but maintains a Class 100 assembly, packaging, and test facility on site. As part of its 

purchase of Micron's military products group, ASI receives wafers from Micron. The firm also uses other major 

manufacturers for the fabrication of its product wafers. 

1-48 


North American Company Profiles Benchmarq 

BENCHMARQ MICROELECTRONICS 

Benchmarq Microelectronics, Inc. 

17919 Waterview Parkway 

Dallas, Texas 75252 

Telephone: (972) 437-9195 

Fax: (972) 437-9198 

Web Site: www.benchmarq.com 



1994 1995 1996 

Sales 23 29 40 

Net Income 2 4 7 

R&D Expenditures 2 3 

Employees 180 235 


Benchmarq Microelectronics, founded in 1989, has a worldwide presence in the power-sensitive and portable 

electronic systems marketplace. It provides integrated IC and module solutions that address real-world problems 

in managing battery-operated, low-power, and power-sensitive equipment. Benchmarq's products are adopted 

by companies producing PCs, cellular phones, telecommunications equipment, and portable electronics systems. 

In 1996, international sales accounted for approximately two-thirds of total sales. 

Management 

Derrell Coker Chairman 

Al Schuele President and Chief Executive Officer 

Wallace E. Matthews Chief Technical Officer 

Will Davies Vice President, Manufacturing and Product Development 

Reginald McHone Vice President, Finance and Administration, and Chief Financial Officer 

Jim Vernon Vice President, Sales 

Gene Armstrong Director, Product Development—Communication and Consumer Components 

David Freeman Director, Product Development—Industrial and Intelligent Peripherals 

David Heacock Director, Marketing and Corporate Communications 

Loren Reifsteck Director, Quality Technology and Assurance 

Eric Smith Director, Manufacturing Operations 


Benchmarq North American Company Profiles 


Benchmarq's product portfolio consists of CMOS and BiCMOS mixed-signal circuits. The focus is on low-power, 

battery-backed ICs and ICs for battery management. Geometries on its devices range from 0.8μm to 1.2μm. 

Benchmarq’s IC product families include: 

• Battery management ICs and modules that provide fast charge control, sophisticated battery conditioning, and 

“gas gauge” capacity monitoring of many different types of battery-operated systems. 

• Real-time clock ICs and modules, which provide highly integrated clock/calendar solutions for microcomputerbased 

designs. The RTCs are available with 3V or 5V operation. 

• Nonvolatile SRAM (nvSRAM) and PSRAM (nvPSRAM) ICs in densities ranging from 64K to 16M. 

• Nonvolatile controller ICs and modules that provide power monitoring, write protection, and supply switching to 

convert standard SRAM and a battery backup into a reliable, predictable nonvolatile memory. 


The company is fabless, relying instead on domestic and overseas foundries for wafer fabrication. Burn-in and test 

of ICs and value-added assembly of hybrid circuits is performed at the company's headquarters in Texas. 

1-50 


North American Company Profiles Burr-Brown 


BURR-BROWN 

Burr-Brown Corporation 

P.O. Box 11400 

Tucson, Arizona 85734-1400 

Telephone: (602) 746-1111 

Fax: (602) 889-1510 

Web Site: www.burr-brown.com 


Japan: Burr-Brown Japan Ltd. • Atsugi-shi, Kanagawa, Japan 

Telephone: (81) (4) 6248-4695 


1992 1993 1994 1995 1996 

Sales 163 169 194 269 220 

Net Income 1 3 6 29 30 



Employees 1,566 1,547 1,825 1,900 1,400 


Founded in 1956, Burr-Brown Corporation is primarily engaged in the design, manufacture, and marketing of a 

broad line of proprietary standard high-performance analog and mixed-signal ICs used in the processing of 

electronic signals. The company’s products are used in applications such as electronic and medical 

instrumentation, process and industrial control, communications, manufacturing automation, automatic test 

equipment, consumer audio, computer peripherals, and multimedia. 

Burr-Brown is moving away from its traditional focus on older IC processing technologies—primarily linear bipolar— 

and instead going in new directions such as CMOS and BiCMOS technologies. The company has also been 

strategically shifting some of its production to outside foundries, a trend that is expected to continue in order to 

access sub-micron CMOS technology. 

In early 1996, Burr-Brown sold its interest in Power Convertibles Corporation (PCC). PCC, formerly a majorityowned 

affiliate of Burr-Brown, manufactures DC-to-DC converters and battery chargers used in cellular telephone 

applications. The divestiture of PCC is part of Burr Brown’s strategic plan to build a stronger focus on its analog 

and mixed-signal IC business. New product development will focus on developing standard linear ICs (SLICs) as 

well as application-specific standard products (ASSPs). 


Burr-Brown North American Company Profiles 


15% 

1-52 

Computer and 

Multimedia 

6% 

Other 

4% 

Digital Audio and 

Video 

20% 

Industrial and 

Process Control 

30% 

Test and 

Instrumentation 

25% 

1996 Sales by Application 

Data Conversion ICs 

46% 

Analog ICs 

47% 


In 1995, Burr-Brown set new directions for its foreign operations. Burr-Brown’s Japanese development subsidiary 

is now concentrating primarily on the digital audio and other consumer markets, while the company’s Livingston 

Scotland operations has been re-directed from subcontract manufacturing to in-house product R&D. 

Management 

Europe 

26% 


34% 

Asia 

40% 


Thomas R. Brown, Jr. Chairman 

Syrus P. Madavi President and Chief Executive Officer 

Scott Blouin Vice President and Chief Financial Officer 

Michael Paugh Vice President, Quality 

Michael M. Pawlik Vice President, Marketing 

Paul Prazak Vice President, Data Conversion Division 

Robert E. Reynolds Vice President, Operations 

Bryan Rooney Vice President, Worldwide Sales 

R. Mark Stitt Vice President, Linear Division 

Charles Lewis General Manager, Scotland Division 

Toshiyuki Yamasaki President, Japan Operations 

Other 

7% 


North American Company Profiles Burr-Brown 


Burr-Brown's product portfolio includes operational, instrumentation, power, and isolation amplifiers, 

optoelectronic ICs, digital audio devices, digital-to-analog and analog-to-digital converters, data communications 

products, LAN products, microterminals, design and development software, and board-level microcomputer 

subsystems. The company’s products are manufactured using processes that include bipolar, complementary 

bipolar, CMOS, and BiCMOS. 

The following describes the various processes that Burr-Brown utilizes in the manufacture of its ICs. 

40 Volt Bipolar Process: 

This is a high-voltage (40V) bipolar process (±15V or 36V power supplies) used to make high-voltage 

operational and instrumentation amplifiers. High precision in these products is made possible by the capability 

of ion implanted JFETs and trimmable resistors. Other typical products made from this process are universal 

active filters, isolation amplifiers, and high-voltage power amplifiers. 

20 Volt Bipolar Process: 

This is a lower voltage (20V) bipolar process especially suited for data acquisition and PCM components. 

These are faster circuits utilizing smaller devices with lower Rc. Trimmable resistors allow high precision 

products. 

Dielectrically Isolated Bipolar Process: 

This is a dielectrically isolated high-voltage bipolar (40V) process used for low noise, high precision, and low 

drift. Very high-performance amplifiers are built using this process where the noise and drift characteristics are 

important, especially in the medical equipment markets that it serves. 

Complementary Bipolar Dielectrically Isolated Process: 

This is a dielectrically isolated process with complementary NPN and PNP bipolar transistors. It is used to 

manufacture high-voltage operational amplifiers, voltage-to-frequency converters, and sample/hold circuits. 

CMOS Double-Level Metal Poly-Poly Process: 

This is a 3.0μm double-level metal CMOS process that also makes use of parasitic bipolar devices. This is a ±5V 

process with compatible thin-film resistors and very high quality poly-poly capacitors. It produces high density, 

high precision (16-bit and 18-bit) single and dual analog-to-digital and digital-to-analog converters. 

BiCMOS Process: 

This double-poly, double-metal 3.0μm process is optimized for analog circuitry including critical thin-film resistor 

capability. The process is primarily used for data conversion products. 

Processes not available internally are sourced from various foundries, including Lucent Technologies, Mitel 

Semiconductor, Oki, Hualon Microelectronics, and Taiwan Semiconductor Manufacturing Co. (TSMC). Such 

processes include 2.0μm, 1.2μm, and 0.6μm BiCMOS and CMOS processes, and a very high-frequency bipolar 

process for products such as video amplifiers. 


Burr-Brown North American Company Profiles 


Burr-Brown Corporation 

6730 South Tucson Boulevard 

Tucson, Arizona 85706 

Cleanroom size: 30,000 square feet 

Capacity (wafer/week): 4,200 

Wafer size: 100mm (Planning conversion to 150mm wafers) 

Processes: CMOS, Bipolar, BiCMOS 

Products: Digital and linear ICs, monolithic and hybrid assembly 

Feature sizes: 2.0μm-3.0μm 

Burr-Brown has IC assembly facilities in Tucson and Scotland. The company also incorporated plastic multichip 

module (MCM) assembly capability in its Tucson facility in 1995. 


• Burr-Brown is jointly developing with Oki, 20-bit BiCMOS A/D and D/A converter chips for business digital audio 

equipment. 

1-54 


North American Company Profiles C-Cube Microsystems 


C-CUBE MICROSYSTEMS 

C-Cube Microsystems Inc. 

1778 McCarthy Boulevard 

Milpitas, California 95035 

Telephone: (408) 944-6300 

Fax: (408) 944-6314 

Web Site: www.c-cube.com 


Japan: C-Cube Japan • Yokohama, Kanagawa, Japan 

Telephone: (81) (45) 474-7571 • Fax: (81) (45) 474-7570 

Europe: C-Cube Microsystems • Crawley, West Sussex, United Kingdom 

Telephone: (44) (1293) 651100 • Fax: (44) (1293) 651119 

Asia-Pacific: C-Cube Microsystems International Inc. • Wanchai, Hong Kong 

Telephone: (852) 2511-6683 • Fax: (852) 2511-6939 


1992 1993 1994 1995 1996 

Sales 14 24 45 124 320 

Net Income (5) (1) 5 25 (73) 


Employees 112 140 254 669 


Founded in 1988, C-Cube Microsystems is a provider of highly integrated, standards-based, programmable digital 

video and still image compression products and systems. The company's innovative encoder, decoder, and 

codec products bring full motion video and still image capabilities to a broad range of end-user products in the 

consumer electronics, computer, and communications markets. Such products include video CD players, 

interactive game equipment, and computer add-in cards that allow full-motion video, desktop video conferencing 

systems, interactive digital cable TV systems, and direct broadcast satellite (DBS) systems. 


C-Cube Microsystems North American Company Profiles 

In 1995, C-Cube acquired Media Computer Technologies (MCT), a supplier of PC-based digital video processing 

and video-windowing technology. As a subsidiary of C-Cube, MCT is responsible for developing ASICs, 

reference designs, and application software, and contributing to development projects of C-Cube’s PC 

customers. In 1996, C-Cube acquired DiviCom Inc., a digital video networking company that designs, integrates, 

and markets complete systems for the delivery of broadcast video networks. DiviCom will operate as a wholly 

owned subsidiary of C-Cube. 

Management 

1-56 

U.S. 

33% 

International 

67% 


Alexandre A. Balanski, Ph.D. President and Chief Executive Officer 

Mark K. Allen Vice President, Operations 

James G. Burke Vice President, Finance and Administration, and Chief Financial Officer 

Brian T. Conners Vice President, Sales 

Alex Daly Vice President, Marketing 

Richard Foreman Vice President and Chief Information Officer 

Sai-Wai Fu Vice President, Hardware Engineering 

Didier Le Gall, Ph.D. Vice President, Research and Development 

Richard S. Rasmussen Vice President and General Manager, JPEG Division 

Senjeev Renjen, Ph.D. Vice President, Decoder Engineering 

Nolan Daines President and Chief Executive Officer, DiviCom Inc. 


C-Cube's single-chip and chipset products include: MPEG 1 video and audio/video encoders and decoders for 

consumer electronics applications; highly integrated MPEG 1 video and audio/video decoders, JPEG codecs, 

multistandard codecs, video conferencing codecs, and multimedia video processors for computer applications; 

and MPEG 2 video encoders and decoders and MPEG 2 transport demultiplexers for communications 

applications. In February 1997, C-Cube introduced the ZiVA family of single-chip DVD products, which include 

decoders, encoders, and system-level solutions for consumer and multimedia OEMs. 

C-Cube’s IC products are currently manufactured using two- or three-layer metal CMOS process technology with 

0.65μm, 0.5μm, or 0.35μm feature sizes. 

The company also markets a line of design example boards and demonstration systems products. 


North American Company Profiles C-Cube Microsystems 


C-Cube does not manufacture its own ICs; it uses independent foundries. The company’s principal IC foundry is 

Texas Instruments. Other foundry partners include Matsushita, Yamaha, TSMC, and Samsung. AMD is also a 

foundry partner, but it is not presently manufacturing products for C-Cube. Assembly, test, and packaging of its 

devices is also subcontracted to third parties. 

In 2Q96, C-Cube signed an agreement with foundry partner TSMC. As part of the agreement, C-Cube agreed to 

make advanced payments to secure wafer production capacity through 2001. 


• In October 1995, C-Cube licensed Sun Microsystems’ MicroSPARC processor core technology for use in a 

multifunction chip, to be introduced in 1997, intended for digital compression and decompression. 

• C-Cube entered into an agreement with Matsushita, JVC, and Sharp to jointly develop MPEG 1 and MPEG 2 

decoders. Matsushita also provides C-Cube with preferential access to its 0.5μm and 0.35μm manufacturing 

processes. In return, Matsushita has the rights to use and sell a limited amount of the decoders. 

• C-Cube has an agreement with TI under which TI provides C-Cube with foundry services in exchange for 

access to its core technology for use in creating derivative products. In addition, C-Cube has access to TI’s 

MPEG audio decoding technology on a reciprocal basis. C-Cube has a similar agreement with AMD. 


California Micro Devices North American Company Profiles 

1-58 

CALIFORNIA MICRO DEVICES (CMD) 


California Micro Devices Corporation 

215 Topaz Street 

Milpitas, California 95035-5430 

Telephone: (408) 263-3214 

Fax: (408) 942-9505 


1993 1994 1995 1996 1997 

Sales 30 27 36 40 33 

Net Income 1 (7) (31) 5 1 


Capital Expenditures 3 1 4 n/a 

Employees 247 273 229 297 300 


Founded in 1980, California Micro Devices (CMD) is a designer, manufacturer, and marketer of integrated thin-film, 

silicon-based termination and filtering passive components and active electronic circuitry. These products are 

targeted primarily at applications in the computer, networking, and communications industries. CMD exited the 

military market in 1996. 

Medical 

4% 

Instruments 

6% 

Auto 

3% 

Workstations 

16% 

Military 

2% 

Other 

3% 

PCs/Peripherals 

36% 

Communications/Networking 

30% 


Semiconductor 

Products 

33% 

Technology 

3% 

Thin Film Products 

64% 



North American Company Profiles California Micro Devices 

In 1996, CMD introduced its new line of thin-film P/Active devices, which combine the company’s thin-film 

technology with active semiconductor components and techniques to create enhanced passive networks called 

applications specific passive network (ASPN) products. With these products, CMD is striving to become an 

expert in the matters of high-performance termination systems for PCs, workstations, and networking equipment, 

as well as in the filtering and complimentary functions necessary in both computers and mobile communications. 

Foreign sales, primarily in Europe, Canada, and Asia, accounted for approximately 31 percent of net product sales 

in fiscal 1996. 

Management 

Wade Meyercord Chairman 

Jeffrey C. Kalb President and Chief Executive Officer 

Nick Bacile Vice President, Marketing 

Robert Filiault Vice President, Worldwide Sales 

John Jorgensen Vice President, Engineering 

Rao R. Penumarty Vice President and General Manager, Milpitas Operations 

Basker B. Rao, Ph.D. Vice President and General Manager, Tempe Operations 

Arieh Schifrin Vice President, Operations 

John E. Trewin Vice President and Chief Financial Officer 


CMD's thin-film products use silicon-based thin-film materials and process technology to combine multiple passive 

elements in a single package. They fall into two categories: the traditional IPEC family, consisting of custom and 

general purpose devices; and the new P/Active ASPN components, which use semiconductor techniques and 

devices to enhance the performance and functionality of its traditional thin-film passive technologies. Its first 

P/Active devices include termination devices for the Intel Pentium and Pentium Pro and Motorola Power PC 

processor buses, bias networks for Linear Technology’s and Harris’ PC voltage regulators, special diode clamping 

circuits for second-generation PCI, memory, and other computer buses, and filter circuits for parallel ports in PCs. 

CMD also offers a variety of precision and non-precision thin-film resistors and capacitors as well as combinations of 

those elements with and without semiconductor devices. The company has particular strength in the area of 

resistor-capacitor filters. 

The company's semiconductor products include analog and mixed-signal integrated circuits, such as data 

communications and interface devices and telecommunication dual tone multi-frequency (DTMF) receiver and 

transceiver products. These products are used in personal computers, answering machines, portable 

telephones, and switching systems. They are manufactured in 1.25μm through 3.0μm BiCMOS and CMOS 

processing technologies. 

CMD also offers the use of its Tempe fabrication facility as a foundry and test service. 


California Micro Devices North American Company Profiles 


CMD plans to convert certain of its fabrication facilities from 125mm to 150mm wafers during the next couple of 

years. 

California Micro Devices, Microcircuits Division California Micro Devices 

2000 West 14th Street 215 Topaz Street 

Tempe, Arizona 85281 Milpitas, California 95035-5430 



Capacity (wafers/week): 1,000 Capacity (wafers/week): 750 

Wafer size: 125mm Wafer sizes: 125mm, 4.5in square 

Processes: CMOS (SM/DP, DM/SP, DM/DP); Products: Thin-film discretes 

BiCMOS (SM/DP, DM/DP) 

Products: Linear and mixed-signal ICs, thin-film 

devices, foundry services 

Feature sizes: 1.25μm-3.0μm CMOS; 

1.25μm, 1.5μm BiCMOS 

The company uses subcontractors in Asia, primarily Thailand and the Philippines, for the assembly and packaging 

of most of its products. Most of its product testing is done in-house, but its assembly partners are increasingly 

being used for testing purposes. 


• California Micro Devices has a comprehensive strategic alliance with Hitachi Metals, Ltd. (HML), a subsidiary of 

Hitachi, Ltd., that involves joint IPEC product development, manufacturing, marketing, and worldwide 

distribution. Also under the alliance, HML holds a 10 percent stake in CMD. 

1-60 


North American Company Profiles Calogic 

Employees 200 


CALOGIC 

Calogic Corporation 

237 Whitney Place 

Fremont, California 94539 

Telephone: (510) 656-2900 

Fax: (510) 651-3025 


Calogic is a privately held company, founded in 1983. The company offers a line of standard and full custom 

semiconductor products made using several technologies including CMOS/DMOS and bipolar. Its product line is 

specifically designed for high-performance applications. The company strives to form relationships with its 

customers by offering technical expertise from design to processing to final test. 

Management 

Manny Del Arroz President 

Charlie Bevivino Director, Sales 

Brenda Hill Director, Marketing 


Calogic offers bipolar standard products (e.g., switches, multiplexers, and op amps) and CMOS, DMOS, and JFET 

full custom ICs. Calogic acquired a small signal discrete line from Harris and now offers one of the broadest small 

signal FET product lines in the industry. In addition, Calogic offers its production facilities as a foundry service. 

CRT Related Products : 

Video Products : 

CRT driver amplifiers (30MHz to 185MHz) Widebank buffers and amplifiers 

Pre-amplifiers 

Buffers 

Instrumentation Products : 

Full Custom and Semicustom Capabilities : 

Op amps Design, layout, manufacturing, and test 

References 

Analog switches 


Calogic North American Company Profiles 

Discretes : 

High-speed lateral DMOS FET switch and switch arrays (switching speeds under 1ns) 

Vertical MOS FET switches 

JFETs 

MOSFETs 

Diodes 

Calogic’s process technologies include a dielectrically isolated (DI) complementary bipolar process, a high 

frequency (1GHz), low-noise bipolar process, and a medium-voltage, medium-frequency, bipolar process for 

supply voltages up to ±20 volts. 


Calogic Corporation 

237 Whitney Place 



Capacity (wafers/week): 900 


Processes: CMOS, DMOS, bipolar 

Products: ASICs (gate arrays, full custom ICs); peripheral, linear, and logic ICs; discretes 


1-62 


North American Company Profiles Catalyst 


CATALYST SEMICONDUCTOR 

Catalyst Semiconductor, Inc. 

1250 Borregas Avenue 

Sunnyvale, California 94089 

Telephone: (408) 542-1000 

Fax: (408) 542-1200 


Japan: Nippon Catalyst K.K. • Tokyo, Japan 

Telephone: (81) (3) 5340-3781 • Fax: (81) (3) 5340-3780 

Europe: Catalyst Semiconductor, Inc. • Oxford, England 

Telephone: (44) (1865) 481-411 • Fax: (44) (1865) 481-511 

Asia-Pacific: Catalyst Semiconductor, Inc. • Taipei, Taiwan 

Telephone: (886) (2) 345-6192 • Fax: (886) (2) 729-9388 

Financial History ($M), Fiscal Year Ends April 30 

1992 1993 1994 1995 1996 * 

Sales 29 33 54 49 60 

Net Income (7) (2) (22) 2 4 


Employees 100 90 60 65 82 

*In February 1996, fiscal year changed from ending March 31 to April 30. 


Catalyst Semiconductor, established in 1985, designs, develops, and markets a broad range of nonvolatile 

memory IC products that have applications in the computer, consumer electronics, wireless communications, 

network, automotive, industrial, and instrumentation markets. 

The company's strategy is to become a leading supplier of flash memory devices while maintaining its position as a 

leading supplier of EEPROM products. The company’s development efforts are focused on improving its 

fabrication processes and the development of advanced products. During 1996, development work began on 

next-generation versions of its flash memory and EEPROM products. 


Catalyst North American Company Profiles 

Management 

1-64 

Europe 

21% 

Japan 

16% 

Far East 

23% 

United States 

40% 


C. Michael Powell Chairman, President, and Chief Executive Officer 

Chris Carstens Vice President, Quality and Reliability 

Heber Clement Vice President, Operations 

Scott Parker Vice President, Sales and Marketing 

Alan Renninger Vice President, Technology Development 

Daryl Stemm Vice President, Finance and Administration, and Chief Financial Officer 

Radu Vanco Vice President, Engineering 

Fred Leung Director, Strategic Marketing 

Richard Palm Director, Marketing 


Catalyst's family of nonvolatile devices includes flash memories (512K, 1M, 2M, 4M, and 8M), serial EEPROMs (1K 

to 64K), parallel EEPROMs (16K to 256K), battery-backed SRAMs, and NVRAMs (i.e., shadow RAMs and devices 

that combine EEPROM with SRAM). Catalyst also offers a line of BiCMOS data converters and other specialized 

products such as its application-specific electrically erasable devices (ASEEDs). 

Most of the company's products are designed and manufactured using a 1.0μm CMOS EEPROM process or a 

0.7μm flash memory process, however, the move to a 0.8μm CMOS EEPROM process and a 0.5μm flash memory 

process are currently under way. 


Through the establishment of long-term licensing agreements, Catalyst has contracts with Oki, Seiko Epson, 

Chartered Semiconductor, UMC, and Newport Wafer-Fab Ltd. for the fabrication of its devices. 


North American Company Profiles Catalyst 


• In 1996, Catalyst announced an agreement with United Microelectronics Corp. (UMC). As part of the 

agreement, UMC will take a 10 percent equity stake in Catalyst and will provide significant wafer foundry 

capacity. Also, UMC and Catalyst will jointly develop 0.5μm and 0.35μm process technologies, geared for flash 

memory products. 

• In November 1995, Catalyst signed a cross-licensing agreement with Intel. The agreement provides Catalyst 

with the right to utilize all of Intel’s flash memory patents. 

• Catalyst signed on Wales, U.K.-based Newport Wafer-Fab Ltd. in May 1995 for the manufacture of its 

EEPROMs and for process technology development. 

• Catalyst formed an alliance with Zilog that calls for the joint development of 20M and 40M 2.5-inch solid-state 

disk drives merging Catalyst's flash memory devices with Zilog's compression and controller technology. The 

two companies are also developing other devices combining flash and microcontroller technology. 


Cherry Semiconductor North American Company Profiles 

1-66 

CHERRY SEMICONDUCTOR 

Cherry Semiconductor Corporation 

2000 South County Trail 

East Greenwich, Rhode Island 02818-0031 

Telephone: (401) 885-3600 

Fax: (401) 885-5786 

Web Site: www.cherrysemiconductor.com 


Financial History ($M), Fiscal Year Ends February 28 

1992 1993 1994 1995 1996 

Corporate 

Sales 229 266 275 339 425 

Net Income 5 10 11 15 11 

Semiconductor 

Sales 36 45 56 75 99 

Net Income 3 5 7 11 5 


Employees 415 450 500 550 975 


Formed in 1972 as Micro Components Corporation, Cherry Semiconductor originally manufactured linear bipolar 

ICs with a focus on the photography market. In 1977, MCC was acquired by The Cherry Corporation and renamed 

Cherry Semiconductor Corporation (CSC). The market orientation of CSC began to include more automotive 

business as the photo market began to sag. In 1985, the company committed to two major market focuses: 

automotive and computer. Within these two markets, CSC focused further on four applications areas: dedicated 

automotive, power supply control, motor control, and memory management (high-performance disk drive circuits). 

In 3Q95, CSC was organized into three business groups: automotive OEM, automotive electronics, and 

computer and industrial. The companies global customer base includes automotive equipment manufacturers 

and suppliers, power systems suppliers and resellers, computer OEMs, and telecommunications systems 

manufacturers. 


North American Company Profiles Cherry Semiconductor 

Computer 

16% 

Management 

Telecom 

16% 

Automotive 

68% 

1996 Semiconductor Sales 

by End-Use Market 

Asia-Pacific 

14% 

Alfred S. Budnick President, Cherry Semiconductor 

Andrew F. Durette Executive Vice President 

Walter E. McMann Vice President, Finance and Administration 

Dennis Gaetano Director, Worldwide Sales and Marketing 


Europe 

5% 

United States 

81% 


by Geographic Region 

Cherry Semiconductor designs and builds standard linear and mixed-signal ICs and semicustom and full-custom 

ICs (ASICs). The company’s automotive ICs are most often custom designs, while its standard ICs are usually 

targeted at the computer market. 

CSC developed its high-performance PowerSense BiCMOS process for automotive circuits. It is a mixed-signal 

process that allows analog power functions and compact digital logic to be combined on a single chip. It uses 15 

masks and has five critical alignments. In addition, CSC has developed a 16-volt BiCMOS process for disk drive 

applications and a 2.5MHz bipolar process for computer applications. The firm’s bipolar processes feature vertical 

and lateral PNP transistors, up-down isolation, and low leakage diodes. 


Cherry Semiconductor Corporation 

2000 South County Trail 

East Greenwich, Rhode Island 02818 


Capacity (wafer/week): 2,500 

Wafer sizes: 100mm, 150mm 


Products: Linear and mixed-signal ICs and ASICs 



Cherry Semiconductor North American Company Profiles 


• Cherry Semiconductor works with Motorola to develop ASICs for the automotive industry. The two companies 

struck their first agreement in the late 1980's. 

1-68 


North American Company Profiles Chip Express 


CHIP EXPRESS 

Chip Express Corporation 

2903 Bunker Hill Lane, Suite 105 


Telephone: (408) 988-2445 

Fax: (408) 988-2449 

Web Site: www.chipexpress.com 


Europe/Middle East: Chip Express Ltd. • Haifa, Israel 

Telephone: (972) (4) 855-0011 • Fax: (972) (4) 855-1122 


1994 1995 1996 

Sales 10 18 28 

Employees 80 110 140 


Chip Express started its operations in 1990 when it was spun out from Elron Electronics Industries Ltd. (an Israeli 

high technology holding company). The company provides a complete “Time-to-Market Solution” featuring 

rapid turn application-specific integrated circuit (ASIC) products and services. The company offers flexible ASIC 

production with a seamless migration path for transferring a logic design from netlist to fast-turn prototypes and 

then to volume production. The company’s product, called LPGA (laser programmable gate array), is a customized 

gate array fabricated with a patented technology. 

The company’s product offering includes 24 hour laser prototypes, one week pre-production/low-volume 

qualities, and one month high-volume ASIC production. Rapid prototyping service is provided utilizing its 

proprietary QuICk ® laser micro-machining system to personalize one die at a time in less than two hours. Lowvolume 

production is provided using the OneMask ® technology to personalize a single wafer at a time with a single 

mask, in a single etch process of multi-layers. Cost-effective mass production is provided by implementing the 

same layout, using the TwoMask ® personalization technology at conventional fabs. 

Chip Express believes its ASIC design methodology combined with easy re-spin and fast turnaround time 

significantly reduces the product development cycle. The company provides complete design kits supporting 

popular EDA design environments, including Cadence, Viewlogic, and Synopsys. 


Chip Express North American Company Profiles 

Management 

Zvi Or-Bach President and Chief Executive Officer 

Howard Brodsky Chief Financial Officer 

Paul Indaco Vice President, Sales 

Uzi Yoeli Vice President, Research and Development (Chip Express Israel) 

Meir Janai Chief Scientist 


Chip Express offers CMOS gate arrays with densities that range from 4K to 125K gates. In 2Q96, the company 

introduced the new CX2000 gate array family, which features a 0.6μm triple metal device with approximately 200K 

gates plus configurable embedded memory of up to 128K bits. In 1Q97, the company introduced the next 

generation CX2001 product family with added features such as analog PLL, ATPG, and better access to memory. 

In addition, in 2Q97, the company developed a 0.5μm device. 

Planned for release during 1997 is the CX3000 product family featuring a 0.35μm triple-level-metal process 

technology, which is being co-developed with foundry partners. 


Chip Express provides prototyping and production services with on-site manufacturing. The company has a 

37,000 square foot facility that provides gate array prototyping and low volume production services. The laserbased 

QuICk System operates in a computer room, but the production areas within the machine are cleanroom 

environments. The prototype is personalized in a self-contained Class 100 laminar air flow cell. Chip Express uses 

base arrays that are manufactured by international gate array vendors and are compatible with their gate array 

families. For ASIC prototyping, the QuICk System disconnects the predefined links of multi-layer metal in a single 

operation with 20,000 per second. A real time computer and image processing system use the Cut-List to control 

the automatic laser cutting process. 

For low-volume ASIC production, Chip Express employs its OneMask technology. The OneMask operation is in a 

Class 10 cleanroom environment, processing a single wafer at a time, in a single etch step using only a single mask 

for personalization. 

The LPGA fabrication is provided by Tower Semiconductor and Yamaha. Additional foundry partners for the LPGA 

development include Sony, Seiko Epson, and Chartered Semiconductor Manufacturing. 

1-70 


North American Company Profiles Chips and Technologies 

Financial History ($M), Fiscal Year Ends June 30 

CHIPS AND TECHNOLOGIES 

Chips and Technologies, Inc. 

2950 Zanker Road 


Telephone: (408) 434-0600 

Fax: (408) 894-2082 

Web Site: www.chips.com 


1992 1993 1994 1995 1996 

Sales 141 98 73 105 151 

Net Income (64) (49) 3 9 26 


Employees 400 220 180 185 209 


Chips and Technologies (also known as Chips) supplies advanced semiconductor devices to the worldwide 

personal computer industry. The company has a product portfolio that includes display controllers, graphics 

accelerators, video devices, communications ICs, and system logic chipsets. These products are built into a wide 

range of systems from compact portables to high-performance desktop computers. 

Chips’ product strategy has taken several turns since it was founded in 1984. The company initially placed its 

primary focus on system logic chipsets and built up this particular business to represent 87 percent of total 

revenues in fiscal 1989. Chips’ annual sales in 1990 grew over 100 percent from that in 1988. However, the 

company’s logic chipset business took a turn for the worst and the company reported a net loss in 1991, the first 

since its inception. 

In an effort to move the company out of the red, Chips sold off several product lines in 1993 and implemented a 

plan to reorganize the company’s strategy. With its new objectives—to provide highly-integrated silicon and 

software solutions to the PC industry by creating unique, high-quality products—the company slowly turned 

around. 

Today, the focus of Chips is on single-chip systems for emerging markets such as graphics controllers for 

notebook PCs. Chips’ has been successful in building this business; its flat panel display graphics controllers 

represented 84 percent of total revenues in fiscal 1996. Future plans are to move beyond graphics, core logic, 

and I/O to add multimedia products, as well as more communications-related devices. 


Chips and Technologies North American Company Profiles 

Management 

1-72 


33% 

Asia and Europe 

67% 


James F. Stafford President and Chief Executive Officer 

Morris E. Jones, Jr. Senior Vice President and Chief Technical Officer 

Keith Angelo Vice President, Marketing 

Lee J. Barker Vice President, Operations 

Timothy R. Christofferson Vice President, Finance, and Chief Financial Officer 

Richard E. Christopher Vice President, Sales 

Lawrence A. Roffelsen Vice President, Engineering 

Jeffery Anne Tatum Vice President, General Counsel 


Chips' product line includes CRT and flat-panel graphics controller ICs, graphical user interface (GUI) accelerators, 

PC video circuits, I/O and peripheral controllers, and system logic chipsets. The company's LCD controllers have 

been well received by makers of industry-leading products in the laptop, notebook, and sub-notebook industries. 

In 1996, Chips’ introduced a line of LCD flat panel/CRT controllers and accelerators, called the HiQVideo family, 

which are based on a new 64-bit display graphics engine architecture and feature multiple window display, 

zoomed video, and full-motion video acceleration and scalability. 

Planned for release in 1997 is portable graphics controller chips with embedded DRAM, designed with foundry 

partner Samsung Semiconductor. The two companies announced in mid-1996 a plan to jointly develop 

integrated memory products as part of a plan by Chips to introduce a new generation of low-power, highbandwidth, 

and high-performance products that are software-compatible with its HiQVideo product family. 

The majority of Chips’ products are built using 0.6μm and 0.5μm triple-layer-metal CMOS processes. The 

company plans to utilize 0.5μm and 0.35μm process technology for many of its future products. 


North American Company Profiles Chips and Technologies 


Chips and Technologies uses subcontractors for the fabrication and assembly of its semiconductor components. 

Currently its foundry partners include Chartered Semiconductor, IBM, NEC, Samsung, LG Semicom, and TSMC. 


• Chips and Technologies signed a production agreement with Chartered Semiconductor. Chips agreed to pay 

Chartered $20 million for guaranteed production capacity support of 200mm wafers through 2000. 

• In fiscal 1996, Chips and Technologies established a long-term foundry agreement with TSMC. The 

agreement called for Chips to make deposits totaling $23.5 million to TSMC in exchange for a guaranteed wafer 

supply through 2000. 


Cirrus Logic North American Company Profiles 


Japan: Cirrus Logic K.K. • Tokyo, Japan 

Telephone: (81) (3) 3340-9111 


1-74 

CIRRUS LOGIC 

Cirrus Logic, Inc. 

3100 West Warren Avenue 

Fremont, California 94538-6423 

Telephone: (510) 623-8300 

Fax: (510) 226-2240 

Web Site: www.cirrus.com 


1993 1994 1995 1996 1997 

Sales 355 557 889 1,147 917 

Net Income 21 45 61 (36) (46) 



Joint Venture Investment — — 64 45 n/a 

Employees 1,353 1,854 2,331 3,500 2,600 


Cirrus Logic, founded in 1984, is a leading supplier of advanced integrated circuits for multimedia (graphics, video, 

audio), communications (modems, networking, high-speed I/Os), mass storage (magnetic hard disk and CD-ROM), 

and data acquisition. The company’s products and technologies focus on desktop, portable, and handheld 

computing systems, as well as industrial and consumer electronics. 

Cirrus Logic targets both emerging high growth markets and large existing markets that are undergoing major 

product or technology transitions. Cirrus Logic’s major customers consist of original equipment manufacturers 

(OEMs) of personal computers and PC add-in boards, as well as disk drive manufacturers. 


North American Company Profiles Cirrus Logic 

Mass Storage 

21% 


24% 

Graphics 

29% 

Crystal 

Semiconductor 

26% 

1997 Sales by Product Group (est) 

Europe 

7% 

Asia-Pacific 

34% 


40% 

1997 Sales by Geographic Region (est) 

From its initial public offering in 1989 through its fiscal year 1995, Cirrus Logic posted record revenue growth and 

was consistently profitable year after year. During this period, the company set industry growth records as it 

quickly reached the billion dollar revenue run rate. This rapid growth was challenged in fiscal year 1966, as the 

company faced a combination of softening market conditions, a delayed transition to new products, and a 

diversion of engineering resources to support manufacturing at a dozen foundries around the world. As a result, 

Cirrus Logic posted its first-ever losses in fiscal 1996. This prompted the company to streamline operations and 

intensify its focus on key product development within its core competencies of multimedia, communications, and 

mass storage. A workforce reduction and the divestiture of non-core businesses was also included in its 

streamlining efforts. 

Cirrus Logic has invested substantially in R&D and in the acquisition of key technologies to develop its “systems in 

silicon’’ expertise. Past acquisitions include Pixel Semiconductor (1991), Crystal Semiconductor Corporation 

(1991), Acumos Inc. (1992), Pacific Communication Sciences, Inc. (1993), PicoPower Technology, Inc. (1994), 

the 3D graphics chip technology of Austek Microsystems (1994), and the graphics and disk interface IC 

businesses of Appian Technology (1994). The intellectual property gain from these acquisitions, combined with 

Cirrus Logic’s on-going research and development, have enabled the company to broaden and deepen its 

technology portfolio in the areas of mixed-signal design, digital audio, graphics acceleration, 

modulation/demodulation algorithms, and digital wireless communications. 

As part of the company’s streamlining efforts in fiscal 1996, certain acquisitions were divested, including 

PicoPower Technology (sold to National Semiconductor in May 1996), PCSI’s Wireless Infrastructure Equipment 

Group (sold to ADC Telecommunications in December 1996), and PCSI’s Wireless Semiconductor Group (sold to 

Rockwell Semiconductor Systems in January 1997). 

In early 1997, Cirrus Logic set up a new organizational structure under which came the establishment of the Office 

of the President and the integration of the company’s product operations into four divisions: Personal Computer 

Products—which includes all graphics/video products from the former Graphics Company, the PC audio products 

from Crystal Semiconductor, and the PC modem chipsets from the former Personal Systems Division; 

Communications Products—which includes the WAN and LAN networking products from Crystal Semiconductor, 

and adds enterprise networking and Internet access chip solutions from the former Personal Systems Division; 

Mass Storage Products—which includes magnetic hard disk and CD-ROM products; and Crystal Semiconductor 

Products—which includes products from the former Industrial Products Division of Crystal. 


Japan 

19%


Management 

Michael L. Hackworth President and Chief Executive Officer 

Suhas S. Patil Chairman and Executive Vice President, Products and Technology 

George Alexy Chief Products and Marketing Officer, and Office of the President 

Thomas F. Kelly Chief Operating Officer and Office of the President 

Michael L. Canning President, Mass Storage Products Company 

William W.Y. Chu President, Graphics Company 

James H. Clardy President, Crystal Semiconductor Corporation 

Robert V. Dickson President, Graphics Company 

Edward Ross President, Worldwide Manufacturing 

William D. Caparelli Senior Vice President, Worldwide Sales 

Kenyon Mei Senior Vice President and GM, Personal Systems Business Unit 

Robert F. Donohue Vice President and Chief Legal Officer 

Patrick Boudreau Vice President, Human Resources 

Thomas P. Rigoli Vice President, Corporate Communications 

Halappa Ravindra Vice President, Research and Development 

Ron Shelton Vice President, Finance, and Chief Financial Officer 


Multimedia Graphics/Video 

Cirrus Logic’s graphics/video chip solutions provide high-performance 2D/3D acceleration and full-motion 

video for mainstream personal computing for both desktop and portable applications. During fiscal 1997, the 

company introduced its Laguna3D graphics accelerator, the industry’s first graphics chip solution to employ 

the Rambus memory architecture. Cirrus Logic was also one of the first to sample and demonstrate a 3D 

graphics chip solution incorporating Intel’s AGP (accelerated graphics port). As Cirrus Logic continues to 

expand its family of Rambus-based Laguna3D chips, the company is also working closely with Microsoft on the 

“Talisman” initiative, which will result in a DirectX, Rambus-based, hardware reference design for 2D and 3D 

graphics, video, and advanced audio functionality. This reference design is expected to facilitate the 

deployment of Talisman-driven motherboard implementations and graphics accelerator cards beginning in 

calendar year 1998. 

Multimedia Audio 

Cirrus Logic offers one of the industry’s most advanced audio chip solutions for multimedia PCs through its 

Crystal Semiconductor subsidiary in Austin, Texas. Crystal has distinguished itself as a leading supplier of 16bit 

stereo codecs for PCs, pioneering the use of delta sigma technology in 1988, and enabling 16-bit PC 

audio with a single-chip codec in 1991. In 1995, Crystal developed the first single-chip audio solution that 

complied with Windows 95, and in 1996 its leadership continued with the integration of 3D sound into a 

single-chip solution for PC motherboards. Crystal recently announced the PC industry’s first single-chip 

solution integrating PCI-compliant 3D audio acceleration and Dolby AC-3 decoding. The company’s portfolio 

of multimedia audio chips include solutions for audio processing for consumer products such as digital audio 

tape, digital compact cassettes, and automotive sound systems. 

1-76 


North American Company Profiles Cirrus Logic 


Cirrus Logic launched the industry’s first two-chip intelligent fax/data/voice modem in 1992. More recently, 

the company introduced a high-performance, three-chip version as part of its FastPath Telephony Platform. 

The chipset, which employs a 32-bit Advanced RISC Machines (ARM) processor, is software configurable to 

accommodate high-speed 56 Kbps Internet access, using the x2 protocol from U.S. Robotics. By simply 

downloading software, the FastPath platform can be upgraded to conform to the worldwide 56 Kbps standard 

when it is established. In addition to its powerful family of modem chips, Cirrus Logic also offers high-speed 

serial and parallel I/O devices for multi-channel, multi-protocol communications. Moreover, through its Crystal 

Semiconductor subsidiary, the company is a leading supplier of monolithic T1/E1 line interface circuits, CMOS 

Ethernet LAN line interface circuits, and infrared interface circuits. 

Mass Storage 

Cirrus Logic is a leading supplier of chips that perform the key control function in the most advanced hard disk 

drives. The company’s controllers comply with AT (IDE), PCMCIA, SCSI, and high-speed SCSI2 standards. 

Cirrus Logic began offering read-write electronics for disk drives in 1993, and was the first supplier to provide 

Partial Response Maximum Likelihood (PRML) data-detection technology in its ICs. The company’s most 

recent PRML chip solutions enable 3.5-inch hard disk drives to achieve more than 1G per platter area density 

using thin-film read heads. The company’s line of hard-drive controller chips also features “ID-less” 

technology that can increase the capacity of a hard-disk drive by up to 10 percent. In 1996, Cirrus Logic 

introduced high-speed encoder/decoder chips for next generation CD-ROM applications. These new 

encoders support CD-Recordable/Erasable (CD-R/E) capabilities, which lets the end-user record, erase, and 

re-use the CD. Available in SCSI interface and ATAPI interface versions, the encoders also support the 

industry’s fastest 18x read and 8x record speeds. 

Data Acquisition 

Through its Crystal Semiconductor subsidiary, Cirrus Logic has established a broad line of analog-to-digital 

converters consisting of general-purpose and low-frequency measurement devices. The family includes 

more than twenty products used in industrial automation, instrumentation, medical, military, and geophysical 

applications. 

The majority of Cirrus Logic's IC products are manufactured using 0.8μm, double-layer-metal CMOS and 0.6μm, 

triple-layer-metal CMOS process technologies, although some use other CMOS processes (high and low voltage), 

while others use BiCMOS or GaAs processes (for RF chips). 


In 1994, Cirrus Logic made a move to abandon its completely fabless approach by forming a joint venture with IBM 

to manufacture ICs for both companies at one of IBM's East Fishkill, New York, fab facilities. The venture is 

operating as a separate company, named MiCRUS (see Key Agreements). 

In late 1995, Cirrus Logic announced a program to expand its manufacturing infrastructure, emphasizing both fab 

ownership and foundry relationships that target 0.35μm and 0.25μm process capabilities. The program called for 

the company to invest approximately $2 billion over a five-year period. In early 1997, the amount was reduced by 

half. 



The initial phase of the program resulted in the expansion of MiCRUS and the formation of Cirent Semiconductor, 

a new joint venture with Lucent Technologies, that operates within an existing Lucent wafer manufacturing facility 

in Orlando, Florida. Cirent is 40 percent owned by Cirrus Logic and 60 percent by Lucent Technologies. The two 

firms will equally split the production output of the new 200mm wafer facility, which is initially focusing on 0.35μm, 

with plans to migrate to 0.25μm processing in 1998. 

With both of its joint manufacturing ventures now in production, Cirrus Logic has reduced its dependence on 

foundries. Whereas the company used a dozen foundries before the joint ventures, the company now depends 

on less than half that number to meet its production needs. Cirrus Logic continues to nurture its foundry 

relationships, which include long-standing relationships with TSMC and UMC. 

Under a foundry venture agreement with UMC and two other U.S. semiconductor companies, a new company, 

United Silicon, Inc., has been formed in Hsinchu, Taiwan. Production at the new fab is scheduled to commence in 

1Q98. Meanwhile, Cirrus Logic will expand its current relationship with TSMC to include a long-term purchase 

agreement. 

MiCRUS Cirent Semiconductor 

1580 Route 52 9333 South John Young Parkway 

Hopewell Junction, New York 12533 Orlando, Florida 32819 





Products: DRAMs, MPRs Products: ASICs, MPRs 

Feature sizes: 0.35μm-0.6μm Feature sizes: 0.35μm, 0.5μm 

(Joint venture with IBM Microelectronics. (See Key Agreements.) 

See Key Agreements.) 


• In 1996, Cirrus Logic entered into a licensing agreement with U.S. Robotics that gave the company rights to 

use U.S. Robotics’ x2 protocol for high-speed (56 Kbps) access. Cirrus Logic’s proprietary line of FastPath 

modem chipsets is software configurable. 

• Cirrus Logic licensed the Rambus high-performance DRAM interface architecture in early 1995. The license 

gives Cirrus the right to use the Rambus interface in its graphics controllers. 

• Cirrus Logic is licensed to embed Advanced RISC Machines' ARM processor in its future ICs for 

communications, computer, consumer, and other applications. 

• IBM and Cirrus Logic formed a joint manufacturing venture called MiCRUS in 1994. IBM and Cirrus Logic own 

52 percent and 48 percent of MiCRUS, respectively. Volume production of logic chips for Cirrus and memory 

ICs for IBM began in mid-1995. The agreement does not include product and/or technology exchange. In 

1996, Cirrus Logic entered into a similar joint venture agreement with Lucent Technologies to form Cirent 

Semiconductor in Orlando, Florida. In each joint venture, Cirrus Logic has rights to 50 percent of the 

manufacturing output. 

1-78 


North American Company Profiles Crosspoint Solutions 


CROSSPOINT SOLUTIONS 

Crosspoint Solutions, Inc. 

694 Tasman Drive 


Telephone: (408) 324-0200 

Fax: (408) 324-0123 


With equity funding from ASCII Corporation, Crosspoint Solutions was founded in 1989 to develop a fieldprogrammable 

replacement for standard gate arrays. A proprietary cell and routing architecture, coupled with a 

unique interconnect technology, enables Crosspoint to meet the performance and density demands of the 

mainstream CMOS gate array market. Crosspoint was one of the first companies offering a field-programmable 

challenge to gate arrays. 

Management 

Robert N. Blair President and Chief Executive Officer 

Thomas Chan Vice President, Manufacturing 

John Daws Vice President and Chief Financial Officer 

Scott Graham, Ph.D. Vice President, Technology Development 

Michael Levis Vice President, Business Development and Product Marketing 


The gate array granularity and transistor-level interconnect of Crosspoint's FPGA are made possible by the 

company's proprietary cell and routing architecture and a unique antifuse technology. An antifuse is a 

programmable switch that has a very high impedance initially, but exhibits a low resistance after programming. 

Crosspoint's unique antifuse fabrication technique provides antifuse elements with very low capacitance and low 

"on" resistance. This translates directly to higher operating speed. The programming is permanent and nonvolatile, 

resulting in one-time-programmable (OTP) devices. 

In 1996, Crosspoint unveiled its CP20K CrossFire family of FPGAs. The CP20K series consists of six gate 

density options covering the 2.2K to 20K range with I/O counts ranging from 91 to 250. The FPGAs are 

manufactured using a high-performance 0.6μm two-layer-metal CMOS process and are architecturally compatible 

with standard mask-programmable gate arrays. 


Crosspoint Solutions North American Company Profiles 

Also in 1996, Crosspoint announced its CoreBank program for realizing system-level FPGAs. CoreBank 

comprises a rich library of systems building blocks developed by Crosspoint Solutions and its CoreBank program 

partners. CoreBank includes digital signal processing, communications, computer, and networking cores, as well 

as a large selection of functions ranging from register files to interface circuits. 


Crosspoint has a long-standing foundry partnership with Hitachi. LG Semicon was added on in 1996 as a foundry 

partner (see Key Agreements). 


• In 1Q96, Crosspoint gave LG Semicon limited licensing, manufacturing, and marketing rights to its CP20K 

FPGA architecture in exchange for foundry access to LG’s 0.8μm and 0.6μm two- and three-layer-metal IC 

technology. 

1-80 


North American Company Profiles Cypress Semiconductor 


CYPRESS SEMICONDUCTOR 

Cypress Semiconductor Corporation 



Telephone: (408) 943-2600 

Fax: (408) 943-2796 

Web Site: www.cypress.com 


Japan: Cypress Semiconductor Japan K.K. • Shinjuku-ku, Tokyo, Japan 

Telephone: (81) (3) 5296-0781 • Fax: (81) (3) 5269-0788 

Europe: Cypress Semiconductor International • Waterloo, Belgium 

Telephone: (32) (2) 357-02-20 • Fax: (32) (2) 357-02-30 

Asia-Pacific: Cypress Semiconductor Singapore • Singapore 

Telephone: (65) 735-0338 • Fax: (65) 735-0228 


1992 1993 1994 1995 1996 

Sales 272 305 406 596 528 

Net Income (21) 8 50 102 53 



Employees 1,529 1,262 1,423 1,859 2,171 


Founded in 1983, Cypress Semiconductor is a designer, developer, and manufacturer of high-performance digital 

integrated circuits for a variety of markets including networking, military, computers, telecommunications, and 

instrumentation. Cypress’ product offerings include SRAMs, EPROMs, specialty memories, programmable logic 

devices (PLDs), data communications products, PC chipsets, timing devices, and USB microcontrollers. 


Cypress Semiconductor North American Company Profiles 

Suffering its first revenue decline in 1992, Cypress initiated a restructuring program. From the company's 

beginning, it had been known for its niche-market strategy of acquiring and managing smaller autonomous 

businesses. That approach, however, has been modified to take advantage of Cypress' lowered manufacturing 

costs, allowing the company to compete effectively in high-volume markets such as the PC market. Cypress has 

also turned to a more market-driven focus. 

Restructuring activities included the selling of its SPARC processor subsidiary, Ross Technology, to Fujitsu and 

the realignment of its subsidiaries Aspen Semiconductor and Multichip Technology under the company's four 

business units (today there are five): the Memory Products Division (MPD), the Programmable Products Division 

(PPD), the Data Communications Division (DCD), and the Computation Products Division (CPD). Cypress also 

made a few strategic acquisitions, including Seattle-based IC Designs, Inc., a supplier of clock-frequency 

synthesis chips for the PC market, and the high-speed FCT logic product line from Performance Semiconductor. 

1-82 

International 

27% 


73% 


Programmable 

Products 

19% 

Data Communications 

and Computation 

Products 

30% 

Memory 

Products 

51% 

1996 Sales by Product Division 

During 1996, Cypress experienced a decline in sales due to price erosion in the memory market, but still had a 

profitable year. Cypress entered 1997 with a reinforced strategy to continue developing new products and 

processes utilizing its proprietary technologies to address the needs of its target markets as well as enter new 

markets in order to reduce its dependence on specific markets. 

Several strategic activities took place at Cypress during the late-1996 to early-1997 timeframe. Cypress entered 

the microcontroller market in late 1996 with its first 8-bit RISC-based family of universal serial bus (USB) 

microcontrollers. Designed for use in peripherals and hub products, the MCUs integrate digital logic, analog, 

PROM, SRAM, and microcontroller logic. 

In early 1997, Cypress announced the creation of the Non-Volatile Memory Division that will focus directly on the 

EPROM market. The creation of this business unit reinforces the company’s commitment to remain a key player in 

the EPROM market. 

Also in early 1997, Cypress announced that it would no longer market its FPGA products. As part of a new 

agreement with QuickLogic (see Key Agreements), Cypress will no longer be a second-source for QuickLogic’s 

FPGA products and will only produce FPGA devices for QuickLogic. Cypress will redirect its efforts toward its PLD 

products. For 1997, the company plans to reach the 20,000 gate level. 



Another market Cypress entered in the first part of 1997 was the slow-speed SRAM market. In March 1997, 

Cypress rolled out a family of ultra-low power, slow asynchronous SRAM devices that feature access times of 70ns 

and range from 1.65V to 5V. The devices are manufactured using Cypress’ proprietary six-transistor (6T), 0.5μm 

RAM3 process technology. 

Management 

Pierre Lamond Chairman 

T.J. Rodgers President and Chief Executive Officer 

Antonio Alvarez Vice President, Research and Development 

Dan Barrett Vice President, European Sales and Marketing 

Lou Chetaud Vice President, Worldwide Manufacturing 

Bernard Glasauer Vice President, Quality and Reliability Assurance 

Emmanuel Hernandez Vice President, Finance, and Chief Financial Officer 

Larry Jordan Vice President, Marketing 

Jeff Kaszubinski Vice President, Memory Products Division 

Paul Keswick Vice President, New Products Division 

Jim Kupec Vice President, Products Division 

Jeff Linden Vice President, Non-Volatile Memory Division 

Lothar Maier Vice President, Worldwide Wafer Manufacturing 

J. Daniel McCranie Vice President, Sales and Marketing 

Christopher Norris Vice President, Programmable Logic Division 

Rich Parker Vice President, North American Distribution 

John Ramacciotti Vice President, Procurement 

Sean Salehi Vice President, Management Information Systems and 

Chief Information Officer 

R. Michael Starnes Vice President, Process Technology 

Joyce Sziebert Vice President, Human Resources 

Bruce Threewit Vice President, Systems Development 

John Torode Vice President, Computer Products Division 

Ron Treadway Vice President, Data Communications Division 

William Verde Vice President, Strategic Accounts 

Michael Villott Vice President, North American Sales 


Highlights of Cypress Semiconductor's product portfolio are given below. Its integrated circuits are fabricated 

using proprietary 0.5μm, 0.65μm, and 0.8μm CMOS and BiCMOS technologies. 

SRAMs Specialty Memories and Memory Modules 

• 4K to 1M CMOS SRAMs • Industry-standard FIFOs 

• 64K and 256K BiCMOS SRAMs • Bidirectional FIFOs 

• 1K and 16K ECL SRAMs • Clocked FIFOs 

• 64-bit x 18 cache tag RAMs • Asynchronous FIFOs 

• 128K and 256K cache RAMs • Dual-port RAMs 

• Memory accelerator MCMs 


Cypress Semiconductor North American Company Profiles 

UltraLogic PLDs/Tools Industry-Standard PLDs 

• Flash370 CPLDs (44-288 pins) • 20-pin CMOS/BiCMOS PLDs 

• Development tools • 16V8 GAL-compatible PLDs 

• 22V10 flash/BiCMOS PLDs 

• MAX CPLDs (28-84 pins) 

PROMs/EPROMs Data Communications 

• 4K to 512K CMOS PROMs • HOTLink point-to-point communications 

• 4K-1M CMOS EPROMs • Fast Ethernet, Fibre Channel, and ATM/ 

SONET transceivers/receivers 

Timing Technology Products Logic and Bus Products 

• Motherboard frequency synthesizers • FCT logic chips 

• Low-power system logic devices • VMEbus controllers 

• Graphics frequency synthesizers • ECL-TTL translators 

• Programmable products • Bit slice/multipliers 

• Custom oscillators • Programmable skew clock buffers 

• Pentium clock synthesizers/drivers • Low-skew clock buffers 


In 3Q96, Cypress announced its decision to restructure its Fab I facility. Previously, Fab I was used for lowproduction 

but now is used for research and development purposes only. Also during 3Q96, Cypress put 

construction of Fab V, which began in 1995, on hold until market conditions look more favorable. 

Cypress Semiconductor Inc. Cypress Semiconductor (Texas) Inc. 

3901 North First Street 17 Cypress Drive 

San Jose, California 95134 Round Rock, Texas 78664 


Fab I Fab II (17 percent owned by Altera) 




Processes: CMOS, BiCMOS Processes: CMOS, BiCMOS 

Products: R&D Products: SRAMs, PLDs, FPGAs, EPROMs, 

Feature sizes: 0.35μm-0.8μm datacom ICs 


1-84 



Cypress Semiconductor (Minnesota) Inc. Cypress Semiconductor (Minnesota) Inc. 

2401 East 86th Street 2401 East 86th Street 

Bloomington, Minnesota 55425 Bloomington, Minnesota 55425 


Fab III Fab IV 




Processes: CMOS, BiCMOS Processes: CMOS, BiCMOS 

Products: SRAMs, PLDs, FPGAs, logic chips, Products: SRAMs, specialty memories 

datacom ICs Feature size: 0.5μm 


Cypress Semiconductor 

Round Rock, Texas 

Fab V 


Capacity (wafers/week): 5,000 (when fully equipped) 


Processes: CMOS, BiCMOS 

Products: SRAMs, EPROMs, Logic ICs 


(Production tentatively scheduled for 1998) 


• In February 1997, Cypress and QuickLogic announced the cancellation of a previous joint-develop, licensing, 

and foundry agreement for high-performance FPGA products and released plans for establishing a new 

foundry alliance. As part of a new five-year agreement, Cypress will no longer market and sell antifuse FPGA 

products, but will continue to serve as a foundry for QuickLogic’s FPGAs. In addition, QuickLogic agreed to 

purchase all of Cypress’s existing FPGA inventory. Cypress holds a stake of less than 10 percent in 

QuickLogic. 

• In 2Q96, Cypress settled its PLD litigation with AMD with a cross-licensing agreement. 

• Cypress expanded its agreement with Altera Corporation regarding Altera's MAX 5000 EPLD line to bring a 

family of smaller, faster devices to market. 


Cyrix North American Company Profiles 


1-86 

CYRIX 

Cyrix Corporation 

2703 North Central Expressway 

Richardson, Texas 75080-2010 

Telephone: (214) 994-8388 

Fax: (214) 699-9857 

Web Site: www.cyrix.com 


Japan: Cyrix K.K. • Kohoku-ku, Yokohama, Japan 

Telephone: (81) (45) 471-1661 • Fax: (81) (45) 471-1666 

Europe: Cyrix International, Ltd. • Swindon, Wiltshire, United Kingdom 

Telephone: (44) (1793) 417777 • Fax: (44) (1793) 417799 

Asia-Pacific: Cyrix International, Ltd. • Hong Kong 

Telephone: (852) 2485-2285 • Fax: (852) 2485-2920 


1992 1993 1994 1995 1996 

Sales 73 125 246 228 184 

Net Income 8 20 38 16 (26) 


Capital Expenditures* 7 15 24 80 13 

Employees 150 220 309 400 391 

*As part of the agreement made with IBM in early 1994, Cyrix purchases substantially all of the equipment required 

by IBM to manufacture Cyrix products. 


Founded in 1988, Cyrix Corporation designs, develops, and markets high-performance x86 software-compatible 

microprocessors for the desktop and mobile computer markets. The company seeks to serve the needs of the PC 

marketplace as an alternative source for x86 microprocessors of original design with competitive 

price/performance characteristics. 


North American Company Profiles Cyrix 

Fiscal 1996 was a difficult year for Cyrix financially. The transition from the old 486 product line to the 6x86 

processor did not occur as quickly as expected. The 6x86 was recognized with numerous awards for its 

exceptional processing power, but it did not gain broad market acceptance until late in the year. Significant 

demand for the 6x86 was experienced in 4Q96. 

Plans for 1997 include a focus on promoting the company’s 6x86 while managing a transition to a successor 

product, code-named M2. The M2 will feature significant architectural enhancements and will be fully compatible 

with multimedia extension (MMX) technology. In addition, Cyrix has developed a new product called the 

MediaGX processor that is targeted at the sub-$1,000 consumer PC market. The MediaGX integrates audio, 

video, and certain system functions within the processor unit, providing a complete system solution. Cyrix also 

designed the entire reference system for the MediaGX to accelerate market acceptance and enable quick time-tomarket 

for manufacturers. 

Asia-Pacific 

24% 

Europe 

30% 


46% 


Cyrix has strategic alliances with IBM Microelectronics and SGS-Thomson Microelectronics for the production of its 

high-performance microprocessors. These agreements support the company's current strategy to focus its 

resources on product design, market development, and customer support. 

Management 

Harvey B. Cash Chairman 

James W. Swent* Chief Financial Officer and Acting Chief Executive Officer 

Kenneth B. Edoff Senior Vice President, Sales 

Kevin C. McDonough* Senior Vice President, Engineering 

Mark W. Bluhm Vice President, Strategic Planning and Business Development 

Nancy B. DeChaud* Vice President, Manufacturing 

Russell N. Fairbanks, Jr. Vice President and General Counsel 

Robert D. Maher Vice President, Engineering 

Lewis R. Paceley Vice President, Marketing 

Richard Rippeteau Vice President, Sales, Americas 

Everett J. Roach Vice President, Sales, Asia-Pacific 

Stephen A. Tobak Vice President, Corporate and Channel Marketing 

*Office of the President 


Cyrix North American Company Profiles 


Cyrix’s first products were math coprocessors. The company delivered its first x86 microprocessors in 1992. It 

then moved quickly to develop a full line of 486 processors with advanced power management, clock-doubling 

capabilities, integrated math coprocessors, and write-back cache. In 1995, Cyrix introduced its fifth-generation 

5x86 and sixth-generation 6x86 high-performance processors (the 486 products are no longer in production). 

Cyrix’s 6x86 (formerly called the M1) is based on a superscalar, superpipelined architecture and a RISC core. The 

6x86 is offered at several performance levels ranging from PR133+ to PR200+. The PR+ nomenclature suggests 

which specific higher-clock-rate Intel Pentium each of the members best compete with. 

Launching of the company’s M2 processor was scheduled to occur in May 1997. Building on the 6x86 core, the 

six-million-transistor M2 features Cyrix’s fully compatible MMX technology, a quadrupled (64KByte) internal cache, 

enhanced memory management, and other architectural and performance innovations. The M2 is claimed to 

deliver up to twice the performance of the 6x86 processors on 32-bit applications. Meanwhile, the development 

of the seventh-generation processor, called the M3 or 7x86, is under way. 

Cyrix began shipping its first MediaGX processors in early 1997. Due to the number of functions integrated onchip, 

the MediaGX eliminates the need for L2 cache, memory controller, graphics controller, graphics memory, and 

audio card. Although not socket compatible with competing Pentium processors with MMX, Cyrix’s 120MHz and 

133MHz MediaGX processors have equivalent Winstone 97 performance to Intel 120MHz and 133MHz 

processors. The MPU interfaces with the Cyrix-designed Cx5510 core logic chipset that provides a PCI-ISA 

bridge. By the end of 1997, the MediaGX is expected to reach 200MHz. 

The company currently uses 0.35μm five-layer-metal CMOS technology for its 6x86 products. The initial MediaGX 

processor is being produced with IBM’s 0.44μm three-layer-metal CMOS process, with a 0.4μm process 

scheduled for implementation by the end of 1997. The M2 is being produced with IBM’s 0.33μm five-layer-metal 

CMOS process. 


Cyrix currently has relationships with IBM Microelectronics and SGS-Thomson for the manufacture of its ICs. SGS- 

Thomson has been a manufacturing partner of Cyrix since October 1990. In early 1994, their pact was extended 

and is now valid through the end of 1997. The two companies are said to be negotiating another extension. 

Most, if not all, the 6x86 production by SGS-Thomson is currently being sold under the ST name and not sold 

back to Cyrix. 

Cyrix's agreement with IBM Microelectronics was established in April 1994 and is good through the end of 1999. 

As part of the agreement, Cyrix made a capital equipment investment of about $88 million in an IBM fab in 1995. 

Cyrix expanded its partnership with IBM in May 1996 to increase the quantity of wafers supplied by IBM through 

the end of 1997. 

1-88 


North American Company Profiles Cyrix 

To complement its partnerships with SGS-Thomson and IBM, Cyrix is negotiating to sign up a third manufacturing 

partner. However, the arrangement will likely be for foundry supply only. IBM and SGS-Thomson are licensed to 

also produce Cyrix-designed x86 processors under their own names. 

The construction of its own fabrication facility is not part of the company’s current business plan. However, the 

option is not being ruled out. A jointly owned fab is a more likely option. 


• In 1Q96, Cyrix announced an agreement with Cadence Design Systems. Under the agreement, Cadence will 

provide a broad range of technologies and services to Cyrix, and work together in designing Cyrix’s seventhgeneration 

x86 microprocessor, called the M3. 

• Cyrix extended its wafer supply agreement with SGS-Thomson in 1994. Under the new arrangement, SGS- 

Thomson increased the number of wafers it produces for Cyrix and is allowed to make a certain percentage of 

those same wafers for itself. In addition, Cyrix granted SGS-Thomson the right to use certain Cyrix-designed 

chips as part of SGS-Thomson’s ASIC libraries. SGS-Thomson is allowed to produce and sell such ASIC 

products under its own name in unlimited quantities, with Cyrix receiving royalties from the sale of the devices. 

Also, Cyrix has the right to sell the SGS Thomson-designed ASICs under its own name. 

• Cyrix and IBM announced a five year agreement in early 1994 under which IBM is manufacturing Cyrix's x86compatible 

microprocessors. The agreement calls for the two companies to equally share the output of the 

Cyrix-designed chips. 


Dallas Semiconductor North American Company Profiles 


1-90 

DALLAS SEMICONDUCTOR 

Dallas Semiconductor Corporation 

4401 South Beltwood Parkway 

Dallas, Texas 75244-3292 

Telephone: (972) 371-4000 

Fax: (972) 371-3715 

Web Site: www.dalsemi.com 


Europe: Dallas Semiconductor • Birmingham, England 

Telephone: (44) (121) 782-2959 • Fax: (44) (121) 782-2156 

Asia-Pacific: Dallas Semiconductor Taiwan • Taipei, Taiwan 

Telephone: (886) (2) 698-3940 • Fax: (886) (2) 698-3941 


1992 1993 1994 1995 1996 

Sales 120 157 181 233 288 

Net Income 18 26 30 37 38 



Employees 696 748 850 1,000 1,300 


Founded in 1984, Dallas Semiconductor designs, manufactures, and markets high performance CMOS ICs and 

semiconductor-based systems that provide innovative and cost-effective solutions to electronic design problems 

in a wide range of markets. The company's continuous new product development strategy serves as a means to 

increase future revenues and avoid dependence upon a single industry, market, or customer. Its products are 

sold to OEMs in the personal computer and workstation, scientific and medical equipment, industrial control, 

automatic information, telecommunications, and other markets. 


North American Company Profiles Dallas Semiconductor 

Management 

Computing 

33% 


33% 

Industrial 

34% 


Europe 

19% 


51% 



Asia 

30% 

Charles Vincent Prothro Chairman, President, and Chief Executive Officer 

Chao C. Mai, Ph.D. Senior Vice President 

Michael L. Bolan Vice President, Marketing and Product Development 

Alan P. Hale Vice President, Finance 

F.A. Scherpenberg Vice President, Computer Products 


Dallas Semiconductor's product groups include: 

• Timekeeping circuits • Microcontrollers (8-bit) 

Commercial Secure MCUs 

Computing High-speed MCUs 

• Non-volatile RAMs (16K to 4M) • Automatic Information 

Integrated battery backup Cryptographic iButton 

Intelligent sockets iButton 

• Telecommunications ICs • System extension circuits 

T1 and E1 circuits CPU supervisors 

SCSI terminators Digital potentiometers 

Thermal and battery management 

• Silicon timed circuits 

In 1996, Dallas’ Automatic Information product division introduced a device called the Cryptographic iButton. The 

device is said to provide safer transfer of sensitive information such as credit card numbers or electronic transfer of 

funds. The device consists of a processor, an arithmetic accelerator, a true time clock, a random number 

generator, and 8K of SRAM.

Dallas Semiconductor North American Company Profiles 


Dallas Semiconductor 

4401 South Beltwood Parkway 

Dallas, Texas 75244-3292 



Wafer size: 150mm (2 lines) 

Process: CMOS 


1-92 


North American Company Profiles Digital Semiconductor 


DIGITAL SEMICONDUCTOR 

Digital Equipment Corporation 

Digital Semiconductor 

77 Reed Road 

Hudson, Massachusetts 01749 

Telephone: (508) 568-6868 

Web Site: www.digital.com/semiconductor 

Captive IC Manufacturer 

1992 1993 1994 1995 1996 

Corporate 

Sales 13,931 14,371 13,451 13,813 14,563 

Net Income (2,796) (251) (2,156) 122 (112) 

Semiconductor* 

Sales 230 240 270 305 375 

Internal Sales 230 235 245 255 290 

External Sales — 5 25 50 85 


*Calendar year 


Digital Equipment Corporation (DEC) is one of the world's largest manufacturers of computers and computerrelated 

products. The company provides network computer systems, systems integrator, computer peripheral 

equipment, software, and associated computer accessory equipment to customers in more than 100 countries. 

DEC began developing semiconductor products in 1975 for use in its electronic systems. In 1993, Digital 

expanded its semiconductor charter to become a merchant vendor. As part of its push into the merchant market, 

DEC spun out its semiconductor operation in mid-1994 to become an autonomous business unit, called Digital 

Semiconductor. For the past several years, Digital Semiconductor has worked to establish itself as an 

independent semiconductor vendor, but its largest customer always has been Digital Equipment, which bases its 

workstations and servers on its proprietary high-performance RISC microprocessor, called Alpha. Still, the 

company desires to expand its merchant focus. 

Digital Semiconductor designs, manufactures, and markets a broad portfolio of semiconductor products including 

its Alpha processor and PCI-based networking, bridge, and graphics/multimedia devices. 


Digital Semiconductor North American Company Profiles 

Management 

Robert B. Palmer President and Chief Executive Officer 

Charles F. Christ Vice President and General Manager, Components Division 

R.E. Caldwell Vice President, Digital Semiconductor 

William N. Johnson Vice President, Marketing, Digital Semiconductor 


Digital Semiconductor’s IC products include its Alpha 64-bit RISC microprocessors with speeds as fast as 533MHz; 

the high-performance, low-power StrongARM 32-bit RISC microprocessor; PCI-compliant system and peripheral 

logic chipsets; PCI-PCI bridge devices; Ethernet and Fast Ethernet LAN controller ICs; and graphics and 

multimedia coprocessors. 

Digital’s Alpha 21164 microprocessor is available in speed grades ranging from 366Hz to 533Hz. It is designed for 

use in high-performance computing systems like network servers and workstations. A 600MHz version of the 

21164 entered the sampling stage in early 1997. Also in early 1997, Digital announced its first Alpha chip 

designed for use in a desktop PC. The 21164PC die is 34 percent smaller than its big brother 21164 and requires 

86 fewer pins. The result is a high-performance 533MHz RISC microprocessor for systems that sell for as little as 

$2,500. 

Digital's IC products are built using primarily CMOS and bipolar technologies, with all advanced process 

development centered on CMOS technology. Its leading-edge 0.35μm, four-level interconnect, CMOS-6 

process technology is being used to manufacture the latest versions of the Alpha 21164. 


In 1995, Digital Semiconductor sold to Motorola its South Queensferry, Scotland, fabrication facility. 

Digital Semiconductor 

75 Reed Road 

Hudson, Massachusetts 01749 

Telephone: (508) 568-4000 

Fab 6 




Process: CMOS 

Products: MPUs, MPRs, ASICs, logic ICs, custom ICs 

Feature sizes: 0.35μm, 0.5μm (eventually, 0.18μm) 

1-94 


North American Company Profiles Digital Semiconductor 


• Samsung Electronics became a licensee of the Alpha architecture in 1996 and is manufacturing and selling 

Alpha microprocessors to its customers as an independent alternate source of Alpha technology. 

• Mitsubishi agreed to be both a second source for Digital's Alpha MPUs and a development partner. The 

Japanese company began producing Alphas for Digital at its Saijo facility in late 1994. Subsequently, 

Mitsubishi began designing and fabricating its own versions of the RISC architecture for use in its own systems 

and for sale to its own customers. 

• In 1995, Advanced RISC Machines Ltd. began jointly developing with Digital and Apple Computer a family of 

high-performance microprocessors compatible with the ARM RISC line. The 32-bit processor, called 

StrongARM, is being produced by Digital using its 0.35μm CMOS-6 process. Volume shipments began in the 

first half of 1996 and are targeted at applications in digital imaging, multimedia, set-top boxes, handheld 

computers, and communications products, as well as Apple's Newton line. 


Dionics North American Company Profiles 

Employees 35 


1-96 

DIONICS 

Dionics Inc. 

65 Rushmore Street 

Westbury, New York 11590-4839 

Telephone: (516) 997-7474 

Fax: (516) 997-7479 


Established in 1969, Dionics is a developer, manufacturer, and marketer of innovative high-quality integrated 

circuits and discrete products. It targets these devices at areas of the industrial and military markets where high 

voltage, high frequency, and unusual structures are required. 

Using a dielectric isolation process, Dionics has evolved from a supplier of discrete components to a manufacturer 

of hybrid circuits and photovoltaic ICs, solid-state relays (SSRs), and MOSFET-drivers. The products were initially 

targeted for use in digital watches but have since made their way to markets that require high reliability that is 

inherent to the dielectric isolation process. 

Management 

Bernard L. Kravitz President 

Sherman Gross Vice President 


Photovoltaic ICs, SSRs, and MOSFET-drivers. 


Dionics Inc. 

65 Rushmore Street 

Westbury, New York 11590-4839 




Process: Dielectric isolation bipolar 

Products: Photovoltaic ICs, SSRs, and MOSFET-drivers 



North American Company Profiles DSP Group 


Japan: DSP Group Japan • Tokyo, Japan 

Telephone: (81) (3) 5496-1611 

Europe: DSP Group Europe • Massy, France 

Telephone: (33) (2) 47-68-67-54 

DSP GROUP 

DSP Group, Inc. 

3120 Scott Boulevard 


Telephone: (408) 986-4300 

Fax: (408) 986-4323 

Web Site: www.dspg.com 



1992 1993 1994 1995 1996 

Sales 9 12 29 50 53 

Net Income (6) (0.4) 4 7 6 




DSP Group, Inc. develops, licenses, and markets digital signal processing (DSP) ICs, cores, and related software 

targeted at digital speech applications in the multimedia personal computer, consumer telephony, and computer 

telephony markets. 

DSP Group began business in 1987 with the purchase of a small design house that was involved in paramilitary 

DSP-related design for applications such as noise cancellation and eavesdropping. The company began 

developing its own DSPs and established a design center in Israel in 1990. 

The company’s strategy is to combine three key technologies—speech processing algorithms, telephony 

algorithms, and digital signal processors—to deliver a wide range of enabling application-specific DSPs to its target 

markets. 


DSP Group North American Company Profiles 

1-98 

Royalties/ 

Licensing/Other 

23% 

DSPs 

77% 


Much of DSP Group’s revenues are generated in international markets, primarily in Europe and Asia. 

Management 

Igal Kohavi Chairman 

Eli Ayalon President and Chief Executive Officer 

Martin Skowron Senior Vice President, Operations 

Avi Basher Vice President, Finance, and Chief Financial Officer 

Irving Gold Vice President, DSP Core Technology 

Moshe Shahaf Chief Technology Officer 

Gideon Wertheizer Vice President, VLSI Design Center 

Serdar Yurdakul Vice President, PC Telephony and TrueSpeech Licensing 


DSP Group has developed a family of low-power consumption, low-cost DSP core architectures that are suitable 

for consumer, mobile computer, and wireless communications products. The company’s products are 

manufactured using 0.6μm-0.8μm CMOS technologies. 

SmartCores Products 

• The company’s SmartCores products are a family of standard DSP macrocells for use in standard cell ASIC 

libraries. The SmartCores are designed for speech/audio processing, telecommunications, digital cellular, and 

embedded control applications. The first two members of the family are the PineDSPCore and the 

OakDSPCore, both of which are 16-bit general-purpose, low-power, low-voltage, and high-speed DSP core 

architectures. The PineDSPCore is based on 0.8μm or 0.6μm double-level-metal CMOS technology (scalable 

to 0.5μm and below). The OakDSPCore is based on 0.6μm double-level-metal CMOS technology (scalable to 

0.5μm and below). 

TrueSpeech Software 

• TrueSpeech ® is a proprietary software-based digital speech compression technology. It is designed for a wide 

range of applications, including video conferencing, computer telephony, the Internet, and personal 

recorders. 


North American Company Profiles DSP Group 

CT Products 

• DSP Group’s CT products are coprocessors that implement real-time TrueSpeech compression and 

decompression functions. They are available for Windows 95 messaging, DSVD (digital simultaneous voice 

and data) modem, video conferencing, and multimedia visual telephony applications. 

TAD Products 

• The company’s D6000 family of products are for digital telephone answering device (TAD) and voice recorders. 

They implement all functions of TrueSpeech compression and decompression, voice prompts, telephone line 

signal processing, and memory management. 

Current licensees of the PineDSPCore and OakDSPCore architectures include Adaptec, Asahi Kasei 

Microsystems, Atmel-ES2, DSP Communications, GEC Plessey Semiconductors, Harris, Hyundai/Symbios Logic, 

Integrated Circuit Systems, LSI Logic, NEC, Rohm, Samsung, Siemens, TI/Silicon Systems, TEMIC, TSMC, VLSI 

Technology, and Xicor. 

Licensees of DSP Group’s TrueSpeech technology include Atmel, Cirrus Logic, Creative Labs, Intel, LSI Logic, 

Lucent Technologies, Microsoft, Siemens, Sierra Semiconductor, U.S. Robotics, and VLSI Technology. 


As a fabless supplier, DSP depends on foundries for the manufacturing of its devices. The company has 

established foundry relationships with several companies, including TSMC and Samsung. 


EDI North American Company Profiles 


1-100 

ELECTRONIC DESIGNS (EDI) 

Electronic Designs, Inc. 

One Research Drive 

Westborough, Massachusetts 01581 

Telephone: (508) 366-5151 

Fax: (508) 836-4850 

Web Site: www.electronic-designs.com 


Europe: Electronic Designs Europe Ltd. • Surrey, United Kingdom 

Telephone: (44) (1276) 472637 • Fax: (44) (1276) 473748 

Financial History ($M), Fiscal Year Ends September 30 

1995 * 1996 

Sales 40 59 

Net Income (3) 4 

R&D Expenditures 3 3 


*Pro forma data. Electronic Designs, Inc. was acquired by Crystallume in October 1995 and the entire company 

was renamed Electronic Designs, Inc. in March 1996. 


Electronic Designs, Inc. was originally established in 1984 under the name of Crystallume. From 1984 to October 

1995, the company had been primarily engaged in research and development of diamond coatings using CVD 

technologies. In October 1995, Crystallume acquired Electronic Designs, Inc., a fifteen-year-old privately held 

Massachusetts-based company involved in the manufacture of high density memory components and activematrix 

LCDs. As a result of the acquisition, the company has shifted its emphasis from diamond coatings to the 

design, manufacture, and sale of semiconductor and flat panel display products. To reflect this shift in business 

focus, the company changed its name from Crystallume to Electronic Designs, Inc. (EDI) in March 1996. 


North American Company Profiles EDI 

Diamond Products 

Displays 

2% 

6% 

Memory Products 

92% 


EDI’s memory products are used in many segments of the electronic equipment industry, including computer 

systems and peripherals, telecommunications, medical equipment, and military systems. The company 

emphasizes a time-to-market advantage for its high-speed SRAM modules. Other memory products incorporate 

SRAM, DRAM, flash, and EEPROM technologies. The company recently announced the release of a line of 

PCMCIA memory cards. Memory product development is currently focused on the design and prototyping of new 

module and monolithic products based on 4M SRAM, as well as on new MCM-L, flash memory, and high-density 

DRAM designs. 

EDI’s offering of AMLCDs includes various sizes of ruggedized panels for use in display heads, monitors, and 

computer systems. The company is developing technology for a PC system incorporating its displays, in addition 

to electronic circuit boards for “smart” displays. 

The company’s diamond research is focused on improving tooling products and related diamond coating 

processes as well as developing numerous other applications for its diamond coating process. Furthermore, EDI 

is developing a semiconductor product incorporating diamond as a heat spreader to significantly improve heat 

removal and thus improve device performance and reliability in heat sensitive applications. 

In fiscal 1996, approximately 34 percent of EDI’s revenues were represented by export sales to customers 

primarily in Europe. 

Management 

Don McGuinness Chairman, President, and Chief Executive Officer 

Frank Edwards Senior Vice President, Finance, and Chief Financial Officer 

Ken Buckley Vice President, Marketing and Sales 

Daniel R. Doyle Vice President, Display Products 

Frank Muscolino Vice President and General Manager, Display Products 

Richard J. Sawers Vice President 


EDI North American Company Profiles 


EDI's products include the following: 

• High-speed monolithic 1M and 4M CMOS SRAMs (industrial or military) 

• High-density CMOS SRAM modules (1M to 32M) with speeds of 8ns-70ns (commercial, industrial, or military) 

• JEDEC pinout super high-density DRAM modules (64MB to 288MB; commercial or industrial) 

• JEDEC pinout flash SIMM modules (4M to 64MB; commercial or industrial) 

• Active-matrix LCDs for avionics and other specialty applications 


EDI handles assembly, test, and QCI at its headquarters in Westborough. For the production of its memory 

products in wafer, die, and component form, the company has partnerships with major semiconductor 

manufacturers in the U.S. and the Far East, including Micron, Mitsubishi, Samsung, and Sharp. 


• EDI formed an agreement with Atmel in 1994 calling for EDI to design, manufacture, and market high-density 

memory modules using Atmel's flash memory devices. 

• EDI signed a licensing agreement with Thomson-CSF that enables EDI to make and market products using the 

French company's technology for 3D stack memory products. 

1-102 


North American Company Profiles EG&G Optoelectronics 


EG&G OPTOELECTRONICS 

EG&G, Inc. 

Optoelectronics Group 



Telephone: (408) 565-0700 

Fax: (408) 565-0777 


Europe: EG&G, Inc., Reticon Division • Munich, Germany 

Telephone: (49) (89) 92692-666 • Fax: (49) (89) 911-008 


1992 1993 1994 1995 1996 

Corporate 

Sales 1,320 1,319 1,333 1,420 1,427 

Net Income 88 59 (6) 68 60 

Optoelectronics 

Sales 210 201 213 259 270 


EG&G Optoelectronics is one of three product groups within EG&G, Inc., a $1.4 billion company involved in 

diversified technology markets. The EG&G Optoelectronics business segment consists of eight autonomous 

divisions, including EG&G Amorphous Silicon, EG&G Canada Ltd., EG&G Electro-Optics, EG&G Heimann 

Optoelectronics, EG&G IC Sensors, EG&G Judson, EG&G Reticon, and EG&G Vactec. These businesses 

specialize in photonic products that are sensitive in the X-ray and ultraviolet to far infrared region of the light 

spectrum. 

Optoelectronics 

19% 

Mechanical 

Components 

19% 

Instruments 

23% 

Technical Services 

39% 



EG&G Optoelectronics North American Company Profiles 

The divisions involved in the production of integrated circuit-related devices are EG&G Reticon and EG&G IC 

Sensors. Reticon was founded in 1971 and became a subsidiary of EG&G in 1976. From its start, Reticon has 

been a leader in image sensing and signal processing technology. It was among the first semiconductor 

companies to specialize in solid-state imaging components and vision system products. IC Sensors was formed 

originally as a spin-off from Foxboro/ICT in 1982 and was acquired by EG&G in 1994. It is a leading developer and 

manufacturer of pressure sensors, accelerometers, valves, and custom microstructures utilizing advanced silicon 

micromachining technology. 

Management 

Richard Brownhill General Manager, EG&G IC Sensors 

Chris Raanes General Manager, EG&G Reticon 


EG&G Reticon Products 

• Image sensing products—character scan devices, instrumentation devices, multiplexer array chips, 

photodiode arrays, pinned photodiode arrays, and CCDs. 

• Solid state camera products. 

EG&G IC Sensors Products 

• Microelectromechanical system (MEMS) devices, such as pressure sensors, accelerometers, precision 

microvalves, and custom microstructures for a broad range of applications, including medical, industrial, 

automotive, consumer, and aerospace. 


EG&G Reticon EG&G IC Sensors 

345 Potrero Avenue 1701 McCarthy Boulevard 

Sunnyvale, California 94086 Milpitas, California 95035 


Fax: (408) 738-3832 Fax: (408) 434-6681 

Capacity (wafers/week): 625 Cleanroom size: 10,000 square feet 


Processes: CMOS, PMOS, CCD Process: Bipolar 

Products: Linear ICs and image sensing devices Products: MEMS devices and sensors 


1-104 


North American Company Profiles Elantec Semiconductor 


ELANTEC SEMICONDUCTOR 

Elantec Semiconductor, Inc. 

1996 Tarob Court 


Telephone: (408) 945-1323 

Fax: (408) 945-9305 

Web Site: www.elantec.com 


Europe: Elantec Semiconductor, Inc. • Wokingham, United Kingdom 

Telephone: (44) (1189) 776080 


1992 1993 1994 1995 1996 

Sales 15 18 23 27 37 

Net Income 0.3 1 1 3 4 

R&D Expenditures 4 4 5 6 


Employees 110 120 125 155 162 


Elantec Semiconductor, Inc., founded in 1983, designs, manufacturers, and markets high-performance analog 

and mixed-signal integrated circuits for the video/multimedia, data processing, instrumentation, and 

communications markets. The company serves these markets with standard products and application-specific 

standard products (ASSPs), using primarily high-speed complementary bipolar and advanced CMOS 

technologies. 

Elantec has transformed itself from a military hybrid IC supplier to a company focused on providing highperformance 

analog intensive functions for growing commercial markets. At one time, military hybrid sales 

accounted for 90 percent of the company's total sales, versus about nine percent in 1996. 

In October 1995, the company completed its initial public offering. 


Elantec Semiconductor North American Company Profiles 

Management 

1-106 

Asia 

39% 

Europe 

13% 


48% 


Donald T. Valentine Chairman 

David O'Brien, Ph.D. President and Chief Executive Officer 

Richard E. Corbin Vice President, Bipolar Design 

Ralph S. Granchelli, Jr. Vice President, Marketing and Sales 

Terrence W. Plette Vice President, Finance, and Chief Financial Officer 

Barry L. Siegel Vice President, Engineering 


Elantec's analog and mixed-signal ICs for commercial markets include the following: 

• Op amps • H-sync Genlock-computer video circuits 

• Video circuits • DC restore subsystems 

• Analog buffers • Fader circuits 

• Fully integrated DC/DC converters • MOSFET drivers 

• Comparators and ATE pin drivers • PWM controllers 

• IGBT drivers • Laser diode drivers 

Elantec has developed and used a variety of technologies for its products. In particular, Elantec has focused on 

developing advanced complementary bipolar technology, using dielectric isolation and silicon-on-insulator (SOI) 

techniques, and advanced CMOS technology. The company utilizes external foundries for other technologies 

such as ultra high-speed bipolar and BiCMOS. 


Elantec Semiconductor, Inc. 

1996 Tarob Court 





Processes: Complementary bipolar, complementary bipolar dielectric isolation (DI), JI bipolar, CMOS 

Products: Analog ICs 

Feature sizes: 5.0μm (bipolar); 1.2μm, 2.0μm (CMOS) 


North American Company Profiles ESS Technology 


ESS TECHNOLOGY 

ESS Technology, Inc. 

48401 Fremont Boulevard 


Telephone: (510) 492-1088 

Fax: (510) 492-1098 

Web Site: www.esstech.com 


Asia-Pacific: ESS Technology, Inc. • Taipei, Taiwan 

Telephone: (886) (2) 346-5300 • Fax: (886) (2) 346-1698 


1992 1993 1994 1995 1996 

Sales 24 15 33 106 227 

Net Income 5 0.2 8 30 22 




ESS Technology, founded in 1984, designs, develops, and markets highly integrated mixed-signal 

semiconductor solutions for multimedia applications in the PC and consumer markets, primarily to multimedia 

desktop and notebook computer manufacturers. ESS is a leading supplier of mixed-signal PC audio solutions that 

integrate all essential audio components on a single chip. In 1996, PC audio products represented 92 percent of 

sales. 

In an effort to broaden its product offerings, ESS made two company acquisitions in 1Q96. The company 

acquired VideoCore Technology, Inc., a developer of digital video technology, and OSEE Technology, Inc., a 

developer of fax/modem technology. 

Current development is focused on new PC audio and multimedia products for the PC and consumer markets that 

provide video and fax/modem/voice capabilities. 

In 1996, 92 percent of ESS Technology’s total sales were to international customers. 


ESS Technology North American Company Profiles 

Management 

Fred S.L. Chan Chairman, President, and Chief Executive Officer 

Robert L. Blair Executive Vice President, Operations 

Nicholas A. Aretakis Vice President, Sales 

John H. Barnet Vice President and Chief Financial Officer 

Hoover J. Chen Vice President, Engineering 

Johnston Chen Vice President, Asia-Pacific Sales 

Jan Fandrianto Vice President, Video Group 

Hadi Ibrahim Vice President, Engineering, Multimedia Technology Design (Austin, Texas) 

Robert S. Plachno Vice President, Research and Development 

Roger K. Shum Vice President, Manufacturing 

Chi-Shin Wang Vice President and Chief Technical Officer 

Gary Breeding Director, Marketing Communications 


ESS Technology has three principal product lines: the AudioDrive family, which targets the PC digital audio 

market; the VideoDrive family, which targets MPEG-1 and MPEG-2 decompression-based consumer products, 

such as DVD, video compact disk players, and set-top boxes; and the TeleDrive family, which focuses on 

integrated audio-fax/modem applications, including full duplex speakerphone, digital simultaneous voice and 

data, and videoconferencing. 

ESS Technology’s audio chips have migrated from 12-bit to 16-bit and from mono to stereo sound. The company 

has also developed a core library of audio semiconductor designs, including microcontroller, bus interface, codec, 

mixer, filter and FM synthesizers, and device drivers, as well as application software. 

The company’s chips are manufactured using mixed-signal 0.5μm and 0.6μm CMOS process technologies. 


ESS has contracts with several independent foundries for the manufacture of its products. The majority of its 

devices are currently manufactured by Taiwan Semiconductor Manufacturing Company (TSMC), its primary 

supplier since 1989. The company also uses UMC, Sharp Corporation, and IC Works. 

In December 1995, ESS announced a wafer supply program to commit approximately $62 million, and an option to 

commit another $31 million, over a three year period for expanding manufacturing capacity and developing 

advanced technology. The company expanded its relationship with TSMC by entering into a long term agreement 

for an increased amount of wafer capacity. ESS agreed to pay approximately $32 million to TSMC in exchange for 

wafer supply through 1999. ESS also obtained an option to further expand this agreement for additional capacity. 

ESS also entered into a joint venture agreement with United Microelectronics Corporation (UMC) of Taiwan. ESS 

agreed to invest $30 million for a five percent equity ownership in UMC’s new 200mm wafer joint manufacturing 

facility, United Integrated Circuits Corporation (UICC). The wafer fab, located in Taiwan, was expected to begin 

production by mid-1997. 

1-108 


North American Company Profiles Exar 


EXAR 

Exar Corporation 

48720 Kato Road 


Telephone: (510) 668-7000 

Fax: (510) 668-7017 

Web Site: www.exar.com 


Japan: Exar Japan Corporation • Kawasaki-shi, Kanagawa, Japan 

Telephone: (81) (44) 922-9411 • Fax: (81) (44) 922-9368 

Europe: Exar, Ltd. • Crowborough, East Sussex, United Kingdom 

Telephone: (44) (1892) 665718 • Fax: (44) (1892) 664354 


1993 1994 1995 1996 1997 

Sales 146 162 159 126 92 

Net Income 14 16 (11) 14 (9) 


Employees 500 525 468 447 325 


Founded in 1971, Exar Corporation is involved primarily in the design and marketing of analog and mixed-signal 

application-specific standard products, primarily for use in communications, consumer electronics, and computer 

products. Nearly 80 percent of the company’s revenues are generated from sales to these three markets. Other 

markets served by Exar include automotive, industrial, and medical. The company also produces digital ICs and 

general-purpose analog ICs that are used primarily to complement its other products. 


Exar North American Company Profiles 

Industrial, 

Automation, 

and Specialty 

14% 

1-110 

Consumer 

11% 

Sensor and Accelerometer 

1% 

PC 

11% 


32% 

Data Converter 

31% 

1996 Sales by Product Line 

Europe 

12% 

Japan 

32% 

ROW 

1% 


45% 


Exar’s business strategy has changed significantly in recent years. Before 1990, Exar was a wholly owned 

subsidiary of Rohm in Japan. As of January 1994, Rohm was no longer an affiliate of the company and today, 

holds less than one percent ownership in Exar. In April 1994, Exar transferred its epitaxial and bipolar wafer 

manufacturing operations to Rohm, thereby making Exar a fabless IC supplier. 

In mid-1995, Exar withdrew from two long-standing businesses, mass storage ICs and Rohm-designed consumer 

electronics IC products. Its departure from the hard disk drive market was involuntary, a result of actions taken by 

SGS-Thomson, its foundry supplier of wafers for mass storage ICs. 

To counter its discontinued businesses, Exar has made a series of acquisitions. In 2Q94, the company acquired 

Origin Technology, Inc. for its automatic speech recognition technology and products, and Micro Power Systems, 

Inc. for its data acquisition technology and access to the document imaging market. In 1995, Exar acquired 

Startech Semiconductor, Inc., a supplier of ASSPs for a variety of markets, and Silicon Microstructures, Inc., a 

company involved in silicon sensors for the medical, automotive, and consumer markets. These acquisitions 

complement the company’s strategy to apply its mixed-signal technology expertise to niche segments within the 

automotive, industrial, and medical markets. 

Although Exar’s total revenues have been on the decline for the past few years, its core business has been 

growing. Its core business represented nearly all of total revenues in fiscal 1996 versus about 45 percent in fiscal 

1993. 

Management 

Donald L. Ciffone President and Chief Executive Officer 

Ronald W. Guire Executive Vice President and Chief Financial Officer 

Aurelio E. Fernandez Senior Vice President, Worldwide Sales 

Roubik Gregorian Vice President, Chief Technical Officer, and General Manager, 

Communications and Computer Division 

Jim Knutti Vice President and General Manager, Silicon Microstructures Division 

John Sramek Vice President and General Manager, Video and Imaging Division 

Suhas "Sid" Bagwe Vice President, Strategic Planning and Long Range Development 

Thomas W. Jones Vice President, Reliability and Quality Assurance 

Stephen W. Michael Vice President, Operations Division 

Asia 

10% 


North American Company Profiles Exar 


Exar’s IC products can be divided into five major market groups: communications, data communications, video and 

imaging, silicon microstructures, and other products. 

• For the communications market, the company offers T1/E1 and T3/E3/STS1 line interface circuits, network 

interface circuits, speech recognition devices through its Origin Technology subsidiary, speakerphone and 

other telephony-oriented components, PLLs, and tone decoders. 

• For the data communications market, Exar supplies UARTs/DUARTs/QUARTs, clock oscillators/clock 

multipliers, line drivers/receivers, frequency timing generators and Super I/O devices through its Startech 

Semiconductor subsidiary, and fax/data/voice modem chipsets. 

• For video and imaging applications, Exar supplies A/D and D/A converters, CCD analog signal processors and 

conditioners, automatic track finding (ATF) circuits, switched capacitor filters, and BBE ® sound enhancement 

circuits. 

• Subsidiary Silicon Microstructures currently offers high-precision pressure sensors for applications such as 

engine control and tire pressure in automobiles, angioplasty and inter uterine pressure in medical instruments, 

and HVAC and pressure transducers in industrial equipment. Silicon Microstructures also supplies 

accelerometers for automotive applications. 

• Other products include general purpose analog-to-digital and digital-to-analog converters for a wide variety of 

applications, including pace makers, handheld digital voltmeters, and high-speed digital communications. 

Through several foundry partnerships, Exar has access to a multitude of process technologies, including bipolar, 

silicon gate and moly gate CMOS, and BiCMOS. The design rules of its bipolar processes range from 2.0μm to 

6.0μm. The CMOS processes in use include 0.6μm 2P3M, 0.8μm 2P2M, 1.2μm 2P2M, and 1.6μm 2P2M 

(5V/18V). Exar plans to implement a 3.3V 0.5μm 1P3M CMOS process in 1997 and a 0.35μm 1P2M process in 

1998. For BiCMOS, the company uses a 0.8μm process and plans to move to a 0.6μm process in 1997. 


Exar obtains approximately half of its wafer requirements from Rohm. Its other foundry partners are American 

Microsystems, Nippon Precision Circuits, TSMC, and Chartered Semiconductor. 

In 1995, Exar announced an agreement with IC Works calling for Exar to invest $15 million to help upgrade IC 

Works’ fab from 125mm to 150mm wafers and improve its process technology. In return, Exar was to receive a 

guaranteed portion of the fab output over a five-year period. In early 1997, it was announced that the agreement 

was terminated as a result of dramatically changed market conditions for wafer pricing and availability, the recent 

business redirection of Exar, and delays in the commencement of anticipated production by the foundry. 


Fairchild Semiconductor North American Company Profiles 



1-112 

FAIRCHILD SEMICONDUCTOR 

Fairchild Semiconductor Corporation 

333 Western Avenue 

South Portland, Maine 04106 

Telephone: (207) 775-8100 

Fax: (207) 761-6027 

Web Site: www.national.com/fairchild 


Fairchild Semiconductor was relaunched in March 1997 when the combined logic, memory, and discrete 

businesses of National Semiconductor were purchased by private investors. Fairchild Semiconductor originally 

emerged in the late 1950’s when the late Sherman Mills Fairchild sponsored a small group of scientists—among 

them Robert Noyce and Gordon Moore—in the development of a new process for the manufacturing of 

transistors. The team reached their goal in 1959 with the introduction of the Planar process. A facility was 

established in 1962 in South Portland, Maine, for the manufacture, test, and assembly of transistors. 

Beginning in 1978, Fairchild became a major force in the development and production of logic circuits. Its first 

innovation was the FAST ® (Fairchild Advanced Schottky Technology) family of advanced Schottky TTL logic 

circuits. Next came the invention of the FACT (Fairchild Advanced CMOS Technology) family of logic circuits in 

1985. Still today, Fairchild is the leading supplier of FAST and FACT, as well as LCX, logic products. 

In 1987, National Semiconductor purchased Fairchild from Schlumberger Ltd., a French conglomerate that had 

acquired the company in 1979. National dropped the Fairchild name, but resurrected it in mid-1996 when its logic, 

memory, and discrete businesses were combined to form the Fairchild Semiconductor Division. The division was 

sold in March 1997. National retains a 16 percent stake in Fairchild. 

Together with its advanced logic IC products, Fairchild’s high-performance non-volatile memory and discrete 

semiconductor technologies form the foundation of the new company’s product portfolio. The fiscal 1996 (ended 

May 31) revenues from these products were approximately $600 million. 

Fairchild is investing in research and development to enhance its portfolio in the fast-growth areas of CMOS, lowvoltage 

logic, power and small-signal discretes, and non-volatile standard and application-specific memories. 

Applications for Fairchild’s products include automotive entertainment systems, communications products, 

desktop and portable computers, security, consumer products, and satellites and aerospace systems. 


North American Company Profiles Fairchild Semiconductor 

Management 

Kirk Pond Chairman, President, and Chief Executive Officer 

Colin Cohen Vice President, Finance, and Chief Financial Officer 

Stephen Hamilton Vice President and General Manager, Memory Products Group 

Darrell Mayeux Vice President, Sales and Marketing 



DRAM Amplifier 

SRAM Interface 

✔ Flash Memory Consumer/Automotive 

✔ EPROM Voltage Regulator/Reference 

ROM Data Conversion 

✔ EEPROM Comparator 

✔ Other (Including Non-Volatile RAM) Other (Includes Telecom) 


General Purpose Logic Bipolar Memory 


Standard Cell Gate Array/Standard Cell 

Field Programmable Logic ✔ Field Programmable Logic 

Other Special Purpose Logic ✔ Other Special Purpose Logic 


MPU OTHER 

MPU/MCU/MPR 

MCU Full Custom IC 

MPR ✔ Discrete 


Logic Products 

Fairchild offers 17 families of standard logic devices utilizing CMOS, bipolar, and BiCMOS process technologies. 

The company claims to be the world’s third-largest supplier of standard logic ICs. 

Its logic products include FAST ® high-speed, low-power bipolar devices; FACT high-performance advanced 

CMOS devices; FACT QS low-noise, high-performance advanced CMOS devices; LVQ low-voltage CMOS 

devices, LCX/LVX high-performance, low-voltage CMOS devices with over-voltage protection; and VHC HCreplacement, 

low-noise, high-speed CMOS devices. 


Fairchild Semiconductor North American Company Profiles 


Fairchild’s memory products include several varieties of non-volatile memory ICs. It is among the world’s leading 

suppliers of serial EEPROMs and EPROMs. Its EEPROM product group includes several families of standard 

devices as well as application-specific devices such as a Plug-and-Play controller for ISA cards, a serial presence 

detect (SPD) device for the memory module market, and the HiSEC family of products for remote keyless entry 

applications. The company’s EPROM products include 5V devices with densities ranging from 16K to 4M and lowvoltage 

1M parts. 

Through an alliance formed originally by National and Toshiba in 1992, Fairchild also offers flash memory devices 

compatible with Toshiba’s NAND and NOR architectures. 

Discrete Products 

Fairchild’s principal discrete products are DMOS power MOSFETs. Its other discrete products are small-signal 

components such as small-signal transistors, JFETs, and diodes. 


Fairchild Semiconductor Corp. Fairchild Semiconductor Corp. 

333 Western Avenue 3333 West 9000 South 

South Portland, Maine 04106 West Jordan, Utah 84088 


Fax: (207) 761-6027 Fax: (801) 562-7500 



Wafer sizes: 100mm, 125mm, 150mm Wafer size: 150mm 

Processes: CMOS, bipolar, BiCMOS Processes: CMOS, DMOS 

Products: Logic ICs, discretes Products: EPROMs, EEPROMs, logic ICs, discretes 

Feature sizes: 0.8μm-2.5μm Feature size: 0.8μm 

Some of Fairchild’s IC products continue to be produced at fabs owned by National Semiconductor and vice versa. 

Fairchild’s semiconductor assembly and test plants are located in Penang, Malaysia, and Cebu in the Philippines. 


• National and Fairchild remain closely linked through a long-term agreement to make the transition as smooth as 

possible. The two companies also share and swap fab capacity. 

• Motorola, Toshiba, and Fairchild Semiconductor announced in early 1997 they would jointly develop nextgeneration 

high-speed CMOS logic ICs. The three companies will work to develop 2.5V and 3.3V devices with 

a propagation delay time of 2ns. 

• Fairchild has a long-term partnership with Toshiba for the development, licensing, design, and manufacture of 

NAND and NOR flash memories. The agreement was signed by Toshiba and National Semiconductor in 1992. 

1-114 


North American Company Profiles Genesis Microchip 

Employees 70 


GENESIS MICROCHIP 

Genesis Microchip Inc. 

200 Town Centre Boulevard 

Suite 400 

Markham, Ontario 

Canada L3R 8G3 

Telephone: (905) 470-2742 

Fax: (905) 470-2447 

Web Site: www.genesis-video.com 


North America: Genesis Microchip Corporation • Mountain View, California 

Telephone: (415) 428-4277 • Fax: (415) 428-4288 


Founded in 1987, Genesis Microchip is a technology leader in digital video/image manipulation. The company 

designs, develops, and markets leading-edge ICs targeted at both existing and emerging applications demanding 

high-quality video/image processing. Genesis sets the standard in video/image resizing. Markets are divided into 

high-end chips (gm865 class), middle tier (gm833 class), and commodity, low-cost, high-performance cores. 

Management 

Paul M. Russo President and Chief Executive Officer 

Peter Dakin Vice President, Manufacturing Operations 

Eric Erdman Vice President, Finance and Administration 

Hamid Farzaneh Vice President, Worldwide Sales 

Lance Greggain Vice President, Product Development Operations 

Stephen Solari Vice President, Marketing and Business Development 

Scott Baker Director, Product Development Operations 

Perry Chappell Director, Sales 

Jordan Du Val Director, Marketing 

Shyam Nagrani Director, Sales 

Jay Giblon Manager, Information Systems 

David Green Manager, Sales 

Graham Loveridge Manager, Customer and Product Support 

Peter Mandl Manager, Video DSP Technology 


Genesis Microchip North American Company Profiles 


Genesis' products include the Genesis Scaling series of video/image resizing ICs (gm865x1, gm833x2, 

gm833x3, gm833x3F), the gm2242B half-band filter, and the gmVLD family of video line doublers plus supporting 

evaluation boards and software. The patented algorithms and architectures provide improvement in 

computational efficiency over traditional finite impulse response (FIR) filter structures. All of Genesis' design 

efforts currently employ 0.8μm (and below) CMOS technology. Several products are described below. 

• gm865x1—This is the first of the Genesis Scaling chip series. The gm865x1 IC is a single-channel device 

that provides high-quality video/image processing technology for medical imaging, broadcast equipment, 

and projection systems. 

• gm833x2—This is the second of the Genesis Scaling chip series and first in the mid-range family of 

GenScale chips. The gm833x2 is a dual-channel device for use in workstation, projection systems, and 

multimedia applications. 

• gm833x3—This is a triple-channel version in the 833 class designed for use in projection systems, 

videographic workstations, and scan conversion equipment. 

• gm833x3F (fast) “Bullet”—This is a 68MHz version of an RGB scaler, featuring low power and an advanced 

0.35μm, 3.3V CMOS process. 

• gm2242B Half-Band Filter—This is a decimating/interpolating digital filter for use in applications requiring 

pre- or post-filtering of digital video signals. The gm2242B supports NTSC, PAL, SECAM, and square pixel 

video standards. 

• gmVLD8/gmVLD10 Video Line Doublers—This is a single-chip de-interlacing device for use in equipment 

such as large screen televisions, video walls, projection systems, video-in-a-window workstations, and home 

theater screens. 

1-116 


North American Company Profiles Gennum 


GENNUM 

Gennum Corporation 

P.O. Box 489, Station A 

Burlington, Ontario 

Canada L7R 3Y3 

Telephone: (905) 632-2996 

Fax: (905) 632-2055 

Web Site: www.gennum.com 


Japan: Gennum Japan K.K. • Suginami-ku, Tokyo, Japan 

Telephone: (81) (3) 3334-7700 • Fax: (81) (3) 3247-8839 

Financial History ($M), Fiscal Year Ends November 30 

1992 1993 1994 1995 1996 

Sales 26 27 33 42 53 




Employees 233 240 247 255 300 


Gennum Corporation, formed in 1973, is a Canadian high technology company that designs, manufactures, and 

markets electronic components, primarily silicon integrated circuits and thick-film hybrid circuits, for special 

applications in the information world. 

The company's products include low-voltage audio electronic amplifiers and analog signal processing circuits 

supplied to the world hearing instrument industry; video signal distribution and processing components sold to 

the professional video and broadcast television markets; and user specific ICs for a wide variety of specific 

applications where information is being conditioned, transmitted, or interpreted. 


Gennum North American Company Profiles 

Management 

1-118 

Canada 

9% 

Pacific Rim 

20% 

Europe 

29% 

United States 

42% 

1996 Sales By Geographic Region 

Video/Broadcast 

Components 

42% 

User-Specific ICs 

3% 

Hearing Instrument 

Components 

55% 

1996 Sales By Product Type 

H. Patrick Thode Chairman 

H. Douglas Barber, Ph.D. President and Chief Executive Officer 

Michael R. Fielding Vice President, Marketing and Sales 

David L. Lynch Vice President, Research and Development 

Ian L. McWalter, Ph.D. Vice President, Manufacturing Operations 

C. Timothy Zahavich Vice President, Finance and Administration, and Chief Financial Officer 


Gennum produces analog arrays, linear ICs, and thick-film hybrid circuits using bipolar process technology. The 

company has developed a DMOS process, though it has not put it into production, and CMOS designs are 

contracted out for manufacture by external foundries. 


Gennum Corporation 

3435 Landmark Road 

Burlington, Ontario L7M 1T4 




Process: Bipolar 

Products: Linear ICs, ASICs, thick-film hybrid circuits 

Feature sizes: 1.5μm-4μm 


North American Company Profiles Harris Semiconductor 


HARRIS SEMICONDUCTOR 

Harris Semiconductor 

2401 Palm Bay Road Northeast 

Palm Bay, Florida 32905 

Telephone: (407) 724-7000 

Fax: (407) 729-5691 

Web Site: www.semi.harris.com 


Europe: Harris Semiconductor • Brussels, Belgium 

Telephone: (32) (2) 724-2111 • Fax: (32) (2) 724-2205 

Asia-Pacific: Harris Semiconductor China Ltd. • Shanghai, China 

Telephone: (86) (21) 6247-7923 • Fax: (86) (21) 6247-7926 


1992 1993 1994 1995 1996 

Corporate 

Sales 3,004 3,099 3,336 3,444 3,621 

Net Income 75 111 112 155 178 

Semiconductor 

Sales 585 591 635 659 708 

Net Income (20) 17 31 42 52 


Employees 8,000 8,100 8,100 


Harris Semiconductor is one of the four major business sectors of Harris Corporation, a worldwide manufacturer of 

electronic systems, semiconductors, communications products, and office systems with sales of over $3.6 billion 

and more than 26,000 employees. 


Harris Semiconductor North American Company Profiles 

1-120 

Semiconductor 

20% 


23% 

Lanier Worldwide 

31% 

Electronic Systems 

26% 

1996 Corporate Sales by Business Sector 

Harris Semiconductor originated as the Microelectronics Division of Radiation, Inc. in 1962. It became Harris 

Semiconductor in 1967 through the merger of Harris and Radiation. Then in 1988, Harris Semiconductor nearly 

tripled in size through the acquisition of the General Electric Solid State semiconductor business. 

Harris Semiconductor manufactures and markets advanced analog, digital, power, and mixed-signal integrated 

circuits and discrete semiconductors for power, signal-processing, data-acquisition, and logic applications. Plans 

for 1997 include a focus on its wireless communications and multimedia technologies. Products recently brought 

to market in these areas include its Prism line of RF integrated devices for communications and a video 

encoder/decoder chipset for multimedia applications. 

Plans for 1997 also include decreasing emphasis on its military product business and maximizing its discrete 

product sales. 

Data Acquisition 

8% 

Intelligent Power 

12% 

Signal Processing 

14% 

Mixed-Signal 

16% 

Power 

30% 

Digital 

20% 


by Application 

Below are applications served by Harris’ semiconductor products. 

Discretes 

29% 

Integrated Circuits 

71% 


by Device Type 

Automotive—multiplexing systems, antilock braking systems, engine controls, emission controls, engine knock 

sensing, air bag systems, and entertainment systems. This is Harris' largest commercial end market. 

Communications—wireless local area network (LAN) systems, cellular base stations, satellite communications 

systems, set-top boxes, and PBX, central office, wireless local loop, and fiber-in-the-loop equipment. 



Video/Multimedia—video and image processing systems, video teleconferencing, and multimedia systems. In 

early 1997, the company released the first of many planned multimedia devices. The device was an HTSC/PAL 

video encoder/decoder chipset. The device is designed for use in VCR-to-PC editing systems, PC video capture, 

teleconferencing systems, DVD players, and digital VCRs. The device is manufactured by foundry partner, TSMC, 

using 0.6μm technology. 

Power and Load Control—motor controllers, disk drives, power supplies, distributed power systems, and power 

switching. 

Power Protection—surge suppression equipment, uninterruptible power supplies, house electrical panel 

protection, and on-board electronic circuit protection. 

Other Applications—test equipment, industrial controls, consumer electronics, medical imaging, computer 

peripherals, hand-held portable equipment, and military and aerospace equipment. 

Management 

Harris Corporation 

Phillip W. Farmer Chairman, President and Chief Executive Officer 

Bryan R. Roub Senior Vice President and Chief Financial Officer 

Harris Semiconductor Sector 

John C. Garrett President 

F. Scott Moody Vice President, Military and Aerospace Products Division 

W. Russell Morcom Vice President and GM, Semiconductor Products Division 

Dyer Matlock Vice President, Engineering 

Bill McLean Vice President (North America), Sales 

Carleton Smith Vice President (Asia), Sales 

Ron Van Dell Vice President and GM, Worldwide Sales and Marketing 

Edward Verbeek Vice President (Europe), Sales 


Harris offers a broad range of standard, semicustom, and custom ICs and discrete semiconductors, including 

intelligent power devices, data acquisition and signal processing circuits, digital microprocessor, peripheral, and 

logic ICs, as well as radiation-hardened circuits for spacecraft and satellite applications. 


Harris Semiconductor North American Company Profiles 

1-122 


DRAM ✔ Amplifier 

✔ SRAM ✔ Interface 

Flash Memory ✔ Consumer/Automotive 

EPROM ✔ Voltage Regulator/Reference 



✔ Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom) 


✔ General Purpose Logic Bipolar Memory 

✔ Gate Array General Purpose Logic 

✔ Standard Cell ✔ Gate Array/Standard Cell 

Field Programmable Logic Field Programmable Logic 

✔ Other Special Purpose Logic 


Other Special Purpose Logic 

MPU/MCU/MPR 

✔ MPU OTHER 

✔ MCU ✔ Full Custom IC 

✔ MPR ✔ Discrete 

✔ DSP ✔ Optoelectronic 

Process technologies used by Harris Semiconductor include: CMOS, BiCMOS, power BiMOS, high-frequency 

bipolar/power MOS, high-voltage bipolar/power MOS, complementary bipolar dielectric isolation (bonded wafer), 

CMOS/SOI (silicon-on-insulator), CMOS/SOS (silicon-on-sapphire), and radiation hardening. 


Harris supplements its internal semiconductor production capabilities with foundry agreements with external 

semiconductor manufacturers. For example, the company uses foundries for the fabrication of triple-layer-metal 

CMOS devices like signal processing ICs. 

Harris Semiconductor (Ohio), Inc. Harris Semiconductor (Florida), Inc. 

1700 Fostoria Road P.O. Box 883 

Findlay, Ohio 45840 Palm Bay, Florida 32905 




Wafer sizes: 100mm, 125mm Wafer sizes: 3in, 100mm, 125mm 

Processes: CMOS, bipolar, BiCMOS Processes: CMOS, PMOS, bipolar 

Products: Custom digital, linear, logic, and Products: MPUs, SRAMs, linear and digital ICs, 

mixed-signal ICs discretes 

Feature sizes: 1.2μm, 1.5μm, 2.0μm Feature sizes: 0.8μm, 1.0μm, 2.0μm, 4.0μm 



Harris Semiconductor (Pennsylvania), Inc. Harris Semiconductor (Pennsylvania), Inc. 

Crestwood Industrial Park Mountaintop, Pennsylvania 

125 Crestwood Road Cleanroom size: 25,000 

Mountaintop, Pennsylvania 18707-2189 Capacity (wafers/week): 5,000 

Telephone: (717) 474-6761 Wafer size: 200mm 

Cleanroom size: 74,000 square feet Process: MOS 

Capacity (wafers/week): 4,000 Products: Discretes, smart power ICs 

Wafer sizes: 100mm, 125mm, 150mm Feature size: 1.0μm 

Processes: MOS, bipolar, BiCMOS 

Products: Discretes, hybrids, ASICs 


In early 1996, Harris began building a new IC assembly and test facility in Suzhou, China. The company expects 

construction to be completed by summer of 1998. The new facility will assemble and test digital logic, 

microperipheral, and analog and mixed-signal devices. Harris has existing semiconductor assembly factories in 

Kuala Lumpur, Malaysia, and Dundalk, Ireland. 


• In 4Q95, Harris announced a license agreement with DSP Group Inc. Harris licensed DSP Group’s Oak and 

Pine DSP cores for use in devices for audio-band signal processing applications. 

• Harris has a product agreement with Sony. Under the agreement, Harris expanded its line of 10-bit, 12-bit, and 

14-bit data converters to include Sony’s 6-bit and 8-bit converters. 

• Harris has a second-source agreement with Xilinx for radiation-hardened FPGAs. 

• Harris formed an agreement with Noise Cancellation Technologies to develop and manufacture proprietary 

chips for application of NCT's active noise reduction technology. 


Honeywell North American Company Profiles 

1-124 

HONEYWELL SSEC 

Honeywell, Incorporated 

Solid State Electronics Center (SSEC) 

12001 Highway 55 

Plymouth, Minnesota 55441 

Telephone: (612) 954-2301 

Fax: (612) 954-2504 

Web Site: www.ssec.honeywell.com 



1992 1993 1994 1995 1996 

Corporate 

Sales 6,223 5,963 6,057 6,731 7,312 

Net Income 247 322 279 334 403 

Semiconductor 

IC Sales 53 45 45 58 60 



Founded in 1885, Honeywell is an international company that provides control components, products, systems, 

and services for the home and building, industrial, space and aviation, and defense and marine markets. 

Space and 

Aviation Control 

22% 

Other* 

2% 

Industrial Control 

30% 

Home and 

Building Control 

46% 

*Includes sales from the SSEC 

1996 Corporate Sales by Business Segment 


North American Company Profiles Honeywell 

Honeywell established its Solid State Electronics Center (SSEC) in 1965 to support the high technology 

demands in the markets served by the parent company. This growing reliance on microelectronics led SSEC to 

become a niche market manufacturer of specialized ICs and solid-state sensors. 

Over the years, Honeywell SSEC has taken on numerous military contracts. Two of the more well known programs 

are the Very High Speed Integrated Circuit (VHSIC) program and the Enhanced Modular Signal Processor (EMSP) 

program. These programs helped position SSEC for its future in control, memory, and spaceborne applications. 

The SSEC's mission is to develop and produce niche semiconductor technologies and products which are 

focused in the market areas of sensors, radiation-hardened space components, and specialized ICs for its parent's 

needs and select external markets. SSEC is the world’s leading supplier of SOI CMOS ICs for space and industrial 

applications. Approximately 50 percent of the SSEC's IC production is sold to external customers. 

Management 

Michael R. Bonsignor Chief Executive Officer 

D. Larry Moore President and Chief Operating Officer 

Larry C. Welliver Vice President, SSEC 

Lou Del Monte Director, Business Management, SSEC 

Bryan Johnson Director, Human Resources and Facilities, SSEC 

Pravin Parekh Director, Operations, SSEC 

Jay Schrankher Director, Quality and Information Systems, SSEC 

Jim Becker Manager, Material Management, SSEC 

Peggy Kvam Manager, ASIC Products, SSEC 


Honeywell SSEC's key business areas are outlined below. 

Space components (for commercial, military space, and tactical and strategic missile applications). 

• SRAMs 

• ROMs (SOI and bulk) 

• Gate arrays (SOI and bulk) with ultra low power options 

• Bus interface products (1773 and 1553) 

Sensors (for industrial control, automotive, medical, and aircraft applications). 

• Precision pressure 

• High-accuracy magnetic 

High-temperature products (for oil service industry, industrial control, and gas turbine control applications). 

All SOI devices. 

• Op amps 

• Switches 

• A/D converters and controllers 


Honeywell North American Company Profiles 

About 90 percent of Honeywell's ICs are manufactured using CMOS or radiation-intensive CMOS (RICMOS) 

processes and 10 percent using an advanced bipolar process. 


Honeywell, Incorporated 

Solid State Electronics Center 

12001 Highway 55 

Plymouth, Minnesota 55441 




Processes: CMOS, bipolar 

Products: Rad-hard memories, ASICs, analog ICs, digital ICs, sensors, foundry services 

Feature sizes: 0.5μm, 0.7μm, 0.8μm, 1.2μm, 0.3μm, 0.4μm, 4.5μm 


• Honeywell SSEC licensed Micron Technology's Softool known-good die technology. It plans to use the test 

method to provide known-good die to the military and commercial markets, primarily for space applications. 

1-126 


North American Company Profiles HP 


HEWLETT-PACKARD (HP) 

Hewlett-Packard Company 

3000 Hanover Street 

Palo Alto, California 94304-1112 

Telephone: (415) 857-1501 

Fax: (415) 857-5518 

Web Site: www.hp.com 


Europe: Hewlett-Packard Company • Geneva, Switzerland 

Telephone: (41) (21) 780-8111 

Asia-Pacific: Hewlett-Packard Company • Causeway Bay, Hong Kong 

Telephone: (852) 2599-7777 

Financial History ($M), Fiscal Year Ends October 31 

1992 1993 1994 1995 1996 

Corporate 

Sales 16,410 20,317 24,991 31,519 38,420 

Net Income 549 1,177 1,599 2,433 2,586 

Semiconductor* 

Sales 745 880 1,085 1,250 1,420 

IC Sales 400 475 585 655 740 


External Sales 50 65 45 40 35 

Discrete Sales** 345 405 500 595 680 


**Includes internal and external sales 


Hewlett-Packard (HP) is one of the world's leading designers and manufacturers of electronic, medical, analytical, 

and computing instruments and systems. HP divides its business into five product categories: computer 

products, electronic test and measurement instruments and systems, medical electronic equipment, analytical 

instruments, and electronic components. 


HP North American Company Profiles 

Analytical 

Instruments 

Medical 2% 

Electronics 

Test/ 4% 

Measurement 

Instruments 

10% 

1-128 

Computers 

82% 

Electronic 

Components 

2% 

1996 Corporate Sales by 

Product Group 

Asia 

21% 

Europe 

35% 

U.S. 

44% 


Geographic Region 

Hewlett-Packard's Components Group is a leading supplier of microwave semiconductors and optoelectronic 

devices for the fiber-optic, wireless and visual communications, computer equipment, industrial, and automotive 

markets. 

In 1992, HP completed the acquisition of Avantek, Inc. Through Avantek, HP gained a wider customer base in the 

components market. Those Avantek products targeted for commercial markets became part of the 

Communications Components Division. Those products whose main applications are defense-related make up 

the Avantek subsidiary of the Components Group. 

Also under the wings of Hewlett-Packard is HP Labs, which is one of the world's leading electronic research 

centers. 

Management 

Lewis E. Platt Chairman, President, and Chief Executive Officer 

Richard W. Anderson Vice President and GM, Microwave and Communications Group 

William F. Craven Vice President and GM, Components Group 

Alan Marty Vice President and GM, Integrated Circuits Business Division 

Frederic N. Schwettmann Vice President and GM, Circuit Technology Group 

Rich Sevcik Vice President and GM, Systems Technology Group 

Neal Carney Manager, Marketing, IC Business Division 

Lance Mills Manager, Research and Development, IC Business Division 


HP's semiconductor products range from analog and high-speed digital ICs to RF, microwave, and optoelectronic 

semiconductors. The company also offers motion control devices, solid-state relays, and millimeter-wave 

components. In addition, HP manufactures RISC MPUs that are designed using what it calls Precision 

Architecture-RISC (PA-RISC). 


North American Company Profiles HP 

In early 1997, HP introduced the latest product from its PA-8000 RISC microprocessor family of 64-bit MPUs for 

high-end systems—the 12-million transistor PA-8500. Claiming to be HP’s most powerful microprocessor, the PA- 

8500 incorporates 1.5MB of memory on chip and was designed on a 0.25μm process. Target applications for the 

device include Internet access, database access and management, computer-aided design and manufacturing 

(CAD/CAM), and communications. 

HP uses sophisticated semiconductor technologies based on silicon, GaAs, and InP materials. 


In April 1997, Hewlett-Packard announced the development of a new joint venture foundry company with foundry 

company, Chartered Semiconductor, and the Economic Development Board (EDB) of Singapore. This is the 

second fab facility investment HP has made in Singapore. 

The new venture, called Chartered Silicon Partners, will be located adjacent to Chartered’s exiting facilities in the 

Woodlands Industrial Park in Singapore. Construction of a 200mm wafer manufacturing facility is expected to 

begin in September 1997 with production beginning in mid-1999. HP will receive a specified amount of wafers 

(0.35μm and 0.25μm ASICs) from the venture in exchange for its investment, while the remaining capacity will be 

offered as part of Chartered’s usual foundry services. Chartered will hold the majority interest of the venture while 

HP and the EDB will hold minority positions. 

Hewlett-Packard Hewlett-Packard 

350 West Trimble Road 39201 Cherry Street 

San Jose, California 95131-1008 Newark, California 95131 


Capacity (wafers/week): 1,100 Cleanroom size: 13,000 square feet 

Wafer sizes: 3in, 100mm Capacity (wafers/week): 1,250 

Processes: Bipolar, GaAs Wafer size: 100mm 

Products: ASICs, optoelectronics, discretes Process: Bipolar 

Feature sizes: 0.5μm-5.0μm Products: Analog ICs, RFICs 

Hewlett-Packard Hewlett-Packard 

3404 East Harmony Road 1050 Northeast Circle Boulevard 

Fort Collins, Colorado 80525 Corvalis, Oregon 97330 

Telephone: (303) 229-3800 Capacity (wafers/week): 5,600 

Capacity (wafers/week): 1,250 Wafer sizes: 100mm, 150mm 

Wafer sizes: 100mm, 150mm Process: CMOS 

Processes: CMOS, bipolar Products: ASICs, MPUs, MPRs, DSPs 

Products: RFICs, microwave ICs, MPUs, ASICs Feature sizes: 0.5μm-1.0μm 



HP North American Company Profiles 

Hewlett-Packard Avantek, Inc. 

Santa Rosa, California Santa Clara, California 


Wafer size: 2in Capacity (wafers/week): 225 

Process: Bipolar Wafer size: 3in 

Products: Discretes Process: GaAs 

Products: ICs and discretes 

TECH Semiconductor Singapore Pte. Ltd. 

P.O. Box 2093, SE 9040 

990 Bendemeer Road 

Singapore 1233 

Telephone: (65) 298-1122 




Process: CMOS 

Products: DRAMs 


(Joint venture with Texas Instruments, the Economic Development 

Board of Singapore, and Canon.) 


• AT&T Microelectronics (now Lucent Technologies) and Hewlett-Packard signed an agreement in early 1995 to 

develop and dual-source fiber-optic transceivers for SONET/SDH and ATM applications. 

• To promote and coordinate the use of its PA-RISC architecture, Hewlett-Packard formed PRO, the Precision 

RISC Organization. Some of the founding members are Convex Computer, Hitachi, Oki, Hughes Aircraft, and 

Mitsubishi. Other members include Sequoia Systems and Winbond Electronics. 

• Although not a PRO member, Samsung has the right to manufacture PA-RISC ICs to sell on the merchant 

market and use in its own workstations. 

• HP formed an alliance with Analog Devices for the joint development of advanced mixed-signal processes 

based on HP's submicron CMOS and BiCMOS technologies. 

• Hewlett-Packard and Intel announced a wide ranging joint research and development alliance in 1994 under 

which the partners are seeking to design a superior next-generation 64-bit microprocessor by 1999, a year later 

than originally planned. The processor will be binary-compatible with both Intel x86 code and HP PA-RISC 

code. 

1-130 


North American Company Profiles Hughes Electronics 

HUGHES ELECTRONICS 

Hughes Electronics Corporation 

Delco Electronics Corporation Hughes Aircraft Company 

One Corporate Center Microelectronics Division 

Kokomo, Indiana 46904-9005 500 Superior Avenue 

Telephone: (317) 451-5700 Newport Beach, California 92663 

Fax: (317) 451-5426 Telephone: (714) 759-2411 

Web Site: www.delco.com Fax: (714) 759-2986 

Web Site: www.hughes.com 



1992 1993 1994 1995 1996 

Corporate 

Sales 12,297 13,518 14,099 14,772 15,918 

Net Income (922) 922 1,049 1,108 1,151 

Semiconductor 

Sales 341 350 360 340 330 

Delco Electronics 205 220 235 240 250 



Hughes Aircraft 136 130 125 100 80 




Hughes Electronics Corporation (HE), known as GM Hughes Electronics Corporation prior to March 1995, is a 

subsidiary of General Motors Corporation. HE's principal operating organizations are Delco Electronics 

Corporation and Hughes Aircraft Company. Its other business units are Hughes Telecommunications and Space 

Company, DirecTV, Inc., and Hughes Network Systems, Inc. 


Hughes Electronics North American Company Profiles 

1-132 


and Space 

26% 

Other 

1% 

Automotive 

Electronics 

33% 

Aerospace and 

Defense Systems 

40% 


Delco Electronics (DE) is a world leader in the development, manufacture, and marketing of vehicle and driver 

systems for the global automotive market, and Hughes Aircraft, acquired by GM in 1985, is a world leader in 

aerospace, defense electronics, and information systems. 

Delco Electronics, alone, is the third largest captive IC manufacturer. Its fabrication facilities produce about 40 

percent of its semiconductor needs. The company produces advanced ICs that perform a variety of functions, 

such as deciphering radio frequency signals for audio systems, controlling the release of an airbag, suspension 

system control, and fuel, electrical, and ignition management. Some of its new technologies include night vision 

systems, collision avoidance systems, navigation systems, keyless start systems, tire pressure warning systems, 

and reconfigurable LCD head-up displays. 

Hughes Aircraft continues to restructure its business to adapt to severe cuts in U.S. defense spending. The 

company intends to maintain its leadership in key defense markets, while at the same time, explore new 

marketplaces and exploit new technologies. Some commercial ventures the company is involved in include: 

digital cellular communications systems, advanced acoustic technologies, light projection systems, digital signal 

compression, character recognition, and airport integration systems. 

In January 1997, GM and Hughes Electronics announced a series of strategic transactions designed to 

strengthen the position of GM in two key areas—telecommunications and space, and automotive electronics. GM 

has a definitive agreement with Raytheon to spin off Hughes Aircraft from Hughes Electronics and then merge the 

operation into Raytheon. Separately, Delco Electronics will be transferred from Hughes Electronics to GM’s Delphi 

Automotive Systems. Both of these transactions are expected to take place in 3Q97. 

Management 

C. Michael Armstrong Chairman and Chief Executive Officer, Hughes Electronics Corporation 

Michael J. Burns Executive Vice President, Hughes Electronics Corporation; 

General Manager, Delco Electronics Corporation 

John C. Weaver Senior Vice President, Hughes Electronics Corporation; 

President, Hughes Aircraft Company 


North American Company Profiles Hughes Electronics 


IC Delco, DE's automotive semiconductor unit, designs and manufactures custom analog and digital ICs for 

specific automotive applications such as anti-lock brake systems, engine controllers, suspension control systems, 

communications, and instrumentation. IC Delco also produces silicon-based electronic sensors. 

Among the semiconductor devices Hughes Aircraft designs and manufactures are ASICs, memory devices, 

microcomponents, rad-hard circuits, monolithic microwave integrated circuits (MMICs), and millimeter-wave devices 

using a variety of process technologies including CMOS, BiCMOS, GaAs, and InP. 


Delco Electronics Corporation Hughes Aircraft Company 

IC Delco Business Unit Microelectronics Division 

700 East Firmin Street 500 Superior Avenue 

Kokomo, Indiana 46902-2340 Newport Beach, California 92663-3627 

Cleanroom size: 125,000 square feet (3 fabs) Telephone: (714) 759-2411 


Wafer sizes: 100mm, 125mm Wafer sizes: 100mm 

Processes: NMOS, CMOS, BiCMOS, bipolar Processes: CMOS, BiCMOS, SOS, CryoCMOS 

Products: MPUs, MCUs, ASICs, logic and Products: ASICs, memories, MCUs, LCD drivers, 

linear ICs, discretes linear ICs, rad-hard ICs, foundry services 


Hughes Aircraft Company Hughes Microelectronics Europa, Ltd. 

Hughes Communications Products Fullerton Road 

3100 Lomita Boulevard Queensway Industrial Estate 

Torrance, California 90509 Glenrothes, Fife, Scotland KY7-5PY 

Telephone: (310) 517-6880 Telephone: (44) (1592) 754-311 

Fax: (310) 517-6883 Fax: (44) (1592) 610-186 

Capacity (wafers/week): 250 Capacity (wafers/week): 1,600 

Wafer size: 3in Wafer size: 100mm 

Processes: GaAs, InP Processes: CMOS, MOS 

Products: MMICs, MM-wave devices, discretes Products: ASICs, memories, custom ICs 



• Delco Electronics and Texas Instruments jointly developed a new methodology, called Prism, that is claimed to 

cut the high cost and long lead time of taking complex mixed-technology designs from concept to silicon. 

Prism is being used by DE to produce configurable 16-bit microcontrollers for GM cars. 


IBM Microelectronics North American Company Profiles 


1-134 

IBM MICROELECTRONICS 

IBM Microelectronics 

1580 Route 52, Building 504 

Hopewell Junction, New York 12533 

Telephone: (914) 894-2121 

Fax: (914) 894-6891 

Web Site: www.chips.ibm.com 


Europe: IBM Microelectronics Europe • Geneva, Switzerland 

Telephone: (41) (22) 918-4600 • Fax: (41) (22) 918-4650 

Asia-Pacific: IBM Singapore Pte., Ltd., Microelectronics • Singapore 

Telephone: (65) 320-1000 • Fax: (65) 227-8721 


1992 1993 1994 1995 1996 

Corporate (IBM Corp.) 

Sales 64,523 62,716 64,052 71,940 75,947 

Net Income (4,965) (8,101) 3,021 4,178 5,429 

Semiconductor 

Sales 3,775 3,885 4,575 5,705 5,100 

Internal Sales 3,725 3,510 3,605 4,020 3,550 

External Sales 50 375 970 1,685 1,550 

Capital Expenditures 650 1,000 1,500 

Employees (IBM Microelectronics) 22,000 


International Business Machines (IBM) was founded by Thomas J. Watson in 1924. Since then, IBM has grown 

into one of the world's largest corporations that sells in over 140 countries. IBM develops, manufactures, and sells 

advanced information processing products, including computers and microelectronics technology, software, 

networking systems, and information technology-related services. 


North American Company Profiles IBM Microelectronics 

Finance and Other 

5% 

OEM Hardware* 

4% 

Maintenance 

9% 

Software 

17% 

Services 

21% 

Information 

Technology 

Products 

44% 

*Includes external sales of semiconductors. 


Product/Service Group 

Latin America 

9% 

Asia-Pacific 

19% 

Europe/ 

Middle East/Africa 

33% 


39% 



The Microelectronics Division of IBM develops, manufactures, and markets a wide range of integrated 

microelectronic products and technologies. Products and services range from semiconductor design and 

fabrication to fully assembled and tested functional assemblies. 

Prior to 1992, IBM Microelectronics supplied its products and services exclusively to one customer—IBM 

Corporation. Spurred by both a comprehensive restructuring of IBM into independent business units and the 

high cost of developing advanced semiconductor technologies, IBM Microelectronics launched a worldwide 

microelectronics merchant market effort in 1992 by offering to sell virtually every product and service in its 

technology portfolio. Its products and services are targeted at manufacturers of computers, communications, and 

consumer electronics systems. 

IBM Microelectronics’ strategic products are its PowerPC RISC microprocessors and embedded controllers, x86 

microprocessors, memory ICs, ASICs, and leading-edge packaging services. Other important microelectronic 

products include analog and mixed-signal ICs, digital signal processors, and graphics chips. By combining several 

of its chips to form system solutions, IBM is seeking to strengthen its presence in the data processing, consumer 

electronics, and communications markets. 

To bolster its technological leadership, IBM has entered into several major alliances. Examples of these alliances 

are Toshiba, Siemens, and Motorola in process technology, the PowerPC microprocessor alliance with Motorola 

and Apple Computer, and work in the area of X-ray lithography with Lucent Technologies, Motorola, and 

Lockheed-Martin Federal Systems. 



Management 

IBM Corporation 

Louis V. Gerstner, Jr. Chairman and Chief Executive Officer 

J. Thomas Bouchard Senior Vice President, Human Resources 

Nicholas M. Donofrio Senior Vice President and Group Executive, Server Group 

J. Bruce Harreld Senior Vice President, Strategy 

Paul M. Horn Senior Vice President, Research 

Ned C. Lautenbach Senior Vice President and Group Executive, Sales and Service 

Lawrence R. Ricciardi Senior Vice President and General Counsel 

Robert M. Stephenson Senior Vice President and Group Executive, Personal Systems and 

Technology Group 

G. Richard Thoman Senior Vice President and Chief Financial Officer 

John M. Thompson Senior Vice President and Group Executive, Software Group 

David B. Kalis Vice President, Communications 

Abby F. Kohnstamm Vice President, Corporate Marketing 

IBM Microelectronics Division 

Michael J. Attardo General Manager, IBM Microelectronics Division 

Orest Bilous General Manager, Manufacturing and Process Development 

James K. Picciano General Manager, Applications and Solutions Development 

John C. Gleason Vice President and Assistant GM, Worldwide Sales and Marketing 

John Kelly Vice President, Strategy and Technology 

Peter Draheim Chief Executive Officer, SubMicron Semiconductor Technologies GmbH 

Stanley J. Grubel Chief Executive Officer, MiCRUS 


IBM Microelectronics offers the following products: 


• 4M, 16M, and 64M DRAMs (standard and low power versions). The company announced in April 1997 that it 

was halting production of 4M DRAMs to make more room for ASIC production. 

• 16M and 64M synchronous DRAMs (SDRAMs). 

• 8M and 16M synchronous graphics RAMs (SGRAMs). 

• 4M enhanced DRAMs (EDRAMs) through its partnership with Enhanced Memory Systems Inc. 

• 4M VRAMs. 

• 1M and 4M high-performance CMOS synchronous SRAMs (250MHz and 225MHz, respectively). 

1-136 


North American Company Profile IBM Microelectronics 

ASIC Products 

• CMOS digital ASICs—gate arrays and standard cells with gate counts ranging from 50,000 to 3.2 million gates 

(max.). IBM’s system cores include PowerPC and x86 MPUs, DSPs, peripheral circuits, I/O circuits, USB 

devices, audio/video/graphics components, and communications interfaces. 

• Bipolar analog and mixed-signal ASICs. 

• CMOS analog and mixed-signal ASICs. 

• BiCMOS analog and mixed-signal ASICs. 

• High-performance BiCMOS analog and mixed-signal ASICs. 

• IBM abandoned its FPGA development and production program in 1996. 

Microprocessors and Controllers 

• 6x86, 5x86C, 486 DX4, and 486 DX2 microprocessors (the 5x86C and 6x86 are designed by Cyrix). 

• PowerPC 600 Series 32-bit and 64-bit RISC microprocessors (clock speeds of up to 250MHz). 

• PowerPC 400 Series 32-bit RISC embedded controllers. 

• MC196 16-bit microcontrollers (compatible with Intel’s MCS-96 16-bit architecture). 

• Mwave digital signal processor (DSP) products for multimedia and communications applications. 

Communications, Networking, Interface, and Graphics Products 

• PCI core logic chipsets and PCI-to-PCI bridge chips. 

• Firewire (IEEE 1394) high-speed (200Mbps) serial bus transceiver chips. 

• High-end RGB series of palette digital-to-analog converters for 2D and 3D graphics. 

• Adaptive Lossless Data Compression (ALDC) ICs and MPEG-2 digital video encoders and decoders. 

• High-performance ATM, Ethernet, and Token Ring networking chips and ASIC cores (made available to the 

merchant market in 3Q96). 

• Silicon-germanium-based wireless communications and data-conversion devices. 

• Infrared transceivers and communications controllers. 

Other Products and Services 

• Semiconductor contract manufacturing services for advanced ICs. Process technologies offered through 

IBM’s foundry services include the CMOS 5S1 0.5μm process, the CMOS 5SF 0.35μm SPQM process, and 

the CMOS 6SF 0.25μm SPQM process, which will be available for volume production in 2Q98. 

• Deep-UV photoresists. 

• Semiconductor test equipment. 

• Semiconductor packaging services for single or multiple chip applications. 

• Printed circuit boards and cards. 

• PCMCIA infrared wireless and data/fax modem products and solid state file storage products. 

IBM has developed and uses some of the industry's most advanced CMOS processing technologies including the 

following: 0.35μm, 0.5μm, and 0.6μm CMOS with up to five layers of metal. The company unveiled its 0.25μm 

CMOS 6S process technology in mid-1996. While digital CMOS is the company's principal technology, various 

other processes are used, including bipolar, analog CMOS, BiCMOS, complementary BiCMOS, and silicongermanium 

(SiGe). 




IBM Microelectronics IBM Microelectronics 

East Fishkill Facility 1000 River Street 

1580 Route 52 Essex Junction, Vermont 05452 

Hopewell Junction, New York 12533 Telephone: (802) 769-0111 


Cleanroom size: 230,000 square feet Wafer size: 200mm 

Capacity (wafers/week): 16,750 Processes: CMOS, BiCMOS, bipolar 

Wafer sizes: 125mm, 200mm Products: DRAMs, SRAMs, logic ICs, mixed-signal ICs, 

Processes: CMOS, BiCMOS, SiGe linear ICs, ASICs, MPUs, foundry services 

Products: Logic ICs, linear ICs, mixed-signal ICs, Feature sizes: 0.25μm-1.0μm 

memories, R&D 


(IBM's ASTC—Advanced Semiconductor 

Technology Center is located here) 

IBM Microelectronics IBM United Kingdom Labs Ltd. 

Thomas J. Watson Research Center Hursley Park 

Route 134 North Winchester 

Yorktown Heights, New York 10598 Hampshire SO21 2JN 

Telephone: (914) 945-3000 England 

Capacity (wafers/week): 1,500 United Kingdom 

Wafer size: 100mm Telephone: (44) (962) 84-4433 

Process: CMOS Wafer size: 200mm 

Products: R&D Processes: Bipolar, MOS 

Feature size: 0.25μm Products: R&D 

IBM France IBM/Siemens 

224 Bd. John Kennedy Corbeil-Essonnes Cedex 

P.O. Box 58 France 

F-91102 Corbeil Essones-Cedex Cleanroom size: 116,000 square feet 

France Capacity (wafers/week): 3,000 

Telephone: (33) (1) 60-88-51-51 Wafer size: 200mm 

Cleanroom size: 390,000 square feet Process: CMOS 

Capacity (wafers/week): 10,750 Products: DRAMs (logic ICs in future) 

Wafer sizes: 125mm, 200mm Feature sizes: 0.35μm-0.5μm 

Process: CMOS 

Products: MPUs, MCUs, ASICs, DRAMs, SRAMs 


1-138 



IBM Duetschland GmbH IBM Japan Ltd. 

Werk Singdelfingen 800 Ohaza Ichimayake, Yasu-Machi 

Postfach 266 Yasu-gun, Shiga-ken 520-23, Japan 

Singdelfingen, Germany Telephone: (81) (755) 88-2511 


Capacity (wafers/week): 18,750 Wafer sizes: 125mm, 200mm 

Wafer sizes: 125mm, 200mm Process: CMOS 

Processes: Bipolar, CMOS Products: MPUs, DSPs, ASICs, logic ICs 

Products: DRAMs, SRAMs, ASICs, DSPs, MPUs Feature sizes: 0.6μm, 0.8μm 

Feature sizes: 0.8μm-2.0μm (DRAM production discontinued here in 1996.) 

MiCRUS SubMicron Semiconductor Technologies GmbH (SMST) 

1580 Route 52 Schoenaicherstrasse 220 

Hopewell Junction, New York 12533 Boeblingen Hulb, Germany 

Telephone: (914) 892-2121 Cleanroom size: 107,640 square feet (Class 1) 




Products: DRAMs, MPRs Products: DRAMs, logic ICs 


(Joint venture with Cirrus Logic. (Joint venture with Philips. The partners plan 

See Key Agreements.) to upgrade the fab to handle 0.5μm line 

widths. See Key Agreements.) 

Dominion Semiconductor LLC 

9600 Godwin Drive 

Manassas, Virginia 22110 

Telephone: (703) 367-3280 

Fax: (703) 367-3271 




Process: CMOS 



(Joint venture with Toshiba. Scheduled to begin 

production in early 1998. See Key Agreements.) 


• In mid-1996, IBM announced an agreement with Mitsubishi that allows the Japanese company to sell IBM 

PowerPC embedded controller chips under the Mitsubishi brand name. 

• IBM and Synopsys announced a six-year R&D agreement in February 1996 to jointly develop tools and 

methodologies for designing complex ICs with as many as 10 million gates. 



• IBM licensed the Rambus ASIC Cell (RAC) high-bandwidth interface technology in early 1996 from Rambus to 

use in its SystemCore ASIC megacell library. 

• IBM granted licensing rights to Exponential Technology, Inc. to develop and market a new ultra-highperformance 

BiCMOS microprocessor based on the PowerPC architecture. Volume shipments of 

Exponential’s MPU are expected to begin in early 1997. 

• In late 1995, IBM and Toshiba began building a new 64M DRAM plant at the site of a closed IBM fab in 

Manassas, Virginia. IBM and Toshiba will each own 50 percent of the facility, which will operate under the name 

Dominion Semiconductor. First silicon is expected from the fab in late 1997 with production beginning in 

1998. 

• Ramtron signed a manufacturing agreement with IBM in May 1995 for EDRAM production. Under the 

agreement, IBM is serving as a foundry for the production of Ramtron-subsidiary Enhanced Memory Systems' 

EDRAMs, and IBM has a non-exclusive license to sell the devices. 

• In 1994, Philips agreed with IBM Microelectronics to form a joint venture to manufacture ICs at IBM's fab facility in 

Boeblingen Hulb, Germany. Philips holds 51 percent and IBM 49 percent of the new company, called 

SubMicron Semiconductor Technologies GmbH (SMST). SMST is supplying products solely to IBM and 

Philips, manufacturing DRAMs for IBM and logic ICs for Philips. Separately, Philips acquired the rights to IBM’s 

16M DRAM technology for embedded applications. Embedded DRAM products will also be produced by 

SMST. 

• IBM and Cirrus Logic formed a joint manufacturing venture called MiCRUS in 1994. MiCRUS fabricates wafers 

for both companies in a former IBM plant in East Fishkill, New York. IBM and Cirrus Logic own 52 percent and 48 

percent of MiCRUS, respectively. For the time being, the agreement does not include product and/or 

technology exchange. 

• S3 Incorporated signed an agreement with IBM for the production of S3's graphics accelerators at IBM's fab in 

Essex Junction, Vermont. 

• The PowerPC RISC architecture has been, and continues to be, codeveloped by IBM, Motorola, and Apple 

Computer. The trio of companies are also working on combining the PowerPC technology with an open 

hardware platform supporting a range of operating systems. 

• IBM is jointly developing with Siemens and Toshiba, 0.25μm technology for shrink-version 64M DRAMs and 

256M DRAMs. Additionally, in 3Q96, Toshiba, IBM, and Siemens agreed to jointly develop system-on-a-chip 

devices. As part of a separate agreement, Siemens and IBM are jointly producing 16M DRAMs in Corbeil- 

Essonnes, France. 

• Toshiba licensed the PowerPC microprocessor technology from IBM Microelectronics. Although Toshiba was 

not given the right to sell PowerPC MPUs on the merchant market, it does have the right to develop and 

manufacture its own derivatives of the processor. For now, IBM will produce the MPUs for Toshiba. 

1-140 



• IBM and Cyrix announced a five-year agreement in early 1994 calling for IBM to manufacture Cyrix's 486, 5x86, 

and 6x86 MPUs. The two companies equally share the output of the Cyrix-designed chips. 

• IBM and Analog Devices announced in late 1993 plans to jointly design, produce, and market mixed-signal and 

RF chips based on IBM's silicon-germanium (SiGe) process technology. In 1996, Hughes Electronics joined 

IBM in a program to develop SiGe chips for commercial communications applications. 

• IBM is working with Motorola, Lockheed-Martin Federal Systems, and Lucent Technologies to establish a 

manufacturing infrastructure for X-ray lithography. The team hopes to have a manufacturing capability by the 

end of 1997. 


IC Works North American Company Profiles 


1-142 

IC WORKS 

IC Works, Inc. 



Telephone: (408) 922-0202 

Fax: (408) 922-0833 


1994 1995 1996 1997 

Sales 21 26 41 47 

Employees 125 150 200 250 


IC Works was established in June 1992 when it acquired the San Jose fabrication facility, process technology, and 

engineering and manufacturing staff of Samsung Semiconductor, the U.S. business of Korea’s Samsung. 

As an independent company, IC Works designs, manufactures, and markets mixed-signal products using its 

design and in-house facility, and provides quick-turn, submicron foundry services to selected mixed-signal 

semiconductor companies. 

IC Works operates three complementary mixed-signal businesses—clock products, wireless communications 

products, and submicron foundry services. 

Management 

Ilbok Lee, Ph.D. President and Chief Executive Officer 

John Hagedorn Vice President and Chief Financial Officer 

John Kelly Vice President, Fab Operations 

Richard Miller Vice President, Marketing 

Chen Wang Vice President, Engineering 


North American Company Profiles IC Works 


IC Works' product and services include high-performance clock generator ICs, wireless communication circuits, 

and foundry services. New products for the computer and data communications markets are being developed. 

Foundry Services 

IC Works’ in-house foundry provides special services to mixed-signal semiconductor companies for the 

development, prototyping, and early production of new products. 

Clock Products 

IC Works offers a wide range of high performance phase-locked-loop (PLL)-based clock ICs for system 

manufacturers in a variety of markets. The main applications within the clock market include PC motherboards, 

communications, mass storage, multimedia, and workstations. Products include clock buffers and single and 

dual PLL clocks. 

Wireless Communications 

Utilizing its PLL and BiCMOS process technologies, IC Works is developing RF solutions for the wireless 

marketplace, focusing on data communications. This product strategy includes development of component 

level functional block products and ASSPs. 

As part of the buyout, Samsung licensed IC Works to use its scaleable submicron CMOS and BiCMOS process 

technologies. Currently, the majority of IC Works’ production wafer output is processed to 0.7μm design rules with 

a migration to 0.6μm under way. Future plans include development of finer geometry processes down to 0.35μm. 


IC Works, Inc. 




Capacity (wafers/week): 1,200 (expanding) 

Wafer size: 125mm (upgrading to 150mm) 


Products: Mixed-signal ICs, foundry services 

Feature sizes: 0.5μm, 0.7μm (0.35μm under development) 

IC Works is in the process of expanding its fab capacity with financial support from its fab partners, which include 

Sierra Semiconductor and TelCom Semiconductor Inc. The $50 million expansion, which includes moving from 

125mm to 150mm wafers, is scheduled to be completed in 1997. 


IC Works North American Company Profiles 


• In 1996, IC Works and Motorola announced a second-source agreement for the development and manufacture 

of CMOS and BiCMOS-based mixed-signal timing circuits. Motorola will contribute high-performance timing 

solutions targeted at workstations, servers, and network applications, while IC Works will provide “clock” 

solutions targeting personal computers and peripheral applications. 

• IC Works has a foundry agreement with TelCom Semiconductor. Under the agreement, TelCom will invest $10 

million in equipment and the expansion of IC Works’ submicron wafer fabrication facility, in return for wafer 

capacity. The agreement covers a five-year period which is expected to begin in late 1997. 

1-144 


North American Company Profiles ICS 

INTEGRATED CIRCUIT SYSTEMS (ICS) 


Integrated Circuit Systems, Inc. 

2435 Boulevard of the Generals 

P.O. Box 968 

Valley Forge, Pennsylvania 19482-0968 

Telephone: (610) 630-5300 

Fax: (610) 630-5399 

Web Site: www.icst.com 


1992 1993 1994 1995 1996 

Sales 37 78 94 104 100 

Net Income 4 11 12 5 4 


Employees 224 314 336 219 206 


Founded in 1976, Integrated Circuit Systems (ICS), designs, develops, and markets mixed-signal integrated 

circuits primarily for data communications, clock, and multimedia applications. The company also provides custom 

application specific ICs (ASICs) for the consumer, medical, telecommunications, and aerospace industries. 

ICS’s primary focus is to combine its innovation, market position, and competency in mixed-signal and phase 

locked-loop technology to capitalize on the trend convergence of computer, communications, and consumer 

applications, especially in the LAN/WAN communications marketplace. 

For most of its formative years ICS concentrated on supplying its mixed-signal technology in custom ASIC designs 

for OEMs. In the late 1980’s, ICS began to develop proprietary standard products. ICS entered the frequency 

timing generator (FTG) business in 1989 with a pioneering FTG for video clocks. 

In 1992, ICS completed the acquisition of the Avasem Corporation, the leader in motherboard clocks. Together, 

ICS and Avasem offer a breadth of clock products unequaled by any other company. 

In April 1995, ICS purchased a majority interest in ARK Logic Inc., a Santa Clara, California-based developer of 

graphical user interface (GUI) accelerator devices. ARK Logic's graphics controller technology was merged with 

ICS's audio and mixed-signal RAMDAC and video clock generator technologies to provide complete PC 

multimedia solutions. 


ICS North American Company Profiles 

In 1995, ICS introduced a line of high-performance transceiver chips designed for international use in the latest 

network systems. These devices work in local area networks (LANs) and wide area networks (WANs), including 

the newest technologies such as Sonet/SDH fiber optic systems, asynchronous transfer mode (ATM) 

copper/fiber systems, and fast Ethernet systems. 

In December 1996, ICS sold its subsidiary, Turtle Beach Systems Inc., in an effort to focus on its core businesses. 

In a separate move, ICS sold its battery charge controller business. 

1-146 

Multimedia/ 

ARK Logic 

13% 

ASICs 

17% 

Turtle Beach 

21% 

Clock ICs 

49% 


Sales outside of the United States, primarily to the Pacific Rim, reached approximately 48 percent of total sales in 

1996. 

Management 

Henry I. Boreen Chairman and Interim Chief Executive Officer 

Stavro Prodromou President and Chief Executive Officer 

Hock E. Tan Senior Vice President, Finance and Administration, 

Chief Financial Officer, and Chief Operating Officer 

Gregory J. Richmond Vice President, FTG Business Group (San Jose, CA) 

William H. Weir Vice President, Data Communications Business Group 

Ronald J. Wenger Vice President, Sales 

Edward Christiansen Director, Operations 

John Klein Director, Custom Products 

Allan Havemose President, ARK Logic, Inc. 


ICS's products are outlined below. The products are designed and produced using CMOS processing 

technologies ranging from 0.35μm to 3.0μm. 

Data Communications Products Multimedia Audio Products 

• Fast Ethernet LAN • Music synthesizers 

• ATM • Audio codecs (coders and decoders) 

• Sonet/SDH • Software for wavetable music synthesis 


North American Company Profiles ICS 

Clock Products ARK Logic 

• Motherboard timing generators • GUI controller chips and software drivers 

• Video timing generators • Multimedia accelerators 

• Graphics timing for workstations 

• Special-purpose FTGs for Pentium Pro and Custom ICs 

PowerPC microprocessors and chipsets • Mixed-signal ICs for a broad range of applications 


All of ICS's wafers are currently manufactured by outside foundries, two of which meet a substantial majority of the 

company's wafer needs. ICS’s foundry partners include AMI and Chartered Semiconductor. 


• During fiscal year 1996, ICS established an agreement with Chartered Semiconductor to secure a minimum 

wafer supply from Chartered covering a five year period. 

• ICS acquired a 51 percent interest in ARK Logic, Inc. in 3Q95. ICS plans to combine its audio design specialty 

with ARK’s video graphics expertise to develop a chip that handles 3D graphics, VGA control, and audio and 

video processing. ICS may purchase the remaining 49 percent of ARK Logic. 

• In October 1992, ICS entered into an alliance with American Microsystems Inc. under which ICS secured wafer 

processing capacity through the year 2000. 

• ICS licensed DSP Group’s Pine digital signal processing and TrueSpeech voice compression technologies for 

use in its next-generation audio components. 


ICT North American Company Profiles 


1-148 

ICT 

ICT Inc. 

2123 Ringwood Avenue 


Telephone: (408) 434-0678 

Fax: (408) 434-0688 

Web Site: www.ictpld.com 


ICT Inc., founded in November 1991, designs, manufactures, and markets programmable logic devices (PLDs) for 

a variety of applications such as PCs, telecommunications, industrial, medical, and consumer electronics. The 

company was originally established in 1983 by International CMOS Technology. 

ICT is organized into two divisions: the Programmable Logic Division (PLD) and the Personal Computer Products 

Division (PCPD). The PLD designs, develops, and markets user-programmable integrated circuits specializing in 

programmable logic devices (PLDs). The PCPD designs and markets PC core logic chipsets and peripheral 

controller products. 

Management 

David Sears, Ph.D. Chairman and acting Chief Executive Officer 

Edward D. Barnett President and Chief Operating Officer 

Volker Cathrein Chief Financial Officer and Secretary 

Donald E. Robinson Vice President, Special Products 

Beverly Schirl Director, Marketing 


ICT's programmable logic product line consists of two families of CMOS PLDs—PEEL (Programmable Electrically 

Erasable Logic) Devices and PEEL Arrays—in addition to supporting development tools. PEEL Devices are 

simple PLDs designed as replacements for standard 20-pin and 24-pin PAL/GAL devices with speed grades 

ranging from 5ns to 25ns. PEEL Arrays are complex PLDs (CPLDs) that combine a non-segmented PLA with 

FPGA-like logic cells with wide single-level delays as fast as 9ns/15ns (internal/external). PEEL Arrays are used for 

combinatorial logic, with clocking frequencies running up to 80MHz for sequential functions. 


North American Company Profiles ICT 

PEEL Devices 

PEEL Arrays 

PEEL 16V8 PA7024 

PEEL 18CV8 PA7128 

PEEL 20V8 PA7140 

PEEL 22CV8 

PEEL 22CV10A 

PEEL 22CV10AZ 

PEEL 22LV10AZ 

PEEL 22V10 

ICT's PLDs are designed and manufactured using proprietary 0.8μm CMOS EEPROM technology. 

The company's PC product line consists of Pentium and 486 portable and desktop core logic chipsets, 

programmable peripheral interface ICs, and peripheral controller ICs. 


As with other fabless IC suppliers, ICT utilizes external fabrication and assembly facilities. ICT wafers are currently 

fabricated by two companies: Chartered Semiconductor Manufacturing of Singapore and Rohm Co. of Japan. 

Assembly and test work is handled by multiple vendors in the Philippines, Thailand, and Taiwan. 


• ICT has a license agreement with AMD involving PLD products. 


IDT North American Company Profiles 

1-150 

INTEGRATED DEVICE TECHNOLOGY (IDT) 


Integrated Device Technology, Inc. 

2972 Stender Way 


Telephone: (408) 727-6116 

Fax: (408) 727-8043 

Web Site: www.idt.com 


Japan: Integrated Device Technology–Nippon–K.K. • Chiyoda-ku, Tokyo, Japan 

Telephone: (81) (3) 3221-9821 • Fax: (81) (3) 3221-9824 

Europe: Integrated Device Technology, Ltd. • Leatherhead, Surrey, United Kingdom 

Telephone: (44) (1372) 363339 • Fax: (44) (1372) 378851 

Asia-Pacific: Integrated Device Technology, Asia, Ltd. • Tsimshatsui, Hong Kong 

Telephone: (852) 2736-0122 • Fax: (852) 2375-2677 


1993 1994 1995 1996 1997 

Sales 236 330 422 680 537 

Net Income 5 40 78 120 (42) 



Employees 2,414 2,615 2,965 3,875 4,380 


Integrated Device Technology, Inc. (IDT), founded in 1980, designs, manufactures, and markets highperformance 

integrated circuits and modules that are used in products serving its targeted markets segments: 

personal computing (desktop and portable PCs), distributed computing systems, communications equipment, 

and office automation. IDT enhances its customers’ ability to optimize the cost and performance of their 

microprocessor-based systems by providing innovative solutions based on four product groups: high-speed 

SRAMs; communications products including FIFOs, multi-port memories and ATM products; high-performance 

logic products; and RISC microprocessors. 

In an effort to diversify its products and reduce its reliance on one particular market, IDT is moving towards other 

growth areas of SRAMs such as the communications market. 


North American Company Profiles IDT 

Office 

Automation 

7% 

Distributed 

Computing 

10% 

Management 

Other 

10% 

Personal 

Computing 

22% 

RISC MPUs 

12% 

Logic 

Products 

20% 

Fiscal 1997 Sales by End-Use Market 

SRAMs 

32% 


Products 

36% 

Fiscal 1997 Sales by Product Group 

Data 


28% 

Telecom 

23% 

Europe 

17% 

United States 

63% 

Fiscal 1997 Sales by Geographic Region 


Japan 

13% 

D. John Carey Chairman 

Leonard C. Perham President and Chief Executive Officer 

Ray Famham Executive Vice President 

Stuart Bardach Vice President, Quality 

Charles R. Clark Vice President, Subsystems Products/SRAM Products 

William B. Cortelyou Vice President, Wafer Operations 

Dave Côté Vice President, Marketing 

Randy Frederick Vice President, Logic Products 

Robin H. Hodge Vice President, Assembly and Test 

Jimmy Lee Vice President, FIFO Products 

Daniel L. Lewis Vice President, Worldwide Sales 

Chuen-Der Lien Vice President, Technology Development 

John R. Mick Vice President, Applications Engineering 

Daniel R. Morris Vice President, ATM Products 

Tom North Vice President, DRAM Products 

Bob Phillips Vice President, Worldwide Manufacturing 

Robert Proebsting Vice President, Advanced Design Concepts 

Christopher P. Schott Vice President, Specialty Memory Products 

William D. Snyder Vice President, Finance, and Chief Financial Officer 

Jerry Taylor Vice President, Memory Products 

Thomas B. Wroblewski Vice President, Human Resources 

Asia 

7%

IDT North American Company Profiles 


IDT produces SRAMs, logic products, communications products, and RISC microprocessors. These products are 

designed and manufactured using proprietary advanced submicron CMOS and BiCMOS process technologies, 

including the company's CMOS VIII 0.5μm process and its next-generation 0.35μm process. IDT's product groups 

are outlined below. 

SRAMs 

• Fast CMOS asynchronous SRAMs with 16K to 1M densities and access times as fast as 10ns; 4M density 

devices will be available in 1998. 

• Fast CMOS ZBT synchronous SRAMs that optimize system performance in applications that frequently turn 

the data bus around between reads and writes. Available in 1M density with 4M density devices that will 

support clock speeds up to 133MHz planned for 1998. 

• Fast CMOS synchronous pipelined burst SRAMs (PBSRAMs) in 1M to 2M densities with clock speeds up to 

100MHz to support zero wait state performance in cache applications. 

• BiCMOS cache tag SRAMs for Pentium and PowerPC processors with high speed address-to-match times up 

to 8ns. 

• Ultra low-power CMOS SRAMs in 1M density with competitive standby and active supply current specifications. 

• High-speed industry-standard and custom CMOS SRAM modules. 

Communications Memory Products 

• High-speed CMOS multi-port SRAMs in densities from 8K to 512K with both synchronous and asynchronous 

interfaces. 

• High-density CMOS first-in, first-out memories (FIFOs) in synchronous unidirectional or bidirectional and 

asynchronous unidirectional or bidirectional versions, covering depths from 64K to 64K bytes and widths from 

4 to 36 bits. 

• Low-cost Asynchronous Transfer Mode (ATM) 25 to 155 Mbps segmentation and reassembly (SAR) controllers 

and physical layer (PHY) transceivers for use in network interface cards. 

Logic Products 

• High-speed FCT CMOS logic devices. 

• High-speed 3.3V CMOS FCT logic devices. 

• Low skew clock drivers. 

• High-speed error detection and correction devices. 

• Zero delay bus switch devices. 

RISC Microprocessors 

• R3000- and R4000-based 32-bit microprocessors, as well as the fourth generation R4700 and R5000 Orion 

64-bit microprocessors. 

• RISC subsystems. 

1-152 


North American Company Profiles IDT 


Integrated Device Technology Integrated Device Technology 

1566 Moffett Street 2670 Seeley Road 

Salinas, California 93905 San Jose, California 95134 

Fab 2 Telephone: (408) 944-0114 

Cleanroom size: 24,000 square feet (Class 3) Fab 3 

Capacity (wafers/week): 2,050 Cleanroom size: 24,000 square feet (Class 1) 

Wafer size: 150mm Capacity (wafers/week): 2,050 


Products: SRAMs, FIFOs, MPUs Processes: CMOS, BiCMOS 

Feature sizes: 0.5μm-0.8μm Products: SRAMs, FIFOs, RISC MPUs, logic ICs, R&D 


Integrated Device Technology 

Hillsboro, Oregon 

Fab 4 


Capacity (wafers/week): 1,875 (3,000 when fully outfitted) 




(Began operations in 1Q96) 


• IDT gained the right to make, market, and distribute multi-banked DRAM (MDRAM) memory architecture 

through a licensing agreement with MoSys Inc. The agreement also serves to expand the existing foundry 

agreement between the two companies. IDT plans to introduce a 9M MDRAM chip in mid-1997, using 0.35μm 

process technology at its Hillsboro facility. IDT is a minority investor in MoSys, Inc. 

• IDT codesigned its Mips-based Orion 64-bit RISC microprocessor with its partner, Quantum Effect Design. 

• IDT signed an alternate source agreement with Texas Instruments for logic products. TI and IDT are also jointly 

developing FIFO memory devices. 


IMI North American Company Profiles 

Employees 80 


1-154 

INTERNATIONAL MICROCIRCUITS (IMI) 

International Microcircuits Inc. 

525 Los Coches Street 


Telephone: (408) 263-6300 

Fax: (408) 263-6571 

Web Site: www.imicorp.com 


International Microcircuits Inc. (IMI) was formed in 1972 to manufacture high quality chrome photomasks. In the 

early 1990's IMI began developing niche application-specific standard products (ASSPs), building on its years of 

experience in ASICs. The company has a particular strength in the area of frequency synthesis using phaselocked 

loop (PLL) techniques. 

IMI has positioned itself as a leading supplier of clock circuits and is focusing its efforts on the consumer, 

computer, and wireless communications markets. The company is expanding its frequency timing generator 

technology to include other markets such as high-speed modems, digital video disks (DVDs), and printer 

applications. In the area of wireless communications, IMI is developing integrated solutions for the ISM and DECT 

wireless communications applications. 

Export sales accounted for almost 80 percent of total revenue in fiscal 1996. 

Japan 

7% 


21% 

Europe 

4% 

Asia 

68% 



North American Company Profiles IMI 

Management 

Frank Deverse Chairman and Chief Executive Officer 

Ilhan Refioglu President and acting Chief Financial Officer 

Orhan Tozun Vice President, Engineering 

Ed Walsh Vice President, Manufacturing 

George Gary Director, Computer Products 

Rick Reifer Director, Marketing and Sales 

Kazuo Tomari Drector, Wireless Communications and New Business Development 

Larry Zuckerman Director, Wireless Communications 


IMI's products are focused on two major applications: frequency synthesis for telecommunications and clock 

generation for digital systems. These products include clock generation devices for PC motherboards (including 

those based on the latest CISC and RISC processors) and PLLs and phase detectors for cellular phones, cordless 

phones, satellite receivers, and cable TV boxes. IMI is also a pioneer in the integration of spread spectrum 

technology for reducing EMI. 


To supplement its own wafer production capacity, IMI has foundry agreements with IBM, GMT Microelectronics, 

and Seiko. 

International Microcircuits Inc. 

525 Los Coches Street 




Process: CMOS 

Products: ASSPs 



IMP North American Company Profiles 


1-156 

IMP 

IMP, Inc. 



Telephone: (408) 432-9100 

Fax: (408) 434-0335 

Web Site: www.impweb.com 


1993 1994 1995 1996 1997 

Sales 56 48 60 77 65 

Net Income (2) 0.4 1 5 (12) 



Employees 324 340 400 425 200 


IMP was founded in 1981 as International Microelectronic Products, but changed its name to IMP, Inc. in 1993. 

Originally in the custom IC business, IMP began marketing its silicon foundry in 1987 and exited the custom IC 

business in 1990 with the introduction of its first standard product. IMP is a supplier of high-integration and 

programmable, analog and mixed-signal ICs and wafer manufacturing services to the computer, communications, 

and control markets. The company is a technology leader in analog signal processing and programmable analog 

design techniques. 

IMP is comprised of two business groups, the Application-Specific Standard Products group and the Customer- 

Specific Products group (wafer foundry). The company's ASSP group designs, manufacturers, and markets a 

proprietary line of value-added ICs for tape and disk drive manufacturers. The CSP group provides a wide range of 

CMOS IC manufacturing processes (specializing in mixed-signal) to companies in the computer and computer 

peripherals markets, as well as to fabless semiconductor companies and IMP's own ASSP group. Value-added 

processes include 0.8μm CMOS, EECMOS, 3-volt, and BiCMOS. 


North American Company Profiles IMP 

ASSP 

48% 

CSP 

52% 


Europe and 

Pacific Basin 

30% 


70% 


To address the need for wafer capacity by small fabless startup companies, IMP announced the establishment of 

its Silicon Venture Partners (SVP) program in May 1995. Under the SVP program, IMP provides access to wafer 

fabrication capabilities to fabless semiconductor startups. This includes absorbing some of the expenses of 

developing and producing a new IC in exchange for product, marketing, and/or technology rights, a share of 

future profits, or other compensation. 

Management 

David A. Laws President and Chief Executive Officer 

George Rassam Chief Financial Officer 

Russ Almand Vice President, Sales 

Tarsaim Batra Vice President, Manufacturing 

Robert J. Crossley Vice President, Administration 

Jerry L. DaBell Vice President, Product Planning 

Moiz B. Khambaty, Ph.D. Vice President, Technology 

Gregory Koskowich Vice President, Product Development 


Application-Specific Standard Products 

• High-frequency programmable filters for tape and disk drives. 

• Read channel ICs with both 3V and 5V operation for tape and disk drives. 

• Electrically programmable analog circuits (EPAC)—Analog counterparts to digital FPGAs that are designed 

for signal conditioning applications in the sensor, instrumentation, and industrial control markets. The 

EPACs are based on IMP's mixed-signal 1.2μm EECMOS process. 

Customer-Specific Products—IMP provides specialized or value-added foundry services. The firm is capable of 

running multiple processes in the same fab. 

• CMOS Analog Processes: For analog and mixed-signal applications in mass storage products, fax modems, 

local area networks, cellular phones, and computers. 

• EECMOS Process: Suitable for customization or personalization of customer designed circuits through onchip 

electrical programming. 

• High-Voltage Processes: Allows a chip to be designed with some sections functioning up to 18 volts and 

other sections at the typical 5 volts. 

• 3-volt Processes: To be used with circuits designed for portable system applications. 


IMP North American Company Profiles 

IMP's process technologies include: 0.8μm double-poly/double-metal CMOS, 1.0μm single- and doublepoly/double-metal 

CMOS, 1.2μm low-voltage and high-voltage CMOS, 1.2μm double-poly/double-metal 

BiCMOS, and 1.2μm double-poly/double-metal EECMOS. 


IMP, Inc. 






Processes: CMOS, BiCMOS, EECMOS 

Products: ASSPs, ROMs, foundry services 

Feature sizes: CMOS: 0.8μm, 1.0μm, 1.2μm, 2.0μm, 3.0μm, 5.0μm 

BiCMOS: 1.2μm 

EECMOS: 1.2μm 


• In July 1995, IMP signed a five-year foundry agreement with Rockwell Semiconductor Systems for the 

fabrication of Rockwell’s mixed-signal modem ICs. 

• IMP joined with Zilog and Allegro MicroSystems in a marketing alliance. The team is marketing what they call a 

ZIA disk drive chipset, with ZIA standing for Zilog, IMP, and Allegro. IMP's contribution to the ZIA chipset are the 

read channel ICs and ROMs. 

• In 1992, IMP signed a technology and distribution agreement with Asahi Kasei Microsystems (AKM) covering 

ASSPs. 

• IMP has a design and process technology transfer agreement with South African Microelectronic Systems 

(SAMES). SAMES purchased the rights to IMP's 1.2μm and 2.0μm mixed-signal process technologies and has 

been qualified as a second source for IMP’s high-volume manufacturing processes. 

1-158 


North American Company Profiles Infinite Technology 

Employees 30 


INFINITE TECHNOLOGY 

Infinite Technology Corporation 

2425 North Central Expressway, Suite 323 

Richardson, Texas 75080 

Telephone: (972) 437-7800 

Fax: (972) 437-7810 

Web Site: www.infinite-tech.com 


Established in 1991, Infinite Technology Corporation (ITC) is involved in the research, design, development, and 

marketing of high-performance reconfigurable function and application specific semiconductor products and 

technology. It also provides design support and design services. 

ITC has developed a field-programmable, in-system reconfigurable architecture that efficiently addresses the 

need for high performance arithmetic datapath functionality required to accelerate data stream algorithms for image 

processing in video editing, digital still cameras, broadcast video, pattern recognition, medical instrumentation, 

and virtual reality. Other applications for the company’s products include robotics, communications, satellites, data 

storage, and military equipment. 

Management 

Tim Smith Chairman and Chief Executive Officer 

Lavelle Gibson President and Chief Operating Officer 

Art Berger Chief Financial Officer 

Glen Haas, Jr. Vice President, Engineering 

George Landers Vice President, Sales and Marketing 

Mark R. Smith Vice President, Business Services 

Robert L. (Les) Veal Manager, Business Development 


ITC’s products and services include: reconfigurable arithmetic datapath (RAD) IC products, which are essentially 

reconfigurable DSPs; technology license agreements for programmable logic, reconfigurable arithmetic datapath, 

and digital signal processing architectures; ASIC design services, including custom macrocell development; and 

software development services. 


Infinite Technology North American Company Profiles 

ITC’s RAD5A4 device features four 100MHz 16-bit MacroSequencer processors, a built-in dual PLA, and five data 

buses. The company believes the RAD5A4 offers concurrent parallel processing performance (up to 3.2 billion 

operations per second) for less than the cost of a single-chip DSP. 

The company’s ASIC design services cover custom development of ICs and design cell libraries specializing in 

digital, analog, and mixed-signal devices, as well as memories. Design libraries include a range of custom I/Os 

(including SCSI and PCI), dense RAMs, PLLs, oscillators, and high-speed multipliers. 

The company also offers its Cheetah high-performance hard datapath core for complex system-level ASICs. The 

Cheetah datapath generator core required no synthesis, is software configurable, and can be integrated with 

popular microprocessor cores. The Cheetah core can also be used to design custom RAD ICs. 

ITC’s architecture features single-poly, double-level-metal 0.5μm or 0.6μm CMOS technology. A 0.35μm process 

is under development. 

Infinite Technology also functions as the U.S. representative for Nippon Precision Circuits and has a close 

relationship with the Japanese company involving technology and design. 


ITC’s RAD devices are manufactured by TSMC through Nippon Precision Circuits. 

1-160 


North American Company Profiles Integrated Silicon Solution 

INTEGRATED SILICON SOLUTION (ISSI) 


Integrated Silicon Solution Inc. 

2231 Lawson Lane 


Telephone: (408) 588-0800 

Fax: (408) 588-0806 

Web Site: www.issiusa.com 


Europe: ISSI Europe • Planegg, Germany 

Telephone: (49) (89) 899-30193 • Fax: (49) (89) 899-0399 

Asia-Pacific: ISSI Taiwan • Taipei, Taiwan 

Telephone: (886) (2) 397-9070 • Fax: (886) (2) 394-4024 


1992 1993 1994 1995 1996 

Sales 29 53 61 123 132 



Employees 190 228 311 385 


Integrated Silicon Solution, Inc. (ISSI), founded in 1988, designs and markets high-performance SRAM and nonvolatile 

memory ICs. The company’s initial development efforts were focused on high-performance SRAMs for 

cache memory applications and introduced its first SRAM products in 1990. ISSI has since expanded its product 

offering to include high-speed EPROMs, serial EEPROMs, and flash memory devices, and has expanded its 

markets to include networking applications, telecommunications, office automation, instrumentation, and 

consumer markets. 

To date, SRAM sales have accounted for substantially all of ISSI's product sales. In an effort to reduce its 

dependency on the memory market, ISSI entered the microcontroller market in early 1997 with the introduction of 

a microcontroller family. 


Integrated Silicon Solution North American Company Profiles 

Telecom 

2% 

Disk Drives 

5% 

Management 

1-162 

Networks 

10% 

Distributors 

13% 

Other 

8% 

Computers 

22% 

Modem 

40% 


Europe 

10% 

Japan 

3% 

Asia/Other 

11% 

Taiwan 

24% 

United States 

52% 


Jimmy S.M. Lee Chairman, President, and Chief Executive Officer 

Gary L. Fischer Executive Vice President, Finance and Administration, 

and Chief Financial Officer 

Kong-Yeu Han Executive Vice President and General Manager, ISSI-Taiwan 

Mo Bandali Vice President, Test and Product Engineering 

Robert G. Cushman Vice President, Corporate Marketing 

Thomas Doczy Vice President, Memory Marketing Business Unit 

Robert Shen Vice President, Corporate Planning 

Paul Song Vice President, Design Engineering 

John Unger Vice President, Quality Assurance 

Chung Wang Vice President, Technology 


ISSI designs and markets a family of high-performance SRAMs, as well as several families of non-volatile memory 

products, such as high-speed, high-density EPROMs, serial EEPROMs, and flash memories. In early 1997, ISSI 

introduced the first products in a new family of microcontrollers with integrated non-volatile memory. 

SRAM Products 

• 5V SRAMs in 64K, 256K, 512K, and 1M density levels with access speeds as low as 10ns. 

• 3.3V SRAMs in 256K, 512K, and 1M density levels with access speeds as low as 12ns. 

• 3.3V 1M and 2M synchronous SRAMs with access speeds as low as 4ns for Pentium and PowerPC cache 

applications. 

EPROM Products 

• 5V EPROMs in 256K, 512K, and 1M density levels with access speeds of 30ns to 90ns. 

• 3.3V EPROMs in 512K and 1M density levels with 90ns access times. 

• 2.4V voice EPROMs with embedded speech algorithm technology. 


North American Company Profiles Integrated Silicon Solution 

EEPROM Products 

• 3.3V and 5V serial EEPROMs in 1K, 2K, and 4K density levels. 

Flash Memory Products 

• 1M Intel-compatible bulk-erase flash memories. The company plans to introduce a 2M bulk-erase and 1M, 2M, 

and 4M boot block flash chips in 1996. 

Microcontroller Products 

• The company offers variations on the industry-standard 8051 and 8031 8-bit MCUs with embedded ROM. A 

flash version, as well as 16-bit and 32-bit parts, are planned for introduction in 3Q97. 

Other Products 

• ISSI entered the voice-chip market in 1996 with the introduction of a one-time programmable (OTP) voice chip. 

The device features ADPCM compression and pop noise reduction and is the first in a planned product line of 

OTP voice devices. 

ISSI develops its advanced CMOS process technology in collaboration with its Asian manufacturing partners. 

Through these alliances, ISSI has jointly developed and taken into production six generations of CMOS memory 

technology with 1.2μm, 1.0μm, 0.8μm, 0.6μm, 0.5μm, and 0.35μm feature sizes. The company currently has 

several development programs with Taiwan Semiconductor Manufacturing Company (TSMC), including a program 

based on a 0.35μm design for advanced SRAM applications and a 0.5μm design for a high-speed flash memory 

product. ISSI is currently in the process of developing 0.3μm and 0.25μm SRAM processes. 

The company also has collaborative programs with Chartered Semiconductor Manufacturing (CSM) in Singapore 

for 0.5μm SRAM process technology and with Belling Semiconductor in China for EEPROM design and process 

technology. 


ISSI’s principal manufacturing partner is TSMC, with whom it also jointly develops process technology. Since 

1993, ISSI has also used Chartered as a foundry for some SRAM and flash products. 

In addition to securing capacity with independent foundries, ISSI has invested in several joint venture 

agreements, further guaranteeing capacity. In June 1996, ISSI entered into a joint venture with TSMC, along with 

Altera, Analog Devices, and other investors, to create a wafer fabrication facility, called WaferTech LLC, to be 

located in Camas, Washington. ISSI also has a similar agreement with United Microelectronics Corporation (UMC), 

located in Taiwan, for additional supply of wafers. (see Key Agreements below). 


Integrated Silicon Solution North American Company Profiles 


• In July 1996, ISSI signed a manufacturing and joint venture agreement with TSMC, along with other investors. 

The agreement calls for ISSI to receive a minimum wafer capacity from TSMC in return for a four percent equity 

stake in the new venture. Construction of WaferTech LLC began in June 1996 with production expected to 

start in 2Q98 (see separate profile of TSMC). 

• In early 1996, ISSI announced an agreement with Intel. ISSI licensed flash-related patents from Intel and will 

pay royalty fees to Intel for the revenues generated from certain flash-based products. 

• In fiscal 1995, ISSI and UMC signed a manufacturing and joint venture agreement. Under terms of the 

agreement, ISSI agreed to invest $30 million for an equity stake in a joint manufacturing venture (UICC) that will 

provide ISSI with an additional supply of wafers beginning in 2H97. 

1-164 


North American Company Profiles Intel 


INTEL 

Intel Corporation 

Robert Noyce Building 


P.O. Box 58119 

Santa Clara, California 95052-8119 

Telephone: (408) 765-8080 

Fax: (408) 765-1821 

Web Site: www.intel.com 


Europe: Intel Corporation (UK) Ltd. • Swindon, Wiltshire, United Kingdom 

Telephone: (44) (1793) 403-000 

Japan: Intel K.K. • Tsukuba-shi, Ibaraki, Japan 

Telephone: (81) (289) 47-8522 

Asia-Pacific: Intel Semiconductor Ltd. • Hong Kong 

Telephone: (852) 2844-4555 


1992 1993 1994 1995 1996 

Sales 5,844 8,782 11,521 16,202 20,847 

IC Sales 4,950 7,550 9,850 13,590 17,870 

Net Income 1,067 2,295 2,285 3,566 5,157 

R&D Expenditures 780 970 1,111 1,296 1,808 

Capital Expenditures 1,228 1,933 2,441 3,550 3,024 

Employees 25,800 29,500 32,600 41,600 48,500 


Intel Corporation was established in 1968 to pursue the potential of integrating large numbers of transistors into 

silicon chips. The company created the first DRAM, the first EPROM, and the first microprocessor, revolutionizing 

the electronics industry by making possible small and powerful computing systems. Intel originally flourished as a 

MOS memory supplier. However, in 1985 Intel abandoned the DRAM business, in favor of microprocessors. 


Intel North American Company Profiles 

Today, Intel is by far the world's leading supplier of MOS microprocessors. The company's other principal products 

are microprocessor-related board-level products, core-logic chipsets, embedded processors and microcontrollers, 

flash memory devices, network and communications products, and conferencing products. Its IC products are 

sold to manufacturers of computer systems and peripherals, automotive equipment, industrial systems, and 

telecommunications products. 

1-166 

Systems/ 

Other 

15% 


5% 

Microcomponents 

80% 


Asia-Pacific 

18% 

Europe 

28% 


42% 


Thanks to strong demand for its microprocessors, Intel grew to become the world's largest semiconductor 

manufacturer in 1993. Part of Intel's strategy to maintaining momentum and supporting demand for its products is 

heavy reinvesting with its profits. Since 1991, Intel has invested more in new plants and equipment each year 

than any other semiconductor company in the world. The company expects to expend approximately $4.5 billion 

for capital additions in 1997. 

Intel believes that communications and multimedia will be decisive areas for the PC industry in the next decade. 

For this reason, the company continues to introduce new hardware and software products for local area network 

(LAN) management and personal computer conferencing systems. Intel is also pushing its MMX media 

enhancement technology, which the company says speeds up the execution of multimedia-related functions by 

routing compute-intensive code to the central processor, rather than through dedicated silicon. The first 

processors to use the MMX instruction set were introduced in January 1997. Intel’s other chips are expected to 

gain MMX capability in 1997. 

Due to the growth of Pentium microprocessor-based systems, Intel has become a major supplier of core-logic 

chipsets. The company’s Intel430 PCIset products, designed for desktop and mobile Pentium processors, were 

the first chipsets to support the Universal Serial Bus (USB) high-performance bus architecture. 

In flash memories, Intel has dominated the market essentially from the beginning. However, its share of the market 

has dropped from 75 percent or more in the early 1990’s to about 44 percent in 1996 as several other players 

have aggressively pursued the market. 

Japan 

12% 



Over the past couple of years Intel has stepped up its strategy of investing in other companies, typically startups, 

to help facilitate new application software content and hardware. The company investments number in the 

“hundreds,” and are not limited to chip companies. Companies in which it has recently invested include I/O chip 

specialist Standard Microsystems Corp.; Avid Technology Inc., which makes digital content-creation products; 

Case Technology, a Denmark-based company that makes Fast Ethernet products; and Xircom Inc., a PC-Card 

modem vendor. 

Management 

Gordon E. Moore Chairman Emeritus 

Andrew S. Grove Chairman and Chief Executive Officer 

Craig R. Barrett President and Chief Operating Officer 

Frank C. Gill Executive Vice President and GM, Internet and Communications Group 

Paul S. Otellini Executive Vice President and Director, Sales and Marketing Group 

Gerhard H. Parker Executive Vice President and GM, Technology and Manufacturing Group 

Leslie L. Vadasz Senior Vice President and Director, Corporate Business Development 

Ronald J. Whittier Senior Vice President and GM, Content Group 

Albert Y.C. Yu Senior Vice President and GM, Microprocessor Products Group 

Michael A. Aymar Vice President and GM, Desktop Products Division 

Andy D. Bryant Vice President and Chief Financial Officer 

Louis J. Burns Vice President and Director, Information Technology 

Dennis L. Carter Vice President and Director, Sales and Marketing Group 

Sunlin Chou Vice President and Director, Components Technology Development 

Richard A. DeLateur Vice President, Finance, Intel Architecture Group 

F. Thomas Dunlap, Jr. Vice President, General Counsel, and Secretary 

Carlene M. Ellis Vice President and Director, Information Technology 

Patrick P. Gelsinger Vice President and GM, Desktop Products Group 

Hans G. Geyer Vice President and GM, European Operations 

Thomas L. Hogue Vice President and Director, Materials 

Harold E. Hughes, Jr. Vice President and Director, Planning and Logistics 

James W. Jarrett President, Intel PRC Corporation 

Robert T. Jenkins Vice President and Director, Corporate Licensing 

Patrick S. Jones Vice President, Finance, and Corporate Controller 

D. Craig Kinnie Vice President and Assistant GM, Internet and Communications Group 

Michael C. Maibach Vice President, Government Affairs 

Edward A. Masi Vice President, Enterprise Server Group 

Avram C. Miller Vice President and Director, Business Development 

John H.F. Miner Vice President and GM, Enterprise Server Group 

Patricia Murray Vice President and Director, Human Resources 

Stephen P. Nachtsheim Vice President and GM, Mobile/Handheld Products Group 

Robert H. Perlman Vice President, Finance and Director, Tax, Customs, and Licensing 

Ronald J. Smith Vice President and GM, Computing Enhancement Group 

Arvind Sodhani Vice President and Treasurer 

Michael R. Splinter Vice President and Assistant GM, Technology and Manufacturing Group 



Microprocessor Products Group 

Michael J. Fister Vice President and General Manager, Microprocessor Division 6 

Dov Frohman Vice President and General Manager, Israel Operations 

David Perlmutter Vice President and General Manager, Israel Development Center 

Stephen L. Smith Vice President and General Manager, Santa Clara Processor Division 

Robert P. Colwell Director, IA-32 Architecture 

John H. Crawford Director, Microprocessor Architecture 

Paul D. Madland Director, Circuit Technology 

Frederick J. Pollack Director, Measurement, Architecture, and Planning 

Uri C. Weiser Director, Israel Development Center, Architecture 

Robert B. Wirt Director, Microcomputer Labs 

Internet and Communications Group 

Mark A. Christensen Vice President and General Manager, Network Products Division 

Kirby A. Dyess Vice President and Director, New Business Development 

Edward D. Ekstrom Vice President and General Manager, Systems Management Division 

James B. Johnson Vice President and General Manager, Internet Services Operation 

Steven D. McGeady Vice President and Director, Strategy 

Kevin C. Kahn Director, Communications Infrastructure Lab 

Technology and Manufacturing Group 

Frank Alvarez Vice President and General Manager, Strategic Components Manufacturing 

Robert J. Baker Vice President and GM, Microprocessor Components Manufacturing 

Luther G. Disney Vice President and Director, Corporate Services 

Youssef A. El-Mansy Vice President and Director, Portland Technology Development 

Robert M. Jecmen Vice President and Director, California Technology and Manufacturing 

Bruce H. Leising Vice President and General Manager, Peripheral Components Manufacturing 

David B. Marsing Vice President and General Manager, Assembly/Test Manufacturing 

Frank A. McCabe Vice President and General Manager, Ireland Operations 

Boon Chye Ooi Vice President and General Manager, Systems Manufacturing 

Jacob A. Peña, Jr. Vice President and General Manager, Philippine Operations 

John F. Slusser Vice President and Director, Corporate Quality Network 

William M. Siu Vice President and Director, Assembly Technology Development 

Kenneth M. Thompson Vice President and GM, Technology Manufacturing Engineering 

Keith L. Thomson Vice President and Manager, Oregon Site 

Gregory E. Atwood Director, Flash Memory Architecture 

Mark T. Bohr Director, Process Architecture and Integration 

Paolo A. Gargini Director, Technology Strategy 

Eugene S. Meieran Director, Manufacturing Strategic Support 

Leo D. Yau Director, Innovative Technology Models 

Ian A. Young Director, Advanced Circuit and Technology Integration 

1-168 



Desktop Products Group 

John E. Davies Vice President and Director, Consumer Desktop Marketing 

William A. Swope Vice President and Director, Business Desktop Marketing 

James H. Yasso Vice President and General Manager, Reseller Products Division 

Richard L. Coulson Director, I/O Architecture 

Peter D. MacWilliams Director, Platform Architecture 

Computing Enhancement Group 

William O. Howe Vice President and General Manager, Memory Components Division 

William B. Pohlman Vice President and General Manager, Central Logic Engineering 

Sales and Marketing Group 

Edwin G. Bauer Vice President and Director, Americas Sales and Marketing 

Nobuyuki Denda Vice President and Executive Vice President, Japan Operations 

Sean M. Maloney Vice President and General Manager, Asia-Pacific Operations 

Ikuo Nishioka Vice President and President, Japan Operations 

Pamela L. Pollace Vice President and Director, Worldwide Press Relations 

Earl L. Whetstone Vice President and General Manager, European Operations 

Ellen R. Konar Director, Corporate Strategic Marketing 

Content Group 

Claude M. Leglise Vice President and Director, Entertainment/Education Developer Relations 


Intel's principal products are microprocessors, core logic chipsets based on the PCI bus, embedded processors 

and microcontrollers, flash memory chips, computer modules and boards, network and communications products, 

personal conferencing products, and scalable parallel processing computers. Some of these products are 

described in more detail below. 

• Microprocessors—Intel's 32-bit microprocessors include the fifth-generation Pentium family and the sixthgeneration 

Pentium Pro family. The company significantly expanded its Pentium family in 1996, introducing 

new versions operating at 150, 166, and 200MHz. The 120 and 133MHz versions of the Pentium have 

become the company’s entry-level processors. In January 1997, Intel introduced versions of the Pentium 

incorporating MMX media enhancement technology, which is said to significantly enhance media-rich and 

communications applications. Also in early 1997, the company introduced the Intel Mobile Module, an 

integrated Pentium-based module that plugs into a mobile system’s motherboard. The Mobile Module is 

thought to be the kick off of Intel’s planned sales shift from processors to processor modules. 

The Pentium Pro, which is available in 150MHz, 166MHz, 180MHz, and 200MHz speed grades, makes use of 

RISC-like techniques that Intel has chosen to call "dynamic execution.” To date, the Pentium Pro has been 

designed primarily into servers and workstations. In early 1997, Intel named its new Pentium Pro processor with 

MMX technology the Pentium II processor. Initially, the Pentium II will be targeted at business desktop PC 

applications. 

Intel’s microprocessor products also include OverDrive processors, a family of upgrade MPUs. OverDrive 

processors allow users to upgrade their Intel486 or older Pentium processors to newer versions of the Pentium 

(120MHz to 166MHz). A Pentium MMX version will be introduced in 1997. 



Intel announced in early 1996 that it would phase out its commercial-grade 486SX2 and DX processor lines by 

the end of 1997. The company will continue to offer 486SX, DX2, and DX4 MPUs, as well as its new ultra-lowpower 

486SX, but only for embedded applications. 

• Chipsets—Based on the Peripheral Components Interconnect (PCI) bus, Intel’s core-logic chipsets include the 

Intel430 PCIset family for desktop and mobile Pentium microprocessors and the Intel440 and 450 PCIset 

families for the Pentium Pro microprocessors. 

• Embedded Processors and Microcontrollers—This product group includes the company's i960 family of 32-bit 

RISC processors, the embedded Intel386 and Intel486 processor families, the 16-bit 80C186 processor family, 

8-bit MCS 51 and MCS 251 microcontrollers, and 16-bit MCS 96 microcontrollers. These products are targeted 

at a variety of applications, such as automobile engine and braking systems, hard disk drives, laser printers, 

input/output control modules, cellular phones, home appliances, factory automation control products, 

commercial and military avionics, and medical instrumentation. 

On December 24, 1997, Intel will stop taking orders for mil-spec versions of its i960 MPU and i860 DSP 

products. Intel has said it is exiting the market for military ICs because parts for the commercial market are far 

more lucrative than mil-spec parts. Other military-grade products to be discontinued include SRAMs, EPROMs, 

flash memories, and x86 and Pentium processors. 

• Flash Memory Chips—Intel continues to be the largest flash memory producer. In early 1996, Intel announced 

that it was scaling back production of low-density (256K and 512K) flash parts to open up capacity for higher 

density devices. The company provides a broad line of flash memory devices, with densities ranging from 1M 

to 32M. Included are the 2.7V High-Integration Boot Block flash devices (1M to 8M) that are targeted at wireless 

communications applications; the High Performance Fast Flash devices (16M) that have either a synchronous 

burst-read interface or a DRAM system read interface; the High Value FlashFile Memory products (8M to 32M) 

that are partitioned into independently erasable 64K blocks, making them optimal for partial code updates or file 

storage applications; and the first-generation bulk erase flash memories (1M and 2M) that were designed for 

EPROM-type replacement applications. 

In April 1997, Intel introduced its newest family of flash memories—the Smart3 Advanced Boot Block family of 

devices. The new flash architecture, in conjunction with a new software program called Flash Data Integrator 

(FDI), allows for the storage of both code and data on a single flash IC. Intel expects the Smart3 flash chips will 

eliminate the need for EEPROMs in cellular phone applications. 

Intel uses advanced CMOS and BiCMOS process technologies in the manufacture of its integrated circuits. In 

1996, most of Intel’s IC products were manufactured using 0.35μm and 0.4μm process technologies. During 

1997, the company will migrate its microprocessor production to the 0.25μm level. At 0.25μm, the company 

believes it will be able to surpass the 400MHz mark for its MPU speeds. Some of Intel’s products are still 

manufactured with 0.6μm, 0.8μm, and 1.0μm process technologies. 

1-170 




Intel Corporation Intel Corporation 

Ronler Acres 3601 Juliet Lane 

Hillsboro, Oregon 97007 Santa Clara, California 95050 


Fab D1B Fab D2 

Cleanroom size: 70,000 square feet Cleanroom size: 60,000 square feet (Class 1) 

Capacity (wafers/week): 1,000 (6,250 in 1998) Capacity (wafers/week): 5,000 


Process: CMOS Processes: CMOS, BiCMOS 

Products: MPUs, R&D Products: MPUs, flash memories, R&D 

Feature sizes: 0.18μm, 0.25μm Feature sizes: 0.25μm-0.8μm 


2111 Northeast 25th Avenue 5000 West Chandler Boulevard 

Aloha, Oregon 97124 Chandler, Arizona 85226-3699 


Fab 5 (former Fab D1 R&D fab) Fab 6 




Processes: CMOS Processes: CMOS 

Products: Logic and memory ICs, MPUs, R&D Products: MPUs, MCUs 

Feature sizes: 0.6μm, 0.8μm, 1.0μm Feature sizes: 0.8μm, 1.0μm 

Intel Corporation Intel Israel, Ltd. 

4100 Sara Road SE Jerusalem, Israel 

Rio Rancho, New Mexico 87124 Fab 8 





Wafer size: 150mm Products: MPUs, MCUs, logic ICs 

Process: CMOS Feature sizes: 0.6μm-1.0μm 

Products: Flash memories 




Intel Corporation Intel Ireland, Ltd. 

4100 Sara Road SE Collinstown Industrial Park 

Rio Rancho, New Mexico 87124 Leixlip, County Kildare, Ireland 

Telephone: (505) 893-7000 Telephone: (353) (1) 707-7000 

Fab 9 Fab 10 




Process: CMOS Process: BiCMOS 

Products: Flash memories Products: MPUs 

Feature sizes: 0.4μm, 0.6μm Feature size: 0.6μm 


4100 Sara Road SE Chandler, Arizona 

Rio Rancho, New Mexico Fab 12 

Telephone: (505) 893-7000 Cleanroom size: 160,000 square feet (Class 1) 



Capacity (wafers/week): 10,000 Processes: CMOS, BiCMOS 

Wafer size: 200mm Products: MPUs 

Processes: BiCMOS, CMOS Feature size: 0.35μm (0.25μm capable) 

Products: MPUs, logic ICs 


Intel Ireland, Ltd. Intel Corporation 

Collinstown Industrial Park 3585 Southwest 98th Avenue 

Leixlip, County Kildare, Ireland Aloha, Oregon 97007 

Telephone: (353) (1) 707-7000 Telephone: (503) 681-8080 

Fab 14 (Startup in 1998) Fab 15 (former D1A R&D fab) 





Products: MPUs Products: MPUs 

Feature size: 0.25μm (0.18μm capable) Feature sizes: 0.35μm-0.6μm 

Intel Corporation Intel Israel, Ltd. 

Fort Worth, Texas Kiryat Gat, Israel 

Fab 16 (Startup in 1999) Fab 18 (Startup in 1998) 




Products: MPUs Process: CMOS 

Feature sizes: 0.18μm, 0.25μm Products: Flash memories 


1-172 



The majority of Intel’s semiconductor assembly and testing takes place at the company’s facilities in Penang, 

Malaysia, and Manila, the Philippines. Some assembly and testing is performed in the U.S. In addition, the 

company is building new assembly and test factories in Shanghai, China, and San Jose, Costa Rica, both 

scheduled for completion in 1998. 


• Moving to ensure itself a steady supply of high-density DRAMs, Intel in early 1997 purchased an equity stake in 

Samsung’s new $1.3 billion fab in Austin, Texas. The fab is expected to begin production of 64M DRAMs in 

late 1997 or early 1998. Separately, Intel has made a move to back Rambus Technology in the development of 

very-high bandwidth Direct Rambus DRAMs. Intel has been given the option to purchase $10 million worth of 

Rambus stock after the technology for Direct RDRAMs, which will link directly to Intel’s chipsets, is developed. 

• Integrated Silicon Solution Inc. (ISSI) licensed flash memory-related patents from Intel in early 1996. 

• Intel and AMD signed a five-year patent cross-licensing agreement near the end of 1995 giving the two 

companies rights to use each other’s MPU-related patents and certain copyrights—excluding microprocessor 

code. AMD agreed not to use Intel microcode beyond the 486 MPU generation. 

• In October 1995, Intel and flash memory card maker SanDisk agreed to cross-license the full inventory of their 

respective flash memory patent portfolios. The deal does not include a physical exchange of technology. 

• Micron signed a cross-licensing agreement with Intel in 1995 covering flash memory ICs, making Micron a true 

alternate source for Intel’s flash devices. 

• Intel and Hewlett-Packard announced a wide ranging joint research and development alliance in 1994 under 

which the partners are seeking to design a superior next-generation 64-bit microprocessor by 1999, a year later 

than originally planned. The processor will be binary-compatible with both Intel x86 code and HP PA-RISC 

code. As part of a separate agreement made in November 1996, Intel and HP are codeveloping computer 

encryption chips for use in PCMCIA cards. 

• In 1992, Intel and Sharp signed an agreement to develop their flash memory business jointly. Sharp is currently 

shipping Intel's 32M and smaller flash devices on an OEM basis, and the two firms have developed parts that 

Sharp markets under its own brand name. In 1995, Sharp was able to expand into the lucrative U.S. market 

after its initial licensing agreement with Intel, which restricted it to the flash market in Japan, expired. 

• Intel and Philips extended a patent cross-license agreement they made in 1977 to include all of each other's 

semiconductor devices except certain proprietary Intel MPUs and Philips video products. The agreement is 

now valid until the year 2000. 


Interdesign North American Company Profiles 


1-174 

INTERDESIGN 

Interdesign Custom Arrays Corporation 

525 Del Ray Avenue 


Telephone: (408) 749-1166 

Fax: (408) 749-1718 


Founded in 1984, Interdesign is a member of the ELEX Group of companies headquartered in Belgium. Through 

its association with ELEX, Interdesign offers mixed-signal CMOS custom and standard cell ASICs in addition to its 

own MM and MV bipolar arrays. 

The ELEX Group also has a wafer foundry, X-FAB, located in Germany with technologies that include N-well and Pwell 

CMOS, vertical DMOS, MOS analog to 40V, and micro sensors. Foundry services are available to U.S. 

semiconductor and sensor companies, through Interdesign acting as an interface between the foundry and the 

customers. 

"Interdesign" has been registered as a trademark and the company has commenced doing business as 

Interdesign. 

Management 

Robert W. Townley President 

William H. Hass Vice President, Finance 


Interdesign supplies mixed-signal CMOS ASICs, both custom and standard cell. 


Interdesign occupies an 8,000-square-foot facility devoted to assembly, test, and engineering. 


North American Company Profiles International Rectifier 


INTERNATIONAL RECTIFIER (IR) 

International Rectifier Corporation 

233 Kansas Street 

El Segundo, California 90245 

Telephone: (310) 322-3331 

Fax: (310) 322-3332 

Web Site: www.irf.com 


Japan: International Rectifier Far East Co., Ltd. • Toshima-ku, Tokyo, Japan 

Telephone: (81) (3) 3983-0641 • Fax: (81) (3) 3983-0642 

Europe: International Rectifier Company (Great Britain) Ltd. • Oxted, Surrey, United Kingdom 

Telephone: (44) (1883) 713215 • Fax: (44) (1883) 714234 


1992 1993 1994 1995 1996 

Sales 265 282 329 429 577 

IC Sales* 15 17 22 29 40 

Net Income 9 (3) 16 39 66 



Employees 3,000 2,700 3,100 3,310 3,915 



International Rectifier (IR) was founded in 1947 and is today a major worldwide manufacturer of power 

semiconductors with applications in the automotive, consumer electronics, computer/peripheral, industrial, 

lighting, telecommunications, and government/space markets. 

The company's growth products recently have been HEXFET ® power MOSFETs, insulated gate bipolar transistors 

(IGBTs), control ICs, and high-performance diodes. In control ICs, new development efforts concentrate on 

devices tailored to specific applications. New control ICs are tuned to specific power levels, features, and circuit 

topologies in motor control, lighting, and power supply applications. During 1996, IR’s focus was in the area of 

“solution” products that combine multiple components and technologies to benefit the customers’ overall circuit 

size, cost, and performance. 


International Rectifier North American Company Profiles 

Management 

1-176 

Asia 

26% 

Europe 

28% 


46% 


Eric Lidow Chairman and Founder 

Alexander Lidow Chief Executive Officer 

Derek B. Lidow Chief Executive Officer 

Robert J. Mueller Executive Vice President, External Affairs and Business Development 

Michael P. McGee Vice President and Chief Financial Officer 


IR manufactures power semiconductors, including HEXFET power MOSFETs, IGBTs, high-voltage control ICs, 

diodes, rectifiers, thyristors, and standard and custom power modules. 

IR’s high-voltage control ICs combine power MOSFETs with analog and digital control circuitry on a single chip. 

They are used in a wide variety of power supply, motor, and lighting control applications, including motor controls, 

solenoid drivers, welding equipment, telecom switches, computer peripherals, instrumentation and test 

equipment, electronic lighting ballasts, and compact fluorescent light bulbs. 

In late 1995, IR introduced its next-generation manufacturing technology, a four-step mask, low-voltage process 

called Gen5. By the end of fiscal 1996, IR had over 200 Gen5 HEXFET devices in volume production. 


International Rectifier International Rectifier 

(HEXFET America) 233 Kansas Street 

41915 Business Park Drive El Segundo, California 90245 

Temecula, California 92390 Telephone: (310) 322-3331 



Capacity (wafers/week): 13,100 Processes: CMOS, BCDMOS 

Wafer sizes: 125mm, 150mm Products: Discretes, power ICs 

Processes: CMOS, BCDMOS Feature size: 5.0μm 

Products: Discretes, power ICs 



North American Company Profiles International Rectifier 

International Rectifier Italiana, S.p.A. 

Via Privata Liguria 49 

10071 Borgoro, Turin, Italy 

Telephone: (39) (11) 470-14-84 



Products: Discretes 


• International Rectifier signed a cross-licensing and alternate-source agreement with Motorola covering power 

ICs and power discretes. 


ISD North American Company Profiles 

1-178 

INFORMATION STORAGE DEVICES (ISD) 

Information Storage Devices, Inc. 

2045 Hamilton Avenue 


Telephone: (408) 369-2400 

Fax: (408) 369-2422 

Web Site: www.isd.com 



1992 1993 1994 1995 1996 

Sales 5 23 39 55 41 

Net Income (3) — 4 6 (9) 




Information Storage Devices, Inc. (ISD), designs, develops, and markets integrated circuits for voice recording and 

playback using the company’s proprietary ChipCorder storage technology. The company’s ChipCorder 

products are targeted at the consumer, communications, and industrial market segments. 

In 1991, ISD introduced its first commercially available products—non-volatile chips that store analog signals in 

analog form. From its inception in December 1987, ISD's charter has been to develop such devices for storage of 

voice, music, and other forms of analog information on a single chip. 

In early 1997, ISD purchased National’s CompactSpeech processor product line. The purchase enables ISD to 

add long duration record and playback chips to its ChipCorder product line. The CompactSpeech product line 

includes a family of RISC-based speech processors that feature advanced DSP technology designed for voice 

applications in the communications market. 

ISD's storage technology is adaptable to a variety of small form factor applications, such as hand-held products, 

alarms, answering machines, cellular phones, greeting cards, and implantable medical devices. The firm's original 

chips were capable of storing up to 20 seconds of information. However, ISD’s newest devices are able to store 

up to four minutes of information. The company has received twelve patents with several others pending. ISD 

became a public company in February 1995. 


North American Company Profiles ISD 

Management 

Consumer 

21% 

Industrial 

7% 


72% 


United States 

35% 

Europe 

11% 


David L. Angel Chairman and Chief Executive Officer 

Eric J. Ochiltree President and Chief Operating Officer 

James Brennan Vice President, Technology and Development 

Michael Geilhufe Vice President, Quality and Reliability 

Paul Ross Hayden Vice President, Sales 

Carl R. Palmer Vice President, Engineering 

Felix J. Rosengarten Vice President, Finance and Administration, and Chief Financial Officer 

Al Woodhull Vice President, Manufacturing 

Karin Bootsma Managing Director, Marketing 


ISD's ChipCorder products are solid-state memory devices based on flash technology that store analog signals 

in a multilevel format. The company currently offers six product families incorporating its ChipCoder technology. 

All of the company’s ChipCoder products feature an on-chip oscillator, microphone preamplifier, automatic gain 

control, anti-aliasing filter, smoothing filter, and speaker amplifier. The devices are being built using 0.8μm CMOS 

technology. 

Its most recent product family, the 33000 series is based on the company’s multilevel storage methodology that 

stores 256 distinct voltage levels in each memory cell. The series operates at 3 volts and extends voice storage 

capacity up to four minutes, making it possible to have an answering machine built into a digital or analog cellular 

phone. 


ISD currently has foundry agreements with Rohm, Sanyo, and Samsung. 


Asia 

54%

IXYS North American Company Profiles 


1-180 

IXYS 

IXYS Corporation 

3540 Bassett Street 


Telephone: (408) 435-1900 

Fax: (408) 435-0670 

Web Site: www.ixys.com 


IXYS Corporation designs, develops, and markets a broad spectrum of power semiconductors, integrated circuits, 

and modules for the global power market. IXYS products are incorporated into various industrial, commercial, and 

military systems. 

Founded in 1983, IXYS has been an innovator in power MOS semiconductor products and technologies since its 

inception. However, it has differentiated itself by focusing on the higher voltage and higher power end of the 

MOSFET and IGBT spectrum. The company's strategy is to provide cost-effective systems solutions for its target 

markets. To that end, it provides several lines of low-cost chipsets for various applications. 

In April 1989, IXYS acquired the Asea Brown Boveri (ABB) power semiconductor operation in Lampertheim, 

Germany. Now called IXYS Semiconductor GmbH, the firm is recognized for pioneering direct copper bonding-toceramic 

packaging technology and provides IXYS with a strong foothold in the European market. 

Management 

Nathan Zommer, Ph.D. President and Chief Executive Officer 

Peter Ingram Managing Director, IXYS Semiconductor GmbH 

Arnold Agbayani Vice President, Finance 

Rich Fassler Vice President, Sales and Marketing 


The IGBT discrete and IGBT module product lines are the company's flagship products. They are targeted at the 

AC motor drive market first and at electric vehicles for the long-term market. 


North American Company Profiles IXYS 

IXYS's key product lines include: 

Modules 

• IGBT modules 

• High current thyristor and rectifier modules 

• Rectifier bridges 

• Custom (customer-specific) power modules 

Discretes 

• Ultra-fast and short circuit-rated IGBTs 

• MegaMOSFET devices 

• HiPer FET power MOSFETs 

• High-voltage BiMOSFET devices 

• Ultra-fast recovery epitaxial diodes (FREDs) 

• High-current rectifiers and switching current regulators 

• High-power thyristors and rectifiers 

Smart Power ICs 

• High-voltage current regulators 

• Half-bridge (high side/low side) smart power ICs 

• Pulse width modulation controllers 

Direct Copper Bond (DCB) Ceramic Substrates 

For the design of its products, IXYS uses a proprietary HDMOS (high performance DMOS) technology, which is 

compatible with standard bulk CMOS. 


The company’s semiconductor products are fabricated in external wafer fabrication facilities through technology 

and foundry relationships with a number of semiconductor companies throughout the world. 


Lansdale Semiconductor North American Company Profiles 

Employees 50 


1-182 

LANSDALE SEMICONDUCTOR 

Lansdale Semiconductor, Inc. 

2502 West Huntington Drive 

Tempe, Arizona 85282 

Telephone: (602) 438-0123 

Fax: (602) 438-0138 

Web Site: ssi.syspac.com/~lansdale 


Founded in 1964, Lansdale Semiconductor is a semiconductor life cycle extender dedicated to manufacturing 

past and present technologies as long as the market requires them. The privately-held company is a strategic 

resource for critical military programs, telecommunications systems, and semiconductor OEMs wishing to offer 

their products longer than the normal lifecycle dictates. 

The company purchases lines as they are discontinued by large semiconductor companies such as Intel, 

Signetics, Harris, National, and Motorola. It actively seeks new product licenses from semiconductor 

manufacturers as part of its niche strategy and supports OEM semiconductor companies by manufacturing wafers 

on a foundry basis to extend their product lifecycles. 

Military weapons systems typically operate for approximately 25 years while the commercial lifecycle of a 

semiconductor chip is about seven years. Lansdale manufactures and supports these products on a continuing 

basis making it possible to extend the lifecycles of the system and its products. 

Management 

R. Dale Lillard Owner and President 


Lansdale's current product lines (about 2,600 parts) include NMOS 8-bit MPUs and bipolar general purpose logic, 

MPU, SRAM, PROM, and linear ICs, as well as bipolar full custom devices. 


North American Company Profiles Lansdale Semiconductor 

Original Manufacturer 

Product Line 

AMD Digital Bipolar ICs 

Raytheon DTL 200 Series ICs 

Signetics DTL, TTL ICs, 54LS, 82S, 54S, 54H, LSI, 8X 

Motorola SUHL ICs, 5400 TTL, 3000 TTL, 900 DTE, RTL, Linear 

Harris 0512 Bipolar PROMs, 7600 Bipolar PROMs/Diode Matrices 

National PMOS ICs 

Intel 8080A and peripherals, 828x Peripherals 


Lansdale Semiconductor, Inc. 

2502 West Huntington Drive 

Tempe, Arizona 85282 



Wafer sizes: 100mm, 3in 

Processes: Bipolar, LS, Linear, TTL 

Products: Foundry service, bipolar ICs 

Feature size: 3μm, two-layer metal 


Lattice Semiconductor North American Company Profiles 


1-184 

LATTICE SEMICONDUCTOR 

Lattice Semiconductor Corporation 

5555 Northeast Moore Court 

Hillsboro, Oregon 97124-6421 

Telephone: (503) 681-0118 

Fax: (503) 681-0347 

Web Site: www.latticesemi.com 


Japan: Lattice Semiconductor K.K. • Taito-ku, Tokyo, Japan 

Telephone: (81) (3) 5820-3533 • Fax: (81) (3) 5820-3531 

Europe: Lattice Semiconductor Ltd. • Waybridge, Surrey, United Kingdom 

Telephone: (44) (1932) 831180 • Fax: (44) (1932) 831181 

Asia-Pacific: Lattice Semiconductor Asia, Ltd. • Kowloon, Hong Kong 

Telephone: (852) 2319-2929 • Fax: (852) 2319-2750 


1993 1994 1995 1996 1997 

Sales 103 126 144 198 204 

Net Income 17 22 27 42 45 


Employees 352 394 438 450 500 


Lattice Semiconductor, founded in 1983, is a leader in the design, development, and marketing of high-density 

and low-density programmable logic devices (PLDs) and related software development systems. Its proprietary 

Generic Array Logic (GAL ® ), pLSI ® , and ispLSI ® devices are sold worldwide, primarily to OEMs in the fields of 

communications, industrial control, and military systems. In 1992, the company pioneered the development of a 

family of in-system programmable products called Lattice ISP. Lattice ISP products give customers the ability to 

program a PLD without removing it from the circuit board, subsequently increasing the PLD’s flexibility. ISP 

products have emerged as the de facto standard in the high density PLD market. 


North American Company Profiles Lattice Semiconductor 

Lattice's strategy is to offer a full line of high-performance in-system programmable devices based on innovative 

architectures. The company supports its products with sophisticated logic development tools providing high 

functionality at low cost that can be easily adopted and fully integrated with common third-party CAE development 

systems. 

International sales represented 48 percent of the company’s total sales in fiscal 1996. 

Management 

Cyrus Y. Tsui Chairman, President, and Chief Executive Officer 

Steven A. Laub Senior Vice President and Chief Operating Officer 

Steven A. Skaggs Senior Vice President, Chief Financial Officer, and Secretary 

Jonathan K. Yu Corporate Vice President, Business Development 

Martin R. Baker Vice President and General Counsel 

Randy D. Baker Vice President, Manufacturing 

Albert L. Chan Vice President, California Product Development 

Stephen M. Donovan Vice President, International Sales 

Paul T. Kollar Vice President, Sales 

Rodney F. Sloss Vice President, Finance 

Kenneth K. Yu Vice President and Managing Director, Lattice Asia 


Lattice entered the high-density complex PLD (CPLD) market in 1992 and currently offers four families of ispLSI ® 

products. The ispLSI 1000E family incorporates familiar GAL-like logic building blocks and offers performance up 

to 125MHz (7.5ns) and densities of 2,000 to 8,000 gates. The ispLSI 2000 family provides speeds of up to 

180MHz (5.0ns) and 3.3V and 5V operating voltages. The ispLSI 3000 family offers densities of 7,000 to 14,000 

gates, while retaining performance up to 125MHz (7.5ns). The ispLSI 6000 family extends the company’s CPLD 

density range to 25,000 gates and enables integration of complete logic subsystems. The family utilizes an 

innovative cell-based architecture that combines a general-purpose high-density CPLD with memory and other 

function specific circuit blocks. 

Lattice offers one of the industry’s high performance and broadest line of low density CMOS PLDs. The company 

sells the industry standard GAL16V8, GAL20V8, GAL22V10, GAL20RA10, and GAL20XV10 architectures in a 

variety of speed grades (as fast as 3.5ns), with 5V or 3.3V signal compatibility. Lattice also offers several 

proprietary architectures, the GAL26CV12, GAL18V10, GAL16VP8, GAL20VP8, and GAL6001/2, each of which 

is optimized for specific applications. In 1994, the company extended its GAL line by introducing the 

ispGAL22V10, bringing the advantages of in-system programmability to the low density market. 

In April 1997, Lattice unveiled its ispGDX product family designed primarily for routing applications. According to 

the company there is no control logic on the chips, allowing them to operate faster than conventional PLDs. The 

family includes four devices with 64, 80, 120, and 160 programmable I/Os, with input-to-output delays of 5ns, 

clock-to-output delays of 5ns, and operating frequencies of 111MHz. 


Lattice Semiconductor North American Company Profiles 

Lattice also offers its ispGDS (Generic Digital Switch) family of in-system programmable switching matrices 

targeted at mechanical dip switch replacement and connectivity applications. 

The company's products are based on a proprietary EECMOS process technology, called UltraMOS ® . The current 

mainstream processes, UltraMOS V (0.65μm) and UltraMOS VI (0.5μm) are advanced double-metal CMOS 

technologies. 


Most Lattice Semiconductor products are produced by Seiko Epson in Japan. In 1994, Lattice advanced to Seiko 

Epson $42 million for the expansion of Seiko’s submicron wafer fab in Sakata, Japan. The investment will provide 

Lattice with additional submicron manufacturing capacity through 1997. The foundry relationship between Lattice 

and Seiko Epson was further strengthened in early 1997. As part of their latest agreement, Lattice agreed to 

invest up to $150 million in Seiko Epson’s Sakata, Japan, wafer fab facility in exchange for a production line 

dedicated to Lattice. 

Lattice added Taiwan’s United Microelectronics Corporation (UMC) as a foundry partner in 1995. In October 1995, 

Lattice said it would invest $60 million over a two and a half year period for a 10 percent equity stake in one of 

UMC’s joint-venture fabs that will come on-line in mid-1997. Additionally, UMC agreed to provide Lattice with 

interim wafer capacity from one of its existing fabs. 

In December 1996, Lattice secured additional future capacity by signing a foundry and technology development 

agreement with Taiwan-based Holtek Microelectronics (see Key Agreements below). 


• Lattice signed a foundry and technology agreement with Holtek Microelectronics in December 1996. Under 

the agreement, Lattice will make an equity investment in Holtek’s 200mm wafer facility that is currently under 

construction in Taiwan. In return, Holtek will provide Lattice with foundry capacity from the facility, which is 

expected to be operational by January 1998. Additionally, Holtek plans to develop non-volatile memory 

products for Lattice. 

• Lattice entered into a joint venture with UMC and other US-based fabless IC companies. Lattice will invest $60 

million to gain a 10 percent equity stake in a new joint-venture wafer fab UMC is building in Taiwan. The joint 

venture fab, called United Integrated Circuits Corporation (UICC), was expected to begin production in mid- 

1997. 

• In 1994, Lattice signed a production agreement with Seiko Epson. As part of the agreement, Lattice advanced 

Seiko $42 million to finance additional submicron wafer capacity at its fab in Sakata, Japan. In 1995, Lattice 

invested an additional $2 million for the development of submicron process technology. In early 1997, Lattice 

signed an agreement to advance up to $150 million to Seiko Epson, in return for a dedicated production line in 

Seiko Epson’s Sakata wafer fab that was expected to begin production in mid-1997. 

• Lattice has a cross-licensing agreement with AMD under which patents for AMD's PALs have been exchanged 

for Lattice's GAL patents. 

1-186 


North American Company Profiles Level One Communications 

LEVEL ONE COMMUNICATIONS 

Level One Communications Inc. 

9750 Goethe Road 

Sacramento, California 95827 

Telephone: (916) 855-5000 

Fax: (916) 854-1101 

Web Site: www.level1.com 



1992 1993 1994 1995 1996 

Sales 14 26 47 78 112 

Net Income 2 4 8 10 13 


Employees 70 139 221 300 408 


Level One Communications, Inc., founded in 1985, is a leading supplier of silicon connectivity solutions for 

complex mixed-signal communications and networking applications. The company name “Level One” refers to 

the company’s initial focus on the physical layer, “layer one”, of the seven layer network model developed by the 

International Standards Organization (ISO). 

The company specializes in the development of ASSPs and custom derivatives, such as transceivers, repeaters, 

and related devices used in two key areas of the telecommunications and data communications industry: interface 

solutions for digital transmission systems; and local and wide area networking (LAN/WAN) solutions, including 

Ethernet LAN, datacom, and digital modems. Most of Level One’s ICs feature complex functions incorporated on 

a single silicon chip for applications formerly requiring multiple chips. 

In June 1995, the company acquired San Francisco Telecom, which operates as a wholly owned subsidiary and 

develops products for the Sonet/SDH, wireless, and cable modem communications markets. In 4Q96, Level One 

acquired Silicon Design Experts Inc. (SDE) to accelerate its development of Gigabit Ethernet and xDSL products. 


Level One Communications North American Company Profiles 

Management 

Robert D. Pepper, Ph.D. Chairman, President, and Chief Executive Officer 

J. Francois Crepin Vice President, Business Development 

John Kehoe Vice President, Finance and Chief Financial Officer 

Daniel S. Koellen Vice President, Quality and Reliability Assurance 

Manuel Yuen Vice President, Operations 


Level One’s semiconductor products include T1/E1 transceivers, receivers, repeaters, and clock adapters; digital 

subscriber line (DSL) chipsets; PDM multiplexers; and Ethernet transceivers and repeaters. 


Level One utilizes several foundries in the U.S., Europe, and the Far East for the fabrication of its ICs, but does all 

its chip testing in-house. 


• In 1995, Level One entered into a technology agreement with Maker Communications Inc. for the 

development of asynchronous transfer mode (ATM) products. 

1-188 


North American Company Profiles Linear Systems 


LINEAR SYSTEMS 

Linear Integrated Systems, Inc. 

4042 Clipper Court 


Telephone: (510) 490-9160 

Fax: (510) 353-0261 


Linear Integrated Systems (LIS), a.k.a. Linear Systems, was formed in 1987 with the goal of establishing a market 

niche by taking advantage of refractory-metal interconnect technology. Most firms have stayed away from 

refractory metals and instead prefer to use CVD and silicon-gate technologies. 

Linear Systems specializes in developing integrated circuits for applications in systems where obsolete devices or 

processes are no longer available or require upgrading. Existing IC products include operational amplifiers, 

voltage references, and multiplexers. Besides proprietary products, Linear Systems also supplies a broad range 

of second source and obsolete devices manufactured to customer's requirements. 

In addition to semiconductor design and custom manufacturing services, state-of-the-art precision thin-film 

services are also offered. 

Management 

John H. Hall President 

Don Howland Manager, Eastern U.S. Marketing 

Paul Norton Manager, Western U.S. Marketing 


Linear Systems’ proprietary product line includes bipolar linear ICs (e.g., amplifiers, voltage references, 

multiplexers) and discretes, as well as full custom bipolar, CMOS, and BiCMOS ICs. 

Using CMOS, bipolar, and dielectric isolation processes, Linear Systems offers a family of second-source products 

including multiplexers, monolithic dual N-channel JFETs, monolithic dual PNPs and NPNs, switches, and 

amplifiers. 


Linear Technology North American Company Profiles 


1-190 

LINEAR TECHNOLOGY 

Linear Technology Corporation 



Telephone: (408) 432-1900 

Fax: (408) 434-0507 

Web Site: www.linear-tech.com 


Japan: Linear Technology K.K. • Shinjuku-ku, Tokyo, Japan 

Telephone: (81) (3) 3267-7891 • Fax: (81) (3) 3267-8570 

Europe: Linear Technology SARL • Chantenay Malabry, France 

Telephone: (33) (1) 41-07-95-55 • Fax: (33) (1) 46-31-46-13 

Asia-Pacific: Linear Technology Pte., Ltd. • Singapore 

Telephone: (65) 753-2692 • Fax: (65) 754-4133 


1992 1993 1994 1995 1996 

Sales 119 151 201 265 378 

Net Income 25 36 57 85 134 



Employees 800 870 1,000 1,350 1,650 


Linear Technology Corporation (LTC) was founded in 1981 to design, manufacture, and market a broad line of 

high-performance standard linear integrated circuits. Its devices monitor, condition, amplify, or transform 

continuous analog signals associated with such physical properties as temperature, pressure, weight, position, 

light, sound, or speed. 

The company targets its product and marketing efforts toward the high-performance segments of the linear circuit 

market. Applications for its products include telecommunications; notebook and desktop computers; 

video/multimedia; computer peripherals; cellular telephones; industrial, automotive and process controls; network 

and factory automation products; and satellites. 


North American Company Profiles Linear Technology 

Management 

Japan 

16% 

Other 

13% 

Europe 

23% 


U.S. 

48% 


Robert H. Swanson, Jr. President and Chief Executive Officer 

Paul Chantalat Vice President, Quality, Reliability, and Service 

Paul Coghlan Vice President, Finance, and Chief Financial Officer 

Timothy D. Cox Vice President, North American Sales 

Clive B. Davies, Ph.D. Vice President and Chief Operating Officer 

Robert C. Dobkin Vice President, Design and Engineering 

Sean T. Hurley Vice President, Operations 

Louis Di Nardo Vice President, Marketing 

Hans J. Zapf Vice President, International Sales 


Linear Technology products include: operational, instrumentation, and audio amplifiers; voltage regulators, power 

management devices, references, comparators, and data converters; switched-capacitor filters; communications 

interface circuits; single-chip data acquisition sub-systems; pulse width modulators; and sample-and-hold devices. 

The company markets approximately 5,000 finished part types, of which more than 80 percent are proprietary. 

Linear Technology uses a variety of process technologies in the design and fabrication of its chips, including 

standard bipolar, CMOS, BiCMOS, and complementary bipolar, as well as thin-film and laser trimming technologies. 


Linear Technology Corporation Linear Technology Corporation 

1630 McCarthy Boulevard Camas, Washington 

Milpitas, California 95035-7487 Fab 3 

Fabs 1 and 2 Capacity (wafers/week): 2,500 


Capacity (wafers/week): 4,500 Processes: CMOS, bipolar 

Wafer size: 100mm Products: Linear ICs 

Processes: CMOS, BiCMOS, bipolar Feature sizes: ≤2.0μm 

Products: Linear ICs (Began production in early 1997.) 

Feature sizes: 2.0μm-3.0μm

Linfinity Microelectronics North American Company Profiles 


1-192 

LINFINITY MICROELECTRONICS 

Linfinity Microelectronics Inc. 


Garden Grove, California 92641-2119 

Telephone: (714) 898-8121 

Fax: (714) 898-2781 


1992 1993 1994 1995 1996 

Corporate 

Sales 69 88 98 103 106 


Semiconductor 

Sales 27 31 39 40 38 



Linfinity Microelectronics Inc. (LMI) is a wholly owned subsidiary of Symmetricom, Inc. (formerly Silicon General, 

Inc.). It was founded in 1968 as Silicon General Semiconductors and adopted its current name in 1993. LMI 

designs, manufactures, and markets linear bipolar, CMOS, and BiCMOS integrated circuits for industrial, 

commercial, automotive, and military applications. Linfinity's special area of expertise is in power management with 

an emphasis on mixed-signal technology. Sales from power supply products, represented over 50 percent of 

total sales in fiscal 1996. 

The company is expanding the value-added products and services it currently provides for power supply systems, 

while adding product lines to serve new areas such as signal conditioning and motion control systems. The 

company currently offers about 400 standard products. 

Management 

James Peterson President (acting) 

Ralph Brandi Vice President, Sales 

Shufan Chan Vice President, Development 

Mark Granahan Vice President, Marketing 

James Hartman Vice President, Manufacturing 


North American Company Profiles Linfinity Microelectronics 


Linfinity's products generally address four main markets: power supply systems, motion control, analog signal 

conditioning, and data communications. 

Power Supply 

Linfinity is a leading supplier of a wide variety of power management products, including pulse width 

modulators (PWMs), voltage regulators, supervisory circuits, and power factor conversion chips. Typical 

applications for these products include desktop and portable computers, portable communications 

equipment, video monitors, automotive entertainment, HVAC products, satellites, and lighting. The new 

product focus in this area includes controllers, linear regulators, DC-DC converters, FET drivers, and voltage 

supervisors. 

Motion Control 

Linfinity makes two kinds of motion control integrated circuits: one that controls the spin motor in computer 

disk drives and another that controls the position of the read-write head. The new product focus in this area 

includes sensorless spindle controllers, voice coil controllers, and brushless DC motor controllers. 

Analog Signal Conditioning 

Linfinity's signal conditioning circuits include operational amplifiers, comparators, and voltage references. 

Typical applications include instrumentation, industrial controls, telecommunications, and audio equipment. 

Data Communications 

A relatively new product area for Linfinity, the company’s data communications ICs include small computer 

systems interface products and high speed, parallel communications buses, which permit high data transfer 

rates between computers and various peripheral devices. 

Linfinity uses a wide range of process technologies that address linear and mixed-signal product requirements. 

Bipolar 

Two main process flows are available in this technology. Option A provides a rugged, high-voltage (60V), 

high-power process for applications such as off-line power supplies and motor drivers. Option B provides a 

high-performance, low-voltage (20V) process for applications in high-speed, low-noise signal conditioning 

equipment. 

CMOS 

Exhibiting all the characteristics of a good analog CMOS process it provides 18V MOS transistors coupled with 

high density 3.0μm feature sizes for optimal packing density. Limited logic capability is available at this feature 

size. 


Linfinity Microelectronics North American Company Profiles 

BiCMOS 

The BiCMOS process combines the Option B bipolar and CMOS processes into a single flow. The process is 

idealized for mixed-signal applications requiring excellent analog performance in conjunction with logic 

capability. A double-level metal option is available for optimum packing density. Applications include power 

supply controllers and high-performance disk drive motor controllers. 


Linfinity Microelectronics Inc. 


Garden Grove, California 92641 



Processes: Bipolar, CMOS, BiCMOS 

Products: Linear ICs, ASICs 


1-194 


North American Company Profiles Logic Devices 


LOGIC DEVICES 

Logic Devices Incorporated 

1320 Orleans Drive 


Telephone: (408) 542-5400 

Fax: (408) 542-0080 

Web Site: www.logicdevices.com 


Europe: Logic Devices Incorporated • Warminster, Wiltshire, United Kingdom 

Telephone: (44) (1985) 218699 


1992 1993 1994 1995 1996 

Sales 12 13 13 17 13 

Net Income 0.1 0.3 1 1 1 


Employees 61 49 44 49 58 


Logic Devices Incorporated was founded in 1983. It develops and markets high-performance digital integrated 

circuits for applications requiring high operating speeds and low operating power. Such applications include 

computers, workstations, video image processing, medical instrumentation, telecommunications, and military 

signal processing. 

Logic Devices was founded as a supplier of building-block DSPs, but later entered the growing 1989 SRAM 

market. It was driven from the SRAM market in 1992 due to cost and quality problems with its then supplier of 

SRAM wafers. Sales of the company’s SRAM products rebounded in 1994 and 1995, but then suffered price 

erosion during 1996. SRAM products fell from representing 45 percent of the company’s sales in 1995 to 14 

percent in 1996. While the company plans to remain a player in fast SRAMs and other niche SRAM markets, it has 

also placed a greater emphasis on DSP devices, which grew to represent 86 percent of sales in 1996, up from 55 

percent in 1995. 


Logic Devices North American Company Profiles 

1-196 

SRAMs 

14% 

DSP Devices 

86% 


Europe 

19% 

Far East 

8% 


73% 


In April 1995, Logic Devices acquired Star Semiconductor, which developed the Sproc programmable digital 

signal processor architecture. The Sproc architecture enables multiple processors to efficiently share data via a 

common memory array, resulting in high processing throughput. 

Research efforts during 1997 will focus on DSP circuits to address broadcast, studio, and audio and video image 

processing applications, and new products utilizing the company’s SRAM technology. 

Management 

Howard L. Farkas Chairman 

William J. Volz President 

Todd J. Ashford Chief Financial Officer 

Anthony G. Bell Vice President, Technology 

William L. Jackson Vice President, Manufacturing 


High-speed, low-power CMOS SRAMs and DSP circuits are Logic Devices' principal product lines. Its DSPs 

primarily target video editing, broadcast special effects, and studio production applications, where lossless 

manipulation of very high bandwidth data is required. The company also offers specialty memories, register 

products, and high-performance CMOS SCSI controllers. 

Ultrafast SRAM 

Fast Logic 

Specialty Memory 

16K family Pipeline registers Cache-tag memories 

64K family Register files Resettable memories 

256K family Shadow registers Cache-data memories 

1M family FIFOs 

Computational Interface 

Multipliers SCSI bus controllers 

Multiplier-accumulators 

Filters 

Arithmetic logic units 

Digital correlators 

Barrel shifters 


North American Company Profiles Logic Devices 

The company's chips are produced using 0.5μm, 0.8μm, and 1.0μm CMOS technologies, and a sub-half-micron 

CMOS process is expected to be implemented in 1997. 


Logic Devices has teamed with three foundry partners to manufacture its products: Oki in Japan, TSMC in Taiwan, 

and Zentrum Mikroelektronik Dresden (ZMD) in Germany. 


LSI Computer Systems North American Company Profiles 


1-198 

LSI COMPUTER SYSTEMS 

LSI Computer Systems, Inc. 

1235 Walt Whitman Road 

Melville, New York 11747-3086 

Telephone: (516) 271-0400 

Fax: (516) 271-0405 


LSI Computer Systems, Inc. (LSI/CSI) began operations in 1969 and is thought to be the world’s first “fabless” 

semiconductor company. The privately held company utilizes a broad array of LSI process technologies in the 

design of full custom and standard ICs for products in applications ranging from consumer and industrial to military 

and aerospace. 

LSI Computer Systems is recognized as one of the leading suppliers of lighting control ICs and full custom ICs, 

and was the first company to develop and market ICs for brushless DC motors. 

Management 

Al Musto Chief Executive Officer 


LSI Computer Systems supplies both standard and full custom ICs. Its standard ICs include programmable digital 

delay timers, CMOS dividers, incremental encoder interface chips, counters, melody generators, lighting control 

ICs, AC and brushless DC motor controllers, LCD drivers, telephone line switch controllers, programmable digital 

lock circuits, and PIR detection circuits. 

The company’s analog and digital full custom IC service is called Extra-Custom. The use of several external mask 

and wafer foundries that offer a broad range of process technologies makes the Extra-Custom service flexible in 

meeting the needs of a variety of applications and provides automatic second-sourcing of product. LSI Computer 

Systems custom designs every detail of each Extra-Custom IC thereby providing protection of the customer’s 

proprietary product techniques. 


North American Company Profiles LSI Logic 


LSI LOGIC 

LSI Logic Corporation 



Telephone: (408) 433-8000 

Fax: (408) 433-7715 

Web Site: www.lsilogic.com 


Japan: LSI Logic K.K. • Minato-ku, Tokyo, Japan 

Telephone: (81) (3) 5463-7811 • Fax: (81) (3) 5463-7825 

Europe: LSI Logic Europe, Ltd. • Bracknell, Berkshire, United Kingdom 

Telephone: (44) (1344) 426544 • Fax: (44) (1344) 481039 

Asia-Pacific: LSI Logic Hong Kong, Ltd. • Hong Kong 

Telephone: (852) 2405-8600 • Fax: (852) 2412-7820 


1992 1993 1994 1995 1996 

Sales 617 719 902 1,268 1,239 

Net Income (110) 54 109 238 147 



Employees 3,400 3,370 3,750 3,750 3,910 


LSI Logic is a leading designer and manufacturer of high-performance ASICs and related products and services. 

Founded in 1981, the company uses advanced process technology and design methodology to design and 

develop highly complex ASICs and other integrated circuits. Customers of LSI Logic are primarily original 

equipment manufacturers (OEMs) in the electronic data processing, consumer electronics, telecommunications, 

and certain office automation industries. Within these industries, the company emphasizes digital video, digital 

broadcasting, networking and wireless communications, desktop and personal computing, and office automation 

applications. 


LSI Logic North American Company Profiles 

1-200 

ASIC Design and Services 

6% 

Component Products 

94% 

1996 Sales by Business 

Europe 

17% 

Japan 

21% 

Pacific Rim 

4% 


58% 


As process technology becomes more sophisticated, allowing greater density and increased functionality, the 

"system-on-a-chip" is becoming the foundation of LSI Logic's business. In fact, the company has trade marked 

the term “The System on a Chip Company.” Its product libraries, including its CoreWare ® libraries, combined with 

its deep submicron process technologies provide the company with the ability to combine microprocessor 

"engines", logic blocks (including industry standard functions, protocols, and interfaces), and memory with a 

customer’s proprietary logic on a single chip. 

LSI Logic’s CoreWare technology is at the center of its shift toward more consumer and communications products. 

In 1996, these two segments accounted for 60 percent of the company’s revenue, versus 44 percent in 1995. 

New industry-standard cores added to the CoreWare library in 1996 included those for the GSM wireless market, 

Internet and Intranet applications, satellite set-top boxes, networking, and DVD products. In 1H97, the company 

entered the cable modem market with the introduction of its Cablestream QAM Receiver core. 


28% 

Other 

6% 

Consumer 

32% 

Computers 

34% 

1996 Sales by End-Use Application 



Management 

Wilfred J. Corrigan Chairman and Chief Executive Officer 

Moshe N. Gavrielov Executive Vice President, LSI Logic Products 

Cyril F. Hannon Executive Vice President, Worldwide Operations 

W. Richard Marz Executive Vice President, Geographic Markets 

R. Douglas Norby Executive Vice President and Chief Financial Officer 

Joseph M. Zelayeta Senior Vice President, Research and Development, and General Manager, 

U.S. Wafer Fab Operations 

Maniam B. Alagaratnam Vice President, Product Development 

Elias J. Antoun Vice President and President, LSI Logic K.K. 

Ronald K. Bell Vice President and General Manager, Computer and Advanced Architecture 

Jean-Louis Bories Vice President, ASIC Technology 

John P. Daane Vice President and General Manager, Communication Products 

John J. D’Errico Vice President and General Manager, Pan Asia 

Simon P. Dolan Vice President, Strategic Marketing 

Bruce L. Entin Vice President, Worldwide Customer Marketing, Geographic Markets 

Donald J. Esses Vice President, U.S. Manufacturing 

Amnon Fisher Vice President and General Manager, Consumer Products 

Jeffrey L. Hilbert Vice President, Worldwide Customer Engineering, Geographic Markets 

James W. Hively Vice President, ASIC Product Development 

Charles E. Laughlin Vice President and General Manager, LSI Logic Japan Semiconductor, Inc. 

Theodore Leno Vice President, Assembly and Test Operations 

Bryon Look Vice President, Corporate Development 

R. Gregory Miller Vice President, Corporate Controller 

Pierre Nadeau Vice President and General Manager, LSI Logic Europe Ltd. 

Willsie H. Nelson Vice President, Logistics 

David E. Sanders Vice President, General Counsel, and Secretary 

Richard D. Schinella Vice President, Wafer Process R&D and Santa Clara Operations 

Chiaki Terada Vice President, Industrial Engineering 

Frank Tornaghi Vice President, North America Sales 

Shubha S. Tuljapurkar Vice President, Business and Personal Systems 

Lewis C. Wallbridge Vice President, Human Resources 

Edward K. Wan Vice President, North America Engineering 




LSI Logic's broad product line includes high-performance gate array, cell-based, and embedded array ASICs with 

up to five million gates. The company's CoreWare library contains cells and cores based on industry-standard 

functions, interfaces, and protocols. Example cores from the CoreWare library include Ethernet controllers, the 

ATMizer II segmentation and reassembly engine, and the GigaBlaze G10 SeriaLink 1.25-gigabit/second 

transceiver for communications applications; PCI and USB bus interfaces and Fibre Channel protocol circuits for 

computer applications; MPEG-2 and DVD decoders for digital video applications; and a GSM baseband processor 

for GSM mobile phones. In addition, cores such as these may be combined with LSI Logic’s MiniRISC family of 

Mips-based RISC microprocessor cores, including the TinyRISC 16-/32-bit compressed-code MPU, and/or 

special-purpose memory circuits to realize system-level applications on a single chip. 

In addition, LSI Logic offers a family of application-specific standard product (ASSP) high-speed digital signal and 

image processing devices that handle many common digital signal processing functions. Some of the ASSPs 

designed by LSI Logic are included in the company’s CoreWare library. The company also sells stand-alone 

SPARC- and Mips-based RISC microprocessors. 

The company has developed and uses advanced CMOS technologies to manufacture its IC products. Its G10 

0.35μm (0.25μm, Leff) 3-volt CMOS process, introduced in 1995, allows for up to 49 million transistors (or up to five 

million usable gates) on a single chip. In early 1997, LSI Logic formally announced its next-generation G11 

process technology featuring a 0.25μm (0.18μm, Leff) gate length, providing up to 64 million transistors (or up to 

8.1 million usable gates) and allowing greater density and increased functionality on a single chip. Devices in the 

G11 ASIC family will operate on 1.8V, 2.5V, or 3.3V, and consume one-fourth of the power of the G10 devices. 

Initial production of G11 ASICs is due to begin in 4Q97. 

In a significant step to increase yields and allow for greater chip customization, LSI Logic during 1996 installed 

chemical mechanical polishing (CMP) equipment in its Japanese fabrication facilities. In addition, the company 

started using flip-chip interconnect package technology for its most complex chips. 


Most of LSI Logic's wafers are manufactured by its Japanese subsidiary, LSI Logic Japan Semiconductor, Inc., 

(JSI) which prior to January 1995 was jointly owned by LSI Logic (55 percent) and Kawasaki Steel Corporation (45 

percent). LSI Logic is now the sole owner of JSI, as a result of the purchase of Kawasaki Steel's interest. 

LSI Logic also obtains wafers from Chartered Semiconductor in Singapore. In 1995, LSI Logic made a $20 million 

equity investment in Chartered, in exchange for guaranteed wafer capacity for products based on 0.6μm 

technology and smaller for a period of 10 years. 

1-202 



In 1996, the company closed its aging fab in Milpitas, California, and delayed by six months the launch of its new 

200mm wafer fab under construction in Gresham, Oregon. The Gresham facility is now scheduled to begin 

production at the beginning of 1998. 

LSI Logic Corporation LSI Logic Corporation 

3115 Alfred Street Gresham, Oregon 

Santa Clara, California 95054 Capacity (wafers/week): 4,000 

Telephone: (408) 433-6666 Wafer size: 200mm 

Capacity (wafers/week): 250 Process: CMOS 

Wafer size: 150mm Products: ASICs, ASSPs 

Processes: CMOS, BiCMOS Feature sizes: 0.25μm, 0.35μm 

Products: R&D, ASICs (Operations to begin in 1Q98.) 


LSI Logic Japan Semiconductor, Inc. 

(formerly known as Nihon Semiconductor) 

10 Kitahara, Tsukuba-shi 

Ibaraki-ken 300-32, Japan 

Telephone: (81) (298) 64-7229 

Fax: (81) (298) 64-33362 

Fabs I and II 





Products: ASICs, MPUs, MPRs 



• In early 1997, LSI Logic licensed the ARM 32-bit RISC microprocessor core of Advanced RISC Machines. 

• In 3Q96, LSI Logic and Mips Technologies, Inc. extended and expanded the scope of the architecture license 

that allows LSI Logic to produce Mips-based RISC microprocessors and microprocessor cores. The new 

license will expire in the year 2004. 

• LSI Logic joined Mentor Graphics to form a 10-year alliance that couples Mentor’s open design tools within LSI 

Logic’s submicron design and manufacturing environment to ensure “right-first-time” ASICs. 

• The company formed a five-year alliance with Argonaut Software to develop a family of 3D graphics 

accelerators. Incorporating LSI’s system-on-a-chip, the companies will develop upgradeable 3D graphics cores 

for LSI’s ASIC library. 



• LSI Logic entered into an agreement with InterDigital Communications Corporation that calls for LSI Logic to 

develop and produce custom chips for InterDigital to use in Personal Communications Services (PCS) 

handsets and Wireless Local Loop equipment. The cores that LSI Logic will use in the design are based on the 

company’s G10 0.35μm process technology. 

• LSI Logic established a joint development agreement with Sanyo Electric to design the core of an HDTV 

system. 

• LSI Logic signed an agreement with Philips to collaborate on developing video compression ICs for HDTV 

applications. 

1-204 


North American Company Profiles Lucent Technologies 


LUCENT TECHNOLOGIES 

Lucent Technologies Inc. 

Microelectronics Group 

Two Oak Way 

Berkeley Heights, New Jersey 07922-2727 

Telephone: (800) 372-2447 

Web Site: www.lucent.com/micro 


Japan: Lucent Technologies, Microelectronics Group • Shinagawa-ku, Tokyo, Japan 

Telephone: (81) (3) 5421-1600 • Fax: (81) (3) 5421-1700 

Europe: Lucent Technologies, Microelectronics Group • Bracknell, Berkshire, United Kingdom 

Telephone: (44) (1344) 865900 • Fax: (44) (1344) 865990 

Asia-Pacific: Lucent Technologies, Microelectronics Group • Singapore 

Telephone: (65) 778-8833 • Fax: (65) 777-7495 


1992 

1993 


1994 

1995 

1996 

Sales (Lucent Technologies) 17,312* 17,734* 19,765* 20,258 23,286 

Net Income (3,778)* 482* (867)* 553 1,054 

Semiconductor** 

Sales 1,018 1,186 1,463 1,836 2,312 


Employees (Microelectronics) 20,000 20,000 18,500 18,000 18,000 

*Data for fiscal years ended December 31. In 1996, the fiscal year was changed to start in October. 

**Calendar year

Lucent Technologies North American Company Profiles 


Lucent Technologies Microelectronics Group (formerly AT&T Microelectronics) designs and manufactures 

advanced integrated circuits, power systems, and optoelectronic components. Its product line is built upon 

strengths in digital signal processing, networked computing, and communications technologies. The company's 

products are used in applications such as personal computers/multimedia systems, local-area networks (LANs), 

cellular base stations, TV set-top boxes, telephones, and answering machines. It is a leader in digital signal 

processors (DSPs), cell-based ASICs, video conferencing ICs, and telecommunication power systems. 

AT&T Corporation’s restructuring began with an announcement on September 20, 1995, to separate the $80 

billion corporation into three independent companies: AT&T Corporation (communications), Lucent 

Technologies (systems and technology), and NCR Corporation (business computing). 

The company name, Lucent, was chosen for its meaning “marked by clarity” or “glowing with light” to distinguish 

itself from AT&T. Lucent Technologies is made up of five business groups: Network Systems, Business 

Communications Systems, Microelectronics, Consumer Products, and Bell Laboratories. 

1-206 

Consumer 

6% 

Microelectronics 

10% 


Systems 

24% 

Other 

3% 

Network Systems 

57% 


Lucent’s semiconductor roots stretch back to the late 1940's, when Bell Labs, the research and development arm 

of Lucent Technologies, was credited with the invention of the transistor. Bell Labs was given the Nobel Prize for 

its invention in 1956. After nearly three decades of supplying its parent with chips, AT&T Microelectronics, as it 

was then known, decided to offer its products on the merchant market. Today, only about 15 to 20 percent of the 

company’s output goes to Lucent customers, versus about 70 percent in 1990. 

Lucent Technologies’ Microelectronics Products business can be divided into three product groups: integrated 

circuits for use in communications and computing products and systems; energy systems, electronic power 

supplies, and associated magnetic components for the telecommunications and electronic data processing 

industries; and optoelectronic products for the telecommunications, cable television, and network computing 

markets. The company sold its interconnect products, Paradyne subsidiary, and custom manufacturing systems 

businesses in 1996. 



Much of Lucent’s recent growth in sales of Microelectronic Products have been due to higher sales of DSPs and 

ASICs to OEMs, particularly in the Asia-Pacific region. International revenues represented approximately half of 

the Microelectronic Products Group’s sales in fiscal 1996. 

Management 

Consumer 

6% 

Data Processing 

38% 


56% 

1996 Semiconductor Sales by 

End-Use Market 

Asia-Pacific 

18% 


50% 


Japan 

6% 

Europe 

26% 



Lucent Technologies 

Henry B. Schacht Chairman and Chief Executive Officer 

Richard A. McGinn President and Chief Operating Officer 

Curtis J. Crawford President, Microelectronics Group 

William T. O’Shea President, Bell Laboratories 

Patricia F. Russo President, Business Communications Systems 

Daniel C. Stanzione President, Network Systems and Bell Laboratories 

Lucent Technologies Microelectronics Group 

Curtis J. Crawford President 

John T. Dickson Vice President, Integrated Circuits 

Kenneth W. Dorushka Vice President, Sales 

Peter R. McCarthy Vice President, Sales Development and Operations 

Peter T. Panousis, Ph.D. Vice President, Silicon Manufacturing and Development, 

and President, Cirent Semiconductor 

John V. Pilitsis Vice President, Optoelectronics 

William R. Spivey Vice President, Systems and Components 

Jay A. Walters Vice President and Chief Operating Officer, Power Systems 


Lucent utilizes CMOS, BiCMOS, and bipolar processes in the manufacture of its integrated circuits. The following 

are Lucent’s primary semiconductor products: 16-bit and 32-bit DSPs (including modem DSPs), ASICs (digital and 

mixed-signal standard cells, gate arrays), FPGAs, MPEG-2 digital TV devices, and communication ICs (e.g., 

network interface ICs, transceivers, and line card ICs).


Recent new product unveilings have included the new ORCA 3 series of FPGAs that will carry the ORCA family 

into 0.25μm processes and 320,000 vendor-defined gates, a 56-Kbps modem chipset, and a DSP with 120MIPS 

performance (claimed to be the first to exceed 100MIPS). 

The company also provides bipolar IC foundry services to outside companies. The Bipolar Foundry utilizes two 

industry leading advanced complementary bipolar process technologies, called CBIC-U2 and CBIC-V2. 

1-208 





EPROM Voltage Regulator/Reference 

ROM Data Conversion 


Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom) 


General Purpose Logic ✔ Bipolar Memory 



✔ Field Programmable Logic Field Programmable Logic 

✔ Other Special Purpose Logic 


Other Special Purpose Logic 

MPU/MCU/MPR 

MPU OTHER 

MCU ✔ Full Custom IC 

MPR Discrete 



Lucent Technologies Inc. Lucent Technologies Inc. 

Allentown Works Reading Works 

555 Union Boulevard P.O. Box 13396 

Allentown, Pennsylvania 18103 Reading, Pennsylvania 19612 




Wafer sizes: 125mm, 150mm Wafer sizes: 100mm (2in for optoelectronics) 

Processes: NMOS, CMOS, bipolar Processes: Bipolar, HVCMOS, BCDMOS 

Products: Linear and logic ICs, DSPs, ASICs, Products: Linear ICs, optoelectronics, 

FPGAs foundry services 




Lucent Technologies Inc. Lucent Technologies Microelectronica S.A. 

Orlando Plant Poligono Industrial de Tres Cantos 

9333 South John Young Parkway S/N (Zona Oeste), 28770 Colmenar Viejo 

Orlando, Florida 32819 Madrid, Spain 




Wafer size: 150mm Process: CMOS 

Process: CMOS Products: ASICs, FPGAs, communications ICs, DSPs 

Products: ASICs, FPGAs, DSPs, R&D Feature sizes: 0.35μm, 0.45μm, 0.9μm, 1.25μm 


Lucent Technologies Inc. Cirent Semiconductor 

Optoelectronics Center 9333 South John Young Parkway 

9901 Hamilton Boulevard Orlando, Florida 32819 

Breiningsville, Pennsylvania 18031-9359 Telephone: (407) 345-6000 



Wafer size: 2in Process: CMOS 

Process: LPMDCVD Products: ASICs, MPRs 

Products: Optoelectronics Feature sizes: 0.35μm, 0.5μm 

Feature sizes: 0.1μm-5.0μm (Joint venture with Cirrus Logic. 

See Key Agreements.) 


• In April 1997, Lucent announced it had licensed Advanced RISC Machines’ high-performance, low-power RISC 

microprocessor core technology (ARM7TDMI) for integration with Lucent’s ASIC library. 

• Lucent and Mitsubishi established an alliance in mid-1996 to jointly develop a set of ICs that together will 

perform all of the functions needed for next-generation HDTV sets for the U.S. market. The first samples of the 

chipset are expected to become available in early 1998. 

• In October 1995, Lucent signed an agreement with Cirrus Logic to form a $600 million joint manufacturing 

venture in Orlando, Florida. The new company, called Cirent Semiconductor, is 60 percent owned by Lucent 

and 40 percent by Cirrus. Production began in early 1997, beginning with a 0.35μm process (with plans to 

move to 0.25μm in the future). Lucent and Cirrus equally share Cirent’s output. 

• Lucent signed an agreement with Hewlett-Packard in 1995 to develop and dual-source fiber-optic transceivers 

for SONET/SDH and ATM applications. 

• Lucent (then AT&T Microelectronics) struck an agreement with Standard Microsystems Corp. (SMC) in 1994 

under which SMC agreed to buy equipment for installation in Lucent's fab in Spain in return for a guaranteed 

portion of the fab output for a period of five years. 



• Lucent is working with IBM, Lockheed-Martin Federal Systems, and Motorola to establish a manufacturing 

infrastructure for x-ray lithography. The team hopes to have a manufacturing capability by the end of 1997. 

• Lucent has been collaborating with NEC on the development of advanced CMOS process technologies since 

1991. The team completed development of a 0.25μm process flow in early 1997 and are currently working on a 

successor 0.18μm program, which is targeted for completion in 1999. 

• Lucent has several agreements with TriQuint Semiconductor involving the development, manufacture, and 

marketing of GaAs ICs for high-performance wireless and telecommunications systems. As part of the deal, 

Lucent discontinued its production of GaAs wafers and now relies on TriQuint for the manufacture of its GaAs 

wafers. The two companies are developing an epitaxial process based on Lucent's GaAs intellectual property. 

• Lucent is teamed with Sandia National Laboratories to develop new lithography patterning technologies for the 

production of high-density ICs with geometries below 0.2μm. 

1-210 


North American Company Profiles Maxim Integrated Products 


Japan: Maxim Japan Co., Ltd. • Tokyo, Japan 

Telephone: (81) (3) 3232-6141 

MAXIM INTEGRATED PRODUCTS 

Maxim Integrated Products, Inc. 

120 San Gabriel Drive 


Telephone: (408) 737-7600 

Fax: (408) 737-7194 

Web Site: www.maximic.com 


Europe: Maxim Integrated Products (UK), Ltd. • United Kingdom 

Telephone: (44) (1734) 303388 

Asia-Pacific: Maxim Integrated Products Inc. • Hong Kong 

Telephone: (852) 2376-3000 


1992 1993 1994 1995 1996 

Sales 87 110 154 250 422 

Net Income 14 17 24 39 123 



Employees 554 638 1,016 1,552 1,987 


Established in 1983, Maxim Integrated Products is a leading designer, developer, and manufacturer of linear and 

mixed-signal integrated circuits. Maxim's products are the interface between the real, analog world and the world 

of digital processing. They detect, measure, amplify, and convert real world signals, such as temperature, 

pressure, or sound, into the digital signals necessary for computer processing. Its circuits are used in a wide 

variety of microprocessor-based equipment, including PCs and peripherals, test equipment, handheld products, 

wireless communicators, and video displays. The company also provides a range of high-frequency design 

processes and capabilities that can be used in custom design. 

Maxim’s main objective is to actively develop and market both proprietary and industry standard analog integrated 

circuits that meet the increasing quality standards demanded by customers. 


Maxim Integrated Products North American Company Profiles 

In mid-1994, Maxim acquired substantially all of the assets of the Tektronix's Integrated Circuits Operation in 

Beaverton, Oregon, for about $22 million. The acquisition provided Maxim with additional wafer production 

capacity, leading-edge high-frequency bipolar technologies that have broadened the firm's presence in the 

wireless and optic communications markets, as well as in high-speed data acquisition, RF signal processing, and 

video products. 

Management 

1-212 

United States 

43% 

Europe and 

Pacific Rim 

57% 


Jack F. Gifford Chairman, President and Chief Executive Officer 

Frederick G. Beck Vice President, Marketing and Sales 

Ziya G. Boyacigiller Vice President 

Michael J. Byrd Vice President and Chief Financial Officer 

Stephen R. Combs, Ph.D. Vice President, Operations 

Tunc Doluca Vice President, Research and Development 

Dave J. Fullager Vice President, Research and Development 

Anthony C. Gilbert Vice President, and Secretary 

Kenneth J. Huening Vice President 

William N. Levin Vice President 

Robert F. Scheer Vice President, Wafer Operations 

Richard E. Slater Vice President and Chief Accounting Officer 

Vijay Ullal Vice President 


Maxim Integrated Products offers a broad range of linear and mixed-signal ICs, including data converters, interface 

circuits, microprocessor supervisory circuits, operational amplifiers, power control circuits, timers and counters, 

display circuits, multiplexers and switches, battery chargers, voltage detectors, filters, comparators, and voltage 

reference circuits. 


North American Company Profiles Maxim Integrated Products 


During fiscal year 1996, Maxim converted over half of its wafer fabrication capacity from 100mm to 150mm wafers. 

To supplements its own IC production capacity, Maxim has foundry agreements with independent foundry 

companies. 

Maxim Integrated Products Maxim Integrated Products 

430 West Maude Avenue 14320 Southwest Jenkins 

Sunnyvale, California 94086 Beaverton, Oregon 97005 




Wafer sizes: 100mm, 150mm Wafer size: 100mm 

Processes: CMOS, BiCMOS, bipolar Process: Bipolar 

Products: Linear and mixed-signal ICs Products: Mixed-signal ICs 


(purchased from Tektronix in mid-1994) 


Micrel Semiconductor North American Company Profiles 

1-214 

MICREL SEMICONDUCTOR 

Micrel Semiconductor, Inc. 

1849 Fortune Drive 


Telephone: (408) 944-0800 

Fax: (408) 944-0970 



1992 1993 1994 1995 1996 

Sales 18 19 36 53 66 



Employees 150 160 180 345 400 


Micrel Semiconductor, founded in 1978, designs, develops, and manufactures a range of high-performance 

analog ICs targeting the communications, computer, and industrial markets. In 1982, Micrel acquired an IC 

fabrication facility in Sunnyvale, California, from Siemens Components and began acting as a silicon foundry. This 

led to the company's development of semicustom and standard linear smart power ICs. In early 1993, Micrel 

moved its headquarters and manufacturing operations from Sunnyvale to San Jose. The new fab, formerly owned 

by Seeq Technology, tripled Micrel's fab capacity. 

The company’s products are divided into three key areas: standard ICs, custom ICs, and foundry services. In 

1996, the majority of the company’s revenues were from sales of standard products. The company’s standard 

products have grown from representing 14 percent of total revenues in 1992 to 66 percent in 1996. Micrel 

currently offers over 800 standard products. 

Custom ICs/ 

Foundry Services 

34% 

Standard ICs 

66% 

1996 Sales by Product 


North American Company Profiles Micrel Semiconductor 

In addition to standard products, the company manufactures custom analog and mixed-signal circuits and provides 

wafer foundry services for customers who produce electronic systems for communications, consumer, and military 

applications. 

Consumer 

8% 

Telecom 

14% 

Military/Other 

7% 

Industrial 

29% 

Computer 

42% 


Europe 

11% 


59% 


Micrel is focusing its efforts on the design and marketing of its high-performance analog power ICs to become a 

strong force in portable computing, desktop computing, communications, and automotive and aviation 

electronics. Future plans include a continued transition toward standard products, while maintaining its presence 

in the custom IC and foundry business. 

Management 


Asia 

30% 

Raymond D. Zinn President and Chief Executive Officer 

George T. Anderl Vice President, Sales and Marketing 

Robert J. Barker Vice President, Finance, and Chief Financial Officer 

John D. Husher Vice President, Fabrication Division 

Warren H. Muller Vice President, Test Operations 

Larry R. Sample Vice President, Design 


Micrel supplies both standard and custom products. The company's key standard product lines include highcurrent 

low-side power MOSFET drivers, high-side power MOSFET drivers, low dropout (LDO) linear regulators, 

high-efficiency switching regulators, PCMCIA power control matrices, power latched drivers, display drivers, Pchannel 

MOSFETs, and open drain power switches. Micrel also continues to offer the use of its fabrication 

facilities as a foundry source. 

Micrel uses and offers a full range of processes: CMOS, DMOS, bipolar, BiCMOS, and BCDMOS. The company’s 

fab is capable of handling metal-gate, silicon-gate, double-metal and double-poly architectures with feature sizes 

down to 1.0μm.

Micrel Semiconductor North American Company Profiles 


Micrel Semiconductor, Inc. 

1849 Fortune Drive 




Wafer size: 100mm (moving to 150mm) 

Processes: CMOS, bipolar, DMOS, BiCMOS/DMOS, BCD 

Products: Linear ICs, custom ICs, foundry services 


1-216 


North American Company Profiles Micro Linear 

MICRO LINEAR 

Micro Linear Corporation 

2092 Concourse Drive 


Telephone: (408) 433-5200 

Fax: (408) 432-0295 

Web Site: www.microlinear.com 



1992 1993 1994 1995 1996 

Sales 37 34 42 57 54 

Net Income 3 — 3 11 7 

R&D Expenditure 7 8 9 10 11 

Employees 210 210 225 251 251 


Established in 1983, Micro Linear designs, develops, and markets analog and mixed-signal ICs for a broad range 

of applications within the communications, computer, and industrial markets. Such applications include local-area 

networks (LANs), mass storage, personal computers, notebook computers, personal digital assistants (PDAs), 

voice-band telecommunications, data acquisition, motor control, and power management. 

Micro Linear targets high growth applications that require substantial analog and mixed signal content. Using its 

designs, the company integrates electronic subsystems or several analog building block circuits into a single 

circuit or chipset. Current development projects include the development of new standard and semi-standard 

products 

In 1991, Micro Linear implemented a strategy to diversify its business and lessen its dependence on the hard disk 

drive industry. As a result, hard disk drive product sales in 1996 represented only six percent of total revenues, 

compared to 81 percent in 1990. Micro Linear expects that sales of hard disk products will continue to represent 

less than 10 percent of total revenues. 

International sales represented approximately 38 percent of total revenues in 1996. 


Micro Linear North American Company Profiles 

Management 

1-218 

Hard 

Disk Drive ICs 

6% 

Other ICs 

37% 

Computer 

Networking ICs 

57% 


Arthur B. Stabenow Chairman, President, and Chief Executive Officer 

Robert Whelton Executive Vice President 

Carlos A. Laber Vice President, Engineering 

Chris A. Ladas Vice President, Operations 

Marty Levy Vice President, Sales 

Ray A. Reed Vice President, Business Development 

J. Philip Russell Vice President, Finance and Administration, and Chief Financial Officer 

Paul E. Standish Vice President, Marketing and Applications 


Micro Linear provides second-source products and proprietary standard products as well as semi-standard parts 

and ASICs using bipolar, CMOS, and BiCMOS processes, with a particular emphasis placed on its 1.5μm BiCMOS 

technology. Its product offerings are broken down by market application below. 

Mass storage (HDD, MOD, and tape): 

Pulse detectors Data separators 

Read/write amplifiers Frequency synthesizers 

Motor, servo controllers Trajectory generators 

Servo demodulators Voice coil drivers 

Read channel Filters 

SCSI terminators Buffers 

Clock generators 

LANs: 

Data quantizer Transceivers for ATM 

Transceivers for MPR, FOIRL Fiberoptic LED drivers 

Transceivers for AUI/FDDI 

Voiceband telecommunications: 

Gain/attenuators Equalizers 

Tone detectors Dual filters 

Sine-wave generators 


North American Company Profiles Micro Linear 

Power and motion control: 

Motor controllers Synchronized power supply chips 

Power factor correctors Resonant controllers 

Battery—DC/DC converters Phase modulation controllers 

PWM controllers LCD backlight IC 

Data conversion: 

12-bit ADCs 8-bit ADCs 

10-bit ADCs 8-bit DACs 


Micro Linear utilizes wafer foundries for the production of its ICs. 


Micro Networks North American Company Profiles 


1-220 

MICRO NETWORKS 

Micro Networks Corporation 

Microelectronics Business Unit 

324 Clark Street 

Worcester, Massachusetts 01606 

Telephone: (508) 852-5400 

Fax: (508) 853-8296 


Micro Networks Corporation designs and manufactures custom and semi-custom data acquisition products, clock 

oscillators, application-specific ICs (ASICs), and custom hybrid microcircuits for worldwide high reliability 

aerospace/defense, industrial, and commercial applications. 

MNC was established in 1969 as a hybrid producer and quickly became a dominant player in data conversion 

products. A second product line, frequency control products, was added in 1991. Micro Networks also designs 

and manufactures custom microelectronics products including thick- and thin-film substrates, hybrids, and 

multichip modules. Typical applications for its custom microelectronics products are avionics, imaging, portable 

satellite terminals, military electronics equipment and submarine communications receivers. 

In September 1996, MNC acquired the assets of GTE Microelectronics from GTE Corporation, one of the world's 

largest suppliers of communications systems, equipment, and services for commercial and government/defense 

applications. GTE Microelectronics was an organization within the Communications Systems Division of GTE 

Government Systems, one of GTE Corporation's two operating groups. With the assets of GTE Micro, MNC 

expanded its monolithic capabilities and its custom microelectronics product line to include capabilities in ASIC 

design, manufacture, and test. With regard to ASICs, MNC specializes in the conversion of ASIC designs and the 

manufacture of secure ASIC products. 

Approximately 60 percent of MNC’s sales, which are forecast to be about $15 million for 1997, are from militaryrelated 

products. Commercial-related products make up the remaining 40 percent. 

Management 

Debbie Cremin Director, Microelectronics Business Unit 

John Condon Sales Manager, Custom Microelectronics Business Unit 


North American Company Profiles Micro Networks 


Micro Networks’ custom microelectronics products include ASICs, FPGAs, multichip modules, and hybrid circuits. 

The company specializes in rapid prototyping, small production runs, custom packaging, and conversion of 

hybrids to ASICs. 

The companies’ ASIC offerings include a variety of standard cell and gate array technologies down to submicron 

CMOS, BiCMOS, and bipolar for digital, analog, and mixed-signal circuits. 

Micro Networks also provides custom test services for test development and production of analog, digital, and 

mixed-signal circuits including temperature testing, characteristics, and qualification. 


For the production of its ICs, MNC works with a number of wafer foundries including National Semiconductor, 

Symbios Logic, and Mitel Semiconductor. 


• As part of the acquisition of GTE Microelectronics in September 1996, MNC established an alliance with GTE 

Government Systems that calls for MNC to supply GTE Government Systems with custom ASICs, which were 

previously supplied by GTE Micro. 


Microchip Technology North American Company Profiles 


1-222 

MICROCHIP TECHNOLOGY 

Microchip Technology Inc. 

2355 West Chandler Boulevard 

Chandler, Arizona 85224-6199 

Telephone: (602) 786-7200 

Fax: (602) 899-9210 

Web Site: www.microchip.com 


Japan: Microchip Technology International Inc. • Yokohama, Kanagawa, Japan 

Telephone: (81) (45) 471-6166 • Fax: (81) (45) 471-6122 

Europe: Arizona Microchip Technology Ltd. • Bourne End, Buckinghamshire, England 

Telephone: (44) (1628) 851077 • Fax: (44) (1628) 850259 

Asia-Pacific: Microchip Technology, Inc. • Kwai Fong, Hong Kong 

Telephone: (852) 2401-1200 • Fax: (852) 2401-3431 


1993 1994 1995 1996 1997 

Sales 89 139 208 286 334 

Net Income 4 19 36 52 57 



Employees 1,070 1,260 1,430 1,665 1,900 


Microchip Technology was organized in 1989 by a group of venture capital investors to acquire General Instrument 

Corporation's Microelectronics division, which was established in 1960. Since the acquisition, Microchip 

Technology has shifted its focus from commodity memory and logic products to embedded control system 

products. 

The company is now a leading manufacturer of highly integrated, field-programmable RISC microcontrollers, 

complementary ASSPs, and related specialty memory products for high-volume embedded control applications. 

Microchip sells its products to a broad and diverse customer base in the consumer, automotive, communications, 

office automation, and industrial markets. 


North American Company Profiles Microchip Technology 

Commodity Memories 

and Logic Products 

7% 

EEPROMs and 

Specialty EPROMs 

34% 

Microcontrollers 

and associated 

development systems 

59% 

1996 Sales by Product Category 

Other 

(primarily Asia, 

Europe, and Japan) 

65% 

United States 

35% 


Microchip's embedded control products (microcontrollers, serial and parallel EEPROMs, and high-speed and lowpower 

EPROMs) represented 93 percent of total product sales in fiscal 1996 compared to only eight percent of 

total product sales in fiscal 1990. The remaining 7 percent in fiscal 1996 was represented by the company’s 

commodity memory and logic products. 

In 1995, Microchip acquired the “KeeLoq” hopping code and secure smart card technology and patents 

developed by Nanoteq of South Africa. The $10 million acquisition also provided Microchip with worldwide 

marketing rights to the technology. New products have been, and continue to be, developed that combine the 

KeeLoq and smart card technology with Microchip’s 8-bit MCUs and serial EEPROMs for enhanced security 

applications in wireless/remote controlled systems. 

Management 

Steve Sanghi Chairman, President, and Chief Executive Officer 

Timothy B. Billington Vice President, Manufacturing Operations 

Frederick J. Bruwer Vice President, Secure Data Products 

C. Philip Chapman Vice President, Chief Financial Officer, and Secretary 

Steve Drehobl Vice President, ASIC Products Division 

Harold R. Fischer Vice President, Far East Sales 

Lanny Fleesas Vice President, Worldwide Distribution Sales 

Franc C. Guerrini Vice President, Europe Sales 

Michael J. Jones Vice President, Human Resources and Information Systems 

Adrian Kuzdas Vice President, Advanced Microcontroller and Technology Products 

David S. Lambert Vice President, Process Development and Manufacturing Engineering 

Robert A. Lanford Vice President, Worldwide Sales 

Mitchell R. Little Vice President, Standard Microcontroller and ASSP Division 

Robert J. Lloyd Vice President, Facilities Management 

Sumit K. Mitra Vice President, Systems and Applications 

John F. Oatley Vice President, Manufacturing Operations-Pacific Rim 

Gordon W. Parnell Vice President, Controller, and Treasurer 

George P. Rigg Vice President, Advanced Microcontroller and Technology Division 

Richard J. Simoncic Vice President, Memory and Specialty Products Division 

Howard C. Teeter Vice President, Americas Sales 

Ernest M. Villicaña Vice President, Advanced Microcontroller and Technology Division Marketing 

William Yang Vice President, Finance-Pacific Rim 


Microchip Technology North American Company Profiles 


During the 1970's and 1980's, a high-volume ROM and EPROM business was then-General Instrument's primary 

revenue generator. Since then, however, Microchip has placed designs derived from microcontrollers at the 

forefront of its strategy, and has limited nonvolatile offerings to specialty areas such as serial EEPROMs. Although 

commodity EPROM shipments will continue to decrease as a percentage of total sales, the company intends to 

manage EPROM production levels to maintain optimal manufacturing capacity utilization. 

Microchip's integrated circuit products are outlined below. These products are based on CMOS process 

technology with lithography dimensions down to 0.7μm. 

Microcontroller Products 

• PIC16/17 8-bit microcontrollers that combine a high-performance RISC processor with one-time-programmable 

(OTP) EPROM technology or reprogrammable EEPROM or flash memory technology. Current PIC16/17 

microcontroller product families include advanced features such as sophisticated timers, embedded A/D 

converters, extended instruction/data memory, inter-processor communication (I 2 C/Microwire/SPI bus ports 

and USARTs), and ROM, RAM, EPROM, EEPROM, and flash memories. Some of Microchip’s MCUs operate 

from power supplies as low as 2.0V. 

• In 1996, Microchip unveiled the industry’s first 8-pin MCU family of devices—the PIC12. The PIC12 packs the 

8-bit high-speed RISC architecture of the PIC16/17 families into the smallest footprint microcontroller. The 

MCU also integrates a 10-bit A/D converter without increasing the pin count. 

Application-Specific Standard Products (combinations of PIC16/17 MCU architecture, non-volatile memory, and 

selected application-specific software technologies) 

• TrueGauge intelligent battery capacity monitoring and charge controller IC. 

• Mouse and trackball controller IC for all Apple Computer- and IBM PC-compatible formats. 

• Energy management controller IC for reducing power consumption of AC induction motors. 

• Cost effective PICSEE PIC16/17 MCUs with 1K of on-chip serial EEPROM for applications such as automotive 

security, keyless entry, remote control, telecommunications, and data acquisition. 

QuickASIC Products 

• In 1996, Microchip acquired quick-turn ASIC specialist ASIC Technical Solutions, Inc. Through the acquisition, 

Microchip now offers the QuickASIC family, which replace standard FPGAs and CPLDs with a lower-cost maskprogrammed 

gate array ASICs. The QuickASIC business includes what the company calls a Zero-NRE 

program. Microchip is developing the technology to allow the combination of the company’s PIC16/17 MCU 

core with configurable gate arrays, thereby providing a wider range of flexibility, power ranges, and custom 

functionality. 

EEPROM Products 

• Serial CMOS EEPROMs with densities ranging from 1K to 64K and featuring data transfer rates up to 1MHz and 

a 10 million erase/write cycle endurance. The company’s serial EEPROMs are offered with a wide operating 

voltage range (1.8V to 6.0V). Microchip also developed the world’s first 64K smart serial EEPROM. 

• Parallel CMOS EEPROMs available in 4K, 16K, and 64K densities with 10,000 to 100,000 erase/write cycles 

(typ). 

1-224 


North American Company Profiles Microchip Technology 

EPROM Products 

• Standard CMOS EPROMs with densities ranging from 64K to 512K. 

• Low-voltage (as low as 3.0V) CMOS EPROMs with densities ranging from 64K to 512K. 

• High-speed 256K CMOS EPROMs with access times as fast as 55ns. 

Secure Data Products 

• KeeLoq family of secure data products. The encoder and decoder devices, which feature Microchip’s 

patented KeeLoq code hopping technology, are suitable for remote keyless entry, logical/physical access 

control systems, alarm and immobilizer systems, garage door openers, and home security systems. 


Microchip plans to install a 200mm wafer pilot line in its Fab 2 facility in 1997, and will completely convert the fab 

over to 200mm wafers over time. Construction of the company’s Fab 3, 200mm wafer fab is expected to begin in 

1998. 

Microchip Technology Inc. Microchip Technology Inc. 

2355 West Chandler Boulevard 1200 South 52nd Street 

Chandler, Arizona 85224 Tempe, Arizona 85281 

Fab 1 Fab 2 





Products: MCUs, EEPROMs, EPROMs, ASSPs Products: MCUs, EEPROMs, ASSPs, ASICs 


Microchip’s IC products are assembled and tested primarily at a subsidiary in Kaohsiung, Taiwan, and by a thirdparty 

contractor in Bangkok, Thailand. Other third-party assembly and test suppliers used by Microchip are located 

in the Philippines and other Asian countries. 


Micron Technology North American Company Profiles 


1-226 

MICRON TECHNOLOGY 

Micron Technology, Inc. 

8000 South Federal Way 

P.O. Box 6 

Boise, Idaho 83707-0006 

Telephone: (208) 368-4000 

Fax: (208) 368-4435 

Web Site: www.micron.com 


Japan: Micron Technology Japan, K.K. • Minato-ku, Tokyo, Japan 

Telephone: (81) (3) 3436-5666 • Fax: (81) (3) 3436-1444 

Europe: Micron Europe, Ltd. • Crowthorne, Berkshire, United Kingdom 

Telephone: (44) (1344) 750750 • Fax: (44) (1344) 750710 

Asia-Pacific: Micron Semiconductor Asia Pacific Pte. Ltd. • Singapore 

Telephone: (65) 841-4066 • Fax: (65) 841-4166 

Financial History ($M), Fiscal Year Ends August 31 

1992 1993 1994 1995 1996 

Sales 506 828 1,629 2,953 3,654 

IC Sales 455 737 1,368 2,287 2,210 

Net Income 7 104 401 844 594 


Capital Expenditures 102 163 377 961 1,699 

Employees 4,300 4,900 5,400 8,080 9,900 


Micron Technology, Inc. (MTI) was founded in 1978 as a semiconductor design consulting firm. In 1981, the 

company opened its first fabrication facility, and in late 1982, entered the memory market with a 64K DRAM, which 

had a significantly smaller die size than competing products. 

Today, Micron is a leading developer and manufacturer of DRAMs, very fast SRAMs, flash memories, and other 

semiconductor memory components, as well as personal computer systems, RF identification chips and systems, 

and complex printed circuit board assemblies. Its memory products continue to feature some of the smallest die 

sizes in the industry. 


North American Company Profiles Micron Technology 

MTI is comprised of several operating companies. Among them are Micron Semiconductor Products, Inc., which is 

responsible for the sales and support of MTI’s semiconductor products; Micron Electronics, Inc., which develops, 

manufactures, markets, and supports PC systems, workstations, and custom-manufactured printed circuit boards; 

Micron Display Technology, Inc., which develops and manufactures small-area field emission displays (FEDs); 

Micron Communications, Inc., which develops and manufactures a line of MicroStamp remote intelligent 

communications (RIC) products; Micron Quantum Devices, Inc., which designs, develops, and markets flash 

memory IC products and systems; and Micron Construction, Inc., which provides customized construction 

services for customers in the microelectronics, industrial, commercial, and institutional industries. 

SRAMs 

2% 

PCs 

31% 

Other 

10% 

DRAMs/ 

Specialty DRAMs 

57% 

1996 Corporate Sales by Product Type 

Asia Pacific 

9% 

Europe 

10% 


74% 


Japan 

2% 

Other 

5% 

1996 Corporate Sales by Geographic Region 

MTI’s customers are primarily computer and computer peripheral manufacturers. Other customers represent the 

consumer electronics, CAD/CAM, telecommunications, office automation, data processing, and graphics display 

industries. 

Management 

Steven R. Appleton Chairman, President, and Chief Executive Officer 

Donald D. Baldwin Vice President, Sales 

Kipp A. Bedard Vice President, Corporate Affairs 

Eugene H. Cloud Vice President, Marketing 

Robert M. Donnelly Vice President, Memory Products 

D. Mark Durcan Vice President, Process Research and Development 

Jay L. Hawkins Vice President, Manufacturing Administration and Back End 

Edward J. Heitzeberg Vice President, Engineering 

Leo B. Jurica Vice President, Lehi Operations 

Roderic W. Lewis Vice President, Legal Affairs, General Counsel, and Corporate Secretary 

James E. O’Toole Vice President, Product Development 

Nancy M. Self Vice President, Administration 

Steven L. Stout Vice President, Facilities 

W. G. Stover, Jr. Vice President, Finance and Chief Financial Officer 

Mark E. Tuttle Vice President, Manufacturing

Micron Technology North American Company Profiles 


Micron's semiconductor product strategy is focused on the design, development, and manufacture of memory 

products, primarily DRAMs, for standard and custom memory applications. In recent years, the company has been 

applying its core semiconductor technology in other areas, such as RFID products and flat panel displays, in order 

to diversify its business. 

Standard and Specialty DRAMs 

• 4M, 16M, and 64M standard DRAMs—fast page, extended data-out (EDO), and burst EDO modes. 

• 16M synchronous DRAMs (SDRAMs)—offered in speed grades of 12ns/83MHz or 10ns/100MHz. 

• 4M EDO DRAMs for graphics applications—x16 configuration and access times as low as 40ns. 

• 8M synchronous graphics RAMs (SGRAMs)—x32 configuration, with speed grades of 15ns/66MHz, 

12ns/83MHz, and 10ns/100MHz. 

• DRAMs are also offered in bare-die form or module form. 

Synchronous SRAMs 

• 1M and 2M flow-through or pipelined burst SRAMs—the flow-through devices support bus frequencies up to 

67MHz and the pipelined devices up to 125MHz. 

• SRAMs are also offered in bare-die form or module form. 


• 2M, 4M, and 8M NOR-type boot block flash memories using Intel-licensed SmartVoltage technology. 

• 8M and 16M NOR-type sector erase flash memories using Intel-licensed SmartVoltage technology. 

• Micron introduced a line of solid-state flash memory cards in 2H96. 

Communications ICs 

• The MicroStamp Engine is a single-chip device that integrates an 8-bit microcontroller, 256 bytes of SRAM, 

and a microwave radio to produce a stamp size remote intelligent communications (RIC) product. The 

MicroStamp unit can be encoded with information and attached to almost any object. The stored data can then 

be retrieved or modified remotely at distances of 10-20 feet. 

Micron’s semiconductor products are based on CMOS process technology, with the majority of chip designs at the 

0.43μm and 0.35μm geometry levels. The company’s research and development efforts are focused on shrink 

versions of its 16M DRAMs, 64M synchronous DRAMs, and a move from 0.35μm to 0.25μm and 0.18μm process 

technologies. Other development efforts are devoted to 64M, 256M, and 1G DRAMs, and the design of new 

flash memory and RIC products. 

1-228 


North American Company Profiles Micron Technology 


Micron recently completed the conversion of its 150mm wafer lines (Fabs I/II and III) to 200mm wafers. 

Furthermore, in mid-1995, the company began construction of a new $2.5 billion 200mm wafer fab complex in 

Lehi, Utah. However, Micron announced in early 1996 that it would complete only the shell of the fab, and hold off 

on outfitting and equipping the facility until market conditions warrant. When completed, the new plant will be 

capable of processing 10,000 wafers per week, utilizing 0.25μm technology. 

Micron Technology, Inc. Micron Technology, Inc. 

8000 South Federal Way 8000 South Federal Way 

Boise, Idaho 83707-0006 Boise, Idaho 83707-0006 

Fab I/II Fab III 





Products: DRAMs, SRAMs, RFID ICs Products: DRAMs, SRAMs, flash memories 


Micron Technology, Inc. 

8000 South Federal Way 

Boise, Idaho 83707-0006 

Fab IV 



Process: CMOS 

Products: Memory R&D 


Micron’s ICs are tested and assembled at its own facilities located at the site of its headquarters and fabs in Boise, 

Idaho. 





• Micron signed a cross-licensing agreement with Intel in 1995 covering flash memory ICs, making Micron a true 

alternate source for Intel’s flash devices. 

• Micron announced in 1992 a memorandum of understanding with NEC on the mutual OEM sales of each 

other's semiconductor memory products. 

• Micron has made a number of agreements to license its known-good die (KGD) technology. Licensees include 

Honeywell SSEC, Chip Supply, nChip, and Cybex Technologies. 


Mitel Semiconductor North American Company Profiles 


1-230 

MITEL SEMICONDUCTOR 

Mitel Semiconductor 

360 Legget Drive 

P.O. Box 13089 

Kanata, Ontario 

Canada K2K 1X3 

Telephone: (613) 592-2122 

Fax: (613) 592-4784 

Web Site: www.semicon.mitel.com 


North America: Mitel Semiconductor • Mt. Dora, Florida 

Telephone: (352) 383-8877 • Fax: (352) 383-8822 

Financial History ($M, Canadian) 

1992 1993 1994 1995 1996 

Sales* 45 69 80 110 197 


Employees 529 552 564 633 1,061 

*External sales only. Mitel Semiconductor also supplies ICs and hybrids to its parent Mitel Corporation. 


Mitel Semiconductor, founded in 1976, designs, manufactures, and markets ICs, hybrids, and optoelectronic 

components. It supplies analog and digital telecommunications ICs, thick-film hybrids, and board-level products to 

designers of products such as PBXs, EDs, MUXs, and computer/telephony systems. These products are used in 

telecommunications, data communications, video, aerospace, industrial, instrumentation, and medical 

applications. Mitel Semiconductor also offers a high-quality custom wafer fabrication service. 

In March 1996, Mitel Semiconductor acquired Swedish semiconductor manufacturer ABB Hafo. 


North American Company Profiles Mitel Semiconductor 

Management 

Hybrids 

11% 

Opto 

11% 

Thermal Print Heads 

1% 

Wafers 

9% 

ICs 

68% 


United States 

34% 


ROW 

18% 

Japan 

8% 

Canada 

5% 

Europe 

35% 


John Millard President and Chief Executive Officer, Mitel Corporation 

Kirk Mandy Vice President and General Manager, Semiconductor Division 


Mitel Semiconductor's product line includes analog and digital switches; DTMF and caller-ID devices; subscriber 

line circuits (SLICs); telephone-set, ISDN, and line interface devices; and broadband ISDN primary rate and ATM 

products. Mitel Semiconductor also offers a custom wafer foundry service. 


Mitel Semiconductor is in the process of upgrading its Bromont fabrication facility to 150mm wafers. Additional 

100mm capacity is also being added to the Järfälla facility in Sweden. 

Mitel Semiconductor Mitel Semiconductor AB 

18 Airport Boulevard Bruttovägen 1, P.O. Box 520 

Bromont, Quebec, Canada J0E 1L0 S-175 26 Järfälla, Sweden 

Telephone: (514) 534-2321 Telephone: (46) (8) 580 24500 

Fax: (514) 534-3201 Fax: (46) (8) 580 20190 


Capacity (wafers/week): 2,700 Capacity (wafers/week): 750 


Processes: CMOS, double poly/triple metal, Processes: CMOS, DMOS, SOS 

CCD, metal gate Feature sizes: 1.25μm, 1.5μm, 2.0μm, 3.0μm 

Feature sizes: 0.8μm, 1.2μm, 1.5μm, 2.0μm, 

3.0μm, 4.0μm, 5.0μm, 9.0μm

Mosaic Semiconductor North American Company Profiles 

Employees 25 


1-232 

MOSAIC SEMICONDUCTOR 

Mosaic Semiconductor, Inc. 

7420 Carroll Road, Suite 300 


Telephone: (619) 271-4565 

Fax: (619) 271-6058 


Founded in 1988, Mosaic Semiconductor is a supplier of high reliability memory components and subsystems for 

military, aerospace, industrial, and medical markets. Mosaic's customers are mainly in the U.S. and Canada. 

European customers are serviced by the England-based operation, HMP. 

Management 

David Armstrong President and Chief Executive Officer 

Anthony Swaddle Executive Vice President and General Manager 

Jaime Conde Manager, North American Sales 


Mosaic’s memory products include EPROM, EEPROM, flash and SRAM in 8, 16, and 32-bit widths, and are 

available in both ceramic and hi-rel plastic packages. Screening levels available range from commercial to MIL-STD 

883C screen. 


Mosaic's ICs are currently manufactured by various North American and off-shore semiconductor manufacturers. 

The company maintains an assembly, test, and package design facility in San Diego. 


North American Company Profiles MOSAID Technologies 

Financial History ($M), Fiscal Year Ends April 30 

MOSAID TECHNOLOGIES 

MOSAID Technologies Incorporated 

P.O. Box 13579 

Kanata, Ontario 

Canada K2K 1X6 

Telephone: (613) 836-3134 

Fax: (613) 831-0796 

Web Site: www.mosaid.com 


1992 1993 1994 1995 1996 

Sales 7 10 15 24 38 

Net Income (1) 2 3 4 8 


Employees 61 58 74 93 132 


MOSAID Technologies was founded in 1975 to provide MOS memory design and consulting services. Today, the 

company is a recognized leader in the design of memory chips and a leading supplier of engineering memory test 

systems. The company operates from two divisions: the Semiconductor Division, which designs advanced 

memory chips for both standard memory and application-specific memory (ASM) requirements, and the Systems 

Division, which designs, manufactures, markets, and services memory test systems focused primarily on 

engineering testing requirements. Approximately 93 percent of MOSAID's sales revenue is generated outside of 

Canada. 

Taiwan 

11% 

Other 

11% 


21% Korea 

23% 


Japan 

34% 

1996 Sales by Geographic Region

MOSAID Technologies North American Company Profiles 

Management 

Richard C. Foss, Ph.D. Chairman 

George J.J. Cwynar President and Chief Executive Officer 

Robert C. Albrow Vice President, Strategic and Technical Development 

Richard D. Broadway Vice President, Finance and Administration, and Chief Financial Officer 

G. Glenn Evans Vice President and General Manager, Systems Division 


MOSAID has experience in nine generations of DRAM designs, from 4K to 256M. Some recent memory chip 

designs include: a 143MHz, four-bank, 64M SDRAM supporting x4, x8, and x16 configurations, a highperformance 

16M synchronous DRAM supporting data transfer rates of up to 200Mbps, a low-voltage 16M DRAM 

upgrading the capabilities of portable computers, a low-voltage word-wide 4M DRAM, and a low-power SRAM. 

Macrocell designs intended for use as blocks within ASICs include high-speed pipelined SRAMs and DACs for 

RAMDAC function, high-performance embedded DRAM, and HDRAM (high-density DRAM)—MOSAID’s 

proprietary DRAM technology for single poly logic processes. A yield enhancement vehicle closely integrated 

with MOSAID’s engineering testers is also available. 


• MOSAID announced in February 1997 that its HDRAM embedded memory technology would be ported to 

TSMC’s 0.35μm logic process. 

• MOSAID signed a distribution agreement with Synopsys Inc. in February 1997 for the integration of the 

company’s HDRAM technology into Synopsys’ cell-based array technology. 

• MOSAID is involved in the SLDRAM Consortium (formerly the SyncLink Consortium). Its role is to examine the 

feasibility, chip architecture, and bus interface of the new SLDRAM standard, as well as provide the 

demonstration design. 

• MOSAID announced a cooperative development agreement with Oki Electric Company in July 1996, for the 

development of an advanced 16M SDRAM and a 64M Outer Data Inner Control SDRAM. 

• In November 1995, MOSAID acquired 12 percent of Edge Semiconductor Inc, a designer and supplier of ICs 

for the automatic test equipment (ATE) market, based in San Diego, California. 

• In 1994, MOSAID teamed up with Symbionics Ltd., Standard Microsystems Corp., and three venture capital 

firms to form the joint venture company Accelerix, which is developing a single-chip graphics accelerator. 

1-234 


North American Company Profiles Motorola 


MOTOROLA 

Motorola, Inc. 

Semiconductor Products Sector (SPS) 

3102 North 56th Street 

Phoenix, Arizona 85018 

Telephone: (602) 952-3000 

Fax: (602) 952-6100 

Web Site: motserv.indirect.com 


Europe: Motorola, European Semiconductor Group • Geneva, Switzerland 

Telephone: (41) (22) 7991-1111 • Fax: (41) (22) 7341-086 

Asia-Pacific: Motorola Silicon Harbor Centre • Tai Po, Hong Kong 

Telephone: (852) 2666-8333 • Fax: (852) 2666-6123 


1992 1993 1994 1995 1996 

Corporate 

Sales 13,303 16,963 22,245 27,037 27,973 

Net Income 453 1,022 1,560 1,781 1,154 

Semiconductor 

Sales 4,470 5,800 6,960 8,540 7,858 

IC Sales 3,606 4,825 5,600 6,850 6,379 

Discrete Sales 864 975 1,360 1,690 1,479 

Capital Expenditures 666 1,120 1,640 2,530 1,400 

Employees (SPS) 41,000 44,000 46,000 52,000 52,000 


Established in 1928, Motorola's first products were battery eliminators and private label radio sets. Shortly after 

WWII Motorola entered the television and semiconductor businesses. Today, Motorola, Inc. (based in 

Schaumburg, Illinois) supplies a wide range of electronic products, including cellular telephones, semiconductors, 

two-way radios, paging and data communications products, defense and space electronics, computers, and other 

electronic components, modules, and systems for automotive, industrial, transportation, navigation, 

communication, energy systems, consumer, and lighting markets. 


Motorola North American Company Profiles 

1-236 

Land Mobile 

13% 

Messaging, 

Information, 

and Media 

13% 

Other 

11% 

Semiconductor 

26% 

General Systems 

37% 


Product Group/Sector 

In 1949, Motorola set up a solid-state research laboratory in Phoenix, Arizona, and then established its 

semiconductor products sector in 1954. The company has since continued to be one of the world’s largest 

producers of semiconductors. It offers one of the industry's broadest portfolios of semiconductor products, 

including high-performance microprocessors and microcontrollers, digital signal processors, memories, mixedsignal 

components, programmable logic devices, advanced CMOS ASICs, customizable standard products, RF 

and microwave devices, sensors, optoelectronics, and discretes. Applications for these products are primarily in 

the communications, computer, and industrial markets, but also in the automotive and consumer markets. 

Consumer 

10% 

Automotive 

15% 

Industrial 

17% 


34% 

Computing 

24% 


End-Use Market (est) 

Asia/Pacific 

18% 

Europe 

23% 

Japan 

8% 

Americas 

51% 



Motorola Semiconductor Products Sector (SPS) is organized into five product groups: 

Communications and Advanced Consumer Technology Group (based in Austin, Texas) 

Advanced Digital Consumer Division 

Wireless Division 

Imaging and Storage Division 

Wireline Division 

Communications, Power, and Signal Technologies Group (based in Phoenix, Arizona) 

RF Semiconductor Division 

Power Products Division 

Sensor Products Division 

Optoelectronic and Signal Products Division 



Logic and Analog Technologies Group (based in Phoenix, Arizona) 

Analog IC Division 

Logic IC Division 

Microcontroller Technologies Group (based in Austin, Texas) 

Advanced Microcontroller Division 

Motorola Segments Division 

CISC Automotive and Industrial Division 

Custom Microcontroller Solutions Division 

CISC Consumer, Communications, and Smartcard Division 

Microprocessor and Memory Technologies Group (based in Austin, Texas) 

RISC Microprocessor Division 

Dynamic Memory Products Division 

Fast Static RAM Division 

It is estimated that Motorola SPS sells approximately 20 percent of its semiconductor output to other Motorola 

groups and sectors. 

Management 

Motorola, Inc. 

Gary L. Tooker Chairman 

Christopher B. Galvin Chief Executive Officer 

Robert L. Growney President and Chief Operating Officer 

Carl F. Koenemann Executive Vice President and Chief Financial Officer 

Motorola Semiconductor Products Sector 

Hector Ruiz President and General Manager 

Bertrand Cambou Senior Vice President and Director, Technology 

Larry L. Gartin Senior Vice President and Director, Finance 

Gary M. Johnson Senior Vice President and GM, Service, Panning, and Logistics 

Paul J. Shimp Senior Vice President and Director, Quality and Support Operations 

Fred Shlapak Senior Vice President and GM, Communications and Advanced 

Consumer Technologies Group 

C.D. Tam Senior Vice President and GM, Microcontroller Technologies Group 

Barry Waite Senior Vice President and GM, Microprocessor and Memory 

Technologies Group 

Pete Bingham Vice President and GM, Wireline IC Division 

Jim George Vice President and GM, Imaging and Storage Division 

Steve Hanson Vice President and GM, European Semiconductor Group 

Bill Seiferth Vice President and GM, Communications, Power, and Signal 

Technologies Group 

George Turner Vice President and GM, Logic and Analog Technologies Group 

Peter Gill Vice President and Director, Manufacturing Technology 

Brian Hilton Vice President and Director, World Marketing 



L.J. Reed Vice President and Director, Application Specific IC Division 

Bud Broeker Corporate Vice President and GM, Dynamic Memory Products Division 

Carlos Genardini Corporate Vice President and GM, Asia-Pacific Semiconductor Group 

Thomas Gunter Corporate Vice President and GM, RISC Microprocessor Division 

Greg White Corporate Vice President and GM, Custom Microcontroller Solutions Division 

Brian Wilkie Corporate Vice President and GM, Advanced Microcontroller Division 


1-238 


✔ DRAM ✔ Amplifier 

✔ SRAM ✔ Interface 

✔ Flash Memory ✔ Consumer/Automotive 







✔ Gate Array ✔ General Purpose Logic 

Standard Cell ✔ Gate Array/Standard Cell 

✔ Field Programmable Logic Field Programmable Logic 

✔ Other Special Purpose Logic Other Special Purpose Logic 


✔ MPU OTHER 

MPU/MCU/MPR 




MOS Memory 

10% 

Analog 

13% 

Digital Bipolar 

7% 

MOS Logic 

15% 

Discrete/Opto 

19% 

MOS Micro 

36% 


Device Type 



Provided below are details concerning Motorola’s semiconductor products. 

Analog ICs 

Motorola offers an extensive line of linear ICs, including amplifiers and comparators, power supply circuits, power 

and motor control devices, voltage references, data converters, interface circuits, communications circuits, 

consumer electronics ICs, automotive ICs, and other special purpose linear ICs like RF circuits. These devices are 

manufactured using bipolar or MOS technology. In early 1997, the company introduced a 1.0V rail-to-rail dual op 

amp. 

Application-Specific ICs (ASICs) 

Motorola’s ASIC products include CMOS, bipolar, and BiCMOS gate arrays and FPGAs. Its most advanced digital 

gate arrays (M5C Series) are based on three-layer-metal 0.45μm (Leff) CMOS process technology, which allows for 

up to 557,000 available gates and 556 I/Os. 

The company’s programmable logic products include its Motorola Programmable Arrays (MPAs), which are SRAMbased 

fine-grain FPGAs. Based on technology from U.K.-based Pilkington Microelectronics, which Motorola 

acquired in March 1997, the MPA devices are built using a 0.6μm triple-level-metal CMOS process and are 

available with gate densities ranging from 8,000 to 22,000 gates. Motorola and Pilkington have had a working 

relationship since 1992 (see Key Agreements). 

Customizable Standard Products (CSPs) 

The company launched its Customizable Standard Product (CSP) program in June 1995, following two years of 

development. Motorola currently offers CSPs for asynchronous transfer mode (ATM) local and wide area network 

applications in its MC92000 Series. 

Discretes, Optoelectronics, and Sensors 

These products include a variety of bipolar and MOS transistors, diodes, RF and microwave devices, thyristors, 

optoelectronics, pressure and temperature sensors, fiber optic devices, and power modules. 

Logic ICs 

From the beginning, Motorola has been a leader in the market for digital logic devices. Its product line includes a 

broad range of bipolar MECL (Motorola emitter-coupled logic), MECL10K, MECL10KH, MECL III, ECLinPS (ECL in 

picoseconds), ECLinPS Lite, low-power TTL, and fast TTL logic IC families, as well as CMOS high-speed, lowvoltage, 

and metal-gate logic IC families. 

Memory ICs 

Motorola manufactures and markets dynamic and fast static RAMs, including processor-specific SRAMs, 

synchronous SRAMs, and BurstRAM devices. Its fast SRAMs are based on 0.8μm to 0.4μm BiCMOS and highperformance 

CMOS technologies with access times as low as 4.5ns and operating frequencies greater than 

200MHz. 

The company’s DRAMs include 4M and 16M parts designed using 0.6μm and 0.5μm high-performance CMOS 

technologies. 64M DRAMs will be available in late 1997. 



In late 1996, Motorola added flash memory products to its portfolio through an alliance with Mitsubishi (see Key 

Agreements). The first MobileFlash product to be offered by Motorola was an 8M 3.3V-only boot-block DINOR 

flash memory device for portable and handheld equipment applications. 

Microcontrollers and Digital Signal Processors 

Motorola offers one of the most comprehensive selections of high-performance single-chip microcontrollers, 

ranging from industry-standard 8-bit controllers to state-of-the-art 16-bit and 32-bit modular controllers. 

The company’s 68HC05 and 68HC08 families of 8-bit MCUs are part of the Motorola Customer Specific IC (CSIC) 

program, which is targeted for high-volume projects that require the cost-efficiency of standard devices, but have 

requirements that cannot be met by “off-the-shelf” components. 

Motorola’s 16-bit MCUs include the 68HC11 controller family and the 68HC16 modular controller family. Its 32-bit 

MCUs include the 6833x controller family and the PowerPC-based MPC5xx controller family. 

Motorola’s digital signal processor products include the 56100 and 56800 families of 16-bit general-purpose 

DSPs, the 56000, 56300, and 56800 families of 24-bit general-purpose DSPs, and the 96002 family of 32-bit 

general-purpose floating-point DSPs. The company is working to regain a dominant position in the merchant 

digital signal processor market by developing new DSPs for the personal and wireless communications 

applications. 

Microprocessors and Embedded Processors 

Motorola manufactures and markets high-performance microprocessors for computer applications and embedded 

processors for a variety of applications, including communications, imaging, office peripherals, multimedia 

systems, games, and industrial controls. 

The PowerPC RISC microprocessor family has replaced the 680x0 family of CISC MPUs as Motorola’s mainstream 

processors for computer applications. However, the 680x0 MPUs still have a strong presence in the market for 

embedded processors. 

• PowerPC 601 Microprocessor—The first member of the PowerPC family, the 2.8-million-transistor 32-bit 601 is 

designed for application in desktop computers. The newest 100MHz version (601v) is based on a 0.5μm 

(0.25μm L eff) CMOS process. 

• PowerPC 602 Microprocessor—The 1-million-transistor 32-bit 602 is intended for use in portable and small 

form factor equipment, such as PDAs. 

• PowerPC 603/603e Microprocessors—The 32-bit 603 is a 1.6-million-transistor high-performance RISC MPU 

with integrated power management features for the notebook and energy-sensitive desktop PC markets. In 

4Q96, Motorola (and its partner IBM) introduced 225MHz and 240MHz versions of the 603e, and set a goal of 

reaching 300MHz by the end of 1997. 

• PowerPC 604/604e Microprocessors—The 32-bit 604 and 604e processors are targeted at mainstream 

desktop PC and server applications. The 604e is expected to surpass its current 200MHz clock rate to 

eventually exceed 300MHz. 

1-240 



• PowerPC 620 Microprocessor—The 620 is the first 64-bit implementation of the PowerPC RISC architecture. It 

is intended for use in server and high-end workstation computers. The 133MHz 620 is based on a four-levelmetal 

0.5μm CMOS process and has about 7 million transistors. 

• PowerPC G3 Series—The new G3 Series are the initial products in a line of next-generation PowerPCs. Based 

on enhanced 603, 604, and 620 processor cores, the G3 processors are expected to deliver about twice the 

performance of the earlier PowerPC chips. Initially the G3 PowerPCs will be built using a 0.35μm CMOS 

process and will move, during 1997, to a 0.25μm process, giving the processors on-chip speed of 300MHz to 

400MHz. The G4 Series, expected to be in systems in 1999, will feature a completely new microarchitecture 

for the PowerPC and will take the product line to the 0.18μm process level. 

Motorola’s embedded processor products include: the 680x0 family, the ColdFire (MCF51xx and MCF52xx) 

processors, the Embedded PowerPC (MPC8xx and MPC6xx) processors, the FlexCore products, the 683xx 

family of integrated microprocessors, data communications controllers and peripherals, and physical interface 

products. Motorola is attempting to drive the ColdFire line into emerging applications areas such as DVD and CD- 

ROM players, cable modems, HDTV, and digital cameras. 

Mixed-Signal ICs 

The company’s mixed-signal ICs are targeted at applications including wireless and wireline communications, 

multimedia systems, automotive equipment, and control networks. 


Motorola has several fab facility projects underway, including the construction of a new 200mm wafer fab (MOS 17) 

in Tianjin, China, where CMOS and BiCMOS ICs will be produced. Other projects include the construction of a 

new fab facility (MOS 19) near Richmond, Virginia, for the production of PowerPC chips; and an expansion of the 

Nippon Motorola fab in Aizu, Japan. In addition, Motorola and Siemens are building a jointly owned DRAM plant in 

Richmond, Virginia. Construction of the joint venture, which goes by the name White Oak Semiconductor, began 

in 1996, with initial production of 64M parts scheduled to start in 1998. 

Motorola, Ltd. Motorola, Inc. 

Colvilles Road 3501 Ed Bluestein Boulevard 

Kelvin Estate, East Kilbride Austin, Texas 78721 

Glasgow G75 0TG, Scotland Telephone: (512) 928-6000 

United Kingdom MOS 2 

Telephone: (44) (35) 52-39101 Cleanroom size: 30,000 square feet 

MOS 1 Capacity (wafers/week): 10,000 



Wafer size: 150mm Products: Logic ICs, ASICs 

Processes: CMOS, HMOS Feature sizes: 1.2μm-2.0μm 

Products: MCUs, linear and logic ICs 




Motorola, Inc. Motorola, Inc. 

3501 Ed Bluestein Boulevard 5005 East McDowell Road 

Austin, Texas 78721 Phoenix, Arizona 85008 


MOS 3 MOS 4 



Wafer size: 100mm Process: MOS 

Processes: CMOS, MOS Products: Power MOS discretes 

Products: MCUs Feature sizes: 0.5μm-5.0μm 



2200 West Broadway Road 2200 West Broadway Road 

Mesa, Arizona 85202 Mesa, Arizona 85202 


MOS 5 MOS 6 




Processes: CMOS, MOS, bipolar Processes: CMOS, BiCMOS, 

Products: MCUs, logic, linear, and digital ICs Products: SRAMs, ASICs 

Feature size: 1.0μm Feature sizes: 0.8μm-1.2μm 

Nippon Motorola, Ltd. Motorola, Inc. 

Aizu Facility 3501 Ed Bluestein Boulevard 

1 Oyagi, Kofune Austin, Texas 78721 

Shiokawa-machi, Yama-gun Telephone: (512) 928-6000 

Fukushima-ken 969-35, Japan MOS 8 

Telephone: (81) (241) 27-2231 Cleanroom size: 100,000 square feet 




Wafer size: 150mm Products: MCUs, MPUs, SRAMs, DSPs 

Process: CMOS Feature sizes: 0.7μm-1.5μm 

Products: MCUs, logic and smart power ICs 


(This fab is being upgraded to produce logic ICs 

with 0.5μm to 0.65μm feature sizes on 200mm 

wafers. Operations are planned to start in 1999.) 

1-242 



Motorola, Ltd. Motorola, Inc. 

Colvilles Road 8105 Irvine Center Drive 

Kelvin Estate, East Kilbride Irvine, California 92718 

Glasgow G75 0TG, Scotland, UK Telephone: (714) 932-5000 

Telephone: (44) (35) 52-39101 MOS 10 




Wafer size: 150mm Products: DSPs, linear ICs 

Processes: CMOS, BiCMOS Feature size: 0.65μm 

Products: MPUs, MCUs, DSPs, SRAMs (Acquired from Western Digital) 

Feature sizes: 0.5μm, 0.65μm, 0.8μm, 1.0μm 


6501 William Canon Drive West 1300 North Alma School Road 

Austin, Texas 78735-8598 Chandler, Arizona 85224 


MOS 11 MOS 12 





Products: MCUs, MPUs, SRAMs, DSPs Products: MCUs, DSPs, linear ICs 



3501 Ed Bluestein Boulevard 3026 Cornwallis Road 

Austin, Texas 78721 Research Triangle Park, North Carolina 27709 


MOS 13 MOS 15 





Products: MPUs, SRAMs Products: MCUs, logic ICs 

Feature sizes: 0.35μm-0.5μm (0.25μm capable) Feature sizes: 0.8μm, 1.0μm 

(Acquired from Harris Semiconductor) 



Motorola, Ltd. Motorola 

Headrig Road XiQing, Tianjin, China 

South Queensferry MOS 17 

West Lothian EH 30 9SH, Scotland Capacity (wafers/week): 3,500 

MOS 16 Wafer size: 200mm 

Capacity (wafers/week): 5,000 Processes: CMOS, BiCMOS 

Wafer size: 150mm Products: MCUs 

Processes: BiCMOS, CMOS Feature sizes: 0.5μm-1.0μm 

Products: MPUs, logic ICs (Scheduled to begin production in 1998) 


(Acquired from Digital Equipment Corporation) 


West Creek, Virginia Development 

MOS 19 5005 East McDowell Road 

Wafer size: 200mm Phoenix, Arizona 85008 

Process: CMOS Center for Integrated Systems (formerly COM 1) 

Products: MPUs Wafer size: 150mm 

Feature sizes: 0.35μm, 0.25μm Process: CMOS 

(Currently on hold. Construction may start in Products: Communications ICs, MCUs, DSPs 

late 1997 or early 1998.) Feature size: 0.65μm 


2200 West Broadway Road 2200 West Broadway Road 

Mesa, Arizona 85202 Mesa, Arizona 85202 


BP 1 BP 2 




Processes: Bipolar, BiCMOS Processes: Bipolar, BiCMOS 

Products: Linear and smart power ICs Products: Linear ICs, ASICs 


Motorola, Inc. Motorola Semiconducteurs 

2200 West Broadway Road 126 Avenue du General Eisenhower 

Mesa, Arizona 85202 Le Mirail BP 1029 

Telephone: (602) 962-2011 31023 Toulouse Cedex, France 

BP 3 Telephone: (33) (5) 61-41-11-88 

Cleanroom size: 20,000 square feet BP 4/Bipolar Power Fab 



Processes: Bipolar, BiCMOS` Wafer size: 100mm (moving to 150mm in 1995) 

Products: ASICs, logic and linear ICs Processes: Bipolar, MOS 

Feature size: 1.0μm Products: Linear, smart power, RF ICs, discretes/opto 


1-244 



Motorola, Inc. Tohoku Semiconductor Corporation 

5005 East McDowell Road Izumi-ku, Sendai-shi, 

Phoenix, Arizona 85008 Miyagi Prefecture, Japan 


RF Power and Rectifier Fabs Wafer sizes: 150mm, 200mm 

Cleanroom size: 80,000 square feet Process: CMOS 

Capacity (wafers/week): 18,000 Products: DRAMs, SRAMs, MPUs, MCUs, MPRs 

Wafer sizes: 100mm, 125mm Feature sizes: 0.5μm-0.8μm 

Processes: Bipolar, GaAs (Joint venture with Toshiba.) 

Products: Discretes, RF MMICs, optoelectronics 


White Oak Semiconductor 

White Oak Technology Park 

Richmond, Virginia 



Process: CMOS 



(Joint venture with Siemens. Currently under 

construction. Operations are planned to begin 

in the spring of 1998.) 


• Motorola licensed the SRAM-based FPGA technology of Pilkington Microelectronics Ltd. (PMeL) of the United 

Kingdom in 1992. Motorola's first FPGAs were announced in 1995. In late 1995, Motorola also licensed 

Pilkington’s field programmable analog array (FPAA) technology. In March 1997, Motorola acquired the PMeL 

business from Pilkington plc., a world leader in glass products. PMeL was absorbed into Motorola’s 

Programmable Logic division and was renamed the Motorola Programmable Technology Center (MPTC). 




• Motorola, Toshiba, and Fairchild Semiconductor announced in early 1997 they would jointly develop nextgeneration 

high-speed CMOS logic ICs. The three companies will work to develop 2.5V and 3.3V devices with 

a propagation delay time of 2ns. 



• Motorola and Mitsubishi announced a couple of joint cooperation agreements in 1996. In October, Motorola 

agreed to exchange its 32-bit ColdFire RISC and 68EC000 embedded MPU technologies for Mitsubishi’s 

M32R microprocessor with embedded DRAM technology. In December, the two companies agreed to jointly 

market MobileFlash memory devices based on the DINOR flash technology developed by Mitsubishi. 

Motorola and Mitsubishi have said that their alliance in flash memories may be expanded in the future to include 

a joint venture fab dedicated to the manufacture of flash chips. 

• In mid-1996, Motorola signed a nonexclusive agreement with Hewlett-Packard’s IC Business Division to license 

Motorola’s 68000, 68020, and 68030 microcontrollers, as well as the ColdFire RISC microprocessor cores. 

• In early 1996, Motorola and IC Works entered into an agreement under which IC Works became an authorized 

second source of selected Motorola CMOS and BiCMOS mixed-signal timing circuits. Moreover, the two 

companies will work together to broaden their existing lines with complementary timing-circuit devices. 

• International Rectifier signed a cross-licensing and alternate-source agreement with Motorola in early 1995 

covering power ICs and power discretes. 

• Motorola and IBM are jointly developing, producing, and marketing the PowerPC family of RISC 

microprocessors (Apple Computer also plays a part in the design of the MPUs). 

• Motorola and Cherry Semiconductor have an agreement to develop mixed-signal ASICs for the automotive 

market. 

• Motorola has an RFID product agreement with Matsushita and ferroelectric memory pioneer Symetrix Corp. 

Motorola's subsidiary Indala Corp. agreed to jointly produce a family of read/write RFID chips with Matsushita 

incorporating Symetrix's ferroelectric memory technology (Matsushita has an equity stake in Symetrix and has 

the right to relicense its technology). 

• Motorola is working with IBM, Lockheed Martin Federal Systems, and Lucent Technologies to establish a 

manufacturing infrastructure for X-ray lithography. The team hopes to have a manufacturing capability by the 

end of 1997. 

1-246 


North American Company Profiles National Semiconductor 


NATIONAL SEMICONDUCTOR 

National Semiconductor Corporation 

2900 Semiconductor Drive 

P.O. Box 58090 


Telephone: (408) 721-5000 

Fax: (408) 739-9803 

Web Site: www.national.com 


Japan: National Semiconductor Ltd. • Tokyo, Japan 

Telephone: (81) (43) 299-2308 • Fax: (81) (43) 299-2408 

Europe: National Semiconductor GmbH • Fürstenfeldbruck, Germany 

Telephone: (49) (180) 532-7832 • Fax: (49) (180) 530-8586 

Asia-Pacific: National Semiconductor HK Ltd. • Kowloon, Hong Kong 

Telephone: (852) 2737-1600 • Fax: (852) 2736-9960 

Financial History ($M), Fiscal Year Ends May 31 

1992 1993 1994 1995 1996 

Sales 1,718 2,014 2,295 2,374 2,623 

Net Income (120) 130 264 264 185 



Employees 27,200 23,400 22,300 22,400 20,300 


National Semiconductor was established in Danbury, Connecticut, as a manufacturer of transistors in 1959. In 

1967, the company moved to Santa Clara, California, where it began producing proprietary ICs. 

National has since remained a leading supplier of analog and mixed-signal semiconductor products. The company 

focuses on four strategic markets: communications, personal systems, industrial, and consumer. System 

applications within these four markets include computers and computer peripherals, cellular phones, fax 

machines, local and wide area networks, telecommunications equipment, automotive electronics, industrial 

controls, and military and aerospace products. National is also a leader in power management solutions. 


National Semiconductor North American Company Profiles 

At the beginning of fiscal 1997, National reorganized into four operating divisions: the Analog Division, the 

Communications and Consumer Division, the Personal Systems Division, and the Fairchild Semiconductor 

Division. In March 1997, as part of its effort to focus on systems solutions, National divested itself of its Fairchild 

Semiconductor business, which consisted of National’s family logic, non-volatile memory, and discrete 

semiconductor product lines. The high-volume, manufacturing intensive business model of Fairchild differs 

significantly from National’s business of providing highly integrated system chip solutions for specific applications. 

For fiscal 1996, the Fairchild product lines represented approximately $600 million of the consolidated revenues 

of the two companies. 

Non-Volatile Memory 

6% 

CMOS Logic 

7% 

Bipolar Logic 

7% 

Discretes 

7% 

Management 

1-248 

Digital and Other 

13% 

Analog and 

Mixed-Signal 

60% 


Europe 

24% 

Japan 

10% 

Southeast Asia 

24% 

Americas 

42% 


Brian Halla President and Chief Executive Officer 

Kamal Aggarwal Executive Vice President, Central Technology and Manufacturing 

Patrick J. Brockett Executive Vice President, International Sales and Marketing 

Donald Macleod Executive Vice President, Finance, and Chief Financial Officer 

Michael Bereziuk Senior Vice President and GM, Personal Systems Division 

John M. Clark III Senior Vice President, General Counsel, and Secretary 

Douglas M. McBurnie Senior Vice President and GM, Communications and Consumer Division 

Gobi Padmanabhan Senior Vice President, Process Technology 

Edgar R. Parker Senior Vice President, Quality and Reliability 

Robert M. Penn Senior Vice President and GM, Analog Division 

Richard L. Sanquini Senior Vice President, Strategic Business and Technology 

Roland Anderson Vice President, European Division 

Michael D. Burger Vice President and GM, Southeast Asia Division 

Gordon C. Chilton Vice President, Asia Pacific Operations 

David S. Dahmen Vice President and Treasurer 

Rich Freeman Vice President, Worldwide Wafer Fab Operations 

Tatsuo Ishihara Vice President, Japan Division 

Keith M. Kolerus Vice President, Americas Division 

Mark Levi Vice President, Corporate Marketing and Communications 

Robert B. Mahoney Vice President and Controller 

Prem Nath Vice President and President, Mediamatics Inc. 

Richard A. Wilson Vice President, Human Resources 











Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom) 


General Purpose Logic Bipolar Memory 

✔ Gate Array General Purpose Logic 

✔ Standard Cell Gate Array/Standard Cell 

Field Programmable Logic Field Programmable Logic 

Other Special Purpose Logic Other Special Purpose Logic 


✔ MPU OTHER 

MPU/MCU/MPR 

✔ MCU ✔ Full Custom IC 

✔ MPR Discrete 


Analog Products 

Analog products and technology has been one of National’s core competencies since its inception. The company 

continues to be a leader in the analog IC industry. Its analog products include operational amplifiers and buffers, 

power management circuits, data acquisition circuits, voltage regulators and references, motor control ICs, audio 

ICs, custom linear ASICs (CLASICs), and other general and special purpose linear devices. 

Comlinear Corporation, acquired by National in 1995, operates as a separate business unit within the Analog 

Division. Fort Collins, Colorado-based Comlinear is a supplier of high-frequency amplifiers, current-feedback 

devices, analog-to-digital converters, and other analog signal processing circuits. 

Communications Products 

National is one of the world’s leading suppliers of LAN Ethernet and Fast Ethernet controller chipsets. The 

company also offers FDDI circuits. 

For telecommunications applications, National offers ATM, ISDN, and Sonet/SDH families of networking devices, 

as well as single-chip Digital European Cordless Telephone (DECT) radio transceivers. In 1996, National’s 

Comlinear business unit released a new family of serial digital video chipsets for transmitting high-speed video 

signals through cable networks. 



For wireless communications applications, National offers its line of PLLatinum RF chips. In 1996, National 

introduced its Fast IR product family of wireless data communications chips using fast infrared technology. 

Personal Systems Products 

National’s personal systems products consist of peripheral function devices that work in tandem with the host 

microprocessor in desktop and notebook computer systems. These products include its family of Super I/O 

products that consolidate many dependent functions on the motherboard, high-performance disk drive ICs, bus 

interface circuits (including USB types), data transmission chips, display drivers, clocks and clock support circuits, 

DRAM management ICs, and UARTs. National added low-power system logic ICs to its product portfolio in 1996 

when it acquired PicoPower Technology from Cirrus Logic. 

Consumer Products 

National’s IC products for consumer applications include audio control circuits, audio noise reduction devices, and 

audio amplifiers. The company’s Boomer series of single-chip CMOS audio amplifiers is used in wireless 

telephones and multimedia computers, as well as CD players, video players, and VCRs. 

In March 1997, National acquired Mediamatics Inc., an MPEG audio/video decoder firm, for approximately $100 

million. Mediamatics is operating as a wholly owned subsidiary based in Fremont, California. The two companies 

are working to incorporate National’s tuner, demodulator, A/D and D/A conversion, and other technologies with 

Mediamatics’ software and hardware MPEG audio/video and Dolby AC-3 audio products to create new products, or 

cores, for the consumer electronics market. 

Also in early 1997, National sold to ISD its CompactSpeech line of RISC-based speech processors for voice 

applications in products such as answering machines and cordless phones. 

Embedded Technologies Products 

This product line includes 4-bit, 8-bit (COP8 Family), and 16-bit microcontrollers and 16-bit and 32-bit 

microprocessors (including its NS486 embedded processor). National is also a licensee of the Advanced RISC 

Machines ARM 32-bit processor core. 

Military and Aerospace Products 

National is the second largest supplier of military/aerospace-related semiconductors. It is driving advances in 

avionics, telecommunications, cryptography, navigation systems, and displays. 

National Semiconductor's primary process technology, M 2 CMOS, is built around a core double-level-metal CMOS 

process. To this core, modules are added to provide a third level of metallization for analog, EEPROM, and 

BiCMOS applications. Optimized for analog and mixed-signal applications, the M 2 CMOS process is used by the 

majority of the communications and computing group product lines. A wide range of design rules (down to 

0.55μm) are supported by the M 2 CMOS process. Plans are to further shrink the process to 0.35μm by the end of 

1997. 

1-250 



In addition to its family of M 2 CMOS processes, National also utilizes a high-performance core VLSI bipolar process 

named ASPECT, which stands for Advanced Poly Emitter-Coupled Technology. ASPECT and its BiCMOS 

module, ABiC, are used for high-performance gate arrays, customer-owned designs, and wireless 

communications. ASPECT has been scaled from 2.0μm to 0.8μm and will be replaced with BiCMOS at 0.5μm and 

beyond. The current versions of ASPECT and ABiC offer up to four-layers of metallization in addition to a level 

zero local interconnect. 

A variety of analog processes are used to produce a broad line of linear products. Notable process technologies 

are VIP, a high speed complementary bipolar process for operational amplifiers, LB, a medium voltage automotive 

market oriented process, LMDMOS, a high power mixed-signal process, and LFAST and LCMOS, which are used 

for CLASICs. 


National is installing a 200mm wafer line at its fab in Maine for the fabrication of ICs with 0.35μm geometries. The 

new $830 million facility will include 40,000 square feet of Class 1 cleanroom and is scheduled to be ready for 

production in 4Q97. 

National Semiconductor Corp. National Semiconductor Corp. 

2900 Semiconductor Drive 2900 Semiconductor Drive 

Santa Clara, California 95012 Santa Clara, California 95012 





Products: Linear ICs, ASICs, R&D Products: R&D 


National Semiconductor Corp. National Semiconductor Corp. 

1111 West Bardin Road 1111 West Bardin Road 

Arlington, Texas 76017 Arlington, Texas 76017 


Fab 1 Fab 2 





Products: Logic ICs, EEPROMs, EPROMs, Products: Logic, linear, and mixed-signal ICs, ASICs 

microcomponents, ASICs Feature sizes: 0.35μm-0.65μm 




National Semiconductor Corp. National Semiconductor (UK) Ltd. 

333 Western Avenue Earnhill Road, Larkfield Industrial Estate 

South Portland, Maine 04106 Greenock PA16 OEQ, Scotland, UK 

Telephone: (207) 775-8100 Telephone: (44) (1475) 633733 

Cleanroom size: 40,000 square feet Fab 1 

Wafer size: 200mm Cleanroom size: 40,300 square feet 

Processes: CMOS, BiCMOS Capacity (wafers/week): 10,000 

Products: Linear and mixed-signal ICs Wafer size: 100mm 

Feature size: 0.35μm Process: Bipolar 

(Operations to begin in 4Q97) Products: Logic and linear ICs 


National Semiconductor (UK) Ltd. National Semiconductor (UK) Ltd. 

Earnhill Road, Larkfield Industrial Estate Earnhill Road, Larkfield Industrial Estate 

Greenock PA16 OEQ, Scotland, UK Greenock PA16 OEQ, Scotland, UK 

Telephone: (44) (1475) 633733 Telephone: (44) (1475) 633733 

Fab 2 Fab 3 




Processes: Bipolar, CMOS Processes: CMOS, BiCMOS 

Products: Linear ICs Products: Linear and logic ICs, MCUs, ASICs 


Some of National’s IC products continue to be produced at the fabs now owned by Fairchild Semiconductor and 

vice versa. 

National’s semiconductor assembly and test plants are located in Toa Payoh, Singapore, and Malacca, Malaysia. 


• National and Fairchild remain closely linked through a long-term agreement to make the transition as smooth as 

possible. The two companies also share and swap fab capacity. 

• In early 1996, National joined up with the Belgian research firm IMEC to develop process technology for the 

0.25μm and 0.18μm generations. 

• National signed a three-year agreement in mid-1995 with Tower Semiconductor Ltd. under which Tower was to 

increase its wafer production commitment to National. Tower’s fab in Israel was originally owned by National, 

which retains a 3.5 percent interest in the foundry. 

• In November 1994, National formed a long-term alliance with Synaptics Inc. to jointly develop computer controls 

based on human senses (sight, touch, and sound). 

1-252 



• National formed an alliance with 8x8 Inc. (formerly Integrated Information Technology) in 1993. The partners are 

developing embedded processor, video, and data compression technologies. 

• National entered a resale and joint-development agreement with NEC for Ethernet ICs in 1993. 

• National entered a cooperative relationship with Matsushita, including joint development and manufacturing 

(1992). 

• National signed a 10-year semiconductor patent cross-licensing agreement with Hitachi in 1991. 


Oak Technology North American Company Profiles 


1-254 

OAK TECHNOLOGY 

Oak Technology Inc. 

139 Kifer Court 


Telephone: (408) 737-0888 

Fax: (408) 737-3838 


Japan: Oak Technology, K.K. • Musashino-shi, Tokyo, Japan 

Telephone: (81) (422) 56-3761 

Asia-Pacific: Oak Technology, Taiwan • Taipei, Taiwan 

Telephone: (886) (2) 784-9123 


1992 1993 1994 1995 1996 

Sales 43 30 46 111 248 

Net Income (3) (5) 4 21 37 

R&D Expenditures 5 6 15 31 



Oak Technology Inc. designs, develops, and markets high-performance integrated semiconductors and related 

software solutions for OEMs worldwide who serve the multimedia PC, digital video consumer electronics, and 

digital office equipment markets. The company targets these markets through five core technologies: optical 

storage, video/graphics (2D and 3D), MPEG imaging, audio/communications, and digital imaging. 

Founded in 1987, Oak’s initial product offerings were PC graphics chips. In 1988, the company expanded into 

Super VGA graphics controllers and grew to become a unit volume leader in the SVGA market segment between 

1989 and 1991. Furthermore, Oak developed the first commercially available CD-ROM controller in 1990 and 

pioneered the development of an IDE/ATAPI (integrated drive electronics/AT attachment packet interface) CD- 

ROM controller in 1993. With the IDE/ATAPI established as an interface standard for CD-ROM drives, Oak is one 

of the largest merchant suppliers of CD-ROM controllers. 


North American Company Profiles Oak Technology 

In October 1995, Oak Technology acquired Pixel Magic, a leader in image processing technology. Pixel Magic’s 

strengths in compression and image enhancement technology are expected to play a key role in the new 

generation of digital office equipment. 

Other 

9% 

CD-ROM Controllers 

91% 


Oak plans to continue designing and developing new CD-ROM controllers, while moving aggressively into new 

markets to diversify its business. Oak plans to continue development of optical storage technology to address the 

CD-R (Recordable), CD-RW (ReWritable), and DVD-ROM markets. Oak’s other product developments include 

MPEG video decoders, such as the company’s MPEG-2/Dolby Digital decoder for DVD players. 

Virtually all of Oak’s revenues in 1996 were from international sales, principally in Japan, Singapore, and Taiwan. 

Management 

David D. Tsang Chairman, President, and Chief Executive Officer 

Sidney Faulkner Vice President, Finance, and Chief Financial Officer 

Kenji Fujimoto Vice President, Oak Technology; General Manager, Oak Technology, K.K. 

Aydin Koc Vice President, Optical Storage Business Unit 

Abel Lo Vice President, Oak Technology; General Manager, Oak Technology, Taiwan 

Ben T. Taniguchi Vice President, Sales 

Mou Hsin Yang , Ph.D. Vice President, Operations 


Oak’s products include CD-ROM controllers, MPEG video decoders, video compression/expansion processors 

(VCEPs), 64-bit multimedia video/graphics accelerators, and 16-bit digital audio controllers. 

Recent product announcements include the OTI-975 CD-R/CD-RW controller for CD-R/CD-RW drives, the OTI- 

64217 Eon 64-bit DirectX accelerator for video/graphics applications, and an audio/communications accelerator 

called the OTI-611 TelAudio 3D. 


Oak Technology North American Company Profiles 


Oak Technology is a fabless IC supplier. The company's devices are produced by wafer foundry companies. 

In 1995, Oak Technology entered into several long-term agreements with TSMC and Chartered Semiconductor, 

securing additional wafer capacity through 2001. Also in 1995, the company entered into agreement with UMC to 

form, along with other investors, a separate Taiwanese company called United Integrated Circuits Corporation 

(UICC), for the manufacture of ICs. Oak agreed to invest approximately $60 million for a 10 percent equity position 

in UICC. UICC began manufacturing 200mm wafers in mid-1997. 

1-256 


North American Company Profiles OPTi 


OPTI 

OPTi Inc. 



Telephone: (408) 486-8000 

Fax: (408) 486-8001 

Web Site: www.opti.com 


Japan: OPTi Japan K.K. • Tokyo, Japan 

Telephone: (81) (3) 5454-0178 • Fax: (81) (3) 5454-0168 

Europe: OPTi Inc. • Oxon, United Kingdom 

Telephone: (44) (1869) 369161 

Asia-Pacific: OPTi Inc. • Taipei, Taiwan 

Telephone: (886) (2) 325-8520 • Fax: (886) (2) 325-6520 


1992 1993 1994 1995 1996 

Sales 98 85 134 164 119 

Net Income 9 9 15 11 (14) 




OPTi Inc. was spun out from Chips and Technologies in 1989 to focus on developing and supplying core logic 

chipsets to the personal computer industry. The company’s products are divided into three core areas within the 

PC industry: notebook products, desktop products, and multimedia products. In addition to its core logic 

chipsets, OPTi supplies peripheral and multimedia chipsets as well as custom ICs for audio/telephone, power 

management, graphics/video, and storage control applications. The company’s chipsets provide in one or a few 

semiconductor devices the core logic functions of a PC as well as the multimedia-related functions. 


OPTi North American Company Profiles 

OPTi’s core logic chipset sales shifted in 1996. In 1995, its core logic chipset sales were largely made up of 

desktop logic chipsets. However, due to Intel’s aggressive moves to gain marketshare in the desktop core logic 

market, OPTi shifted to notebook logic chipsets, which represented 59 percent of core logic chipset revenues in 

1996, up from 14 percent in 1995. 

Management 

1-258 

Audio/ 

Graphics Chips 

29% 

Core Logic Chipsets 

71% 



14% 

Europe/Other 

6% 

Far East 

80% 


Jerry Chang Chairman and Chief Executive Officer 

Stephen Dukker President 

David Zacarias Chief Financial Officer 

Patrick Ang Vice President, Multimedia Products 

Jun-Wei Chen Vice President, Foundry and Technology Services 

Richard D’Sa Vice President, North America and Europe Sales 

George Fang Vice President, Asia-Pacific Sales 

Steve Wu Vice President, Mobile Products 


OPTI’s product offering includes multimedia and peripheral chipsets, core logic chipsets, and audio controllers, as 

well as custom ICs. 

The initial member of its Viper family of Pentium-class chipsets was unveiled in 1994. The second member of the 

family, the Viper-N, is designed for Pentium PCI-based portable computers, and the third member, the Viper-M, is 

a multimedia-enhanced chipset for Pentium PCI-based desktop computers. In addition to the Pentium, the Viper 

products will support compatible AMD and Cyrix microprocessors. 

In the first part of 1997, OPTi introduced two 64-bit single-chip core logic devices, the Vendetta for Pentium 

desktop computers and the Firestar for Pentium notebook computers. The Vendetta is the first core logic product 

to incorporate SoundBlaster audio functionality for higher integration and lower cost solutions, and features 

auxiliary 66MHz PCI for support of Intel’s new accelerated graphics port architecture. Vendetta features an array of 

control and monitoring options and can be scaled to work in entry level to high-end workstations and servers. 

Firestar combines high performance features with space saving design capabilities and power management for 

mobile and embedded applications. 


North American Company Profiles OPTi 

In addition to Vendetta and Firestar, OPTi introduced the Discovery chipset for Pentium Pro-based desktop 

systems. The chipset is a 64-bit core logic product that features an integrated PCI and unified memory 

architecture. 

In 1993, OPTi began to broaden its product line to include peripheral chips. In the fourth quarter of that year, the 

company acquired MediaChips Inc., a designer of audio chips. Through the MediaChips acquisition, OPTi began 

supplying 16-bit audio controller ICs featuring an on-chip sigma-delta audio codec/mixer. That move was followed 

by an entrance into the graphics chip market with an LCD controller for notebook computers in early 1994. Its 

other peripheral ICs include IDE disk drive controllers and bus-interface bridge chips. 

The process technologies used by OPTi in the design and manufacture of its semiconductors include 0.6μm and 

0.8μm CMOS. 


Fabless OPTi has three principal foundry partners, IBM Microelectronics, Ricoh, and UMC. The company also 

uses, to a certain extent, Chartered Semiconductor, TSMC, Samsung, Winbond, and Toshiba for the fabrication of 

its wafers. 

In 1995, OPTi signed a manufacturing and foundry venture agreement with United Microelectronics Corporation 

(UMC). Under the agreement, OPTi agreed to make a $30 million equity investment in UMC’s joint venture IC 

foundry, called United Integrated Circuits Corporation (UICC), located in Taiwan. The fab began producing 200mm 

wafers in mid-1997. 


• In July 1996, OPTi licensed its super VGA LCD controller to NEC Electronics who planned to integrate the 

device into embedded applications such as handheld terminals and PDAs. 


Orbit Semiconductor North American Company Profiles 


1-260 

ORBIT SEMICONDUCTOR 

Orbit Semiconductor, Inc. 

116 Java Drive 


Telephone: (408) 744-1800 

Fax: (408) 747-1263 

Web Site: www.orbitsemi.com 


Europe: Orbit Europe • Surrey, England 

Telephone: (44) (1932) 346288 • Fax: (44) (1932) 347110 

Asia-Pacific: DII Group • Singapore 

Telephone: (65) 298-0866 • Fax: (65) 298-3689 


1992 1993 1994 1995 1996 

Corporate (DII Group) 

Sales 258 397 459 

Net Income 9 23 10 

Semiconductor 

Sales 25 34 50 62 64 

Employees (Orbit) 120 154 184 278 400 


Orbit Semiconductor specializes in semiconductor design, manufacturing, and engineering support services that 

allow system designers to manage application-specific integrated circuit (ASIC) development, production, 

scheduling, and inventory control. In August 1996, Orbit Semiconductor was acquired by DII Group, Inc., who 

serves as a global network of companies that provide design, manufacturing, product development, and support 

services to the electronics industry. Orbit operates as a wholly-owned subsidiary of DII Group. 

Orbit's customers include companies that design various electronic systems and products for application in the 

medical, communications, consumer, aerospace and military, computers and peripherals, and other industries. 


North American Company Profiles Orbit Semiconductor 

Consumer 

Products 

6% 

PCs 

2% 

Military 

10% 

MPRs 

13% 

Other 

15% 

Medical 

24% 


16% 

Industrial 

14% 


End-Use Market 

Europe 

14% 

Asia-Pacific 

8% 


78% 



In October 1992, Orbit introduced its Encore! program that converts FPGAs and other IC designs into Orbit digital 

gate arrays for more cost-effective solutions or accelerated delivery. Orbit also offers a mixed-signal (analog/digital) 

design service that provides rapid development of custom mixed-signal ASICs. A shared wafer-processing 

program, Foresight, is provided for cost-effective prototyping of mixed-signal ASICs. In addition, Orbit offers 

contract manufacturing programs including hi-rel manufacturing, a low-cost prototyping service, and charge 

coupled device (CCD) fabrication. 

Management 

DII Group 

Ronald R. Budacz Chairman and Chief Executive Officer 

Carl R. Vertuca, Jr. Senior Vice President and Chief Financial Officer 

C.Y. Cheong Vice President and Managing Director, Asia-Pacific 

Orbit Semiconductor 

Gary P. Kennedy President and Chief Executive Officer, Orbit Semiconductor 

Steve Kam Executive Vice President, Technology and Chief Technology Officer 

Richard B. Kash Executive Vice President, Mixed-Signal Design 

Joseph K. Wai Executive Vice President, Chief Operating Officer, and Secretary 

Edward Rodriguez Group Vice President, Sales, Marketing, Engineering, and Customer Service 

Fernando A. Bettencourt Vice President, Operations 

Brian Gillings Vice President, Marketing 

George W. Lewicki Vice President, Software Engineering 

Betty Y. Newkirk Vice President, Foundry Business Unit and Customer Service 


Orbit's manufacturing services include several IC fabrication programs. The most popular program, Encore!, is a 

service that converts netlists for gate arrays or FPGAs into Orbit gate arrays with 270 to 37,000 usable gates. The 

resulting circuits are functionally equivalent, but lower in price. Another program, Foresight, supports multiproject, 

multi-technology runs and reduces NRE charges. Subscribers of Foresight's processes see lower costs 

because they share space on masks and wafers. 


Orbit Semiconductor North American Company Profiles 

Both Encore! and Foresight users have access to all of Orbit's processes. They include: 1.0μm and 1.2μm N-well 

and P-well CMOS processes with various options such as a second poly layer for capacitors and gates, NPN 

bipolar transistors with high or low collector resistances, classical EEPROM, imaging buried channel CCDs with an 

oxide nitride gate insulator to maintain low leakage on large arrays, and conventional N-channel and P-channel 

transistors to allow on-chip digital logic. 

Orbit offers additional programs based on its independent manufacturing capabilities. Its low-volume 

manufacturing programs include a "High Reliability Manufacturing Program" in support of medical companies and 

military contractors and a low-cost prototyping service, typically used by fabless semiconductor companies. 


In late 1996, Orbit purchased Paradigm’s 0.6μm, 150mm wafer production facility for $20 million. Orbit plans to 

move all existing property from its Sunnyvale facility to the San Jose fab by the end of 1997. 

Orbit also maintains a relationship with Chartered Semiconductor to supplement its wafer production capabilities. 

Orbit Semiconductor, Inc. Orbit Semiconductor, Inc. 

169 Java Drive 71 Vista Montana 

Sunnyvale, California 94089 San Jose, California 95134 


Capacity (wafers/week): 2,400 Capacity (wafer/week): 1,250 


Processes: CMOS, CCD Process: CMOS 

Products: ASICs, foundry services Products: ASICs, foundry services 

Feature sizes: 0.8μm, 1.0μm, 1.2μm, 2.0μm Feature sizes: 0.6μm, 0.8μm (0.5μm in future) 

(Will be closed by end of 1997) (Purchased from Paradigm in 1996) 

1-262 


North American Company Profiles Paradigm Technology 

PARADIGM TECHNOLOGY 

Paradigm Technology, Inc. 



Telephone: (408) 954-0500 

Fax: (408) 954-8913 

Web Site: www.prdm.com 



1992 * 1993 * 1994 * 1995 1996 

Sales 15 25 32 52 36 

Net Income (9) (18) (4) 5 (36) 


Employees 140 190 205 244 85 

*Data for fiscal years ended March 31. In 1994, the company changed its fiscal year ending date to the end of 

December. For the period April 1 to December 31, 1994, Paradigm’s sales totaled $26 million and net income was 

$11 million. 


Paradigm Technology designs and markets high-speed, high-density SRAMs and SRAM modules. Target 

markets for its SRAM products include telecommunications, networks, workstations, high-performance PCs, 

advanced modems, and complex military/aerospace systems. The company focuses on the high-performance, 

10ns and faster, segment of the SRAM industry. In 1996, 10ns and faster SRAMs accounted for approximately 36 

percent of the company’s sales. 

When established in 1987, Paradigm Technology initially focused on the development of high-speed 256K and 

1M SRAMs. In 1989, the company opened a wafer fabrication facility in San Jose, California. Costs associated 

with operating the fab and developing its technology, coupled with a less than optimal sales mix, drove the 

company to bankruptcy in 1994. The majority of Paradigm’s high-performance SRAM products were being sold 

into lower margin commodity markets. As part of the restructuring in 1994, Paradigm’s new management team 

adopted a strategy of focusing on emerging markets for higher performance asynchronous and synchronous 

SRAMs and specialty products. With the help of investments from Singapore-based AMCA Limited and National 

Semiconductor, the company emerged with record sales in the quarter ended September 1994. Unfortunately, 

the weakness in the SRAM market that began in late 1995 has had an adverse effect on Paradigm’s revenues. 


Paradigm Technology North American Company Profiles 

In 2Q96, Paradigm made a move to expand its product line beyond SRAMs by acquiring startup NewLogic 

Corporation, a developer of logic designs with large memory arrays. However, in early 1997, the NewLogic 

operation was closed down so that Paradigm could focus on its core SRAM products and markets. In November 

1996, Paradigm adopted a fabless supplier strategy by selling its fab to Orbit Semiconductor, thereby gaining 

greater flexibility and lowering it fixed costs. Orbit purchased Paradigm’s fab, which was newly converted from 

125mm to 150mm wafers, for $20 million. 

Approximately 25 percent of Paradigm’s sales in 1996 were attributable to sales outside the U.S., primarily in Asia 

and Europe. 

Management 

Michael Gulett President and Chief Executive Officer 

James H. Boswell Vice President, Sales and Marketing 

David G. Campbell Vice President, Finance and Chief Financial Officer 

Dennis McDonald Vice President, Human Resources 

Richard Morley Vice President, Operations 

Philip Siu Vice President, Engineering 


Paradigm Technology’s products include high-performance 256K, 1M, and 4M asynchronous SRAMs, 100MHz 

FIFO buffer-memory chips, high-speed processor-specific synchronous burst SRAMs, pipelined burst SRAMs, 

and high-speed cache RAM modules. Paradigm’s most recent product announcements include a 256K CMOS 

SRAM featuring an access time of 7ns. 

The proprietary technology of Paradigm involves a 0.6μm dual-well CMOS process consisting of two polysilicon 

layers and two metal layers, with three of the four layers fully configurable. The company has also developed a 

0.35μm process. 


In November 1996, Paradigm sold its wafer manufacturing facility to Orbit Semiconductor and therefore, now 

operates as a fabless IC supplier. Paradigm has established foundry agreements with Orbit and Atmel in the U.S., 

NKK Corporation in Japan, and UMC in Taiwan. 


• In November 1996, Paradigm sold its wafer fab facility to Orbit Semiconductor for $20 million. After the 

purchasing agreement was complete, the two companies entered into an agreement that calls for Paradigm to 

receive a supply of wafers from Orbit over a specified timeperiod. 

1-264 


North American Company Profiles Paradigm Technology 

• Paradigm and Atmel signed a five-year manufacturing, product, and technology agreement in May 1995. 

Terms of the agreement include guaranteed wafer supply from Atmel to Paradigm for a five year period. 

Moreover, Paradigm transferred its 0.6μm SRAM process to Atmel, and the two companies are jointly 

developing 0.5μm and 0.4μm technologies. Atmel also purchased a significant equity interest in Paradigm. 

• Paradigm has an extensive relationship with Japan's NKK Corporation. NKK holds a 10 percent stake in 

Paradigm as well as a technology and product license for 256K and 1M SRAMs and FIFOs. The two companies 

worked together to codevelop the latest 4M technology. Paradigm also has access to NKK's state-of-the-art 

200mm wafer fabrication facility in Japan. 

• Paradigm has a strategic alliance with National Semiconductor that provides National exclusive marketing and 

sales rights to Paradigm’s products for military and aerospace applications. National also made an equity 

investment in Paradigm. 


Peregrine Semiconductor North American Company Profiles 

Employees 25 


1-266 

PEREGRINE SEMICONDUCTOR 

Peregrine Semiconductor Corporation 

6175 Nancy Ridge Drive 


Telephone: (619) 455-0660 

Fax: (619) 455-0770 

Web Site: www.peregrine-semi.com 


Founded in 1990, Peregrine Semiconductor develops and markets high-performance commercial integrated 

circuits based on its patented UTSi (ultra thin silicon) process. Initially, Peregrine focused on developing the 

UTSi process and today, through joint research and product development, uses this proprietary technology to 

develop high-performance products targeted at specific applications such as wireless communications, portable 

computing, and high-speed memory. 

Management 

Ronald E. Reedy, Ph.D. Chairman, President, and Chief Executive Officer 

James S. Cable Vice President, Technology and Operations 

Bill Peavey Vice President and Chief Financial Officer 

David R. Staab Vice President, Engineering and Design 

Milt Mills Director ,Sales 

Jon Siann Director, Marketing 


Peregrine products include the Microcommunicator family of frequency synthesizers, which are capable of 

operating at frequencies as high as 2.5GHz. This family of communications products provides integrated solutions 

to wireless system design problems in applications such as satellites, cellular and cordless telephones, and cable 

and direct broadcast satellite televisions. Other products produced by Peregrine include a Xilinx-compatible 

FPGA, a 64K SRAM, and other various microwave devices. Peregrine’s UTSi FPGA chip was developed in 

cooperation with Xilinx. Peregrine has a license to manufacture and market 3V UTSi versions of Xilinx’s XE3000 

family. 


The company's devices are currently produced by Asahi Kasei Microsystems in Japan. 


North American Company Profiles Peregrine Semiconductor 


• In January 1996, Peregrine signed a six-year fab agreement with Asahi Kasei Microsystems Co. (AKM) of 

Japan. AKM will provide wafer fabrication to Peregrine in exchange for process technologies. The two 

companies are also negotiating a joint development agreement for future products. 


Pericom Semiconductor North American Company Profiles 


1-268 

PERICOM SEMICONDUCTOR 

Pericom Semiconductor Corporation 

2380 Bering Drive 


Telephone: (408) 435-0800 

Fax: (408) 435-1100 

Web Site: www.pericom.com 


Europe: Pericom • Bridport, Corset, United Kingdom 

Telephone: (44) (1308) 458986 

Asia-Pacific: Pericom Technology (Shanghai) Co., Ltd. • Shanghai, China 

Telephone: (86) (21) 6485-0576 • Fax: (86) (21) 6485-2181 


1992 1993 1994 1995 1996 

Sales 0.5 6 19 23 41 

Employees 26 40 50 100 122 


Pericom Semiconductor, founded in 1990, designs and markets ultra fast digital and mixed-signal CMOS and 

BiCMOS ICs that provide solutions to bottlenecks in high-performance computing and communications systems. 

The company's first products were high-performance cache SRAMs. However, its current product line includes 

CMOS 5V and 3V logic clock generators and drivers, networking ICs, and application-specific switching devices. 

Pericom's 3V, 5V, and 3V/5V products are applicable in computing, data communications, and networking 

systems. 

Founded originally as Pioneer Semiconductor, the company changed its name to Pericom Semiconductor in 

1993 to avoid becoming confused with a number of other technology companies with "Pioneer" in their names. 


North American Company Profiles Pericom Semiconductor 

Management 

Alex Hui President and Chief Executive Officer 

Patrick Brennan Vice President, Finance, and Chief Financial Officer 

John Chi-Hung Hui, Ph.D. Vice President, Technology 

Hank O'Hara Vice President, Sales 

Michael Yen Vice President, Applications and Systems Engineering 

Van Lewing Director, Marketing 

Dan Wark Director, Operations 


Employing proprietary 0.8μm and 0.6μm CMOS and BiCMOS technologies, Pericom provides advanced logic, 

clock, and mixed-signal products. 

• High-speed FCT bus interface logic chips with propagation delays as low as 3.2ns 

• High-speed clock distribution series, including PLL implementation for high clock rates 

• Fast switching, low impedance bus switches and true analog switches 

• Wide architecture 16-bit FCT logic families 

• Low voltage 3.3V, high-performance 8- and 16-bit FCT, LPT, LCX, and ALVCH logic families 

• Frequency synthesizer ICs that provide several PLL generated output frequencies for PCs, modems, and laser 

printers 

• Networking products for Token Ring, 100VG, and Fast Ethernet 


Pericom has foundry relationships with Austria Mikro Systeme, Chartered Semiconductor, New Japan Radio, and 

TSMC. 


Power Integrations North American Company Profiles 

Employees 90 


1-270 

POWER INTEGRATIONS 

Power Integrations Inc. 

477 North Mathilda Avenue 


Telephone: (408) 523-9200 

Fax: (408) 523-9300 


Japan: Power Integrations, Inc. • Kohoku-ku, Yokohama-shi, Japan 

Telephone: (81) (45) 471-1021 • Fax: (81) (45) 471-3717 

Europe: Power Integrations Europe Ltd. • Windsor, Bershire, United Kingdom 

Telephone: (44) (1753) 622-208 • Fax: (44) (1753) 622-209 


Power Integrations, founded in 1988, is a privately held company focused on the power conversion market. The 

company designs, develops, and markets integrated circuits that combine low-voltage analog and digital control 

capability with high-voltage power output devices in monolithic form. 

The company's technology is used to build innovative high-voltage products for the power supply, battery 

charging, telecommunications, motor control, and lighting markets. 

Management 

Howard Earhart President and Chief Executive Officer 

Balu Balakrishnan Vice President, Marketing and Engineering 

Vladimir Rumennik, Ph.D. Vice President, Technology 

Dan Selleck Vice President, Sales 

Robert Staples Vice President, Finance and Administration 

Clifford Walker Vice President, Corporate Development 

Shyam Dujari Director, Marketing 


North American Company Profiles Power Integrations 


Power Integrations utilizes a standard CMOS process and adds one implant to generate high voltage MOSFETs 

integrated into power supply and interface products. The process is capable of combining 1,200V N-channel 

MOSFETs, 700V P-channel MOSFETs, and 400V L-IGBTs with 5-15V CMOS and bipolar logic devices. 

TOPSwitch®-II is the newest family of products for power conversion applications. In addition to integration 

benefits of the high voltage process technology, this family also has patented circuit and system design 

innovations. 

The company's power supply IC product line is targeted at the needs of portable and small form-factor products 

such as portable computers, camcorders, cellular telephones, PBX line cards, and feature phones. The highvoltage 

outputs of Power Integrations' power supply circuits provide universal input voltage (85-256 VAC) 

capability. The high-frequency switching capability and low system component count enables low-cost, small 

form-factor power supply/chargers to be realized. The power supply ICs cover universal input voltage applications 

from 1 watts to 90 watts (1 watts to 50 watts from 100 VAC). A one-watt buck converter for non-isolated ISDN 

applications is also available. 

Its interface IC products are designed for use in energy-efficient, variable-speed electric motors for appliances 

such as room air conditioners. The high-voltage capability of these products provides cost-effective level shifting 

capability and control for those 110/220 VAC applications. The latest product is the INT 100 half-bridge MOSFET 

driver, providing 800-volt level shifting and control for electric motors in the 50W to 3kW power range. 


Foundry relationships with Panasonic Semiconductor group of Matsushita and Oki Electric have been established 

for wafer fabrication utilizing Power Integrations' proprietary process. 


• Power Integrations granted Matsushita access to its technology and products for internal consumption 

worldwide, and for non-exclusive distribution of the products in Japan and other selected geographical areas in 

return for providing foundry support. 


QLogic North American Company Profiles 


1-272 

QLOGIC 

QLogic Corporation 

3545 Harbor Boulevard 

Costa Mesa, California 92626 

Telephone: (714) 438-2200 

Fax: (714) 668-5008 

Web Site: www.qlc.com 


1993 1994 1995 1996 1997 

Sales 52 45 58 54 70 

Net Income 6 (5) 2 1 6 


Employees 130 161 145 190 


QLogic Corporation develops and markets a full line of host and peripheral I/O controller chips and host adapter 

cards used to connect hard disk drives, optical storage devices, CD-ROMs, and other peripherals to computer 

systems. In addition, the company develops small computer system interface (SCSI) target and disk controller 

chips used in peripherals and host computers themselves. 

QLogic was originally known as Emulex Micro Devices (EMD), a subsidiary of Emulex Corporation. In 1993, the 

subsidiary changed its name to QLogic and became a publicly-held company in February of 1994. 

To position itself as a major supplier of computer and peripheral controllers, the company is expanding its SCSI 

technology. QLogic is devoted to providing its customers with products that optimize the transfer and 

management of data between computer systems and peripheral devices, by developing IC chips, host adapters 

boards, and software that combine a range of features and technologies. 

In 1996, 55 percent of revenues were to foreign customers, primarily in the Pacific Rim region. 


North American Company Profiles QLogic 

Management 

Gary E. Liebl Chairman 

H.K. Desai President and Chief Executive Officer 

Thomas R. Anderson Vice President and Chief Financial Officer 

Mark Edwards Vice President, Sales and Corporate Marketing 

Larry Fortmuller Vice President and GM, Computer Systems Group 

David Tovey Vice President and GM, Peripheral Products Group 


QLogic’s semiconductor product families include: 

• The FAS (Fast Architecture SCSI) Family of fast and wide SCSI controller ICs for host and peripheral 

applications. 

• The ESP (Enhanced SCSI Processor) Family of SCSI controller ICs based on the industry standard advanced 

SCSI core. 

• The TEC (Triple Embedded Disk Controller) Family of 8-bit and 16-bit wide SCSI HDD controllers. 

• The ISP (Intelligent SCSI Processor) Family of fast and wide, bus master host adapter ICs for 32-bit interfaces. 

QLogic is working with Apple Computer to develop a new version of its high performance Fast!SCSI IQ PCI card 

for the Power Macintosh platform. 


The company relies on outside vendors for the manufacturing of its semiconductor and circuit board products. 


Quality Semiconductor North American Company Profiles 


1-274 

QUALITY SEMICONDUCTOR 

Quality Semiconductor, Inc. 

851 Martin Avenue 


Telephone: (408) 450-8000 

Fax: (408) 496-0773 

Web Site: www.qualitysemi.com 


Europe: Quality Semiconductor, Inc. • Hampshire, United Kingdom 

Telephone: (44) (1420) 563333 • Fax: (44) (1420) 561142 


1992 1993 1994 1995 1996 

Sales 18 28 37 46 45 

Net Income (5) 3 3 5 (1) 

R&D Expenditures 5 6 7 

Capital Expenditures 1 2 7 

Employees 100 160 160 160 197 


Established in 1989, Quality Semiconductor, Inc. (QSI) is a provider of high-performance logic devices and 

networking and logic-intensive memory semiconductor products. Quality's strategy is to go after existing areas 

with higher performance parts, then create new niches that can be developed. The company targets systems 

manufacturers principally in the networking, personal computer and workstation, and communications industries, 

but also sells devices for military and high-reliability applications. 

In early 1996, Quality Semiconductor purchased AWA MicroElectronics, Pty. Ltd. (now Quality Semiconductor 

Australia) from AWA Limited, acquiring AWA’s fab facility, foundry business, and design center in Australia. During 

1996, QSI upgraded the facility from 1.5μm to 0.8μm process technologies. The new subsidiary continues to 

provide foundry services to AWA and its existing foundry customers. AWA Limited retains some ownership in the 

new subsidiary and is jointly developing new products and technologies with Quality Semiconductor. 


North American Company Profiles Quality Semiconductor 

Management 

Europe 

5% 

Far East 

34% 

Australia 

4% 

United States 

57% 


Quality Semiconductor Inc. 

Chun P. Chiu Chairman and Chief Technical Officer 

R. Paul Gupta President and Chief Executive Officer 

Edward J. Bradley, Jr. Vice President, Manufacturing 

Albert R. Enamait Vice President, Sales and Marketing 

Farzin Firoozmand Vice President, Networking Products 

Jacob H.V. Foraker Vice President, Logic and Memory 

Gilbert C. Jones Vice President, Marketing Operations 

Stephen H. Vonderach Vice President, Finance, and Chief Financial Officer 

Quality Semiconductor Australia 

Phil Cavanagh President 

Andy Brawley Manager, Operations 

Andrew Greatbach Manager, Marketing 

Clive Potter Manager, Engineering 


Quality Semiconductor produces high-performance 5V and 3.3V CMOS FCT logic devices, high-speed digital 

logic switches, clock management circuits, fast FIFOs, analog devices, JTAG devices, and advanced networking 

products. Sales of interface logic devices account for a significant majority of the company’s net product 

revenues. 

Networking Products—QSI offers advanced CMOS Fast Ethernet transceivers for access equipment and LAN 

applications, as well as a 4:1 ATM multiplexer/demultiplexer with on-chip FIFO buffering for ATM switch fabric 

and transmission applications. 

Specialty Memory Products—QSI’s memory products include a variety of asynchronous and synchronous FIFOs, 

as well as dual-port and shared-port RAMs. 


Quality Semiconductor North American Company Profiles 

Logic Products—QSI offers a variety of standard 3.3V and 5V FCT logic devices in 8-, 16-, and 32-bit 

configurations, as well as a new line of LCX logic devices for mixed-voltage applications. 

Clock Management Devices—These products include high-performance 3.3V and 5V devices with low skew, low 

jitter, and low EMI-noise characteristics. 

QuickSwitch ® Products—The QuickSwitch product line was invented to meet the requirement for zero 

propagation delay multiplexing and switching functions in high-performance computing and networking 

systems. 

QuickScan Products—These are derived from QSI’s QuickSwitch product line and add JTAG boundary scan 

capabilities. 

Analog Switch Devices—This is a new family of devices designed for advanced high-performance video, audio, 

and networking applications. 

All of QSI’s products are manufactured using advanced CMOS process technologies with geometries ranging 

from 0.8μm to 1.5μm. A 0.6μm CMOS process is under development. 


In addition to using its newly acquired fabrication facility in Australia, QSI has foundry partners from which it 

receives fabricated wafers. Its current foundry partners include Seiko Instruments, Ricoh, Yamaha, and TSMC. In 

1996, approximately 85 percent of QSI’s wafers were manufactured by Seiko and Ricoh. 

Quality Semiconductor Australia, Pty, Ltd. (QSA) 

8 Australia Avenue 

Homebush, NSW, 2140 

Australia 

Telephone: (61) (2) 763-4105 

Fax: (61) (2) 746-1501 

Cleanroom size: 5,000 square-feet 




Products: Logic and memory ICs, ASICs, foundry services 

Feature sizes: 0.8μm, 1.0μm, 1.2μm, 1.5μm (0.6μm in development) 


• Quality is developing new products and technologies through a strategic alliance with AWA Limited. 

• Quality formed a second-source and product development alliance with Sharp Corporation in April 1995 that 

covers a variety of specialty memory products for advanced networking, multimedia data communications, and 

high-performance I/O subsystem applications. 

1-276 


North American Company Profiles QuickLogic 


QUICKLOGIC 

QuickLogic Corporation 

1277 Orleans Drive 


Telephone: (408) 990-4000 

Fax: (408) 990-4040 

Web Site: www.quicklogic.com 


Europe: QuickLogic Corporation • London, England 

Telephone: (44) (181) 563-7624 • Fax: (44) (181) 563-0489 


1994 1995 1996 

Sales 7 15 30 



QuickLogic was founded in 1988 by the inventors of the programmable array logic (PAL) device. Today, the 

privately-held company designs and sells high density CMOS field programmable gate arrays (FPGAs) featuring 

high speeds and low power consumption, along with high productivity design software. 

QuickLogic’s FPGAs compete with conventional high density programmable local devices and gate arrays in 

applications such as graphics processing, high-speed memory control, video and image processing, DSP support 

logic, and data acquisition. 

QuickLogic has indicated that it may announce its initial public offering sometime during 1997, depending on 

market conditions. Currently, international sales represent about 40 percent of QuickLogic’s total sales, and the 

company is working to increase that number. 


QuickLogic North American Company Profiles 

Management 

Irwin B. Federman Chairman 

E. Thomas Hart President and Chief Executive Officer 

John Birkner Vice President, CAE 

Andrew Chan Vice President, Product Development 

H.T. Chua Vice President, Technology Development 

Richard Johnson Vice President, Worldwide Sales 

Vincent McCord Vice President, Finance, and Chief Financial Officer 

Philip Ong Vice President, Operations 

Ronald Zimmerman Vice President, Human Relations 

Edward Smith Director, Marketing 


QuickLogic's programmable ASIC (pASIC) devices are implemented in a submicron CMOS process and deliver 

high speeds and low power consumption. All of the company's existing devices are offered in both 5V and 3.3V 

power supply versions. They are based on QuickLogic's proprietary metal layer, amorphous silicon ViaLink® 

antifuse programming element technology that offers high speeds and high densities (up to 20,000 usable 

gates). QuickLogic also supplies a comprehensive set of CAE development tools, operating on PCs and popular 

workstation platforms. An open architecture approach allows popular third-party tools to interface to the 

company's development environment. 

pASIC 1 FPGA Family—Consists of four parts in densities ranging from 1,000 usable gates to 8,000 usable gates 

(96 to 768 logic cells) and I/O pin counts ranging from 64 pins to 180 pins. The pASIC 1 devices are based on 

high-speed, low-power, two-layer-metal 0.65μm CMOS process technology. 

pASIC 2 FPGA Family—Consists of seven parts in densities ranging from 3,000 usable gates to 20,000 usable 

gates (192 to 1,440 logic cells) and I/O pin counts ranging from 120 pins to 336 pins. The pASIC 2 devices are 

based on high-speed, low-power, three-layer-metal 0.65μm CMOS process technology. 

Future product development includes a hybrid PLD device that will combine FPGA and ASIC functionality. The 

company plans to introduce this new product family during 1997. 


QuickLogic does not fabricate its own ICs, it has a manufacturing and technology agreement with Cypress 

Semiconductor. However, QuickLogic does perform all FPGA product testing for both companies. To 

supplement the capacity it receives from Cypress, QuickLogic established a foundry agreement with TSMC in 

1996 (see Key Agreements). 

1-278 


North American Company Profiles QuickLogic 


• In February 1997, Cypress and QuickLogic announced the cancellation of a previous joint-develop, licensing, 

and foundry agreement for high-performance FPGA products and released plans for establishing a new 

foundry alliance. As part of a new five-year agreement, Cypress will no longer market and sell antifuse FPGA 

products, but will continue to serve as a foundry for QuickLogic’s FPGAs. In addition, QuickLogic agreed to 

purchase all of Cypress’s existing FPGA inventory. Cypress holds a stake of less than 10 percent in 

QuickLogic. 

• In late 1996, QuickLogic established a foundry agreement with Taiwan foundry, TSMC. The two companies will 

work together to integrate QuickLogic’s antifuse technology into TSMC’s 0.35μm process technology. 

Originally, the agreement called for using 0.5μm technology, however, a decision was later announced to 

bypass 0.5μm and move directly to a 0.35μm process. The agreement also allows QuickLogic to move from 

150mm to 200mm wafers. 


Ramtron North American Company Profiles 


1-280 

RAMTRON 

Ramtron International Corporation 

1850 Ramtron Drive 


Telephone: (719) 481-7000 

Fax: (719) 481-9170 

Web Site: www.csn.net/ramtron 


Japan: Ramtron K.K. • Yokohama, Japan 

Telephone: (81) (45) 473-9372 • Fax: (81) (45) 473-9373 


1992 1993 1994 1995 1996 

Sales 1 7 20 29 31 

Net Income (23) (27) (20) (2) (6) 



Employees 129 140 121 88 105 


Ramtron was established in 1984 to produce non-volatile memory products by combining the unique 

characteristics of ferroelectric materials with conventional integrated circuitry. The company was the first to 

manufacture ferroelectric memory devices. It holds 89 U.S. and international patents covering its proprietary 

technologies and products and more than 90 are pending. 

Ramtron's principal business focus is directed toward the development of the commercial manufacture of 

ferroelectric RAMs (FRAMs). The company sites benefits of FRAMs as having fast write times, high write 

endurance, non-volatile retention, small form factors, and minimal power consumption. Applications for FRAM 

devices include consumer electronics, business machines, communications equipment, test instruments, 

industrial controls, and medical equipment. 

Besides ferroelectric RAMs, Ramtron is also involved in the development and sale of very high speed DRAMs the 

company calls enhanced-DRAMs (EDRAMs), that are based on standard volatile DRAM technology. In 1995, 

Ramtron spun off its EDRAM business into a wholly owned subsidiary called Enhanced Memory Systems, Inc., 

(EMS) which has the sole responsibility of developing EDRAMs. 


North American Company Profiles Ramtron 

FRAMs* 

11% 

EDRAMs* 

89% 

*Includes license and development fee revenues. 


License and 

Development 

Fees 

43% 

Semiconductor 

Devices 

57% 


EDRAMs have been demonstrated to provide SRAM performance with DRAM density in a product that 

approaches DRAM pricing. A large portion of the company’s EDRAM business is targeted at replacement of fast 

(≤15ns) SRAMs in high-performance systems. As such, EDRAMs applications include a wide variety of the 

highest performing systems such as personal computer motherboards, accelerator boards, multiprocessor 

systems, disk controllers, embedded computer modules, digital signal processing systems, and video graphic 

systems. 

Ramtron's business strategy is to manufacture its own products, to license its products on a contract basis to other 

companies, and to license its proprietary technologies to a limited number of IC manufacturers in exchange for 

royalties and access to advanced manufacturing capabilities. The company has forged alliances with IBM 

Microelectronics, Fujitsu, Hitachi, Rohm, Toshiba, Nippon Steel Semiconductor, Samsung, and SGS-Thomson. 

International sales represented 21 percent of sales in 1996. 

Management 

L. David Sikes Chairman and Chief Executive Officer 

Greg B. Jones President and Chief Operating Officer 

Richard L. Mohr Executive Vice President and Chief Financial Officer 

Elliot M. Philofsky, Ph.D. Senior Vice President and Chief Technical Officer 

Donald G. Carrigan Vice President, Sales and Marketing 

Craig Rhodine General Manager, Enhanced Memory Systems, Inc. 


Ramtron first demonstrated a working 256bit FRAM prototype in 1987 and in 1993, began commercial sales of 4K 

FRAMs. Commercial 16K and prototype 64K devices were introduced in 1994. Production of 256K FRAMs 

started in the second half of 1995. Ramtron is pursuing the development, through its strategic alliance partners, 

of new high-density (1M and above) FRAM products. Ramtron's FRAM products are pin compatible with many 

serial and parallel EEPROMs on the market. 

The nonvolatile storage element in Ramtron's FRAMs is a capacitor constructed from two metal electrodes with a 

thin-film ferroelectric material between the transistor and metallization layers of an industry standard CMOS 

manufacturing process. 


Ramtron North American Company Profiles 

In addition to nonvolatile memories, Ramtron has identified other products in which ferroelectric technology may 

be integrated, including microcontrollers, programmable logic devices (PLDs), and radio frequency identification 

devices (RFIDs). Ramtron's joint venture affiliate, Racom ID Systems, Inc., is engaged in the development of 

ferroelectric RFID chips and systems. 

Enhanced Memory Systems' enhanced-DRAM (EDRAM) products were developed in cooperation with United 

Memories Inc. (UMI) and Nippon Steel Semiconductor (then NMB Semiconductor). Colorado Springs-based UMI 

was formed by Ramtron and NMB in 1990 (see Key Agreements). The EDRAMs are fabricated at Nippon Steel 

Semiconductor's fab facility in Japan. 

During 1996, EMS began development of a 133MHz, 16M enhanced synchronous DRAM (ESDRAM) based on 

the company’s EDRAM technology. Sample shipments of the device are expected to begin in late 1997. In early 

1997, EMS introduced the Enhanced 10ns family of EDRAMs that features upgraded performance speeds up to 

10ns. The 10ns family is manufactured by IBM using 0.6μm process technology. 


Ramtron International Corporation 

1850 Ramtron Drive 





Processes: Ferroelectric CMOS and standard CMOS 

Products: Specialty memory ICs 


Ramtron's wafers are also manufactured by Rohm, Nippon Steel Semiconductor, IBM Microelectronics, and Hitachi 

(see Key Agreements). 


• In February 1997, Ramtron established a relationship with SGS-Thomson that will cover FRAM production. The 

agreement calls for SGS-Thomson to provide CMOS wafers to Ramtron, who will return the wafers to ST as 

finished 64K FRAMs. The two companies may extend this relationship in the future to include joint foundry or 

technology licensing agreements. 

• Ramtron signed a non-exclusive licensing agreement with Samsung. Under the agreement, Ramtron licensed 

its FRAM technology to Samsung in exchange for certain licensing and royalty considerations. 

• Ramtron signed a manufacturing agreement with IBM Microelectronics in May 1995 for EDRAM production. 

Under the agreement, IBM is serving as a foundry for the production of Enhanced Memory Systems' EDRAMs, 

and IBM has a non-exclusive license to sell the devices. The first products manufactured by IBM became 

available in October 1996. 

1-282 


North American Company Profiles Ramtron 

• Ramtron added Fujitsu to the list of companies with which it maintains joint design and licensing deals for 

ferroelectric memories. The two firms are developing a 1M FRAM device, and in June 1996, Fujitsu completed 

a feasibility study for 16M FRAMs. In August 1996, the agreement was amended allowing Fujitsu to use FRAM 

technology in the development and manufacture of embedded memory FRAM products. 

• In late 1994, Ramtron signed a cross-licensing deal with ferroelectric memory competitor, Symetrix, also located 

in Colorado Springs. Both companies are jointly developing a 3-volt 16K FRAM based on Symetrix's Y-1 

ferroelectric material technology. In addition, Ramtron's ferroelectric technology is now licensable by Symetrix 

to its strategic partners, which include Motorola and Matsushita, and Ramtron may license Symetrix's 

technology to its partners. The deal also called for Ramtron to purchase half of Symetrix for about $6 million. 

• Ramtron and Rohm signed a joint manufacturing, development, and marketing deal in 1993 giving Rohm 

access to Ramtron's line of FRAM products. Under the agreement, Rohm is supplying Ramtron with wafers and 

is selling completed devices in Japan under both logos. In addition, joint development of new ferroelectricbased 

circuits, including microcontrollers and custom products will take place. Volume production of FRAM 

memories by Rohm is expected to begin in the second half of 1997. 

• A joint program to integrate Ramtron's ferroelectric technology with Hitachi's DRAM manufacturing process was 

established in 1992. In early 1994, Hitachi indicated it was satisfied with its pilot program of testing and 

packaging midrange density FRAMs. As a result, Hitachi is working with Ramtron to design and develop 256K, 

1M, and 4M FRAMs. Volume production of the 256K FRAM is expected to begin in the second half of 1997. 

Ramtron also agreed to license all its non-standard and standard FRAM products to Hitachi. Ramtron will rely on 

Hitachi as a foundry for the devices since its own fab is not capable of the feature sizes required for the larger 

memories. 

• Toshiba agreed to jointly develop and second-source Ramtron’s FRAMs in densities of 256K and above. 

• In 1988, Ramtron and NMB Semiconductor (now Nippon Steel Semiconductor) entered into a product 

development and license agreement for conventional 1M and 4M DRAMs. Then, in 1990, the two companies 

established United Memories, Inc. (UMI) to design and develop advanced memory devices (not involving 

Ramtron's ferroelectric technology) for both companies. In 1995, Ramtron sold all its remaining interest in UMI 

to Nippon Steel. Now, Nippon Steel manufactures and sells 4M EDRAM products to Enhanced Memory 

Systems for resale to EMS’s customers. 


Raytheon North American Company Profiles 

1-284 

RAYTHEON 

Raytheon Company 

141 Spring Street 

Lexington, Massachusetts 02173 

Telephone: (617) 862-6600 

Web Site: www.raytheon.com 



1992 1993 1994 1995 1996 

Corporate 

Sales 9,122 9,334 10,098 11,804 12,331 

Net Income 635 693 597 793 761 

Semiconductor 

Sales 105 105 110 110 115 



Founded in 1922 as the American Appliance Company, the company adopted the Raytheon name in 1925. Early 

expertise was in the field of radio tubes and missile guidance. In 1964, Raytheon launched a diversification 

program to broaden its business base by adding commercial operations. 

Today, Raytheon consists of four major business segments: electronics, engineering and construction, aircraft 

products, and major appliances. Approximately 60 percent of its sales are from commercial customers and 40 

percent from government and defense electronics customers. 

Major 

Appliances 

12% 

Aircraft 

Products 

19% 

Engineering 

and Construction 

25% 

Electronics 

44% 



North American Company Profiles Raytheon 

In electronics, Raytheon’s principal business is the design, manufacture, and servicing of advanced electronic 

devices, equipment, and systems for governmental and commercial markets. The company is seeking to greatly 

enhance its defense electronics business through the acquisition of the Defense Systems and Electronic 

business of Texas Instruments and the Hughes Aircraft business of Hughes Electronics. Both of the transactions 

are expected to be completed in 3Q97. Once Raytheon, TI DS&E, and Hughes Aircraft are combined, 

Raytheon’s revenues with be on the order of $21 billion, more than $13 billion of which will be in defense 

electronics. 

Raytheon’s commercial electronics business consists of Raytheon Marine Company, a supplier of marine-related 

electronics and systems; Raytheon Semiconductor, which specializes in the design and manufacture of 

multimedia video circuits and analog ICs; Raytheon Microelectronics, which produces GaAs ICs for wireless 

communications and satellite applications; Seiscor Technologies, Inc., a supplier of telephone transmission 

equipment; and Switchcraft, Inc., a supplier of a wide range of electronic components. 

Raytheon Semiconductor is made up of three business units. The Multimedia Business Unit, based in San Diego, 

California, is a leading designer and manufacturer of high-performance digital and mixed-signal ICs for computer 

graphics, multimedia, imaging, and communications applications. The Analog Business Unit, based in Mountain 

View, California, provides a wide range of analog and mixed-signal IC products for PC, broadcast video, automatic 

test equipment (ATE), and set-top box applications. The High Speed Communications Business Unit offers ICs 

for Fast Ethernet, Fibre Channel, and Fibre Distributed Data Interface (FDDI) applications. More than 90 percent of 

Raytheon Semiconductor’s devices are sold to commercial customers. 

Management 

Dennis J. Picard Chairman and Chief Executive Officer 

Peter R. D’Angelo Executive Vice President and Chief Financial Officer 

Christoph L. Hoffmann Executive Vice President, Law and Corporate Affairs 

William H. Swanson Executive Vice President and GM, Raytheon Electronic Systems 

Philip W. Cheney Vice President and Group Executive, Raytheon Electronics 

Shi-Chuan Lee President, Raytheon Semiconductor 

James V. DiLorenzo General Manager, Advanced Device Center, Raytheon Microelectronics 

Arthur J. Hoage Manager, Manufacturing Services, Raytheon Semiconductor 

Peter F. Bejarano Director, VLSI Products, Raytheon Semiconductor 

Scott Keller Director, Linear and Mature Products, Raytheon Semiconductor 

Les Welborn Director, Worldwide Sales, Raytheon Semiconductor 


Raytheon Semiconductor's products are focused primarily on video/multimedia, ATE and instrumentation, PC, 

and communications applications. They include analog audio, video, and special function circuits; analog-to-digital 

and digital-to-analog converters; DC/DC converters; ATE pin electronics drivers; digital video decoders, encoders, 

and genlocks; imaging and video processors and filters; line regulators and references; memory and storage 

products; operational amplifiers; standard PROMs and power-switched SPROMs; transceivers; and voltage 

regulator modules. Raytheon Semiconductor also offers IC design, test, and manufacturing foundry services. 


Raytheon North American Company Profiles 

Technologies used in the manufacture of Raytheon Semiconductor’s IC products include CMOS processes, a 

complementary BiCMOS process, a 5GHz high-speed complementary bipolar process, and a wide range of bipolar 

processes (up to 32V). Submicron CMOS process capabilities are obtained from contract foundry suppliers. 

Raytheon Microelectronics manufactures a wide range of RF, microwave, and millimeter-wave GaAs ICs, including 

cellular/PCS circuits, digital broadcast satellite (DBS) devices, and wideband circuits. Raytheon Microelectronics 

also offers custom MMIC solutions and foundry services. There are five standard GaAs processes offered through 

its foundry services program, a 0.25μm power PHEMT process, a 0.25μm LN PHEMT process, a 0.5μm E/D 

MESFET process, a 0.5μm LN MESFET process, and a 0.5μm power MESFET process. 


Raytheon Semiconductor Raytheon Semiconductor 

350 Ellis Street Hartwell Road 

Mountain View, California 94039 Bedford, Massachusetts 01730 





Processes: Bipolar, CMOS, BiCMOS Processes: NMOS, CMOS, bipolar 

Products: Linear, logic, ASICs, discretes, foundry Products: Logic and custom ICs 


Raytheon Microelectronics Raytheon Electronic Systems 

Advanced Device Center 350 Lowell Street 

350 Lowell Street West Andover, Massachusetts 01810 

West Andover, Massachusetts 01810 Telephone: (508) 475-5000 


Cleanroom size: 17,000 square feet Capacity (wafers/week): 875 

Capacity (wafers/week): 360 Wafer size: 125mm 

Wafer size: 100mm Processes: NMOS, CMOS, bipolar, BiCMOS 

Process: GaAs Products: Logic, custom, and linear ICs 

Products: MMICs, discretes, foundry Feature size: 0.9μm 


Through the acquisitions of the defense electronics businesses of TI and Hughes Electronics, Raytheon may gain 

control of the following IC fabs: a TI GaAs MMIC fab in Dallas, Texas, a Hughes silicon IC fab in Newport Beach, 

California, a Hughes GaAs MMIC fab in Torrance, California, and a Hughes silicon IC fab in Scotland. 

1-286 


North American Company Profiles Rochester Electronics 


ROCHESTER ELECTRONICS 

Rochester Electronics Inc. 

10 Malcolm Hoyt Drive 

Newburyport, Massachusetts 01950 

Telephone: (508) 462-9332 

Fax: (508) 462-9512 

Web Site: www.rocelec.com 


Europe: Rochester Electronics, Ltd. • Luton, Bedfordshire, England 

Telephone: (44) (1582) 488680 • Fax: (44) (1582) 488681 


Rochester Electronics was established in 1981 to supply discontinued semiconductors. Rochester offers entire 

discontinued lines, both commercial and military, from manufacturers that reduce support for old parts to rationalize 

scarce manufacturing and service resources. Increased military cutbacks have also led chip makers to reduce their 

support for military parts as they shift to more commercial offerings. 

Rochester handles discontinued lines from companies such as AMD, National, Texas Instruments, Harris, Intel, 

AT&T/Lucent, and Raytheon. 

Management 

Curt Gerrish President 


Rochester has more than 450 million devices in stock, some over 20 years old. Its product lines include SRAMs, 

DRAMs, VRAMs, PROMs, logic chips, and linear devices. The company also stocks unfinished wafers and original 

mask sets. 


Rochester uses more than 30 foundries to manufacture its product lines. 


Rockwell Semiconductor Systems North American Company Profiles 

1-288 

ROCKWELL SEMICONDUCTOR SYSTEMS 


Rockwell Semiconductor Systems 

Rockwell International Corporation 

4311 Jamboree Road 

P.O. Box C 

Newport Beach, California 92658-8902 

Telephone: (714) 221-4600 

Fax: (714) 221-6544 

Web Site: www.nb.rockwell.com 


Japan: Rockwell International Japan Co., Ltd., Semiconductor Systems • Shibuya-ku, Tokyo, Japan 

Telephone: (81) (3) 5371-1520 • Fax: (81) (3) 5371-1501 

Europe: Rockwell Semiconductor Systems SARL • Valbonne, Sophia Antipolis Cedex, France 

Telephone: (33) (4) 93-00-33-35 • Fax: (33) (4) 93-00-33-03 

Asia-Pacific: Rockwell International Hong Kong, Ltd., Semiconductor Systems • Wanchai, Hong Kong 

Telephone: (852) 2827-0181 • Fax: (852) 2827-6488 


1992 1993 1994 1995 1996 

Corporate* 

Sales 5,856 6,204 7,029 9,065 10,373 

Net Income 483 562 634 742 726 

Semiconductor Systems 

Sales 431 530 691 875 1,593 


Employees 

(Semiconductor Systems) 1,695 4,000 4,500 

*Restated to reflect continuing operations. Rockwell sold its Graphics Systems and Aerospace and Defense 

Businesses in 1996. 


North American Company Profiles Rockwell Semiconductor Systems 


Rockwell International Corporation was incorporated in 1928 and is engaged in the research, development, and 

manufacture of diversified products, including industrial automation equipment and systems, avionics products 

and systems and related communications technologies primarily for commercial and military aircraft and defense 

electronics systems, system-level semiconductor chipsets for personal communication electronics markets, and 

automotive components and systems. 

Avionics and Communications 

14% 

Semiconductor 

Systems 

16% 

Automotive 

30% 

Electronics 

40% 


Business Segment 

In 1996, Rockwell made several acquisitions and divestitures to sharpen its business focus. Its divestitures 

included the sale of its Graphics Systems business to Stonington Partners in October 1996 and the December 

1996 sale of its Aerospace and Defense business to Boeing for $3.2 billion. Meanwhile, Rockwell’s acquisitions 

were focused on gaining semiconductor technologies. In September 1996, the company acquired Brooktree 

Corporation, a supplier of high-performance chipsets for computer graphics, multimedia, imaging, and 

communications applications for $278 million, and then in December 1996 acquired the Wireless Semiconductor 

Products group of the Cirrus Logic subsidiary Pacific Communications Sciences Inc. (PCSI) for $18.1 million and 

certain graphics and multimedia technology assets of Weitek Corporation. As a result of these transactions, 

Rockwell is now predominantly an electronics company with 70 percent of 1996 sales coming from its electronics 

business compared to in 1984 when 63 percent of the company’s sales were aerospace- and defense-related. 

The transformation of Rockwell has continued into 1997. In April 1997, the company acquired the Hi-Media 

broadband communications chipset business of ComStream Corporation for approximately $50 million. By the 

end of September 1997, Rockwell plans to spin-off of its Automotive business into a separate, publicly-traded 

company. 

Meanwhile, Rockwell’s sales outside the U.S. have grown to 43 percent of total sales in 1996 compared to 13 

percent in 1984. 



Rockwell Semiconductor Systems is the fastest-growing business segment of Rockwell and comprises the 

Multimedia Communications Division (MCD), the Wireless Communications Division (WCD), the Network Access 

Division (NAD), and the Digital Infotainment Division. The MCD is the world’s leading supplier of facsimile and PC 

modem devices. The WCD offers semiconductor systems for advanced cordless telephony and Global 

Positioning Systems (GPS) receiver engines and is developing products and technologies to address the 

Personal Communications Services (PCS) and wireless packet data markets. NAD offers a broad line of highbandwidth 

communications and networking devices. The Digital Infotainment Division focuses on products for the 

digital consumer electronics information and entertainment markets. 

Management 

Rockwell International Corporation 

Donald R. Beall Chairman and Chief Executive Officer 

Don H. Davis, Jr. President and Chief Operating Officer 

W. Michael Barnes Senior Vice President, Finance, and Chief Planning Officer 

William J. Calise, Jr. Senior Vice President, General Counsel, and Secretary 

William D. Fletcher Senior Vice President, Technology and Business Development 

Robert H. Murphy Senior Vice President, Organization and Human Resources 

Earl S. Washington Senior Vice President, Communications 

Lee H. Cramer Vice President and Treasurer 

Lawrence J. Komatz Vice President and Controller 

Thomas A. Madden Vice President, Corporate Development 


Dwight W. Decker, Ph.D. President 

A.C. D’Augustine Vice President and General Manager, Digital Infotainment Division 

Raouf Halim Vice President and General Manager, Network Access Division 

Vijay Parikh Vice President and General Manager, Multimedia Communications Division 

Vijay Parikh (acting) Vice President and General Manager, Wireless Communications Division 


Rockwell Semiconductor Systems specializes in system-level semiconductor solutions. The company has a 

history of leadership in the development and application of mixed-signal technologies. Rockwell introduced the 

first modem to the worldwide communications market in 1995 and has since played a key role in helping the 

industry turn those original three-board modems into today’s low-cost single-chip devices. The company is the 

world’s leading supplier of advanced voice, fax, and data modem products, with a 70 percent share of the total 

modem marketplace. Rockwell claims that its installed base of data modems is more than 150 million and that over 

80 percent of all fax machines use its fax-modem digital signal processors and chipsets. 

Rockwell believes its core competencies in IC design include digital signal processing (DSP) architectures and 

algorithms, submicron CMOS technology, application-specific IC (ASIC) design, interconnect technology, 

embedded memory, mixed-signal integration, and radio frequency (RF) technology. The company’s product 

portfolio is organized around five product platforms: personal computing products; digital infotainment 

appliances; wireless devices for cordless phones, cellular/PCS handsets, and Global Positioning Systems (GPS); 

personal imaging systems; and network access equipment. 

1-290 



Personal Computing Products 

Through its Multimedia Communications Division, Rockwell serves the PC market with its fax, data, and integrated 

data/fax/voice modem devices with transmission speeds of up to 56Kbps. In September 1996, Rockwell was the 

first company to announce 56Kbps modem technology. Through the acquisition of Brooktree, Rockwell 

expanded its product portfolio to include video encoding and decoding products, creating a complete offering of 

multimedia and connectivity products for desktop PCs, notebook PCs, and PDAs. 

Digital Infotainment Products 

Rockwell’s Digital Infotainment Division was formed in April 1997. Much of the products from this division stem 

from Rockwell’s Brooktree, Weitek, and ComStream Hi-Media acquisitions. The products include video 

decoders/encoders and other graphics and video ICs; broadband wireless and cable demodulation products and 

tuners; WaverArtist PC audio system devices, WaveStream software synthesizers, and the EndlessWave 

unlimited-capacity wavetable synthesis sampling engine; and the MediaPacket silicon architecture and 

TrueView video display technology for advanced multimedia applications. 

Wireless Communications Products 

Rockwell’s Wireless Communications Division focuses on chips, chipsets, and modules for spread-spectrum 

digital cordless telephones, GPS receivers, and cellular/PCS handsets. These products are supported by a wide 

variety of semiconductor processes, including advanced CMOS (used for digital and mixed-signal devices), a new 

silicon bipolar process for RF applications, and an HBT (heterojunction bipolar transistor) GaAs process for wireless 

power amplifiers. Rockwell is developing pager-chipset solutions for personal Air Communications Technology 

(pACT), a narrowband two-way messaging system. 

Personal Imaging Products 

At the core of Rockwell’s personal imaging platform offering is its Advanced FAX ENGINE family, a highly 

integrated technology featuring a digital answering machine coupled with fax functions such as modem, fax 

protocols, and compression/decompression, as well as scanner and printer interfaces. 

Network Access Products 

Formed in April 1997, the Network Access Division is focused on the underlying infrastructure tying together all of 

the company’s other strategic product platforms. The Brooktree acquisition brought Rockwell a broad family of 

high-speed digital data communications products spanning the company’s existing Central Site modems and 

Brooktree’s HDSL and other T1/E1 products, and packet-switched products for ATM and SMDS (switched multimegabit 

data services). 


In August 1995, Rockwell purchased the United Technologies Microelectronics Center (UTMC) wafer fab facility in 

Colorado Springs, Colorado. The company plans to invest up to $1.3 billion to build a 450,000 square-foot fab 

facility at this site to produce 7,500 wafers per week. Construction of Phase I, which began in March 1996, will 

include a 65,000 square-foot, Class 1 cleanroom. The exterior shell will be completed in 1998, but Rockwell has 

decided to hold off on starting volume production until late 1999. The company has cited the attractive cost and 

availability of external resources as the reason for the delay. 



In early 1994, the company executed an agreement to acquire additional 200mm wafer capacity through a minority 

equity investment in Chartered Semiconductor Manufacturing, Ltd., of Singapore. Under the agreement, 

Rockwell is guaranteed capacity in Chartered’s $1.3 billion Fab 2 facility in Singapore. 

In early 1996, Rockwell and Submicron Technology announced a long-term technology transfer and wafer supply 

agreement. Rockwell agreed to transfer its 0.5μm and 0.35μm CMOS process technologies in return for 

guaranteed wafer capacity (up to 25 percent) at Submicron Technology’s new $1.2 billion, 200mm fab facility 

located near Bangkok, Thailand. Operations at the Thai fab are scheduled to begin in 1998. 

Rockwell’s long-term wafer capacity target calls for a mix of about 70 percent in-house and 30 percent outsourced. 

Rockwell Semiconductor Systems Rockwell Semiconductor Systems 

Digital Communications Division Digital Communications Division 

4311 Jamboree Road 4311 Jamboree Road 

Newport Beach, California 92660 Newport Beach, California 92660 

Fab 4 Fabs 5 and 6 





Products: MPRs, MPUs, DSPs, ASICs, Products: MPRs, DSPs, 

memory ICs, linear ICs Feature sizes: 0.35μm-0.65μm 


Rockwell Semiconductor Systems Rockwell Semiconductor Systems 

1575 Garden of the Gods Road 1575 Garden of the Gods Road 

Colorado Springs, Colorado 80907-3486 Colorado Springs, Colorado 80907-3486 

Fab 7 Fab 8 


Capacity (wafers/month): 750 Capacity (wafers/month): 3,750 



Products: Linear ICs, ASICs, MPRs, MPUs Products: MPRs, MPUs, DSPs, ASICs 

Feature sizes: 0.8μm, 1.0μm Feature size: 0.35μm 

(Purchased from UTMC in 1995) (Operations to start in late 1999) 

1-292 




Microelectronic Technology Center 

2427 West Hillcrest Drive 

Newbury Park, California 91320 

Telephone: (805) 375-1256 



Processes: HBT, MESFET GaAs 

Products: ASICs, receivers, power amps, 

high-speed digital circuits 



• In early 1997, Rockwell licensed the ARM810 and the ARM7TDMI “Thumb” 32-bit RISC microprocessor core 

technologies of Advanced RISC Machines Ltd., as well as a core to be developed in the future. Rockwell will 

integrate the cores into a variety of communications products. 

• In 4Q96, Rockwell and Lucent Technologies jointly announced plans to make the two companies’ 56Kbps 

modem products interoperable. 

• In July 1995, Rockwell signed a five-year foundry agreement with IMP, Inc. for the wafer fabrication of CMOS 

mixed-signal ICs. 

• Rockwell is teamed with McCaw Cellular Communications to develop and provide a Cellular Digital Packet Data 

(CDPD) chipset that enables portable PCs to send digital data over cellular phone networks. 


Ross Technology North American Company Profiles 


1-294 

ROSS TECHNOLOGY 

Ross Technology 

5316 Highway 290 West 

Austin, Texas 78735 

Telephone: (512) 349-3108 

Fax: (512) 349-3101 

Web Site: www.ross.com 


Europe: Ross Europe • La Hulpe, Belgium 

Telephone: (32) (2) 652-1014 • Fax: (32) (2) 652-1062 


1995 1996 1997 

Sales 39 101 100 

Net Income (11) 18 n/a 

R&D Expenditures 13 16 n/a 



Ross Technology is an independent wholly owned subsidiary of Fujitsu Ltd., which acquired the firm from Cypress 

Semiconductor in mid-1993 for about $22 million. In November 1995, Ross completed its initial public offering, 

reducing Fujitsu’s share to 60 percent. A minority position in Ross is also held by Sun Microsystems (five percent). 

Originally established in 1988, Ross is involved in the design, development, and marketing of advanced RISC 

microprocessors based on the SPARC architecture pioneered by Sun Microsystems. Besides SPARC 

microprocessors, Ross also offers a complete line of high-end motherboards and systems through its Ross 

Microcomputer business unit, which was established in February 1996. 


North American Company Profiles Ross Technology 

Management 

CPU Upgrade 

19 % 

Other OEM 

17% 

Fujitsu 

19% 

Sun Microsystems 

45% 

1996 Sales by Customer 

Fred T. May Chairman and Acting Chief Executive Officer 

Frank A Baffi Vice President, Worldwide Sales 

Carter Godwin Chief Accounting Officer and Controller 

John Rasco Vice President, Marketing 

Francis A. “Kit” Webster Chief Financial Officer 


Ross Technology's current family of RISC microprocessors include the 32-bit Colorado 2, 3, and 4 

hyperSPARC lines. The superscaler, superpipelined hyperSPARC processors are based on a 0.4μm triplelevel-metal 

CMOS process and deliver performance of up to 200MHz. The company continues to develop its 

next-generation Viper microprocessor technology. 

To support its hyperSPARC microprocessors, Ross also offers core logic chipsets. 


The company's devices are manufactured by Fujitsu. 


S-MOS Systems North American Company Profiles 


1-296 

S-MOS SYSTEMS 

S-MOS Systems, Inc. 

150 River Oaks Parkway 


Telephone: (408) 922-0200 

Fax: (408) 922-0238 

Web Site: www.smos.com 


1992 1993 1994 1995 1996 

Sales 152 137 135 190 210 

Employees 210 210 220 210 215 


S-MOS Systems Inc., established in 1983, designs, develops, and markets a full line of very-low-power and lowvoltage 

(2V) advanced CMOS integrated circuits for a variety of market applications including desktop, notebook, 

and palmtop computers, handheld instrumentation, data and telecommunications, and mobile and portable 

communications devices. The company is divided into four key business units: Semiconductor Contract 

Manufacturing, Standard Products, ASICs, and Card Products. The company provides silicon foundry services 

through its Japanese affiliate, Seiko Epson Corporation. 

ASIC 

20% 

Standard 

Products 

21% 

Card Products 

2% 

Semiconductor 

Contract 

Manufacturing 

57% 

1996 Sales by Business Unit 


North American Company Profiles S-MOS Systems 

Management 

Tadakatsu Hayashi Chairman, President, and Chief Executive Officer 

Tom Endicott Vice President, Sales and Marketing 

Eiichi Suda Vice President, Product Creation 

Kai P. Yiu Vice President, Advanced Systems Division 

Ian R. Mackintosh Executive Director, ASIC Business Unit 

Takami Takeuchi Executive Director, Finance 

Dan Beck Director, Marketing Communications 

Dev Chakravarty Manager, ASIC Marketing 


Standard Products Business Unit 

Memories—SRAMs, mask ROMs, EEPROMs 

Controllers—VGA-LCD controllers, 3D graphics accelerators 

Drivers—LCD drivers 

Microcontrollers—low-power 4-bit and 8-bit microcontrollers 

ASIC Business Unit 

Gate Arrays 

—SLA40000 Series: 0.45μm CMOS process with two or three layers of metal, 13K to 

288K raw gates, and 128 to 400 available I/Os. 

—SLA30000 Series: 0.6μm CMOS process with two or three layers of metal, 18K to 


—SLA20000 Series: 0.65μm CMOS process with two and three layers of metals, 12K to 


—SLA9000F Series: 0.6μm CMOS process, 3K to 44K raw gates, and 80 to 256 I/Os. 

—SLA9000 Series: 1.0μm CMOS process with two layers of metals, 4K to 


—SLA100X Series: 2.0μm CMOS process with two layers of metals, 1K to 


Standard Cells 

—SSC5000 Series: 0.8μm CMOS process, 7K to 107K raw gates, and 112 to 432 

available I/Os. 

—SCC2500 Series: 1.6μm CMOS process, 300 to 16K raw gates, and 44 to 256 I/Os. 

—SCC2000 Series: 2.0μm CMOS process, 250 to 11K raw gates, and 40 to 192 I/Os. 

Embedded Arrays 

—SSL20000-1: RAM-DAC embedded array for PC video and graphics applications. 

—SSL20000-2: LAN/Ethernet embedded array for LAN controller applications. 

—SSL20000-3: RAM/ROM embedded array for pager, cellular phone, and PDA applications. 


S-MOS Systems North American Company Profiles 

Card Products Business Unit 

Subsystem design and assembly 

Contract Manufacturing Services 

Foundry, test, and packaging services through Japanese affiliate Seiko Epson. 


Design, engineering, and marketing of S-MOS's products are handled at its San Jose headquarters. 

Manufacturing is done at Seiko Epson's fabrication facility in Fujimi, Nagano Prefecture, Japan. 

1-298 


North American Company Profiles S3 


S3 

S3 Incorporated 



Telephone: (408) 588-8000 

Fax: (408) 980-5444 

Web Site: www.s3.com 


Japan: S3 Japan K.K. • Tokyo, Japan 

Telephone: (81) (3) 3345-7360 • Fax: (81) (3) 3345-7390 

Asia-Pacific: S3 Taiwan • Taipei, Taiwan 

Telephone: (886) (2) 757-6768 • Fax: (886) (2) 757-6880 


1992 1993 1994 1995 1996 

Sales 31 113 140 316 465 

Net Income 4 19 6 35 48 



Employees 68 141 230 444 678 


S3 Incorporated, founded in 1989, pioneered graphics acceleration in 1991 when it introduced the industry’s first 

single-chip graphics accelerator, significantly improving the performance of personal computers. The 16-bit 

accelerator was followed by 32-bit and 64-bit families in 1992 and 1993, respectively. In addition, S3 delivered the 

first integrated 2D and 3D graphics and video accelerator designed for the mainstream PC market. 

As multimedia continues to become pervasive in PCs, S3 has leveraged its expertise to accelerate 3D graphics 

and video, offer optimized UMA (Unified Memory Architecture) and MPEG solutions, and introduce new products, 

such as an audio signal processor. 


S3 North American Company Profiles 

Beginning in 1997, S3 plans to bring greater technology differentiation to the PC by exploiting the best of the 

consumer electronics proprietary technologies, such as compression, communications, high-quality video and 

audio, and life-like 3D graphics. In addition, the company intends to further extend the capabilities of its 2D, 3D, 

and audio accelerators into new markets and technologies emerging from consumer electronics and the Internet. 

Management 

1-300 

United States 

39% 

Asia/Europe/ROW 

61% 


Diosdado “Dado” P. Banatao Chairman 

Terry N. Holdt Vice Chairman 

Gary Johnson President and Chief Executive Officer 

G. “Ven” Venkatesh Executive Vice President, Graphics and Audio Communications 

Harry L. Dickinson Senior Vice President, Sales 

Paul G. Franklin Senior Vice President, Operations 

Dale Lindly Controller and acting Chief Financial Officer 

Neal D. Margulis Senior Vice President, Research and Technology 

Ronald T. Yara Senior Vice President, Strategic Marketing 

Edwin DeSouza Vice President and General Manager, Networking 

Cecilia Hayes Vice President, Human Resources 

Wei-Chan Hsu Vice President, Analog Technology 

Michael P. Nell Vice President, Business Development 

Greg Paley Vice President, Central Software Engineering Operations 

Werner Stahel Vice President, Central Engineering 


S3 offers a variety of 32-bit and 64-bit graphics and multimedia accelerator ICs, as well as supporting software 

drivers. In 1995 and 1996, the company significantly expanded its product offerings from 2D graphics 

acceleration to video acceleration, MPEG decoding, audio processing, 3D acceleration, and mobile multimedia 

acceleration. S3’s IC products are listed below. 


North American Company Profiles S3 

Products for home PC applications 

• Trio32 and Trio64 DRAM-based integrated mixed-signal graphics accelerators for cost-sensitive users. 

• Trio64V+ 64-bit, DRAM-based, multimedia accelerator with high-end video and graphics capabilities. 

• Trio64UV+ 64-bit, UMA-based, video-enable graphics accelerator. Optimized for next-generation Pentium 

processor designs. 

• ViRGE and ViRGE/VX 64-bit graphics and video accelerators, which integrate 3D rendering, 2D GUI, and 

video acceleration with a RAMDAC and clock synthesizer on a single chip. 

• Sonic/AD CD-quality, programmable, sigma-delta audio DAC. S3’s first audio product. 

• SonicVibes PCI-based audio processor that integrates the capabilities of a “sound card on a chip.” 

• Scenic/MX2 MPEG-1 audio/video decoder. Connects to the Trio64V+ multimedia accelerator. 

Products for desktop PC applications 

• Vision864 and Vision964 graphics and video accelerators. The DRAM-based Vision864 enables 64-bit 

performance in midrange PCs, while the VRAM-based Vision964 is targeted for power users that need higher 

resolutions, color depths, and refresh rates. 

• Vision868 and Vision968 64-bit multimedia accelerators with an integrated video playback engine. The 

Vision868 is DRAM-based and the Vision968 is VRAM-based. 

• Trio32 and Trio64 graphics accelerators (see above). 

• Trio64V+ multimedia accelerator (see above). 

• Trio64V2 graphics and multimedia accelerator that brings high-quality hardware assisted video playback to 

the mainstream business desktop PC. The Trio64V2 provides an upgrade path to synchronous memory 

technologies for even higher performance. 

• ViRGE/DX/GX 3D-enabled multimedia accelerators based on the S3d architecture, which significantly 

increases the performance of S3’s 3D platform. The ViRGE/DX is DRAM-based and the ViRGE/GX is 

SDRAM/SGRAM-based. 

• Plato/PX Integrated Platform Accelerator. Based on a shared memory architecture (SMA), the Plato/PX 

integrates a PC’s system controller and multimedia accelerator onto a single chip, eliminating the need for a 

separate graphics subsystem. 

• Scenic/MX2 MPEG-1 decoder (see above). 

• Sonic/AD programmable audio DAC (see above). 

Products for mobile PC applications 

• Aurora64V+ 64-bit multimedia accelerator. The Aurora64V+ provides notebook computer users with 

desktop-equivalent graphics performance and multimedia capability, as well as the industry’s first dual display 

support. 


The majority of S3's silicon products are currently manufactured by IBM Microelectronics, Hewlett-Packard, TSMC, 

and UMC. In 1995, S3 entered into a partnership with UMC and Alliance Semiconductor to establish a new jointly 

owned wafer foundry company in Taiwan called United Semiconductor Corporation (USC). S3 enjoys 20 percent 

ownership in USC, which began processing 200mm wafers in 3Q96. S3 has the right to purchase up to about 31 

percent of the USC fab’s output. See UMC’s profile for data on USC’s fab facility. 


Seeq Technology North American Company Profiles 

1-302 

SEEQ TECHNOLOGY 

Seeq Technology, Inc. 

47200 Bayside Parkway 


Telephone: (510) 226-7400 

Fax: (510) 657-2837 

Web Site: www.seeq.com 



1992 1993 1994 1995 1996 

Sales 37 33 21 23 31 

Net Income (11) (4) (8) 1 3 


Employees 190 161 67 67 74 


Seeq Technology was established in 1981 to develop, produce, and market EEPROMs. Over the years the 

company has undergone a series of transitions that has created a company that is today much different than it was 

founded to be. Seeq began developing Ethernet products in 1982 and adopted a strategy to have its products 

manufactured by outside foundries in 1989. As a result of the foundry alliances that were established, the 

company shut down its wafer fab facility in 1992 and thus became a fabless IC supplier. In early 1994, the 

company abandoned the market it had itself created by selling its EEPROM business to competitor Atmel 

Corporation for $10 million. Additionally, the company's Ethernet adapter board product line was discontinued in 

early 1994. 

Seeq now focuses exclusively on local area network (LAN) communication devices and subsystems. These 

products are targeted at system manufacturers in the personal computer, workstation, printer, networking, and 

telecommunications markets. Fast Ethernet devices accounted for 31 percent of total revenues in 1996. 


North American Company Profiles Seeq Technology 

Management 

Asia-Pacific 

19% 

Europe 

6% 

U.S. 

75% 


Alan V. Gregory Chairman 

Phillip J. Salsbury, Ph.D. President and Chief Executive Officer 

Stephen Dreyer Vice President, Engineering 

Walter B. Gebaur Vice President, Manufacturing 

Barry Gray Vice President, Marketing 

Robert O. Hersh Vice President, Finance and Chief Financial Officer 

Philip A. Ortiz Vice President, Worldwide Sales 

Albert Schadlick Vice President, Eastern Sales 


Seeq supplies Ethernet data communication controllers, encoder/decoders, coaxial and unshielded twisted pair 

cable CMOS transceivers, and networking modules. The company also sells media signaling ICs for the highspeed 

ATM (Asynchronous Transfer Mode) LAN market. Its products are designed using proprietary digital and 

mixed-signal CMOS processes, including submicron technologies (0.8μm and 0.6μm). 


Seeq has established several agreements with wafer-based and ASIC-based foundry suppliers. Its volume wafer 

processing partners are AMI, Hualon Microelectronics Corporation (HMC), Ricoh, and Rohm. VLSI Technology 

and Samsung are used for turn-key manufacturing using either a standard cell or a gate array approach. 


• In 1995, Seeq re-established its foundry relationship with HMC for the manufacture of its mixed-signal products 

with an agreement that guarantees foundry services through July 1998. Seeq is also sharing resources with 

HMC to co-develop new generations of analog circuits for Ethernet data communications products. 


Semtech North American Company Profiles 

1-304 

SEMTECH 

Semtech Corporation 

652 Mitchell Road 


Telephone: (805) 498-2111 

Fax: (805) 499-5487 

Web Site: www.semtech.com 


Financial History ($M), Fiscal Year Ends January 31 

1993 1994 1995 1996 1997 

Sales 20 21 36 62 65 

Net Income 0.4 1 2 7 8 



Employees 340 372 500 505 


Semtech Corporation, incorporated in 1960, manufactures and markets a wide variety of semiconductor products 

focused at both commercial and military applications. Initially, Semtech only supplied semiconductor devices to 

the military and aerospace industries. However, in 1990, Semtech began its migration into commercial markets 

with the acquisition of Lambda Electronics. This equipped Semtech with an IC fab facility in Corpus Christi, Texas. 

In 1992, the company acquired Modupower Inc., a supplier of solid state modules, further moving Semtech into 

the commercial marketplace. In late 1995, Semtech acquired ECI Semiconductor, an analog semiconductor 

manufacturer located in Santa Clara, California. From ECI, Semtech gained new process technology, additional 

wafer fab capacity, and ECI’s foundry customer base. 

Today, Semtech’s primary focus is on the personal computer and telecommunications markets, though it still 

maintains a presence in the military and aerospace markets. In fiscal 1997, military and aerospace revenues 

accounted for 14 percent of total revenues, down from 40 percent in 1995. 


North American Company Profiles Semtech 

Management 

Far East 

33% 

European 

13% 


54% 


Military and 

Aerospace 

14% 


8% 

Foundry 

15% 

John D. Poe President and Chief Executive Officer 

Raymond E. Bregar Executive Vice President, Corporate Operations 

David I. Anderson Vice President, IC Design and Development 

David G. Franz, Jr. Vice President, Finance, and Chief Financial Officer 

Jean Claude Zambelli Vice President, Sales and Marketing 


Industrial 

22% 

Computer 

41% 


Semtech offers a wide range of integrated circuits and discrete devices including transient voltage suppressors, 

linear and switching voltage regulators, DC-to-DC power modules, rectifiers, high voltage monolithic ceramic 

capacitors, and modular assemblies. 

Through its acquisition of ECI Semiconductor, Semtech now offers linear and mixed-signal CMOS arrays, linear 

bipolar arrays, standard analog circuits, and RF discretes, in addition to offering foundry services. 


Semtech Corpus Cristi Semtech Santa Clara (formerly ECI Semiconductor) 

121 International Boulevard 975 Comstock Street 

Corpus Christi, Texas 78406 Santa Clara, California 95054 


Wafer size: 100mm Wafer sizes: 100mm, 125mm 

Process: Bipolar Processes: CMOS, bipolar 

Products: Linear ICs Products: ASICs, linear ICs, discretes, foundry 

Feature size: 3.0μm Feature sizes: 3.0μm, 4.0μm, 5.0μm 

Semtech Corporation 

652 Mitchell Road 


Telephone: (805) 498-2111 



Sensory North American Company Profiles 

Employees 29 


1-306 

SENSORY 

Sensory, Inc. 

521 East Weddell Drive 


Telephone: (408) 744-9000 

Fax: (408) 744-1299 

Web Site: www.sensoryinc.com 


Founded in 1994, Sensory, Inc. is a privately held company that designs and markets high-quality low-cost ICs that 

perform speech recognition, speaker verification, speech and music synthesis, audio record/playback, and 

general purpose product control for consumer electronic applications, including telecommunications devices, 

interactive toys, home appliances, personal electronics, and security devices. 

Management 

Todd Mozer President and Chief Executive Officer 

Mark Frankel Vice President, Sales 

Robert Savoie Vice President, Technology 

Keith Kitami Director, Marketing 


Sensory’s current products include the Interactive Speech line of integrated circuits (ICs). This family of chips is 

designed to “bring life to products” through Sensory’s speech and audio technologies. The Interactive Speech 

single-chip ICs utilize neural network technology to deliver high-quality low-cost speech recognition and speaker 

verification solutions to telecommunications and consumer electronic products. 

Other services offered by Sensory include product specification, vocabulary development for recognition and 

synthesis, circuit board design, application programming, product design consulting, and custom ICs. 

Sensory’s complete product line is produced using a 0.6μm CMOS process technology. 


North American Company Profiles Sierra Semiconductor 


SIERRA SEMICONDUCTOR 

Sierra Semiconductor Corporation 

2222 Qume Drive 


Telephone: (408) 434-9300 

Fax: (408) 894-0218 

Web Site: www.pmc-sierra.com/sierra_semi_site 


Europe: PMC-Sierra, Inc. • Warrington, Cheshire, United Kingdom 

Telephone: (44) (1925) 651122 • Fax: (44) (1925) 650033 


1992 1993 1994 1995 1996 

Sales 92 83 105 189 188 

Net Income 12 (13) (9) 1 (51) 


Employees 322 295 335 480 500 


Founded in 1984, Sierra Semiconductor and its wholly owned subsidiary, PMC-Sierra, Inc., develop and market 

high-performance semiconductor system solutions for advanced communications applications. The company 

participates in the broadband communications infrastructure and local area networking segments of the 

communications industry with its product lines of ATM (Asynchronous Transfer Mode), T1/E1, DS3/E3, and 

Sonet/SDH ICs and subsystems developed and marketed by PMC-Sierra. Sierra also offers products for 

multimedia personal computers, such as highly integrated data and voice communications devices and 

graphics/imaging products. 

In August 1996, the company announced its decision to exit the PC modem chipset business and put the product 

line up for sale in an effort to focus on its networking and infrastructure semiconductor business. Also part of this 

effort was the acquisition of the Ethernet switching technology and assets of Bit, Inc., a small, fabless firm in 

Beaverton, Oregon. Bit was folded into PMC-Sierra and operates as a new product group focused on Ethernet 

applications. 


Sierra Semiconductor North American Company Profiles 

Burnaby, British Columbia-based PMC-Sierra was originally established in 1992 as Pacific Microelectronics Centre, 

a spinoff of MPR Teltech Ltd., the research arm of the British Columbia phone company. The spinoff was 

supported by a significant investment from Sierra for 61 percent of PMC’s stock. PMC was then fully acquired by 

Sierra in the third quarter of 1994 and subsequently renamed PMC-Sierra. 

International sales accounted for over 50 percent of Sierra’s total revenues in 1996. 

Management 

James V. Diller Chairman, President, and Chief Executive Officer 

Glenn C. Jones Senior Vice President, Finance and Chief Financial Officer 

George D. Antenucci Vice President, Human Resources 

Naresh K. Batra Vice President and General Manager, Multimedia Products 

Alden J. Chauvin, Jr. Vice President, Worldwide Sales 

Victor Godbole Vice President, Strategic Planning and System Engineering 

Raman K. Rao Vice President, Operations 

Marc E. Robinson Vice President, Technology Development and Quality 

Robert L. Bailey President and Chief Executive Officer, PMC-Sierra, Inc. 


Sierra's semiconductor product offerings include WAN and LAN chipsets and subsystems; audio, voice synthesis, 

and voice recognition circuits; and graphics and imaging products. Much of the company’s development efforts 

are focused on ATM and related products. 

Sierra uses what it calls a "Triple Technology" process that uses its competencies in analog, digital, and EEPROM 

technologies to provide complex IC system solutions. 


Sierra Semiconductor is a fabless IC operation, with the majority of its wafers (as much as 60 percent) being 

manufactured by Chartered Semiconductor. In 1987, the company formed Chartered Semiconductor as a faband-test 

joint venture with Singapore Technologies Industrial Corporation Pte. Ltd. Sierra originally held a minority 

interest in the venture and licensed Chartered Semiconductor to use its manufacturing processes and test 

technologies. In 1993, Singapore Technologies purchased all of the shares held by Sierra. 

Sierra also uses Taiwan Semiconductor Manufacturing Co. (TSMC), LG Semicon, and IC Works for the fabrication 

of its wafers. 

1-308 


North American Company Profiles Signal Processing Technologies 

Employees 100 


SIGNAL PROCESSING TECHNOLOGIES (SPT) 

Signal Processing Technologies, Inc. 

4755 Forge Road 


Telephone: (719) 528-2300 

Fax: (719) 528-2370 

Web Site: www.spt.com 


Signal Processing Technologies (SPT) is a supplier of high-performance data conversion and signal conditioning 

integrated circuits. It was formed in 1983 as a business unit of Honeywell's semiconductor group. SPT was then 

acquired in 1989 by a group of private investors and an employee team and was established as a separate 

corporation. In June 1990, the company became a wholly-owned subsidiary of Japan's Toko, Inc., a worldwide 

supplier of electronic components and integrated circuits. 

Management 

Ben Takada General Manager 

Richard Mintle Director, Sales and Marketing 

Alfi Moscovici Director, Engineering 

Mike Ruebenson Director, Finance and Administration 


SPT offers a portfolio of products that includes high-speed comparators and A/D and D/A converters. The 

company's primary focus is on developing proprietary, high-performance signal conditioning and data conversion 

products. It has received funding from its parent to develop new analog products designed for a variety of 

commercial, industrial, and military applications. 


Toko acts as the foundry for SPT. In late 1992, SPT purchased a former Digital Equipment Corp. R&D facility, 

which more than doubled the company's engineering and test area. The facility includes a 10,000 square-foot 

space that SPT may convert into a Class 10 or Class 1 fab in the future. 


Siliconix North American Company Profiles 

1-310 

SILICONIX 

Siliconix Incorporated 

(Member of TEMIC Semiconductors) 

2201 Laurelwood Road 


Telephone: (408) 988-8000 

Fax: (408) 970-3950 



1992 1993 1994 1995 1996 

Sales 155 171 197 250 269 

IC Sales 43 36 34 64 65 

Discrete Sales 112 135 163 186 204 

Net Income 5 7 11 24 26 



Employees 1,202 1,211 1,172 1,269 1,228 


Founded in 1962, Siliconix designs, manufactures, and markets ICs and discrete components for switching, motor 

control, and power management in computers, automotive, instrumentation, and telecommunications 

applications. AEG Capital Corporation became a majority shareholder of the company in December 1990, 

increasing its ownership from 38 percent to 80 percent of the company's outstanding stock. In July 1992, 

Siliconix was joined with Telefunken Semiconductors, Matra MHS, and Dialog Semiconductor to form the 

semiconductor division of TEMIC, the microelectronics group of Daimler-Benz AG, a German automotive, 

electronics, and aerospace conglomerate. 

In 1996, Siliconix restructured its business to better reach its target markets. Power MOS, Power IC, and Signal 

Processing product units were created with profit and loss responsibilities for their respective product lines. The 

Power MOS and Signal Processing units report jointly to Siliconix and the Discrete Components Division of TEMIC 

Semiconductors. The Power IC unit reports jointly to Siliconix and the Integrated Circuits Division of TEMIC 

Semiconductors. 


North American Company Profiles Siliconix 

Management 

Asia Pacific 

21% 

Japan 

19% 

Europe 

27% 


33% 


Richard J. Kulle President and Chief Executive Officer 

King Owyang Executive Vice President, Technology and Silicon Operations 

Jürgen F. Biehn Senior Vice President and Chief Financial Officer 

Michael Gingrass Vice President, Environmental and Plant Services 

Rod Graham Vice President, Worldwide Sales 

G. Thomas Simmons Vice President, Strategic Marketing and Business Development 


Siliconix's power transistors and integrated circuits are mainly used for power management and motion control in 

computers, hard disk drives, automobiles, and communications systems. The company's analog switches, analog 

multiplexers, and low-power transistors are used to sense, switch, and route signals in video, multimedia, 

instrumentation, and test equipment in both industrial and hi-rel environments. 

In 1996, sales of power MOSFETs, the company’s fastest growing product group, and power ICs accounted for 

about 74 percent of total sales. Siliconix expects this percentage to increase as the company continues its push 

into the high-end disk drive market. 

Analog Switch and 

Low-Power Discretes 

26% 

Power MOSFETs 

and Power ICs 

74% 



Siliconix North American Company Profiles 

Siliconix provides products and technologies that directly answer the market's demand for smaller, more efficient, 

and more cost-effective components. The company's Lite Foot discrete power transistors are the industry's 

most compact solution for motion control in hard disk drives and for load management in portable computers. 

These miniaturized products can be mounted directly on the printed circuit board, and are the first such power 

devices small enough to fit in a PCMCIA card. The company's Little Foot ® line has been designed into telecom 

systems, automotive air bag triggers, and numerous other applications where space-savings and efficiency are at a 

premium. In early 1997, Siliconix announced a family of specialized power MOSFETs as part of its Little Foot 

product line. The devices are designed to work with most low-voltage pulse width modulation (PWM) controllers. 

Each of the five new devices is designed to handle a different power level, and thus each targets a different 

application. 

Siliconix's power integrated circuits combine the functions of two or more discrete transistors on one chip. A family 

of high-frequency switchmode regulator and controller ICs designed for use with Lite Foot or Little Foot discretes 

offers the optimal level of integration for DC-to-DC conversion in battery-operated equipment, including laptop 

and notebook computers. For data storage customers the company offers highly integrated chips for voice coil 

and spindle motor control. Other IC products include power interface devices for computers equipped with dual 

battery packs or PCMCIA slots, power ICs for bus control in automobiles, and analog switches and multiplexers for 

use in signal switching and routing in electronic instruments and industrial equipment. 

Siliconix utilizes CMOS, DMOS, BiCMOS, and BiC/DMOS (BCDMOS) technologies in the manufacture of its IC 

and discrete products. The company's power ICs are manufactured using its proprietary self-isolated BCDMOS 

technologies, which include the BCD15 process for producing power ICs operating from 2.5V to 15V and the 

BCD60 process for producing power ICs operating up to 60V. 


Siliconix Incorporated Siliconix Incorporated 

2201 Laurelwood Road 2201 Laurelwood Road 

Santa Clara, California 95056 Santa Clara, California 95056 

Fab 2 (Will be closed in 1997) Fab 3 



Processes: CMOS, DMOS, BiCMOS, BCDMOS Processes: CMOS, DMOS, BiCMOS, BCDMOS 

Products: Linear and power ICs, discretes Products: Power ICs and discretes 


1-312 


North American Company Profiles Siliconix 

Siliconix/TEMIC 

Itzehoe, Germany 


Wafer sizes: 150mm, 200mm 

Processes: PowerMOS, BiCMOS 


Siliconix also uses a foundry in Taiwan for the production of some of its cost-sensitive analog switch and low-power 

discrete product lines. 

High-volume assembly and product testing is handled at the company's facilities in Kaohsiung, Taiwan, a joint 

venture in Shanghai, China, called Simconix, and at subcontractors in the Philippines, India, Taiwan, and China. A 

limited amount of assembly and product test is performed in Santa Clara. 


Simtek North American Company Profiles 

1-314 

SIMTEK 

Simtek Corporation 

1465 Kelly Johnson Boulevard 


Telephone: (719) 531-9444 

Fax: (719) 531-9481 

Web Site: www.csn.net/simtek 



1992 1993 1994 1995 1996 

Sales 0.5 3 1 2 5 

Net Income (6) (6) (4) (3) 0.1 


Employees 25 32 25 17 17 


Simtek Corporation has designed, developed, and marketed non-volatile semiconductor memory products since 

it commenced business operations in 1987. Its concentration has been on the design and development of fast 

nvSRAMs (non-volatile SRAMs) and associated products and technologies. 

Simtek's products are aimed at avionics subsystems, portable computers and instruments, medical 

instrumentation, navigation aids, robotics, telecommunications systems, and other high performance applications. 

Military product sales represented 36 percent of total sales in 1996. 


47% International 

53% 



North American Company Profiles Simtek 

Management 

Richard L. Petritz Chairman, President, and Chief Executive Officer 

Jack Maxcy Vice President, Production 

Albert S. Weiner Vice President, Engineering 

Sheldon A. Taylor Director 


Simtek's nvSRAM product family includes 4K, 16K, 64K, and 256K devices with access speeds ranging from 

25ns to 45ns. The nvSRAMs utilize a unique patented memory cell technology called Novcel, which integrates 

fast SRAM and EEPROM elements in each cell. In late 1993, Simtek introduced its AutoStore nvSRAMs, which 

automatically detect power loss and transfer data from SRAM into EEPROM. 

Simtek uses an advanced implementation of silicon-nitride-oxide-semiconductor (SNOS) technology in the 

design of its products. The company's Novcel technology is compatible with basic CMOS technology, allowing 

nvSRAM memory cells to be incorporated with other system level semiconductor products. 

Simtek’s products are based on 1.2μm and 0.8μm process technologies. In 1996, products based on 1.2μm 

process technology represented 68 percent of sales, while products based on 0.8μm process technology made 

up the remaining 32 percent. 


Simtek has foundry agreements with Chartered Semiconductor Manufacturing (CSM) of Singapore and Zentrum 

Mikroelektronik Dresden of Germany for the manufacture of its wafers. 


• Simtek signed an agreement with Zentrum Mikroelektronik Dresden (ZMD) in mid-1994 to install its 1.2μm 

process in ZMD's fab in Germany and to jointly develop 0.8μm process technology. The agreement was later 

modified to bypass the installation of 1.2μm technology and instead install 0.8μm technology. ZMD also 

received a license to sell Simtek's 64K and 256K nvSRAMs built in the 0.8μm process. 

In 1995, the two companies expanded their relationship to include the joint development of additional 

nvSRAMs using the 0.8μm process. ZMD agreed to finance the development in exchange for shares in 

Simtek. In the second quarter of 1996, ZMD began supplying Simtek with 64K finished units based on 0.8μm 

process technology. ZMD is the largest shareholder of Simtek, owning 30 percent. 

• Simtek entered into a manufacturing and development agreement with Chartered Semiconductor 

Manufacturing (CSM) in 1992 for 64K through 1M nvSRAMs. CSM will provide Simtek with wafers at least 

through 3Q97. 

• Simtek established an agreement in 1989 with GEC Plessey Semiconductors under which GEC Plessey has 

the right to incorporate Simtek's non-volatile memory technology into its ASICs. In 1990, the agreement was 

extended to grant GEC Plessey a worldwide license to manufacture and market Simtek's nvSRAM devices. 


Single Chip Systems North American Company Profiles 


1-316 

SINGLE CHIP SYSTEMS 

Single Chip Systems Corporation 

10905 Technology Place 


Telephone: (619) 485-9196 

Fax: (619) 485-0561 


Single Chip Systems (formerly Instant Circuit Corporation) was established in 1992 to design and sell electrically 

programmable integrated circuits that employ patented antifuse technology. Specifically, Single Chip Systems is 

developing IC products for the radio frequency identification (RF/ID) market. The company also assembles its ICs 

into electronic ID tags. The company has not yet sold ICs of its own, but has produced test wafers. 

Management 

Bruce B. Roesner, Ph.D. Chairman and Chief Technical Officer 

Jacob Jacobson President and Chief Executive Officer 

Gregory A. Bohdan Vice President and Chief Financial Officer 


The company's first product is an electronic ID tag and scanner system that offers a significant increase in 

performance and decrease in cost compared to existing systems. 


Single Chip Systems' ICs are manufactured at independent foundries. 


North American Company Profiles Sipex 


SIPEX 

Sipex Corporation 

22 Linnell Circle 

Billerica, Massachusetts 01821 

Telephone: (508) 667-8700 

Fax: (508) 667-8310 

Web Site: www.sipex.com 


Japan: Nippon Sipex Corporation • Chiyoda-ku, Tokyo, Japan 

Telephone: (81) (3) 3254-5822 • Fax: (81) (3) 3254-5824 

Europe: Sipex SARL • Rungis Cedex, France 

Telephone: (33) (1) 4687-8336 • Fax: (33) (1) 4560-0784 


1992 1993 1994 1995 1996 

Sales 29 28 23 30 23 

Net Income (8) (4) (5) (2) 4 





Sipex Corporation is a leading designer and manufacturer of high-performance, high valued-added analog 

integrated circuits. The company is focused on three market areas: data communications and 

telecommunications; battery powered/portable products; and industrial controls/instrumentation. Sipex serves 

these market sectors with three primary product lines: interface circuits, low power application-specific analog 

circuits, and data converter products. The company pioneered the design, development, and manufacture of 

electroluminescent lamp (EL) driver circuits. 


Sipex North American Company Profiles 

Sipex was established in 1965 under the name Hybrid Systems Inc. and until the late 1980’s focused on the 

design and manufacture of data conversion products utilizing hybrid technology, primarily for the military market. 

The company merged with DataLinear Corporation in 1986 and then with Dielectric Semiconductor Inc. in 1987, at 

which time the company name was changed to Sipex Corporation. Then in 1988, the company acquired Barvon 

BiCMOS Technology, Inc., a designer and manufacturer of custom and standard monolithic products for 

commercial markets. The development of new standard hybrid products was discontinued in 1989, and while the 

company continues to support the military markets with existing hybrid products, its focus today is on commercial 

products. 

1-318 

Military 

20% 

Commercial 

80% 


International sales account for approximately 42 percent of the company’s net sales in 1996. 

Management 

James E. Donegan Chairman, President, and Chief Executive Officer 

Frank R. DiPietro Executive Vice President and Chief Financial Officer 

Raymond W.B. Chow Senior Vice President 

Sanford Cohen Senior Vice President, Technology 


Sipex offers both standard and custom products. The standard products include interface (line drivers/receivers), 

electroluminescent lamp driver circuits, data conversion products, and other linear products, while the custom 

products include full-custom monolithic ICs and custom multichip products. The company also provides 

dielectrically isolated silicon substrates to a broad spectrum of semiconductor manufacturers. 

For interface products, Sipex offers a full line of products, including low-power single interface products 

supporting RS-232 and RS-485 standards and programmable multi-mode serial interface transceivers allowing 

single chips to communicate in up to eight different standards. These products are fabricated in a high-voltage 

BiCMOS process technology and specialize in low-power 5V-only operation. 

The low-power application-specific products utilize a proprietary dielectrically isolated (DI) BiCMOS process 

technology that allows both very low voltages (1V) and very high voltages (100V) to be used simultaneously on 

the same IC. The company’s EL driver circuits are based on this specialized process. 

For data converter products, Sipex specializes in high-accuracy 12-bit A/D and D/A converters. 


North American Company Profiles Sipex 

The broad base of semiconductor processes and technologies used by Sipex enable it to design products 

optimized for each application. Sipex focuses on leveraging its specialized dielectrically isolated BiCMOS 

technology, which the company believes is particularly well suited to the low-power, low-voltage requirements of 

battery powered/portable products. 

The company utilizes its own fabrication facility for producing 3.0μm to 5.0μm dielectrically isolated complementary 

bipolar and BiCMOS linear devices, and has strategic foundry relationships for producing 0.8μm to 4.0μm 

BiCMOS and CMOS linear devices. 


As already mentioned, the company’s own wafer fabrication facility produces products utilizing the company’s DI 

complementary bipolar and BiCMOS processes. The company’s BiCMOS and CMOS products are manufactured 

using fully processed wafers supplied primarily by UMC, Orbit Semiconductor, and Calogic Corporation. 

Sipex Corporation 

491 Fairview Way 


Telephone: (408) 945-9080 

Fax: (408) 946-6191 




Products: Linear ICs 



Space Electronics North American Company Profiles 


1995 1996 

Sales 4 10 


1-320 

SPACE ELECTRONICS (SEI) 

Space Electronics, Inc. 

4031 Sorrento Valley Boulevard 


Telephone: (619) 452-4167 

Fax: (619) 452-5499 

Web Site: www.newspace.com/spaceelec 


Space Electronics, Inc. (SEI) was established in 1992 as a spin-off of Science Applications International 

Corporation (SAIC) Microelectronics Technology Center. The focus of Space Electronics is to address the niche 

market of spacecraft microcircuits. The company’s proprietary Rad-Pak, Rad-Coat, and LPT technologies 

enable off-the-shelf commercial microelectronic components to survive the typical radiation levels encountered in 

space. 

Management 

Robert Czajkowski Chief Executive Officer 

David J. Strobel President 

Paul Blevins Chief Financial Officer 

David Czajkowski Manager, Marketing 

Edward Li Manager, Sales 

Stuart Shanken Manager, Products 


Space Electronics' products and services include power MOSFETs, A/D and D/A converters, FPGAs, logic ICs, 

interface ICs, memory (EEPROMs, DRAMs, SRAMs, flash memories, and FIFOs), processors, and coprocessors. 

For demanding imaging requirements, Space Electronics provides high performance Megatek ® 2D graphics 

accelerator cards in “S” bus and VME bus configurations. 


North American Company Profiles SST 

SILICON STORAGE TECHNOLOGY (SST) 


Silicon Storage Technology, Inc. 

1171 Sonora Court 


Telephone: (408) 735-9110 

Fax: (408) 735-9036 

Web Site: www.ssti.com 


Japan: Silicon Storage Technology Asia • Yokohama, Japan 

Telephone: (81) (45) 471-1851 • Fax: (81) (45) 471-3285 


1992 1993 1994 1995 1996 

Sales 1* 4* 4 40 93 

Net Income 1 0.2 (5) 6 12 


Employees 143 

*Primarily license revenues 


Silicon Storage Technology (SST) was founded in 1989 and is a supplier of non-volatile memories, specifically 

flash memory devices. The company currently offers medium density devices ranging from 512K to 4M, for a 

range of applications in the computer, communications, multimedia, and video game markets. 

Product development at SST is focused on developing new memory products featuring higher densities, such as 

16M and 32M flash memories, for use in digital cameras, memory cards, and digital cellular phones. For the 

company’s higher density products, the company is also developing advanced process technologies. 

SST made its initial public offering in November 1995. 


SST North American Company Profiles 

Management 

1-322 

Other 

27% 

U.S. 

14% Japan 

20% 

Taiwan 

39% 


Bing Yeh Chairman, President, and Chief Executive Officer 

Thomas A. Freeze Executive Vice President and Chief Operating Officer 

Yaw-Wen Hu Vice President, Technology Development and Wafer Manufacturing 

Isao Nojima Vice President, Memory Design and Product Engineering 

Michael J. Praisner Vice President, Finance and Administration, and Chief Financial Officer 

David Sweetman Vice President, Quality and Customer Support 

Amy Yuen Vice President, Operations 


Page Mode Flash Memories— 

512K Page Mode Flash Memory—2.7V-, 3V-, and 5V-only 

1M Page Mode Flash Memory—2.7V-, 3V-, and 5V-only 

2M Page Mode Flash Memory—2.7V-, 3V-, and 5V-only 

Page Erase, Byte Program Flash Memories 

4M SuperFlash Flash Memory—2.7V-, 3V-, and 5V-only 

4M PCMCIA Interface Flash Memory—3V- and 5V-only 

The company’s products are designed and manufactured using the company proprietary SuperFlash CMOS 

technology. 


SST is a fabless company, therefore, its uses independent foundry companies for the manufacturing of its 

devices. The company’s primary foundry partners are Sanyo and Winbond, but SST also has foundry and 

licensing agreements with TSMC and Seiko Epson. 


North American Company Profiles SST 


• In February 1997, SST signed an agreement with foundry partner TSMC for the production of its 2M products. 

As part of the agreement, SST licensed its SuperFlash technology to TSMC in exchange for manufactured 

wafers. 

• In 1996, SST licensed its SuperFlash technology to Seiko Epson and established a foundry agreement for 

production capacity. 

• SST established a foundry agreement with Sanyo that provides wafer production capacity to SST through 

2009. SST has a similar agreement with Winbond that expires in 2008. 

• SST licensed Rockwell the right to use its technology to produce and market 0.8μm embedded modem chips. 

The company has similar agreements with ISD and Analog Devices. 


Standard Microsystems North American Company Profiles 

1-324 

STANDARD MICROSYSTEMS (SMC) 


Standard Microsystems Corporation 

Component Products Division 

80 Arkay Drive 

Hauppauge, New York 11788-9725 

Telephone: (516) 435-6000 

Fax: (516) 271-6004 

Web Site: www.smc.com 


Japan: Toyo Microsystems Corporation (SMC Subsidiary) • Tokyo, Japan 

Telephone: (81) (3) 5721-2271 • Fax: (81) (3) 5721-2270 

Europe: Standard Microsystems GmbH • Munich, Germany 

Telephone: (49) (89) 92861170 • Fax: (49) (89) 92861190 

Asia-Pacific: Standard Microsystems Corporation • Taipei, Taiwan 

Telephone: (886) (2) 578-7118 • Fax: (886) (2) 579-1737 

Financial History ($M), Fiscal Year Ends February 28 

1993 1994 1995 1996 1997 

Corporate 

Sales 251 323 379 342 354 

Net Income 16 20 24 12 (21) 

Semiconductor 

Sales 25 57 117 139 179 


Standard Microsystems Corporation (SMC) is comprised of two complementary business divisions: Component 

Products and System Products. The System Products Division designs, produces, and markets hardware and 

software products for the PC local area network (LAN) market. The Component Products Division develops, 

manufactures, and markets VLSI microperipheral circuits. Its products are sold chiefly in the PC market for 

input/output and network control applications, and in industrial and transportation markets for network control 

applications. 


North American Company Profiles Standard Microsystems 

SMC was strictly a chip manufacturer when it was founded in 1971. Then, in the early 1980's, the System 

Products Division was created and in 1991, Western Digital's LAN Products Division was acquired. The company's 

networking business grew to represent as much as 90 percent of total revenues (fiscal 1993). However, demand 

for the Component Products Division’s products has been strong over the past few years, boosting its share of 

total revenues to 50 percent in fiscal 1997. 

To further its advancement into the chipset market, the Component Products Division announced the acquisition 

of EFAR Microsystems, Inc. in early 1996. Technologies obtained from the acquisition include the UltraCore PCI 

PC systems logic chipset for 64-bit microprocessors and the UltraCache PCI core logic chipset with integrated 

cache memory. The UltraCore was developed in cooperation with MoSys Inc. EFAR now operates as a separate 

business unit called the Personal Computer Systems Logic Business Unit within the Component Products 

Division of SMC. 

In early 1997, SMC made its move toward the application specific memory (ASM) market by purchasing a 20 

percent equity stake in Ontario, Canada-based Accelerix. As part of the agreement, SMC gained rights to market, 

second-source, and enhance technology developed by Accelerix. SMC plans to combine its skills with those of 

other companies associated with Accelerix to pursue the PC semiconductor market with “system-on-a-chip” 

devices that employ ASM technology. 

Management 


Paul Richman Chairman and Chief Executive Officer 

Eric M. Nowling Acting Chief Financial Officer 

Arthur Sidorsky Executive Vice President, Component Products Division 

Lance Murrah Senior Vice President and General Manager, System Products Division 

Reginald R. Maton, Jr. Vice President and Chief Information Officer 

SMC’s Component Products Division 

John E. Burgess Vice President, Sales 

Douglas L. Finke Vice President and GM, Wafer Foundry Business Unit 

Lawrence H. Goldstein Vice President, Engineering 

R. Hollingsworth Vice President, Marketing 

Peter Ju Vice President, Personal Computer Systems Logic Business Unit 

Di Ma Vice President, Component Products Operations 


SMC's IC product and service offerings include the following: 

• Personal computer I/O devices that perform many of the basic input/output functions required in every PC, 

including floppy disk control, IDE hard disk interface, parallel port control, and serial port control. Included is a 

family of Super I/O devices that integrate all of the above functions on a single IC. The Super I/O family includes 

other new products such as a single-chip PCI-to-IDE hard disk interface. 


Standard Microsystems North American Company Profiles 

• Highly integrated single-chip Ethernet products such as an IC that incorporates an encoder/decoder, 10Base-T 

transceiver, AT bus interface, and memory management unit (MMU) on a single chip. 

• ARCNET LAN devices for use in PCs and in industrial networking environments. 

• Foundry services for customers desiring wafer fabrication capacity for 1.6μm geometries and above or for 

specialized semiconductor processing requirements that require unique thin film expertise. In early 1997, SMC 

announced plans to fully convert its fab to a foundry for the production of micro-electro-mechanical systems 

(MEMS), which are tiny systems such as sensors, motors, and valves used in a variety of applications. SMC has 

been producing MEMS for several years. 


SMC utilizes a mix of internal and external wafer fabrication sources to manufacture its products. Its more mature 

products are produced at its fab in New York, while newer products, utilizing 0.6μm and 0.5μm technologies are 

produced by external wafer foundries in the U.S., Europe, and Asia. SMC’s core-logic products (acquired with 

EFAR) are built by TSMC in Taiwan. 

In 1995, SMC made a $12 million investment in Lucent Technologies’ Madrid fab and a $20 million investment in 

Chartered Semiconductor to enhance its external wafer supply (see Key Agreements). 


Component Products Division 

35 Marcus Boulevard 

Hauppauge, New York 11788 



Processes: CMOS, MOS 

Products: LAN ICs, disk controllers, 

discretes, foundry services 


(This fab is being fully converted to 

a dedicated MEMS foundry.) 


• SMC and Intel agreed to work together to integrate new semiconductor I/O chips into selected Intel PC 

motherboard designs through the end of 1997. SMC will provide Intel with the I/O devices, which have been 

specifically designed to work with Intel’s newer microprocessors and core logic chipsets. Intel holds a 10 

percent equity interest in SMC. 

1-326 


North American Company Profiles Standard Microsystems 

• In 1995, SMC made a $20 million investment in Singapore-based foundry Chartered Semiconductor 

Manufacturing (CSM) in return for guaranteed capacity from CSM's new 200mm wafer fab that came on-line in 

2H95. 

• SMC struck a foundry deal with Lucent Technologies in 1994 under which SMC agreed to boost the capacity of 

Lucent's fab facility in Madrid, Spain, in return for a guaranteed portion of the fab output over a five-year period. 

The new equipment has the capability to produce devices with 0.9μm to 0.45μm feature sizes. SMC received 

its first wafers in 1996. 


Supertex North American Company Profiles 


1-328 

SUPERTEX 

Supertex, Inc. 

1235 Bordeaux Drive 


Telephone: (408) 744-0100 

Fax: (408) 734-5247 

Web Site: www.supertex.com 


1993 1994 1995 1996 1997 

Sales 24 26 32 43 49 




Employees 240 235 265 274 280 


Established in 1976, Supertex is a niche-oriented company that designs, develops, manufactures, and markets 

high voltage semiconductor products utilizing advanced DMOS and HVCMOS process technologies. Supertex 

merged CMOS and DMOS processes creating its proprietary HVCMOS ® technology. The company originally 

conducted business as a foundry. However, starting in fiscal 1990, and through fiscal 1992, the company's 

foundry business was phased out as sales of proprietary products steadily increased. 

Supertex's proprietary products are sold to electronic equipment manufacturers in the computer, 

telecommunications, instrumentation, defense, medical, and consumer products industries. More specifically, 

Supertex's products are targeted at applications in ultrasound imaging and medical electronics, flat panel displays, 

non-impact printers and plotters, telecommunications, and high-reliability military and commercial aerospace 

systems. 

Europe and 

Far East 

44% 

United States 

56% 



North American Company Profiles Supertex 

Management 

Henry C. Pao, Ph.D. President and Chief Executive Officer 

Richard E. Siegel Executive Vice President 

Benedict C.K. Choy Senior Vice President, Technology Development and IC Products 

Michael V. Bond Vice President, DMOS Products 


Supertex has developed advanced technologies using CMOS and DMOS (Double-diffused MOS) processes. It 

pioneered the merging of CMOS and DMOS processes into its proprietary HVCMOS ® (high-voltage CMOS) 

technology. This process allows for the combination of the high speed and low power logic circuit of CMOS and 

the high voltage output drive of DMOS on the same chip, thus creating the high voltage IC, or HVIC. Supertex 

intends to maintain a leadership position in the HVIC segment of the semiconductor industry. 

• The DMOS product line includes depletion-mode and low-threshold enhancement-mode transistors and 

arrays. 

• The CMOS products encompass a range of offerings from microprocessor supervisory ICs to encoder/decoder 

and smoke detector chips. 

• There are three distinct categories of HVIC products available, digital products, analog products, and BiCMOS 

products. 

• The digital product family includes driver/interface ICs for flat panel displays and non-impact printers and 

plotters. 

• The analog product family includes high voltage analog switches and multiplexers, which are used in the 

medical ultrasound imaging industry, and pulse width modulators (PWMs). 

• The BiCMOS product family consists of DC/DC converters and power supply ICs. 


Supertex, Inc. 

1225 Bordeaux Drive 





Processes: CMOS, DMOS, HVCMOS, BiCMOS 

Products: High-voltage ICs, discretes 



Supertex North American Company Profiles 


• Supertex made an agreement with Texas Instruments in 1991 that provided TI the rights to use Supertex's 

HVCMOS process technologies in return for license fees and royalties, as well as access to TI's foundry and 

assembly services. 

• Supertex has received funding from the U.S. Government's ARPA agency to research and develop dielectricisolation 

(DI) technology. The goal of the project is to further raise the voltage and operating speed of ICs. 

1-330 


North American Company Profiles Symbios Logic 


SYMBIOS LOGIC 

Symbios Logic Inc. 

2001 Danfield Court 

Fort Collins, Colorado 80525-2998 

Telephone: (970) 226-9550 

Fax: (970) 226-9660 

Web Site: www.symbios.com 


Europe: Symbios Logic • Munich, Germany 

Telephone: (49) (89) 547470-0 • Fax: (49) (89) 547470-39 

Asia-Pacific: Symbios Logic • Singapore 

Telephone: (65) 337-6323 


1992 1993 1994 1995 1996 

Sales 228 274 354 520 600 

Employees 1,950 2,010 2,200 2,300 


Symbios Logic was established in February 1995 when Hyundai completed the purchase of the NCR 

Microelectronic Products Division from AT&T Global Information Solutions Co., a wholly owned subsidiary of AT&T 

Corporation. Originally established in 1996, NCR Microelectronic Products Division was acquired as part of NCR 

Corporation in 1991 by AT&T Corporation (NCR Corporation was later named AT&T Global Information Solutions). 

Hyundai renamed the division Symbios Logic, Symbios being a derivative from the word symbiosis, meaning a 

mutually beneficial relationship. 

Symbios Logic, now a wholly owned, independently operated subsidiary of Hyundai Electronics America, 

manufactures semicustom ICs including cell-based ASICs and gate arrays, as well as a family of application-specific 

standard products (ASSPs). Its cell library includes extensive analog functions for cell-based mixed-signal ASICs 

and complex standard function macrocells (cores) for embedded SCSI, Ethernet, disk drive electronics, and serial 

communications. Symbios Logic is a leader in bus interface technology, offering high-performance applicationspecific 

SCSI (including an extensive family of PCI-SCSI I/O controllers), Ethernet parts, and RAID subsystems and 

controllers. 


Symbios Logic North American Company Profiles 

Several firsts claimed by the company include the first SCSI protocol chip, the first OEM RAID chipset, and the first 

FibreChannel RAID Controller board. The company believes it holds 33 percent of the worldwide SCSI chip 

market, and 15 percent of the worldwide market for disk and tape drive electronics. 

Management 

H. Gene Patterson (acting) President and Chief Executive Officer 

C.S. Chung Vice President, Global Planning and Coordination, 

and Chief Financial Officer 

Jeff Dumas Vice President, General Counsel, and Secretary 

Dan Ellsworth Vice President, Technology 

Glenn Gainley Vice President, Business Units 

Tom Lagatta Vice President, World Sales 

Al Lofthus Vice President, Marketing 

Tim McCarthy Vice President, Manufacturing 


Symbios Logic is comprised of five business groups: Client/Server, OEM RAID, MetaStor, Drive Electronics, and 

ASIC Solutions. Listed below are the major products of each business group. 

Client/Server Products 

• Client and server I/O products including SCSI devices. 

• Communications products including LAN communications devices. 

• SCSI host adapter boards. 

OEM RAID 

• RAID-related products including RAID/disk array controller boards, I/O adapter boards, and OEM storage 

subsystems. 

MetaStor 

• Storage related products including RAID/disk array subsystems and tape arrays. 

Drive Electronics 

• Disk, tape, and CD-ROM drive electronic products, including data controllers, servo subsystems, and 

peripheral interfaces. 

ASIC Solutions 

• ASIC products include CMOS cell-based ASICs, both digital and mixed-signal, CMOS gate arrays, and complex 

SYMCore core-related products. In November 1996, Symbios unveiled its 0.35μm, five-layer-metal, onemillion-gate, 

cell-based ASIC family. The company’s cell and core libraries support a wide range of ASIC 

applications, including set-top boxes, cellular phones, PCs, workstations, telecommunications, LAN and 

wireless communications, and electronic data processing. Submicron mixed-signal CMOS ASICs account for 

more than one-third of Symbios’ cell-based ASIC sales. 

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North American Company Profiles Symbios Logic 


Symbios Logic Inc. Symbios Logic Inc. 

2001 Danfield Court 1635 Aeroplaza Drive 

Fort Collins, Colorado 80525 Colorado Springs, Colorado 80916 






Products: ASICs, ASSPs, logic ICs, foundry services Products: ASICs, ASSPs, logic ICs 


Approximately 20 percent of Symbios Logic’s IC products are manufactured by Hyundai. 


• Symbios Logic Inc. formed an alliance with Hyundai Electronics Industries (HEI) and Compass Design 

Automation to develop a new deep sub-micron 0.35μm five-layer metal CMOS technology. The program was 

successfully completed in early 1997. The partnership will likely be extended to the 0.25μm level. 

• In 1995, Symbios licensed Advanced RISC Machines Ltd.’s “Thumb” 32-bit RISC processor core for use in I/O 

channel controllers and other intelligent peripheral products. 


Synergy Semiconductor North American Company Profiles 


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SYNERGY SEMICONDUCTOR 

Synergy Semiconductor Corporation 

3450 Central Expressway 


Telephone: (408) 730-1313 

Fax: (408) 737-0831 

Web Site: www.synergysemi.com 


1993 1994 1995 1996 

Sales 14 19 26 30 



Founded in 1987, Synergy Semiconductor Corporation designs, develops, manufactures, and markets highperformance 

digital and mixed-signal integrated circuits using bipolar and BiCMOS processes. Synergy’s 

products include precision time-clock generators for computers and workstations, and communications circuits for 

local and wide area networks. Synergy’s products employ proprietary design and process technology, resulting in 

high-performance ICs. The company’s products are designed by an internal design team, and built in the 

company’s in-house wafer fabrication facility. 

Management 

Thomas D. Mino President and Chief Executive Officer 

T. Olin Nichols Chief Financial Officer 

George W. Brown Vice President, New Business Development 

Tom Lauer Vice President, Sales 

Larry J. Pollock Vice President, Research and Development 

Luke Smith Vice President, Operations 

E. Marshall Wilder Vice President, Quality and Administration 

Thomas S. Wong Vice President, Engineering 


Synergy supplies high-speed ICs to a range of systems vendors of public network equipment, such as 

multiplexers and digital access cross-connect systems (DACS); LAN and WAN private network equipment, such as 

adapter cards and hubs; high-performance workstations and superservers; and automatic test equipment (ATE). 


North American Company Profiles Synergy Semiconductor 

Synergy’s products encompass three families: the ECLinPS and Super300K family of ultra-high-speed ECL logic 

products, the ClockWorks family of clock generation and distribution devices, and the SuperCOM family of optical 

fiber transceivers, copper wire transceivers, and clock recovery devices. Synergy recently introduced a family of 

network and communication products for Fast Ethernet, FDDI, ATM, SONET, and SDH applications utilizing its 

proprietary bipolar ASSET (All Spacer Separated Element Transistor) technology. 


Synergy Semiconductor System Microelectronic Innovation GmbH (SMI) 

3450 Central Expressway Wildbahn, Markendorf 

Santa Clara, California 95051 O-15203 Frankfurt (Oder), Germany 

Telephone: (408) 730-1313 Telephone: (49) 335-46-2200 

Cleanroom size: 7,000 square feet Capacity (wafers/week): 2,400 (10,500 max.) 

Capacity (wafers/week): 500 Wafer size: 100mm 

Wafer size: 100mm Processes: Bipolar, BiCMOS 

Processes: Bipolar, BiCMOS Products: Logic, memory, and linear ICs, ASICs 

Products: Transceivers, SRAMs, logic products, Feature sizes: ≥1.2μm 

clock control circuits, FIFOs, translators (Joint venture between Synergy and the German 

Feature sizes: 1.2μm, 1.5μm (bipolar); government. Synergy holds a 49 percent stake.) 

1.0μm (BiCMOS); 

submicron in development 

Wafer probing and packaged product test capabilities are performed in-house. 


• In April 1995, Synergy entered into a technology license agreement with Linear Technology Corporation. 

Under the agreement, Synergy gave LTC the right to use the its bipolar ASSET technology to develop noncompetitive 

products. 

• In March of 1993, Synergy entered into a agreement with the German government to form System 

Microelectronic Innovation (SMI). This is a joint venture which is currently 49 percent owned by Synergy and 51 

percent owned by the German government. As part of this agreement, Synergy transferred its ASSET 

technology to SMI, enabling it to produce Synergy's family of ECL SRAMs, logic ICs, clock control circuits, 

translators, and semicustom products and market them throughout Europe. 

• Synergy entered into a comprehensive strategic alliance with Toshiba Corporation in November 1990. The 

alliance covers foundry, joint R&D and manufacturing, technology licensing, and an equity investment in 

Synergy by Toshiba. Under terms of the manufacturing agreement, Toshiba is providing Synergy with the use 

of a high-volume (150mm, submicron) IC fabrication line, which is running Synergy's high-performance ASSET 

and BiCMOS technologies. This fab allows Synergy to produce its current SRAM and logic products, as well as 

future products. 


TelCom Semiconductor North American Company Profiles 


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TELCOM SEMICONDUCTOR 

TelCom Semiconductor, Inc. 

1300 Terra Bella Avenue 

P.O. Box 7267 

Mountain View, California 94039-7267 

Telephone: (415) 968-9252 

Fax: (415) 967-1590 

Web SIte: www.telcom-semi.com 


Europe: TelCom Semiconductor GmbH • Martinsried, Germany 

Telephone: (49) (89) 89-56-500 • Fax: (49) (89) 89-56-5002 

Asia-Pacific: TelCom Semiconductor H.K. Ltd. • Kowloon, Hong Kong 

Telephone: (852) 2324-0122 • Fax: (852) 2354-9957 


1994 1995 1996 

Sales 25 39 38 

Net Income 1 4 (1) 

R&D Expenditures 1 3 4 




TelCom Semiconductor emerged in December 1993 as a result of a management-led buy-out of Teledyne 

Industries' Teledyne Components division. The operation's history stretches back to 1960 when Teledyne 

Industries began Amelco Semiconductor, one of Silicon Valley's first semiconductor firms. In 1970, Amelco 

merged with Continental Devices to form Teledyne Semiconductor. That company was then combined with three 

other Teledyne divisions – Philbrick, Crystalonics, and TAC – in 1990 to form Teledyne Components. Prior to the 

formation of TelCom, Teledyne Components' management shut down parts of the company – Philbrick and TAC – 

and sold the Crystalonics line. TelCom made its initial public offering in July 1995. 

Today, TelCom Semiconductor is building on Teledyne's strengths in analog and mixed-signal technology to 

develop standard ICs for high-volume consumer and commercial markets. TelCom's future growth strategy 

centers on the acquisition of mixed-signal technologies addressing the portable computing, communications, and 

instrumentation markets. The company has also said it will target energy management products. 


North American Company Profiles TelCom Semiconductor 

Management 

Europe 

25% 

U.S. 

37% 


Phillip M. Drayer President and Chief Executive Officer 

Edward D. Mitchell Vice President, Engineering and Chief Technical Officer 

R. Michael O'Malley Vice President, Chief Operating Manager, and Chief Financial Officer 

Gary P. Pinelli Vice President, Sales and Marketing 

Ali Tasdighi Vice President, New Product Development 

Allan I. Resnick Director, Operations 


TelCom's main products are divided into three areas of focus: 

• Mixed-signal ICs: includes A/D converters, V/F and F/V converters, and voltage references. 

• Power management ICs: includes MOSFET power drivers, PWM controllers, DC/DC converters, switching 

regulators, CMOS voltage detectors, microprocessor supervisor circuits, and charge pumps. 

• Smart sensors: includes solid-state thermal management and battery management control ICs. 


TelCom Semiconductor, Inc. 

1300 Terra Bella Avenue 

Mountain View, California 94039 




Processes: Silicon- and metal-gate CMOS, BiCMOS, 

CMOS/DMOS, DMOS, bipolar 



• TelCom established a foundry agreement with IC Works (San Jose, CA) in November 1995. Under the 

agreement, TelCom agreed to invest $10 million in equipment and the expansion of IC Works submicron wafer 

fabrication facility, in return for wafer capacity. The agreement covers a five-year period, which is expected to 

begin in late 1997. 


Asia 

38%

Texas Instruments North American Company Profiles 


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TEXAS INSTRUMENTS (TI) 

Texas Instruments Incorporated 

Semiconductor Group 

P.O. Box 655303 

Dallas, Texas 75265 

Telephone: (214) 995-2011 

Fax: (214) 997-5250 

Web Site: www.ti.com/sc 


Japan: Texas Instruments Japan Ltd. • Minato-ku, Tokyo, Japan 

Telephone: (81) (3) 3457-0972 • Fax: (81) (3) 3457-1259 • Web Site: www.tij.co.jp 

Europe: Texas Instruments France S.A. • Saulnier, Velizy-Villacoublay Cedex, France 

Telephone: (33) (1) 30-70-11-65 • Fax: (33) (1) 30-70-10-32 

Asia-Pacific: Texas Instruments Taiwan Ltd. • Taipei, Taiwan 

Telephone: (886) (2) 377-1450 • Fax: (886) (2) 377-2718 


1992 1993 1994 1995 1996 

Corporate 

Sales 7,440 8,523 8,608* 11,409* 9,940 

Net Income 247 472 691 1,088 63 

R&D Expenditures 578 842 1,181 

Semiconductor 

Sales 3,080 4,100 5,550 7,850 6,750 

IC Sales 3,000 4,040 5,500 7,800 6,700 

Discrete Sales 80 60 50 50 50 

Capital Expenditures 315 525 860 1,170 1,840 

Employees 60,577 59,048 56,333 59,574 59,927 

*Changed to reflect discontinued operations. 


North American Company Profiles Texas Instruments 


Texas Instruments (TI) is one of the leading high-technology companies in the U.S. and one of the top ten 

semiconductor manufacturers in the world. It was founded in 1930 as Geophysical Service to provide geophysical 

exploration services to the petroleum industry using reflection seismographs. In 1946, the company formally 

added electronic systems manufacturing to its operations, and in 1951, adopted its current name. Today, TI's 

products include semiconductors, consumer electronics products, electrical controls, and metallurgical materials. 

In 1996, TI sold its printed circuit board contract manufacturing operation to Solectron Corp. TI also sold its mobile 

computing business to Acer Group, its printer business to Genicom Corp., and signed a definitive agreement to 

sell its defense systems and electronics business to Raytheon Company. In April 1997, TI sold its software 

business to Sterling Software Inc. 

In mid-1996, TI acquired Silicon Systems, Inc., a company whose expertise is in mixed-signal/analog circuits. 

Tustin, California-based Silicon Systems is operating as a wholly owned subsidiary of TI. 

Metallurgical Materials 

2% 

Digital Products 

17% 

Components 

81% 


Business Segment 

Europe 

21% 

East Asia 

33% 


45% 



Texas Instruments’ business is based principally on its broad semiconductor technology and application of that 

technology to selected electronic end equipment markets. The company’s participation in semiconductors dates 

back to the emergence of the industry in the early 1950’s. It began the research and development of 

semiconductor devices in 1952. Two years later, the company commercialized the transistor and in 1958, 

invented the integrated circuit. 

Although the company is a leading producer of DRAMs, much of its semiconductor emphasis is focused on 

differentiated products like digital signal processors (DSPs), microcomponents, and mixed-signal interface 

devices. Such products represented approximately 65 percent of the company’s semiconductor revenues in 

1996. TI is the world’s leading supplier of DSPs and the second largest supplier of analog/mixed-signal ICs. The 

company's bipolar business, meanwhile, is shifting to advanced system logic, with new differentiated products for 

emerging markets in computers, consumer electronics, and telecommunications. 


Other 

1%


The majority (about 75 percent) of the DRAMs TI sells are sourced from the joint venture companies in which it 

holds a majority interest, including TI-Acer in Taiwan, KTI Semiconductor in Japan, TECH Semiconductor in 

Singapore, and TwinStar Semiconductor Inc. in Texas. In addition, TI announced a new joint venture with the 

Italian government to construct a fab facility in Italy for the manufacture of flash memories and another with Anam 

Industrial Co. to build DSPs at a new fab in South Korea. To date, TI and its partners have invested more than $3 

billion in capital expenditures in the joint ventures. See the Semiconductor Fabrication Facilities and Key 

Agreements sections below for more information on these ventures. 

Management 

James R. Adams Chairman 

William P. (Pat) Weber Vice Chairman 

Thomas J. Engibous President and Chief Executive Officer 

David D. Martin Executive Vice President 

Richard K. Templeton Executive Vice President and President, Semiconductor Group 

Richard J. Agnich Senior Vice President, Secretary, and General Counsel 

William A. Aylesworth Senior Vice President, Treasurer, and Chief Financial Officer 

Kevin McGarity Senior Vice President, Semiconductor Group and Manager, Worldwide 

Semiconductor Group Marketing 

John Scarisbrick Senior Vice President, Semiconductor Group and Manager, Worldwide 

Application Specific Products 

Del Whitaker Senior Vice President, Semiconductor Group and Manager, Worldwide 

Mixed-Signal and Logic Products 

Rick Goerner Vice President, Semiconductor Group and President, Silicon Systems 

Mike Hames Vice President, Semiconductor Group and Manager, Worldwide 

DSP Products 


TI's principal semiconductor products include DSPs, CISC and RISC microprocessors and controllers, graphics 

ICs, networking chips, ASICs, memory ICs, and mixed-signal devices. Details concerning these products are 

provided below. 

Processors 

Digital Signal Processors—TI offers a variety of general-purpose DSP chips, including nine generations of 

dedicated and programmable 16-bit fixed-point and 32-bit floating-point DSPs; customizable and applicationspecific 

DSPs; and the highest performance DSP on the market—the TMS326C6x at 1,600 MIPS/200MHz, 10 

times the MIPS performance of any DSP on the market at the time of this writing. The ‘C6x DSP is based on a verylong 

instruction word (VLIW) architecture and a five-layer-metal, 0.25μm CMOS process technology. By the end 

of 1998, TI plans to move the processor to a 0.18μm process that is expected to yield 2,000 MIPS/250MHz 

performance. 

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Microcontrollers—TI offers an expanding family of ROM, one-time programmable, and UV-erasable 8-bit 

microcontrollers for applications in automotive, communications, computer, consumer electronics, and industrial 

equipment. The company’s next-generation 8-bit and 16-bit MCUs offer higher integration levels by utilizing TI’s 

Prism process for reconfigurable MCU libraries. 

LAN Products—This group of products includes media access controllers, switches, communications processors, 

and physical layer interface devices. 

Mixed-Signal and Analog Devices 

TI offers a wide range of mixed-signal and standard analog semiconductor products, including power supply 

products, 1394 devices, Universal Serial Bus (USB) products, fiber channel serial buses, amplifiers, comparators, 

data converters, RAMDACs, telecommunications ICs, power ICs, sensor signal processors, hard disk drive ICs, 

speech processors, digital tapeless answering devices (DTADs), and CCDs. Several of these products are 

available in low-voltage (3V) versions. 

Advanced System Logic Devices 

This family of products includes a full spectrum of devices in a variety of process technologies, including CMOS, 

bipolar, and BiCMOS. TI has second-source agreements with Philips Semiconductors and Hitachi for Advanced 

BiCMOS Technology (ABT) logic devices as well as for low-voltage logic chips. 

Memory ICs 

TI’s extensive line of memory ICs includes a broad family of DRAMs (16M and 64M), synchronous DRAMs 

(SDRAMs), flash memories (512K to 4M), and FIFOs. 

In non-volatile memory, TI has shifted its focus from EPROMs to flash memories. The company plans to build on its 

strength in DRAM technology to expand its capability in high-density flash products. Development plans for future 

new high-density products are being evaluated using 0.12μm-0.15μm technology derived from 1G DRAM 

technology. 

Application-Specific ICs (ASICs) 

TI was the third largest North American ASIC vendor in 1996. Its application-specific IC products include highspeed 

bipolar and CMOS PLDs and CMOS and BiCMOS gate arrays, embedded arrays, and standard cells. The 

company’s most advanced ASICs are manufactured with a four-level-metal 0.35μm CMOS process, enabling 

designs of up to 1.7 million gates. In May 1996, TI announced its 0.18μm TImeline technology and was the first to 

offer the capability to place 125 million transistors on a single chip. 

Texas Instruments sold its antifuse FPGA business to Actel Corporation in 1995. TI had been a licensed second 

source of Actel's FPGAs since 1988. 



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✔ DRAM ✔ Amplifier 


✔ Flash Memory ✔ Consumer/Automotive 

✔ EPROM ✔ Voltage Regulator/Reference 






✔ Gate Array ✔ General Purpose Logic 


✔ Field Programmable Logic ✔ Field Programmable Logic 

✔ Other Special Purpose Logic Other Special Purpose Logic 


✔ MPU/MCU/MPR 

✔ MPU OTHER 





Texas Instruments has several major wafer fab projects underway. At the company’s main campus in Dallas, Texas, 

$2 billion is being spent to put up a new DSP production facility (DMOS-6) and an R&D development fab (R&D-1). 

Both are expected to begin production by the end of 1997. The R&D-1 facility will be used for work on 0.18μm 

and 0.12μm device generations and for the company’s development of 300mm wafer technology. 

In early 1997, TI announced that it had signed an agreement with the Italian government to build a second 

fabrication facility and an R&D center in Avezzano, Italy. The $1.2 billion fab will have the capability to process ICs 

on 300mm wafers, with geometries of 0.28μm and below, when operations start in 1999. Current plans call for the 

production of flash memories and DRAMs at the facility. 

As mentioned earlier, a great deal of fab activity continues to take place at each of TI’s joint venture companies. In 

1996, KTI completed an expansion of its fab that doubled the facility’s wafer capacity. TI-Acer completed 

construction of its second fab in early 1997. TwinStar began production in mid-1996 at its first fab. And, TECH 

Semiconductor is building its second wafer fab, which will have a capacity of 10,000 200mm wafers per week and 

is expected to be ready for production in 1998. 



In April 1997, Texas Instruments pulled out of a $1.4 billion Thailand joint DRAM venture with Charn Uswachoke, 

founder and CEO of Alphatec. Under the deal two companies were to be formed: Alpha-TI Semiconductor, a $1.2 

billion 16M and 64M DRAM fab; and Alpha Memory, a $200 million assembly and test facility. Reasons cited for TI’s 

withdrawal include weakness in the DRAM market and a poor Thai economy. Construction of both facility shells 

has been completed, but no capital equipment orders were ever placed. 

Texas Instruments Texas Instruments 

13500 North Central Expressway 13500 North Central Expressway 

Dallas, Texas 75243 Dallas, Texas 75243 


DMOS 4 DMOS 5 





Products: DRAMs, EPROMs, logic ICs Products: DSPs, MPUs 






DMOS 6 R&D 1 




Process: CMOS Products: R&D 

Products: DSPs Feature sizes: 0.12μm-0.25μm 

Feature sizes: 0.25μm, 0.35μm (Operations scheduled to begin in late 1997) 

(Operations scheduled to begin in late 1997) 





DFAB DP1 




Processes: Bipolar, MOS, GaAs Process: GaAs 

Products: Analog and memory ICs, discretes Products: Analog and digital ICs 





2301 North University Highway 75 South 

Lubbock, Texas 79415 Sherman, Texas 70590 


LMOS Fab SFAB 




Processes: CMOS, NMOS Process: Bipolar 

Products: EPROMs, ASICs Products: Logic ICs, MPRs 


Texas Instruments Texas Instruments Japan Ltd. 

32201 Southwest Freeway 18-36, Minami 3-chome 

Stafford, Texas 77477 Hatagoya-shi, Saitama Prefecture 334 

Telephone: (281) 274-2000 Japan 

HFAB Telephone: (81) (48) 282-2211 

Cleanroom size: 27,000 square feet HATO Fab 



Processes: CMOS, NMOS Processes: CMOS, NMOS 

Products: EPROMs, ASICs Products: Logic ICs, ASICs 


Texas Instruments Japan Ltd. Texas Instruments Japan Ltd. 

2355 Kihara Miho-Mura 2355 Kihara Miho-Mura 

Inashiki-gun, Ibaraki Prefecture Inashiki-gun, Ibaraki Prefecture 

Miho 300-04, Japan Miho 300-04, Japan 

Telephone: (81) (29) 885-3311 Telephone: (81) (29) 885-3311 

MIHO 5 MIHO 6 



Processes: CMOS, MOS Process: CMOS 

Products: ASICs, ASSPs, MCUs, DSPs Products: DRAMs, MPUs, 


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Texas Instruments Japan Ltd. Texas Instruments Italia S.p.A. 

4260 Aza-Takao Via Antonio Pacinotti 5/7 

Oaza-Kawasaki Nucleo Industriale 

Hiji-Machi, Hayami-gun I-67051 Avezzano, Italy 

Oita Prefecture 979-15, Japan Telephone: (39) 863-4321 

Telephone: (81) (97) 772-111 AMOS 1 

HIJI Fab Cleanroom size: 45,000 square feet 


Wafer size: 150mm Wafer size: 150mm (plans for 200mm conversion) 

Processes: CMOS, BiCMOS, bipolar Process: CMOS 

Products: Logic and analog ICs, DRAMs Products: DRAMs 


(Joint venture with the Italian government.) 

Texas Instruments Italia S.p.A. Texas Instruments Italia S.p.A. 

Via Antonio Pacinotti 5/7 Via Antonio Pacinotti 5/7 

Nucleo Industriale Nucleo Industriale 

I-67051 Avezzano, Italy I-67051 Avezzano, Italy 


AMOS 2 AMOS 3 




Products: DRAMs Products: Flash memories, DRAMs 

Feature size: 0.5μm Feature size: 0.28μm 

(Joint venture with the Italian government.) (Joint venture with the Italian government. 

Operations scheduled to begin in 1999.) 

Texas Instruments Deutschland GmbH Silicon Systems, Inc. (subsidiary of TI) 

Haggertystrasse 1 2300 Delaware Avenue 

Freising, Germany Santa Cruz, California 95060 


FFAB Capacity (wafers/week): 6,500 


Wafer size: 150mm Processes: Bipolar, CMOS, BiCMOS 

Processes: CMOS, BiCMOS Products: Mixed-signal ICs 

Products: Logic and analog ICs, ASSPs Feature sizes: 1.0μm-3.0μm 




KTI Semiconductor Ltd. TI-Acer Incorporated 

189-1 Hirano-cho 4F, Industry East 9th Road 

Nishiwaki City Science-Based Industrial Park 

Hyogo Prefecture 677, Japan Hsinchu, Taiwan 

Cleanroom size: 48,400 square feet Telephone: (886) (3) 5785112 

Capacity (wafers/week): 6,250 Fax: (886) (3) 5782038 

Wafer size: 200mm Fab 1 and Fab 2 

Process: CMOS Cleanroom size: 97,000 square feet 

Products: DRAMs, ASICs, MPUs, DSPs Capacity (wafers/week): 10,000 

Feature sizes: 0.35μm-0.8μm Wafer sizes: 150mm, 200mm 

(Joint venture with Kobe Steel) Process: CMOS 



TECH Semiconductor Singapore Pte Ltd. TECH Semiconductor Singapore Pte Ltd. 

P.O. Box 2093, SE 9040 P.O. Box 2093, SE 9040 

990 Bendemeer Road 990 Bendemeer Road 

Singapore 1233 Singapore 1233 


Fab 1 Fab 2 




Process: CMOS Products: DRAMs 

Products: DRAMs Feature size: 0.25μm 

Feature sizes: 0.35μm, 0.5μm (Joint venture with the Economic Development 

(Joint venture with the Economic Development Board of Singapore, Canon, and HP. Operations 

Board of Singapore, Canon, and HP.) scheduled to begin in 1998.) 

TwinStar Semiconductor Inc. 

500 West Penner Road 

Richardson, Texas 75080 

Telephone: (214) 994-5800 




Process: CMOS 



(Joint venture with Hitachi. Began production 

in mid-1996.) 

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• It was announced in early 1997 that Hitachi, Mitsubishi, and Texas Instruments will co-develop the cell 

architecture for a 1G DRAM as well as the process technology needed to manufacture it. Hitachi has a longstanding 

relationship with TI to jointly develop and produce DRAMs. 

• TI formed an alliance with Anam Industrial Co. in South Korea calling for Anam to build an IC fabrication facility in 

Korea and TI to provide technical support during construction of the fab and supply the 0.35μm CMOS 

manufacturing technology. TI will receive, in return, a guaranteed portion of the wafer capacity for the 

production of DSPs. Operations at the fab are expected to begin in the first half of 1998. 

• Samsung, Oki, Fujitsu, and Matsushita renewed their semiconductor patent cross-licensing agreement with TI 

that expired the end of 1995 by signing a 10-year deal that extends through 2005. TI has similar existing 

licensing agreements with LG Semicon, Micron, Hyundai, Mitsubishi, and Toshiba. 

• TI is collaborating with IMEC of Leuven, Belgium, on the research of advanced lithography processes to 

achieve 0.18μm capabilities for manufacturing 1-gigabit-class semiconductors. 

• Texas Instruments and Ericsson have a long-standing alliance in which TI has provided the Swedish company 

with its leading edge process technologies for wireless communications. 

• Hitachi joined with Texas Instruments for 16M, 64M, and 256M DRAM development and production. The 

partners have built a joint 16M and 64M DRAM manufacturing facility in Texas. The $500 million factory, called 

TwinStar Semiconductor Inc., began producing 16M DRAMs in July 1996 and production of 64M parts is 

expected to start in 1997. The output is shared equally between Hitachi and TI. 

• TI, Philips, and Hitachi formed a pact in 1993 covering joint development and alternate sourcing of FutureBus 

and BiCMOS logic IC products. 

• Samsung reached an agreement with Texas Instruments in 1993 to jointly improve and operate TI’s test and 

assembly plant in Portugal. Each company operates separate, dedicated lines. 


TLSI North American Company Profiles 


1-348 

TLSI 

TLSI, Incorporated 

815 Broadhollow Road 

Farmingdale, New York 11735 

Telephone: (516) 755-7005 

Fax: (516) 755-7626 


TLSI designs and markets analog, digital, and mixed-signal ICs for the automotive, telecommunications, industrial 

process control, security, home appliance, and military/aerospace markets. TLSI was formed as a division of 

Telephonics Corp. in 1977 to provide Telephonics with ICs needed for its military and commercial airline 

communication systems. Today, TLSI remains a wholly owned subsidiary of Telephonics and provides ICs to the 

general marketplace. 

Management 

Mort Pullman President 

R. Hartig Vice President, Business Management 

Jerry Powder Director, Sales 


TLSI offers a wide range of solutions in the area of full custom MOS, cell-based, and gate array configurations. 

Broken down into categories, these alternatives include the following: 

Full Custom: 

Includes transistor-level designs. 

Standard Cell Library: 

Characterized functions with auto place-and-route using standard height and variable width cells. 

Standard Cell Library with Custom Interconnect: 

Characterized functions with Calma operator place-and-route using standard height and variable width cells. 

Minimum Area Cell Libraries with Custom Interconnect: 

Custom interconnect with minimum sized cells to reduce die area and development time/cost for highervolume 

requirements where a full custom configuration may not be required. 

Analog and Digital Functions Combined on the Same Chip: 

Maximizes system integration and minimizes printed circuit board area. 

When design its chips, TLSI selects any of the following process technologies that best fits the customer’s 

specific application: 1.5μm to 3μm CMOS, 1.5μm BiCMOS, or bipolar. 


North American Company Profiles TranSwitch 

Employees 100 


TRANSWITCH 

TranSwitch Corporation 

8 Progress Drive 

Shelton, Connecticut 06484 

Telephone: (203) 929-8810 

Fax: (203) 926-9453 

Web Site: www.transwitch.com 


TranSwitch Corporation designs, develops, and markets highly integrated digital and mixed-signal semiconductor 

products for broadband telecommunications and data communications applications. 

The company’s product line includes very large scale integration (VLSI) devices that serve four markets: 

worldwide public telephone networks, local area networks (LAN), wide area networks (WAN), and cable television 

(CATV) systems. 

Management 

Santanu Das, Ph.D. President and Chief Executive Officer 

Michael F. Stauff Senior Vice President, Chief Financial Officer 

William G. Bartholomay Vice President, Engineering 

John Haynes Vice President, Sales 

Mike McCoy Vice President, Controller 

Frank Middleton Vice President, PLM Transmission Products 

Robert G. Pico Vice President, Business Development 

Kandaswamy Thangamuthu Vice President, Operations 

Daniel C. Upp Vice President, Technology Development 

Jitender K. Vij Vice President, Systems Engineering 


TranSwitch’s IC devices include asynchronous (PDH), synchronous (Sonet/SDH), and asynchronous transfer 

mode (ATM) communications circuits. The asynchronous products include line interface, 

multiplexer/demultiplexer, framer, and data communications devices. The synchronous product line includes line 

termination, overhead processor, mapper, and multiplexer/demultiplexer devices. The ATM products include 

physical layer, ATM layer, and ATM adaptation layer devices that implement a variety of public and private switching 

and multiplexing products. 


Trident Microsystems North American Company Profiles 


1-350 

TRIDENT MICROSYSTEMS 

Trident Microsystems, Inc. 

189 North Bernardo Avenue 

Mountain View, California 94043-5203 

Telephone: (415) 691-9211 

Fax: (415) 691-9260 

Web Site: www.tridentmicro.com 


Asia-Pacific: Trident Far East Ltd. • Kowloon, Hong Kong 

Telephone: (852) 2756-9666 


1992 1993 1994 1995 1996 

Sales 67 78 69 107 168 

Net Income 12 10 1 8 17 


Foundry Fab Investment — — — — 14 

Employees 115 130 150 268 308 


Founded in 1987, Trident Microsystems designs, develops, and markets very large scale integrated circuit 

graphical user interface (GUI) accelerators, graphics controllers, and multimedia video processors targeting the 

mainstream PC desktop, notebook, and multimedia markets. 

Trident’s initial product offerings began with SVGA controllers in 1989 and moved toward mixed-signal controllers 

in 1993. The year 1994 marked a year of transition for Trident that included its entrance into the GUI accelerator 

market. Although its revenues declined in 1994, the transition to the GUI accelerator market proved successful in 

the following years. Another shift in Trident’s market strategy occurred during this timeperiod. In 1994, 95 

percent of Trident’s sales came from non-OEMs. In a strategic move, Trident began targeting the OEM market and 

currently derives about 40 percent of its sales from OEMs such as IBM, Hewlett-Packard, NEC, and Philips. 


North American Company Profiles Trident Microsystems 

Trident’s product line includes a complete line of 32-bit and 64-bit integrated circuits, video accelerators, and 

multimedia video processing chips that provide cost-effective easy-to-use graphics solutions based on advanced 

technology. Trident was among the first to deliver chips for the new Unified Memory Architecture (UMA), which 

reduces system memory costs by efficiently using existing PC memory for the graphics frame buffer. Additionally, 

several of Trident’s GUI and video acceleration products include the company’s proprietary TrueVideo algorithm, 

the first technology to deliver horizontal/vertical interpolation and diagonal edge recovery for clearer, sharper fullmotion 

images. 

Future product development will focus on products in the high-end of the graphics market as well as the PC 

notebook market. In early 1997, Trident began sampling its first 3D notebook device. 

Notebook 

Products 

15% 

Management 

Other 

19% 

GUI Accelerator 

Desktop Products 

66% 



22% 

Asia-Pacific 

78% 


Frank C. Lin Chairman, President, and Chief Executive Officer 

Jung-Herng Chang, Ph.D. Vice President, Engineering 

Richard E. Hegberg Vice President, Worldwide Sales 

Peter Jen Vice President, Asia Operations 

James T. Lindstrom Vice President, Finance and Chief Financial Officer 

Amir Mashkoori Vice President, Operations 

Richard Silverman Vice President, Marketing 

Richard F. Hass Director, Marketing Communications 


Trident designs its products using 1.0μm, 0.8μm, and 0.6μm CMOS process technologies. The company's 

product line includes: 3D and MPEG ICs, advanced mixed-signal GUI accelerators, high-performance SVGA 

controllers, multimedia video processing devices, and LCD/CRT controllers. 

In 1Q97, Trident introduced two 3D graphics controllers dubbed the 3DImage 975 and 3DImage 975DVD. 

Both devices are designed for 3D applications and feature 3D and 2D graphics acceleration, TV output 

technology, VGA imaging, and high-quality video. The 3DImage 975DVD also provides DVD playback functions 

for use with MMX-enabled Pentium 166MHz and higher MPUs. 


Trident Microsystems North American Company Profiles 


Trident uses a fabless manufacturing strategy where it meets its manufacturing needs by using foundries. Prior to 

1996, Trident received the majority of its wafer capacity from TSMC. In 1996, in an effort to decrease its 

dependence upon one foundry supplier, Trident secured additional capacity through foundry agreements with 

UMC and Winbond in Taiwan, and Samsung in Korea. In its agreement with UMC, Trident has purchased an equity 

interest in UICC, a UMC joint venture fab facility located in Taiwan. The facility was expected to begin production in 

mid-1997. 


• In May 1996, Trident and Samsung announced a long-term partnership. Samsung will provide manufacturing 

capacity to Trident in exchange for mixed-signal ASIC designs. In late 1996, the two companies announced 

the joint development of a next-generation notebook multimedia accelerator that will feature Samsung’s 

embedded SDRAM. 

• In August 1995, Trident entered into a joint venture agreement with UMC. Under the agreement, Trident 

agreed to invest $60 million for a 10 percent equity interest in a new 200mm fab facility, called United Integrated 

Circuits Corporation (UICC). Production at the new facility, located in Taiwan, was expected to begin in mid- 

1997. 

• In June 1995, Trident expanded its relationship with TSMC by signing a five-year foundry agreement. Under 

the agreement, Trident will purchase a certain number of wafers each year from TSMC through 1999. 

1-352 


North American Company Profiles TriQuint Semiconductor 


TRIQUINT SEMICONDUCTOR 

TriQuint Semiconductor, Inc. 

2300 NE Brookwood Parkway 

Hillsboro, Oregon 97124 

Telephone: (503) 615-9000 

Fax: (503) 615-8900 

Web Site: www.triquint.com 


Europe: Giga A/S • Skovlunde, Denmark 

Telephone: (45) (44) 92-61-00 • Fax: (45) (44) 92-59-00 


1992 1993 1994 1995 1996 

Sales 29 33 30 46 60 

Net Income 1 1 (10) 3 6 



Employees 190 195 222 285 361 


TriQuint Semiconductor designs, develops, manufactures, and markets a broad range of high-performance 

analog and mixed-signal gallium-arsenide (GaAs) ICs for the wireless communications, telecommunications, and 

computing markets. TriQuint's mission is to commercialize GaAs ICs for communications and computing. The 

company’s continued focus is on achieving new designs and introducing new products in all three market areas. 

In 1996, TriQuint expanded its product offerings to include GaAs foundry services. 

Computing 

17% 


34% 

Wireless 


49% 


International 

30% 

United States 

70% 



TriQuint Semiconductor North American Company Profiles 

TriQuint's origin can be traced back to 1978, when researchers at Tektronix Laboratories began investigating 

GaAs IC technology. Established as a majority-owned subsidiary in 1985, TriQuint Semiconductor was charged 

with developing application-specific integrated circuits (ASICs) for high-performance microwave, linear, and digital 

systems. 

TriQuint became independent from Tektronix in 1991 when it completed a successful merger with GigaBit Logic 

and Gazelle Microcircuits to form a new privately-held TriQuint. In 1993, TriQuint became a public company. 

Management 

Steven J. Sharp President and Chief Executive Officer 

Edward C.V. Winn Executive Vice President, Finance and Administration, 

Chief Financial Officer, and Secretary 

Gordon Cumming, Ph.D. Vice President, Technology 

Bruce R. Fournier Vice President, Sales 

Joseph I. Martin Vice President, Corporate Development 

Donald Mohn Vice President and General Manager, Telecommunications and Computing 

David Pye Vice President, Manufacturing Operations 

Ron Ruebusch Vice President and General Manager, Wireless Communications 


TriQuint Semiconductor's standard and customer-specific products are structured into three end-market groups: 

wireless communications, telecommunications, and computing. 

Wireless Communications—Standard products for this market are used as building blocks for multipurpose 

applications in radio frequency (RF) and microwave systems. These systems include personal communications 

networks, cellular telephones, satellite communications and navigation equipment, and wireless computer 

networks. In 1996, TriQuint continued to add devices to its relatively new family of high-power RF amplifier ICs for 

the voice and data wireless communications market. 

Telecommunications—Most the company's telecommunications ICs are customer-specific, but its does offer some 

standard products, such as Sonet and SDH multiplexers/demultiplexers and transceivers, ATM framers, and highperformance 

crosspoint switches. 

Computing—Standard products for this market are concentrated on solving system timing and data 

communications performance bottlenecks in high-performance PCs, workstations, servers, and storage systems. 

The company utilizes its proprietary GaAs technology for the production of its ICs. Its GaAs process features 

0.5μm to 0.7μm geometries, 4.0μm metal pitch, and a cutoff frequency of up to 21GHz. 

TriQuint’s services include GaAs IC design, wafer fabrication, test engineering, package engineering, assembly, 

and testing. 

1-354 


North American Company Profiles TriQuint Semiconductor 


TriQuint Semiconductor, Inc. 

2300 NE Brookwood Parkway 

Hillsboro, Oregon 97124 




Process: GaAs 

Products: ASICs, standard components, foundry services 


In early 1997, TriQuint moved into its new GaAs semiconductor manufacturing facility and office complex in 

Hillsboro, Oregon. The 165,000 square-foot site houses all of the company’s manufacturing, engineering, 

marketing, and administrative functions that were located in Beaverton, Oregon, with 45,000 square-feet used for 

the manufacturing facility. 


• In April 1996, TriQuint and Philips announced a wafer sourcing agreement. Under the pact, Philips will develop 

GaAs ICs for TriQuint to produce according to Philips’ specifications. Assembly and test will be done by Philips 

at a facility in Limeil, France. 

• In August 1993, TriQuint and AT&T Microelectronics (now Lucent Technologies) announced a set of 

agreements involving the development, manufacture, and marketing of GaAs ICs for high-performance wireless 

and telecommunications systems. As part of the deal, Lucent discontinued its production of GaAs wafers and 

is instead relying on TriQuint for the manufacture of its GaAs wafers. Lucent also became a minority stockholder 

in TriQuint. Lucent increased its stake in TriQuint to 8.2 percent in early 1995. 


Tseng Labs North American Company Profiles 

1-356 

TSENG LABS 

Tseng Labs, Inc. 

6 Terry Drive 

Newtown, Pennsylvania 18940 

Telephone: (215) 968-0502 

Fax: (215) 860-7713 

Web Site: www.tseng.com 



1992 1993 1994 1995 1996 

Sales 75 76 79 37 26 

Net Income 14 11 9 1 (14) 




Tseng Labs has designed and supplied integrated circuits and board-level enhancement products for graphics 

and video applications since 1983, its founding year. The company's graphics and multimedia accelerator 

products work in conjunction with a PC’s microprocessor to enhance its overall performance by transferring the 

graphics and video functions from the MPU to the accelerator chip. 

Until 1996, the company had mainly focused on the development of 2D graphics accelerators. However, in late 

1996, the company shifted its research and development efforts away from 2D products and toward the 3D 

graphics market. 

International 

43% 

U.S. 

57% 



North American Company Profiles Tseng Labs 

Management 

Jack Tseng Chairman, President, and Chief Executive Officer 

John J. Gibbons Executive Vice President and Chief Operating Officer 

David Kwok Ping Hui Executive Vice President, Technology Officer 

James E. Bauer Senior Vice President, Sales and Marketing 

Mark H. Karsch Senior Vice President, Finance and Administration, and 

Chief Financial Officer 

Barbara J. Hawkins Vice President and Chief Administrative Officer 

Thomas D. Snodgrass Vice President, Product Development 


The first product in the company's line of graphics accelerators, the ET4000/W32, was introduced late in 1992 and 

became one of the industry's more successful SVGA controllers. Two additional products were introduced in 

1993—the W32i and the W32p. The W32i upgraded the W32 system with a more powerful graphics accelerator 

and added a new 32-bit interleaved memory controller. The W32p further enhanced graphics acceleration and 

added support for both local bus and the PCI bus architecture. 

In November 1994, Tseng Labs introduced its VIPeR f/x advanced video image processor for multimedia systems. 

The VIPeR f/x enables full screen, accelerated playback of .AV1 and .MPG video files as well as simultaneous 

capture and display of full motion, 30 frames-per-second video. 

Tseng began shipping its ET6000, the first in a family of next generation graphics controller products, in 1996. It is 

an advanced 128-bit graphics and multimedia engine that integrates a 2D graphics accelerator, a high quality 

video processor, an interface to the new high-bandwidth Multibank DRAM (MDRAM) from MoSys, Inc., and a PCI 

bus interface. Optimized for Windows 95 graphics performance, the ET6000 is designed to offer high resolution 

and color without system degradation. To complement the ET6000, Tseng also introduced the VPR6000, a 

video image processor, and the MPG9920, an MPEG decoder with built-in scaling capabilities. In November 1996, 

the company announced its plans for the ET6300 family of 3D graphics accelerators based on its ET6000 

accelerator. 

The company’s current products are based on CMOS process technology with line geometries as small as 0.6μm. 

Most of its new products are manufactured using an advanced three- or four-layer metal process and are expected 

to use 0.35μm process technology in the near future. 


Tseng currently has foundry agreements with Chartered Semiconductor Manufacturing in Singapore, Tower 

Semiconductor in Israel, and Winbond Electronics in Taiwan. 


Tundra Semiconductor North American Company Profiles 

Employees 60 


1-358 

TUNDRA SEMICONDUCTOR 

Tundra Semiconductor Corporation 

603 March Road 

Ontario, Canada K2K 2M5 

Telephone: (613) 592-0714 

Fax: (613) 592-1320 

Web Site: www.tundra.com 


North America: Tundra Semiconductor Corporation • San Jose, California 

Telephone: (408) 258-3600 • Fax: (408) 258-3659 


Located in Canada, Tundra semiconductor is a privately-held company that designs, develops, and markets PCI 

and VME bus-bridging components. Tundra was established originally as Newbridge Microsystems, a division of 

Newbridge Networks Corporation, a leader in local and wide area networking and communications equipment, but 

became an independent company in December 1995. As an affiliate of Newbridge Networks, Tundra has access 

to advanced infrastructure resources while operating as an independent corporation. 

Tundra’s product strategy is to focus on the niche market of bus-bridging ICs, which control the flow of data 

between different bus architectures used in computer systems. The company also designs and markets a broad 

line of industry standard encryption components for data security in communications networks. To address the 

office equipment, consumer electronics, and automotive markets, Tundra offers a line of Intel-compatible 8-bit 

microperipheral (MPR) devices. 

Management 

Adam Chowenaniec President and Chief Executive Officer 

Jim Roche Executive Vice President and General Manager 

Michael Krause Vice President, Research and Development 

Norm Paquette Vice President, Finance 

Ed Hacker Director, Sales 

Dave Lisk Director, Operations 

Richard O’Connor Director, Marketing and Business Development 


North American Company Profiles Tundra Semiconductor 


Tundra offers a family of embedded PCI bus bridges, VMEbus bridges, encryption components, and standard 8bit 

microperipheral ICs. 

PCI Bus Bridges 

QSpan— PCI interface for Motorola embedded processors (e.g., 68K, PowerPC) 

Eighty-X—PCI interface solution for Texas Instruments’ line of TMS320C8x digital signal processors 

VMEbus Bridges 

Universe—VME-to-PCI bus bridge 

SCV64—High-performance VME64-to-local bus bridge 

Trooper II—Slave only, low-cost VMEbus-to-local bus bridge 

Data Security Products 

Wide array of encryption chips based on the Data Encryption Standard (DES). These products are designed for a 

broad range of networking and communications systems such as cable modems, ATMs, fax machines, and 

satellite base solutions. 

8000 Microperipheral Series 

Six industry standard 8-bit MPRs that support the Intel x86 microprocessor family. 


• Tundra has strategic technology partnerships with Motorola, Texas Instruments, and Cadence Design 

Systems. 


Unitrode North American Company Profiles 


1-360 

UNITRODE 

Unitrode Corporation 

7 Continental Boulevard 

Merrimack, New Hampshire 03054-0399 

Telephone: (603) 424-2410 

Fax: (603) 424-3460 

Web Site: www.unitrode.com 


Europe: Unitrode (U.K.) Limited • London, England 

Telephone: (44) (181) 3181431 • Fax: (44) (181) 3182548 

Asia-Pacific: Unitrode Electronics Asia Ltd. • Kowloon, Hong Kong 

Telephone: (852) 2722-1101 • Fax: (852) 2369-7596 

Financial History ($M), Fiscal Year Ends January 31* 

1993 1994 1995 1996 1997 

Sales 50 65 87 116 134 

Net Income 6 9 12 18 21 



Employees 300 425 514 620 562 

*Results excluding disposed operations. 


Unitrode Corporation was founded in 1960 as a manufacturer of electronic components and subsystems. In 

1994, the company divested its two remaining non-strategic businesses, Powercube Corporation and Micro 

Networks Division, leaving only its IC business, which was established in 1981. Unitrode is now focused entirely 

on the design and manufacture of high-performance analog/linear integrated circuits. The company's ICs are used 

in a variety of applications for power management and as interface devices. For the most part, the chips are used 

to control switching power supplies and small electronic motors, or as high-speed interface and communication 

circuits between various pieces of electronic equipment. 

Unitrode's customers are primarily in the EDP/computer and telecommunications markets, but also in the industrial 

control and instrumentation, defense/aerospace, automotive, and consumer markets. The company plans to 

focus its new product development efforts on the communications and industrial markets. 

In fiscal 1997, about 70 percent of the company's integrated circuit sales were to international customers. 


North American Company Profiles Unitrode 

Management 

Interface 

26% 

Motor Control 

34% 

Power 

Management 

40% 



13% 

Automotive/Military 

8% 

Industrial 

19% 

Computer/Office 

60% 


Robert L. Gable Chairman and Chief Executive Officer 

Edward H. Browder President 

Cosmo S. Trapani Executive Vice President and Chief Financial Officer 

Allan R. Campbell Senior Vice President and General Counsel 

S. Kelley MacDonald Vice President, Corporate Communications 

Patrick Moquin Vice President, Human Resources 

Frederick J. Myers Vice President, International Sales 


Unitrode's product offering is comprised of analog ICs for power supply control, motor control, lighting, power 

driving, power quality, and power factoring, as well as for high-speed and high-power interface applications. Most 

of the products are based upon proprietary designs utilizing enhanced bipolar, BiCMOS, and BCDMOS 

semiconductor technologies and are considered application-specific standard products (ASSPs). 


In mid-1997, the company expected to complete the first phase of construction of a new 150mm BiCMOS wafer 

facility. The facility is expected to begin production in fiscal year 1999. 

Unitrode Corporation 

7 Continental Boulevard 

Merrimack, New Hampshire 03054 



Processes: Bipolar, BiCMOS, BCDMOS 



Unitrode North American Company Profiles 

Unitrode has agreements with four foundries to supply additional wafers, as required. In January 1995, the 

company signed an agreement with GMT Microelectronics Corporation (former Commodore Semiconductor fab in 

Norristown, Pennsylvania) for additional wafer capacity. Under the agreement, Unitrode made a $2 million equity 

investment in GMT, in return for up to 30 percent of GMT's capacity. In February 1996, the company made an 

additional $1.5 million investment in GMT which entitles the company to favorable pricing on certain products. 

During fiscal year 1997, Unitrode received less than 20 percent of its output from outside foundries. 


• Unitrode entered into an alliance with Irvine Sensors. Under the agreement, Unitrode became a licensee and 

exclusive second-source for Irvine Sensors’ wireless infrared communication ICs. 

• Unitrode entered into an agreement with GMT Microelectronics Corporation in early 1995 to supply wafers to 

Unitrode. As part of the agreement, Unitrode invested $2 million in GMT. The company made an additional 

investment of $1.5 million in GMT which entitles the company to favorable pricing on certain products. 

• Unitrode agreed with Toko Inc. (Japan) in 1993 to jointly develop power-control ICs. The deal also calls for the 

cross-licensing and alternate sourcing of select proprietary products. 

1-362 


North American Company Profiles Universal Semiconductor 

Employees 30 


UNIVERSAL SEMICONDUCTOR 

Universal Semiconductor, Inc. 



Telephone: (408) 436-1906 

Fax: (408) 436-1125 


Universal Semiconductor was established in 1978 to serve as a CMOS foundry offering design and manufacturing 

of customers' custom/semicustom devices, gate arrays (digital and mixed-signal), dielectrically isolated (DI) highvoltage 

ICs, linear arrays, and DMOS FETs. 

Management 

Vic Hejmadi President and Chief Executive Officer 

Tony Telesca Director, Marketing and Sales 


Universal Semiconductor uses CMOS processing for all devices and offers gate arrays with up to 2,400 gates, 

mixed-signal gate arrays (18V breakdown), and 300V and 500V dielectrically isolated high-voltage ICs, as well as 

radiation-hardened devices. 


Universal Semiconductor, Inc. 






Process: CMOS 

Products: ASICs, linear devices, discretes, foundry services 

Feature sizes: 1.5μm, 2.0μm, 3.0μm, 4.0μm, 5.0μm 


UTMC Microelectronic Systems North American Company Profiles 


1-364 

UTMC MICROELECTRONIC SYSTEMS 

UTMC Microelectronic Systems 

4350 Centennial Boulevard 


Telephone: (719) 594-8000 

Fax: (719) 594-8032 

Web Site: www.utmc.com 


1992 1993 1994 1995 1996 

Sales 20 27 30 30 38 

Employees 350 300 300 180 170 


UTMC Microelectronic Systems is a subsidiary of United Technologies Corp. (UTC), a $23 billion Hartford, 

Connecticut-based provider of high technology products to the aerospace, building systems, and automotive 

industries throughout the world. 

Established in 1980, UTMC serves government and commercial aerospace, commercial property and residential 

housing, and automotive manufacturing customers. It was originally established to assist other UTC divisions with 

the integration of custom and semicustom microelectronics into their systems. In 1985, UTMC began supplying 

semicustom and military-standard VLSI circuits to external companies in the aerospace and defense industries. 

Today, the majority of UTMC’s business is with external companies. The company also engages in governmentand 

customer-funded R&D. 

Up to about mid-1995, UTMC manufactured its IC products in its own fab in Colorado Springs. However, the 

company took on a fabless strategy with the sale of its fab to Rockwell Semiconductor. UTMC reportedly sold the 

fab because it could not be operated economically. It was underutilized due to the fact that the company sells only 

a small number of wafers with relatively high value. In addition, UTMC felt that by adopting a fabless strategy, it 

would be able to move to 0.8μm and smaller geometries more quickly while not incurring the large capital costs 

associated with a submicron fab. 

In 1996, UTMC underwent another strategic change. UTMC combined its IC business with the former Commercial 

Aircraft Electronics (CAE) division of Hamilton Standard, moved into a former Hamilton Standard facility, and 

changed its name to UTMC Microelectronic Systems. The newly acquired 104,000 square-foot facility houses the 

company’s research and development, engineering, IC assembly, test, sales and marketing, as well as the newly 

acquired circuit card assembly operation. The circuit card operation is a high-mix low-volume operation focusing 

on high reliability for the aerospace market. 


North American Company Profiles UTMC Microelectronic Systems 

Management 

Charles "Nick" H. Ide President 

Mike Dansby Chief Financial Officer 

Chuck Gregory Vice President, Business Development and Engineering 

Dwight Deem Director, Sales and Marketing 

Dick Ahlquist Manager, ASIC Product Marketing 


UTMC offers semicustom and military-standard products. Its semicustom products include CMOS gate arrays with 

densities from 3,400 to 200,000 usable gates, CMOS cell-based ASICs, and radiation-hardened antifuse 

programmable logic arrays. The process used for the gate arrays and standard cells is a JAN-qualified lowtemperature 

double- or triple-metal rad-hard process with 0.8μm and 1.0μm geometries. 

The company also offers a large selection of radiation-hardened monolithic, ASD/ENASC-certified MIL-STD-1553 

products. These include bus interface and control devices, bipolar bus transceivers, 16-bit RISC MPUs and 8-bit 

MCUs in both rad-hard and non-rad-hard versions, mask ROMs, PROMs, dual-port RAMs, SRAMs of up to 256K 

density, and CMOS PLD and MSI logic devices. 

Radiation-hardened products accounted for about 50 percent of UTMC’s IC sales in 1996. 

From its newly acquired circuit card assembly and test division, UTMC offers circuit board assembly and test 

services for low volume production runs of complex board requirements. Typical applications are commercial and 

military aircraft and environmental controls. 


UTMC sold its fabrication facility to Rockwell Semiconductor in mid-1995. As part of the deal, Rockwell will supply 

UTMC with wafers through 1997 as it makes the transition to a fabless operation. In March 1996, UTMC 

announced a foundry deal with Lockheed-Martin Federal Systems to obtain production capacity for rad-hard 

products from Lockheed-Martin’s fab in Manassas, Virginia (see Key Agreements). Other foundries are expected 

to be added in 1997 to support new semicustom and standard products with 0.6μm and 0.5μm geometries. 


• UTMC established a three-year foundry supply deal with Lockheed-Martin Federal Systems in March 1996. 

The deal makes Lockheed-Martin UTMC’s main foundry for rad-hard CMOS devices. 


Vadem North American Company Profiles 

Employees 45 


1-366 

VADEM 

Vadem Ltd. 



Telephone: (408) 467-2100 

Fax: (408) 467-2199 

Web Site: www.vadem.com 


Vadem was established in 1983 as a design house specializing in technologies for the portable computer industry 

that was emerging at the time. The name Vadem is a derivative of the Latin word, vade mecum—meaning 

“something that one carries around.” 

Vadem’s first project was the development of hardware/firmware emulation technology to help PC makers resolve 

compatibility issues raised by the use of low-power CMOS devices. Another early project was the development of 

one of the world’s first laptop computers, a design that was sold to Zenith who would go on to become the first to 

bring a laptop into full volume production. Vadem also designed what was called a PCRadio, which was a portable 

system emphasizing communications rather than computing power. 

In 1987, Vadem announced the development of its first IC for portable systems, a chipset for the 186 PC 

generation. By 1992, the company had developed a full line of chips for portable computing, including a 

notebook power management unit that was later sold by Intel as the 82347, a single-chip LCD VGA controller (VG- 

660), and a single-chip DOS-compatible computer (VG-230) for low-cost handheld systems. 

Today, Vadem is building upon its established portable design experience to become a leading designer and 

marketer of ICs and related software for subnotebook-size computers and personal communications products 

such as handheld data collection terminals, cellular telephones, and personal organizers. 


North American Company Profiles Vadem 

Management 

Chikok Shing Chairman 

John Zhao President and Chief Executive Officer 

Gary Rhea Chief Financial Officer 

Ahmet Alpdemir Vice President, Marketing 

Henry Fung Vice President, Engineering 

John C. Kamps Vice President, Sales 

Siu-Kuen Tsang Director, ASIC Development 

Norman Farquhar Manager, Software 

Phil Mitchell Manager, Single-Chip PC Products 

Geoff Teng Manager, PCMCIA Products 


Vadem's IC products include display controllers, microprocessors, PCMCIA host adapters, and PC card controllers 

for portable systems. Vadem’s product offerings also include software, firmware, and development tools. Some 

of these products are described below. 

• VG-330—a 32MHz x86-compatible processor for handheld systems. This highly integrated processor 

incorporates an MPU core and core logic, memory and power management, a memory controller, a PCMCIA 

controller, a VGA LCD controller, a serial port with HP IR capability, an AT-style bus controller, and a serial 

keypad interface or scanned keyboard matrix. The device is designed for 3.3V operation. 

• VG-469—a 208-pin PCMCIA card controller that is register- and software-compatible with Intel's i82365SL 

controller ICs. The part provides a migration path for current 5V devices, emerging 3.3V, and future lowervoltage 

systems and is compatible with PCMCIA 2.1 ExCA (Exchangable Card Architecture) extension, 

Microsoft's Plug-and-Play ISA version 1.0a, and PC Card DMA operation. 

• VG-660—claimed to be the industry's first LCD VGA controller. It supports small flat panel displays with 

enhanced features and VGA compatibility. 

Future products will include highly integrated Mips-based RISC processors. 


Vadem's primary foundry sources are NEC in Japan and Samsung in Korea. Atmel, Symbios Logic, and VLSI 

Technology are used to a lesser extent. 


Vantis North American Company Profiles 


1-368 

VANTIS 

Vantis Corporation 

920 DeGuigne 

P.O. Box 3755 


Telephone: (408) 732-0555 

Fax: (408) 774-7216 

Web Site: www.vantis.com 


Europe: Advanced Micro Devices (UK) Ltd. • Firmley, England, United Kingdom 

Telephone: (44) (1276) 803100 • Fax: (44) (1276) 803102 

Japan: Advanced Micro Devices • Shinjuku-ku, Tokyo, Japan 

Telephone: (81) (3) 3346-7570 • Fax: (81) (3) 3342-7606 

Asia-Pacific: Advanced Micro Devices Far East Ltd. • Kowloon, Hong Kong 

Telephone: (852) 2956-5322 • Fax: (852) 2956-0588 


1994 1995 1996 

Sales 187 256 248 

Employees 300 


Vantis Corporation was spun off from AMD in 1997 to form a wholly-owned programmable logic subsidiary of AMD. 

The company’s roots in programmable logic devices (PLDs) date back to 1978 when Monolithic Memories, Inc. 

announced the development of the PAL ® device. MMI merged with AMD in 1987. Today, Vantis is the dominant 

supplier of simple PLDs and the world’s third largest supplier of all PLDs. 

There are six basic areas addressed by Vantis’ PLDs: high-speed PAL devices, universal PAL devices, industrystandard 

PAL devices, low-power PAL devices, asynchronous PAL devices, and high-density PLDs. Much of 

Vantis’ emphasis is being placed on the company’s mid- to high-density MACH PLD products. 


North American Company Profiles Vantis 

Vantis’ roadmap calls for CPLDs with up to 1,000 macrocells by 1998 and CPLDs with high-density macrocells and 

integrated cores by 1999. The company will utilize AMD’s core library including its digital signal processing, PCI, 

and microprocessor cores. In mid-1997, Vantis plans to introduce its first FPGA product in the 30,000-gate range 

and then move into the 250,000-gate range by the year 2000. Also by 2000, Vantis wants to become an 

independent, publicly held company. 

Management 

Richard Previte Chairman 

Richard H. Forte President and Chief Executive Officer 

Frank Barone Vice President and Chief Operating Officer 

David Chavoustie Vice President, Worldwide Sales and Marketing 

Al F. Frugaletti Vice President, Sales, North American and Worldwide Distribution 

Andy Robin Vice President, Marketing 


For high-performance applications in the networking, telecommunications, computing, and industrial markets, 

Vantis offers its MACH families of high-density EECMOS PLDs. There are five MACH families, each addressing a 

specific market need and all include features such as guaranteed fixed timing, PCI compliancy, power 

management, and 3.3V options. The MACH 5, MACH Superset, and MACH Performance Plus CPLDs come with 

JTAG in-system programming (ISP) support for no additional cost. 

• MACH 1 and 2 Families—These families (including the MACH Performance Plus CPLD products) consist 

primarily of synchronous devices for synchronous subsystem applications like memory controllers and 

peripheral controllers and an asynchronous device for applications having asynchronous inputs and for 

collecting random glue logic. Characteristics include 900 to 3,600 PLD gates, 44 to 84 pins, and 32 to 128 

macrocells. 

• MACH 3 and 4 Families—These MACH Superset CPLDs provide approximately three times the density (up to 

10,000 PLD gates), two times the number of macrocells (up to 256), and two times the amount of I/O (up to 208 

pins) of the original MACH 1 and 2 families. 

• MACH 5 Family—This is Vantis’ newest CPLD product family with speeds as fast as 7.5ns at 512 macrocells. 

The MACH 5 devices feature a new hierarchical switch-matrix architecture that allows shorter design times. 

While a 0.35μm (effective gate length) CMOS process is currently used to manufacture the MACH 5 PLDs, a 

0.25μm six-layer-metal process is under development and expected to be implemented by 2000. 


Vantis North American Company Profiles 

Vantis also offers one of the industry’s widest variety of PAL devices. 

• High-Speed PALs—Electronically erasable (EE) CMOS and bipolar PALs with delay times as low as 5ns and 

4.5ns, respectively. 

• Universal PALs—EECMOS PALs with user-programmable output logic macrocells. 

• Industry-Standard PALs—Bipolar TTL PALs in a variety of speed and power grades. 

• Low-Power PALs—Zero-power CMOS PALs for portable or battery-operated systems (stand-by current of less 

than 15μA) and quarter-power CMOS PALs that can cut system power consumption 50 percent by replacing 

equivalent CMOS PALs. 

• Asynchronous PALs—CMOS PALs that are optimized for asynchronous and bus interface applications. 


All of the company’s products are manufactured in AMD’s wafer fabrication facilities in Austin, Texas, on processes 

dedicated to programmable logic. AMD’s Fab 25, where much of Vantis’ devices are manufactured, is a 200mm 

fab with 0.35μm line geometries. 

1-370 


North American Company Profiles Vitesse Semiconductor 


VITESSE SEMICONDUCTOR 

Vitesse Semiconductor Corporation 

741 Calle Plano 

Camarillo, California 93012 

Telephone: (805) 388-3700 

Fax: (805) 987-5896 

Web Site: www.vitesse.com 


Europe: Vitesse Semiconductor Corp. • Morainvilliers, France 

Telephone: (33) (1) 3975-6310 • Fax: (33) (1) 3975-2062 


1992 1993 1994 1995 1996 

Sales 37 26 36 43 66 

Net Income 1 (19) (4) 2 13 



Employees 300 238 201 235 320 


Vitesse Semiconductor, founded in 1984, is a leader in the design, development, manufacturing, and marketing 

of digital gallium arsenide (GaAs) ICs suitable for commercial, industrial, and military customers. The company's 

custom, semicustom, and standard products are used in a wide variety of industries including telecommunications, 

data communications, computers, defense and aerospace systems, automatic test equipment (ATE), and 

instrumentation. 

Government 

11% 

ATE 

24% 

Computers 

4% 


Other 

1% 


60% 

1996 Sales by End-Use Market

Vitesse Semiconductor North American Company Profiles 

Vitesse's mission is to be the dominant supplier of the highest performance IC solutions for communications and 

ATE applications. As the communications market shifts from wire to optical channels, and computers undergo a 

shift from large proprietary central processors to open distributed processors, Vitesse is positioning itself to 

provide leading high-performance digital, analog, and mixed-signal IC solutions. 

Management 

1-372 

Standard 

Products 

36% 

Foundry 

6% 

ASIC Products 

58% 

1996 Sales by Product 

Japan 

12% 

Europe 

10% 

ROW 

2% 


76% 


James A. Cole Chairman 

Louis R. Tomasetta President and Chief Executive Officer 

Ian Burrows Vice President, Fab Operations 

Robert Cutter Vice President and General Manager, Colorado Springs 

Ira Deyhimy Vice President, Product Development 

Chris F. Gardner Vice President and General Manager, ATE Products 

Eugene F. Hovanec Vice President, Finance and Chief Financial Officer 

James Mikkelson Vice President, Technology Development 

Michael Millhollan Vice President and General Manager, Standard Products 

Robert Nunn Vice President and General Manager, ASIC Products 

Neil Rappaport Vice President, Sales 

Ram Venkataraman Vice President, Quality 


Vitesse's products are fabricated using its proprietary H-GaAs (high integration gallium arsenide) process 

technology. The current generation is the five-level metal, 0.5μm H-GaAs IV process, capable of integration levels 

of over one million transistors. ASIC design and simulation is supported on industry standard tools from Mentor, 

Cadence, Viewlogic, Synopsys, and Teradyne. 

Vitesse's standard products include telecommunications and data communications ICs. Its communications 

products address the high-speed data transmission marketplace. Most are designed to be compatible with the 

Sonet (synchronous optical network), ATM, and Fibre Channel standards. The operating frequency of these 

devices is from 155MHz to 10GHz and they are aimed at providing physical layer solutions for copper or fiber optics 

communication lines. 


North American Company Profiles Vitesse Semiconductor 

Vitesse's gate array product line consists of five families: GLX, FX, Viper, SCFX, and Fury . Aimed at the 

communication, ATE/instrumental, and computer markets, GLX arrays are suited to switching networks, serial links, 

high-speed data bus transfers, DSP functions, and critical timing blocks. GLX utilizes a sea-of-gates architecture 

and can be powered from either a single or dual power supply, depending on I/O requirements. These gate arrays 

can accommodate virtually any digital application requiring up to 175,000 gates. The FX series provides solutions 

in super minicomputers, high-end workstations, telecommunications systems, and high-performance 

ATE/instrumentation. The Viper family provides solutions in computer peripherals, medical instrumentation, and 

communications. The SCFX family is targeted at telecommunications and data communications applications, 

offering maximum operating frequencies beyond 3GHz. The Fury series addresses the conventional silicon ECL 

user. 

In early 1997, Vitesse introduced its first family of GaAs standard cell arrays targeting telecommunications and 

high-speed switching applications. Dubbed the SLX line, the family consists of five devices with gate densities 

ranging from 10K to 220K gates while operating from a single 3.3V power supply. The SLX family is based on a 

0.4μm four-layer metal HGaAs-IV process and utilizes a standard cell architecture. 


In late 1996, Vitesse began construction of what it claims will be the first 150mm GaAs VLSI fabrication facility in the 

industry. The 100,000 square-foot facility will support manufacturing and test, as well as a design center for 

research and development. Initial production is expected to begin in late 1998. 

Vitesse Semiconductor Vitesse Semiconductor 

741 Calle Plano 4323 ArrowsWest Drive 

Camarillo, California 93012 Colorado Springs, Colorado 80907 


6,500 square feet (Class 100) Wafer size: 150mm 

Capacity (wafers/week): 1,700 Process: H-GaAs E/D MESFET 

Wafer size: 100mm Products: Gate arrays, telecom and datacom 

Process: H-GaAs E/D MESFET devices, microperipherals, foundry services 

Products: Gate arrays, telecom and datacom 

devices, microperipherals, foundry services 



Vivid Semiconductor North American Company Profiles 

Employees 35 


1-374 

VIVID SEMICONDUCTOR 

Vivid Semiconductor, Inc. 

7400 West Detroit Street 

Suite 100 

Chandler, Arizona 85226 

Telephone: (602) 961-3200 

Fax: (602) 961-1135 

Web Site: www.vividsemi.com 


Asia-Pacific: Vivid Semiconductor Korea Inc. • Seoul, Korea 

Telephone: (82) (2) 522-3175 • Fax: (82) (2) 552-3177 


Vivid Semiconductor was formed in 1993 to design and market mixed-signal and analog integrated circuits for 

applications requiring high voltage operation at a low cost. Currently, the company is focused on providing drive 

electronics to manufacturers of flat panel displays (FPDs). 

Using patented extended voltage-range CMOS technology, Vivid has developed technology that allows 

designers to build enhanced performance flat panel displays with 24-bit color and full-motion video. The key to 

this technology is that it can be fabricated on standard CMOS processes. Vivid’s process technology can be 

applied not only to FPDs but also to a broad range of other markets, from automotive to telecommunications, 

where extended voltage-range CMOS can make a difference in product capability, power consumption, cost, and 

reliability. 

Management 

Alex Erhart President, and Chief Executive Officer 

Dan Clarke Vice President, Marketing and Sales 

Gerry Harder Vice President, Operations 

Tim Vatuone Vice President and Chief Financial Officer 

Ed Fullman Director, Marketing 


North American Company Profiles Vivid Semiconductor 


Vivid Semiconductor offers three families of direct drive flat panel display column drivers—CRT replacement 

products, low power notebook TFT display products, and MLS/AA STN display products. Vivid’s direct drive LCD 

column drivers are available for a wide range of panel resolutions from VGA to UXGA. 

Vivid’s column drivers are based on its patented "Dual Range" design architecture, which allows high-voltage 

devices to be achieved on standard, low-voltage CMOS processes. For example 10V operation on a 0.8μm 

process and 7V operation on a 0.5μm process can be easily achieved, and higher voltages are possible. 


Unlike leading edge microprocessors and memories, Vivid’s silicon requirements can be fabricated in plants that 

are three process generations old. Vivid’s wafer processing, packaging, and testing functions are contracted to 

well-established manufacturers. 


VLSI Technology North American Company Profiles 


1-376 

VLSI TECHNOLOGY 

VLSI Technology, Inc. 

1109 McKay Drive 


Telephone: (408) 434-3100 

Fax: (408) 263-2511 

Web Site: www.vlsi.com 


Japan: VLSI Technology, Inc. • Tokyo, Japan 

Telephone: (81) (3) 5454-3800 • Fax: (81) (3) 5454-3801 

Europe: VLSI Technology, Inc. • Palaiseau Cedex, France 

Telephone: (33) (1) 69-19-71-00 • Fax: Fax: (33) (1) 69-19-71-01 

Asia-Pacific: VLSI Technology, Inc. • Taipei, Taiwan 

Telephone: (886) (2) 719-5466 • Fax: (886) (2) 718-3204 


1992 1993 1994 1995 1996 

Sales 429 516 587 720 717 

Net Income (32) 16 32 46 (50) 



Employees 2,379 2,659 2,728 2,986 2,948 


VLSI Technology is a leader in the design, manufacture, and sale of complex high-performance ASICs and 

ASSPs. Founded in 1979, the company has been a pioneer in the cell-based ASIC business. VLSI targets highgrowth 

markets in which it has built expertise and can use its library of proprietary cells and FSB functional 

system blocks to assist customers in designing products and bringing them to market rapidly. The company's 

subsidiary, Compass Design Automation, Inc., supplies software and design libraries to the broad commercial 

ASIC and electronic design automation (EDA) marketplaces. Design services include system definition, complete 

logic and circuit design, and test program generation. 


North American Company Profiles VLSI Technology 

VLSI’s integrated circuit business is organized in a “market-focused” structure. Its three main groups are 

Computing Products, Communications Products, and Consumer Digital Entertainment Products. 

Other 

Consumer 7% 

Digital 

Entertainment 

26% 

Computing 

33% 


34% 


Japan/ 

Asia-Pacific 

18% 

Europe 

29% 

United States 

53% 


The Computing Product group offers devices for the computer market, including high-end computing applications 

such as graphics workstations and high-end storage systems. Sales from this product group declined from 

representing 46 percent of total revenues in 1995 to 15 percent in 1996 due to Intel’s strengthened dominance 

in the core logic business and a decrease in sales for Apple Computer architecture systems. The Computing 

Products group is shifting its focus away from standard core logic chipsets and toward custom products for highend 

applications. 

The Communications Products groups offers devices for wireless and network communications applications. 

Within the communications area, the company continues to develop technologies supporting GSM, PHS, and 

DECT standards. VLSI is also developing products targeting CDMA digital cellular applications. In 1Q96, VLSI 

created a European subsidiary called Creative Systems Solutions. Based in Munich, Germany, Creative Systems 

Solutions will focus on the wireless data communications marketplace. 

The Consumer Digital Entertainment Products group supplies devices for secure communications and home 

entertainment applications such as interactive television, satellite and cable technology, and electronic video 

game systems. Data encryption is one key area of focus due to increased security concerns as products become 

more advanced. 

Future product development will include a focus on the wireless, networking, set-top box, and advanced 

computing markets. 

Management 

Alfred J. Stein Chairman and Chief Executive Officer 

Richard M. Beyer President and Chief Operating Officer 

Thierry Laurent Senior Vice President and GM, Communications Product Group 

Paul McLellan Senior Vice President and President, Compass Design Automation, Inc. 

John C. Batty Vice President and Treasurer 

Balakrishnan S. Iyer Vice President, Finance and Chief Financial Officer 

Ted Malanczuk Vice President, Operations 




Using advanced design capabilities, a vast cell library of predefined cells, and advanced manufacturing processes, 

VLSI Technology offers highly customized, highly integrated standard cell, embedded array (FlexArray), and gate 

array ASICs and ASSPs for applications such as computers, wireless communications equipment, electronic 

games, and digital set-top boxes. 

The VLSI Cell Library provides an extensive and growing variety of predesigned and characterized cells, 

macrocells, and large functional system blocks. The company’s specialized system blocks include: UART, parallel 

port, SCC, SCSI, PCMCIA, PCI, SSA, Fibre Channel, and graphics functions for computing applications; T1/E1, 

Sonet/SDH, and ATM functions for network communications applications; GSM/DCS, DECT, CT2, PHS, CDPD, 

and Ruby II functions for wireless communications applications; and digital demodulation, forward error correction 

(FEC), MPEG-2 video and MPEG audio, microcontroller, and transport for digital entertainment applications. 

VLSI’s cell library also includes general-purpose system blocks such as 32-bit ARM RISC processor cores, data 

encryption devices, and programmable DSP cores. 

In a second attempt to penetrate the data security market, VLSI has developed the GhostRider security chip for 

PCI-based computers, modems, web-browsers, and set-top boxes. The device is designed to protect the 

electronic transfer of intellectual property by integrating an on-chip RISC processor with encryption/decryption 

engine-functional system blocks. 

In April 1997, VLSI introduced a gigabit MAC controller device, the VNS67500. The device is available as a 

standard product, operating at 3.3V, or may be embedded in a submicron CMOS ASIC. The device is designed 

for high-speed networking applications. 

VLSI manufactures its ASICs and ASSPs in CMOS technology with geometries ranging from 0.35μm to 0.6μm 

and with up to five layers of interconnect metal. In April 1997, VLSI introduced its 0.25μm (drawn) and 0.2μm 

(drawn) standard-cell ASIC families, dubbed the VSC9 and VSC10 lines. Each family will have six layers of metal, a 

density of up to 18 million raw (14 million usable) gates, and utilize the company’s trench architecture. Volume 

production of the VSC9 family, which will not include gate arrays, is expected to begin in late 1997, followed by the 

VSC10 family in 1Q98. 

Through its subsidiary, Compass Design Automation, VLSI provides IC design software (design tools and libraries) 

to a broad range of system and semiconductor customers. 


In previous years, VLSI Technology enhanced its manufacturing capacity through wafer manufacturing 

relationships, primarily with Chartered Semiconductor. However, by the end of 1996, VLSI shifted substantially all 

its wafer manufacturing to its own facilities. 

1-378 


North American Company Profiles VLSI Technology 

During 1996, VLSI completed the majority of its expansion plans of its San Antonio fab, including the conversion 

to 0.6μm and smaller processes. In late 1996, VLSI announced plans to close its San Jose facility, citing its 

technology limitations as a contributing factor in the decision. The company expects to close the San Jose facility 

by the end of 1997. 

Addressing future capacity needs beyond 1997, VLSI signed a memorandum of understanding with the 

Malaysian Government that covers a site in Malaysia. However, VLSI indicated that it has no plans to construct a 

new facility before 2000. 

VLSI Technology, Inc. VLSI Technology, Inc. 

1109 McKay Drive 9641 Westover Hills Boulevard 

San Jose, California 95131 San Antonio, Texas 78251 


Fab 1 Fab 2 





Products: ASICs, ASSPs Products: ASICs, ASSPs 

Feature sizes: 0.6μm, 0.8μm, 1.0μm Feature sizes: 0.35μm, 0.5μm, 0.6μm 

(Will be closed by the end of 1997.) 

VLSI subcontracts all of its IC packaging and approximately half of its final test needs. Its in-house final test 

functions are performed at its factories in California and Tempe, Arizona. 


• In November 1996, VLSI signed a memorandum of understanding with the Government of Malaysia. The 

memo covers the construction of a 200mm wafer fabrication facility in Malaysia. To date, the company has not 

announced any decision or timeframe for the facility. 

• VLSI entered into an agreement with Digital Semiconductor that covers the design and manufacture of system 

logic devices. The devices are for use in future Alpha-based systems. 

• VLSI and Hitachi renewed and expanded their 1988 standard cell and process technology exchange 

agreement. The new pact added gate array technology, and the two companies will develop compatible gate 

array families. In July 1996, Hitachi licensed its SuperH-3 RISC MPU core to VLSI, who plans to offer it as a CPU 

core in ASICs and ASSPs for applications such as handheld computing devices, navigation systems, digital 

entertainment, and multimedia peripherals. 

• The DSP Group licensed its Pine digital signal processing core technology and its TrueSpeech speech 

compression technology to VLSI Technology in 1994. The new technologies were added to VLSI's FSB 

library for design in wireless communications applications. 



• In late 1994, VLSI licensed Santa Clara, California-based Mediametrics Inc.'s MPEG-1 and MPEG-2 video 

decompression technology, supporting the company's drive into the set-top box and direct broadcast satellite 

markets. 

• VLSI announced its intention to jointly develop and market fuzzy logic-based ASIC technology for chip design 

and development capabilities with Togai InfraLogic, Inc. of Irvine, California. 

• In February 1994, VLSI and Advanced RISC Machines, Ltd. renewed their agreement to expand market 

opportunities for the ARM 32-bit architecture in embedded control and portable applications. 

1-380 


North American Company Profiles VTC 


Japan: VTC Japan • Tokyo, Japan 

Telephone: (81) (3) 3389-6016 

Europe: VTC Deutschland • Germany 

Telephone: (49) (8071) 95304 


VTC 

VTC Inc. 

2800 East Old Shakopee Road 

Bloomington, Minnesota 55425-1350 

Telephone: (612) 853-5100 

Fax: (612) 853-3355 

Web Site: www.vtc.com 


1992 1993 1994 1995 1996 

Sales 50 75 108 166 178 

Employees 300 375 480 540 600 


VTC was founded in 1984 to design and manufacture VHSIC products for government markets. Within the first 

year, VTC acquired Control Data Corporation's microcircuits division (a captive chip manufacturing operation for 

CDC's disk drive business that had operated since 1969). VTC was privately held, but Control Data was a major 

investor. 

Control Data purchased all of VTC in 1987, making it a wholly-owned subsidiary. In 1988, the two original founders 

left CDC and the company was put up for sale. In October 1990, CDC sold the bipolar portion to a management 

buyout led by VTC's current CEO, Larry Jodsaas. Before the end of the year, CDC also sold the CMOS fab to 

Cypress. 

Today, VTC's strategy is to offer quality, high-performance ICs to the data storage (disk and optical drive) industry. 

The company's revenues come from bipolar read/write preamplifiers and channel electronics found in disk drives 

worldwide. 


VTC North American Company Profiles 

Management 

Larry Jodsaas President and Chief Executive Officer 

Cliff Boler Vice President, Engineering 

John Doyle Vice President, Quality 

Dan Griffith Vice President, Sales and Marketing 

Greg Peterson Vice President and Chief Financial Officer 

Robert Rousseau Vice President, Human Resources 

Ed Schnable Vice President, Manufacturing 


VTC offers a broad line of read/write preamplifier standard products and channel ASICs for use in rigid disk drives. 

Processes used by the company are complementary bipolar (CBP), ECL, and BiCMOS (called PolarMOS). 


VTC Inc. 

2800 East Old Shakopee Road 

Bloomington, Minnesota 55425-1350 




Processes: Bipolar, complementary bipolar, BiCMOS 

Products: Standard and ASIC read/write preamplifiers, servo preamplifiers, and channel electronics 


1-382 


North American Company Profiles WSI 


WSI 

WSI, Inc. 

47280 Kato Road 


Telephone: (510) 656-5400 

Fax: (510) 657-5916 

Web site: www.wsipsd.com 


1992 1993 1994 1995 1996 

Sales 28 27 28 38 44 

Employees 137 125 125 125 100 


WSI, Inc. (formerly WaferScale Integration, Inc.) was founded in 1983 as a supplier of high-performance 

programmable ICs. It serves embedded system designers who need to achieve higher system performance, 

reduce system size and power consumption, shorten product development cycles to achieve faster market entry, 

and reduce manufacturing costs. It offers field-programmable microcontroller peripherals as well as highperformance 

non-volatile EPROM products. 

Management 

Michael Callahan Chairman, President, and Chief Executive Officer 

Boaz Eitan Senior Vice President, Chief Technical Officer 

Yoram Cedar Vice President, New Business Development 

Howard Gopen Vice President, Operations 

Robert Hoard Vice President, Worldwide Sales 

Reza Kazerdunian Vice President, Research and Development 

Carl Mills Vice President, Finance 


WSI supplies several families of programmable microcontroller peripherals as well as a broad line of high 

performance non-volatile PROM and EPROM devices. These products are based on the company's patented 

self-aligned split-gate CMOS EPROM technology. WSI's fast EPROMs are available in densities ranging from 16K 

to 1M. The programmable peripherals integrate EPROM, SRAM, PLD, and user-configurable logic. 


WSI North American Company Profiles 


WSI does not have its own fabrication facility. It has foundry agreements with Sharp, National Semiconductor, AMI, 

SGS-Thomson, and Tower Semiconductor. 


• In January 1997, WSI signed a long-term technology exchange and foundry agreement with Tower 

Semiconductor. Under the agreement, the two companies will jointly develop manufacturing process 

technologies such as WSI’s AMG EPROM architecture using Tower’s 0.6μm technology. The agreement also 

guarantees WSI access to Tower’s wafer capacity. 

• National took a 10 percent stake in WSI as part of a five-year foundry and technology exchange agreement. 

• WSI formed an alliance with American Microsystems to jointly develop mask-programmable versions of WSI's 

line of microcontroller peripherals. AMI is manufacturing the parts and the companies are marketing them 

separately. 

1-384 


North American Company Profiles Xicor 


XICOR 

Xicor, Inc. 

1511 Buckeye Drive 


Telephone: (408) 432-8888 

Fax: (408) 432-0640 

Web Site: www.xicor.com 


Japan: Xicor Japan K.K • Shinjuku-ku, Tokyo, Japan 

Telephone: (81) (3) 3225-2004 • Fax: (81) (3) 3225-2319 

Europe: Xicor Ltd. • Witney, Oxford, United Kingdom 

Telephone: (44) (1993) 700544 • Fax: (44) (1993) 700533 


1992 1993 1994 1995 1996 

Sales 93 104 104 114 124 

Net Income (30) (6) 2 10 14 



Employees 840 800 691 641 680 


Xicor, Inc., founded in 1978, designs and manufactures a broad line of non-volatile in-the-system programmable 

semiconductor ICs. In-the-system programmability enables telecommunications, consumer, computer, industrial, 

automotive, and military products to adapt to changing software and operating environments, and to be 

personalized by the user. Many of Xicor’s products consume little power and operate well from a battery powered 

source, making them well suited for hand-held and portable applications. 


Xicor North American Company Profiles 

1-386 

Consumer 

25% 

Industrial, Military, 

& Transportation 

25% 

Telecom 

25% 

PCs, Peripherals 

& Networking 

25% 


Japan 

14% 

Europe 

23% 

United States 

52% 


Xicor emphasizes the development of proprietary products that incorporate its programmable technology, 

enabling customers to rapidly bring to market products with improved features, efficiency and maintainability. In 

1995, Xicor introduced its first SerialFlash memory product family, which operates from low voltage power 

sources. Xicor is a leading supplier of EEPROM memory products and EEPOT digitally controlled 

potentiometers. 

Management 

Raphael Klein Chairman, President, and Chief Executive Officer 

Joseph Drori Vice President, Products Design, Engineering, Quality, and Reliability 

Bruce Gray Vice President, Wafer Operations 

Geraldine N. Hench Vice President and Corporate Controller 

Klaus G. Hendig Vice President, Finance and Administration 

Timothy D. Kanemoto Vice President, Product Operations 

Dennis E. Krueger Vice President, North America Sales 

Madga M. Madriz Vice President, Human Resources 

Bruce W. Mattern Vice President, Sales and Marketing 

William H. Owen III Vice President, Technology Development and Intellectual Properties 


Xicor offers serial EEPROMs in 128-bit to 128K densities, parallel EEPROMs in 16K to 1M densities, Serial Flash 

memories in 8K to 128K densities, Secure SerialFlash devices for data security applications, NOVRAMs 

(nonvolatile SRAMs), NOVRAMs with Autostore power-loss data protection, EEPOT digitally controlled 

potentiometers, EEPROMs that interface directly with microcontrollers or microprocessor bus-based systems, and 

memory subsystems. 

Xicor is also a licensee of the Pine 16-bit fixed-point DSP core and related development tools from DSP Group. 

The firm is developing products that integrate the Pine DSP core with its EEPROM technology. 

ROW 

11% 


North American Company Profiles Xicor 


Xicor, Inc. 

1511 Buckeye Drive 




Processes: CMOS, NMOS 

Products: EEPROM-based ICs and chipsets 



Xilinx North American Company Profiles 


Japan: Xilinx K.K. • Tokyo, Japan 

Telephone: (81) (3) 3297-9191 

Europe: Xilinx Ltd. • Surrey, United Kingdom 

Telephone: (44) (1932) 349401 

1-388 

XILINX 

Xilinx, Inc. 

2100 Logic Drive 


Telephone: (408) 559-7778 

Fax: (408) 559-7114 

Web Site: www.xilinx.com 


Asia-Pacific: Xilinx Asia-Pacific Ltd. • Kwai Fong, Hong Kong 

Telephone: (852) 2424-5200 


1993 1994 1995 1996 1997 

Sales 178 256 355 561 568 

Net Income 27 41 59 102 110 



Employees 544 689 868 1,201 1,500 


Founded in 1984, Xilinx is the leading supplier of CMOS programmable logic devices (PLDs) and related 

development system software. The company’s PLD product lines include field programmable gate arrays (FPGAs) 

and complex PLDs (CPLDs). Xilinx is credited with the invention of the FPGA and brought the first such device to 

market in 1985. The company also markets HardWire devices, which are mask-programmed ICs functionally 

equivalent to programmed FPGAs. 

Xilinx has remained the world’s largest supplier of FPGAs from the beginning and became the largest supplier of 

PLDs in general in 1994. The company ships its PLDs and related development system software to electronic 

equipment manufacturers in the data processing, telecommunications, networking, industrial control and 

instrumentation, and military markets. 


North American Company Profiles Xilinx 

EPROMs 

5% 

Hardwire 

5% 

CPLDs 

2% 

FPGAs 

85% 

System 

Software 

3% 


Europe 

23% 

Asia-Pacific 

12% 


65% 


Xilinx expanded its presence in the PLD market through the 1992 acquisition of Plus Logic, Inc., a company 

involved in electrically programmable logic devices (EPLDs). In April 1995, Xilinx acquired NeoCAD, Inc., a private 

FPGA design software producer. NeoCAD’s software technology was integrated into Xilinx’s development system 

software. 

Xilinx continues to focus its product strategy on setting new standards for lower complexity CPLDs while 

maintaining a leadership position in the FPGA market, addressing high volume applications with its HardWire 

products, and providing support for all product families with user-friendly software. 

In mid-1996, the company announced its decision to withdraw from the antifuse FPGA market and discontinue its 

XC8100 family of one-time-programmable antifuse devices. The company claimed the decision was based on the 

strong market acceptance of its SRAM- and flash-based devices. Research and development efforts previously 

focused on antifuse devices will be redirected toward its core FPGAs and CPLDs. 

Later in 1996, Xilinx announced the formation of the Digital Signal Processing (DSP) Business Unit. The primary 

focus of the DSP Business Unit is to integrate DSPs into the company’s FPGAs. Xilinx plans to develop the tool 

kits, cores, and software integration for the FPGA-based DSPs, which Xilinx claims will operate 10 times faster than 

normal FPGAs. 

Management 

Bernard V. Vonderschmitt Chairman 

Willem P. Roelandts President and Chief Executive Officer 

R. Scott Brown Senior Vice President, Worldwide Sales 

Gordon M. Steel Senior Vice President, Finance, and Chief Financial Officer 

William S. Carter Vice President and Chief Technical Officer 

Lee D. Farrell Vice President, Program Management 

Charles A. Fox Vice President and GM, Hardwire Business Unit 

Steve Hayes Vice President, North American Sales 

Robert C. Hinckley Vice President, Strategic Plans and Programs, and Secretary 

Nicholas Kucharewski Vice President, CPLD Division 

C. Frank Myers Vice President, Operations 


Xilinx North American Company Profiles 

Dennis L. Segers Vice President, FPGA Product Development 

Richard W. Sevcik Vice President, Software 

Sandra L. Sully Vice President and Chief Information Officer 

Christine C. Taylor Vice President, Human Resources 

Roland Triffaux Vice President, European Sales and Marketing 

Sandeep Vij Vice President, Marketing 

Evert A. Wolsheimer Vice President and GM CPLD Business Unit 

Roman Iwanczuk Director, DSP Business Unit 

Scott Lewis Director, CPLD Marketing 


Xilinx’s product line consists of FPGAs, HardWire Array products, EPROMs for external storage of FPGA 

configuration programs, and CPLDs. All of its products are manufactured using CMOS technology, with the most 

advanced chips utilizing a 0.35μm, three-layer-metal process. A 0.25μm, five-layer-metal process is expected to 

be implemented in 2H97. 

FPGA Products 

XC2000 family—Being discontinued. 

XC3000 family—General-purpose architecture with usable gate densities ranging from 1,500 to 7,500 gates. The 

older XC3000-70 and XC3000A products are being discontinued. 

XC4000 family—The company’s most successful FPGA architecture. The family consists of 13 SRAM-based 

members ranging in density from 3,000 to 85,000 logic gates. The older XC4000A and 

XC4000H sub-families are being discontinued. At the high end, Xilinx offers the XC4000EX 

and XC4000XL sub-families. Introduced in early 1997, the XC4000XL series features highperformance 

3.3V operation through the use of a 0.35μm CMOS process. Devices with up to 

125,000 usable gates are expected to sample in mid-1997 (the XC4000XZ series). 

XC5200 family—With a process-optimized architecture, the XC5200 parts are the first FPGAs specifically 

developed as a cost effective, high volume production alternative to gate arrays. 

XC6200 family—Sea-of-gates FPGAs designed for reconfigurable coprocessing applications within the 

embedded controller market. Introduced in August 1996, the XC6200 family consists of 

devices ranging in density from 9,000 to 100,000 gates. 

XC8100 family—Discontinued line of one-time programmable antifuse-based FPGAs. 

HardWire Array Products 

The company’s hardwire process converts a Xilinx FPGA into a HardWire mask-programmed array offering quick 

time-to-market and a reduction in cost. For every Xilinx FPGA family, there is a corresponding hardwire family. In 

1997, Xilinx expanded its HardWire product offerings with the addition of a PCI+ conversion device featuring full 

PCI compliance and up to 10,000 gates of customer specific logic. 

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North American Company Profiles Xilinx 

CPLD Products 

XC7000 family—High performance CPLDs with 400 to 3,800 usable gates and aimed at PAL replacement and 

logic integration applications. 

XC9500 family—Volume production of these flash memory-based CPLDs began in January 1997. The XC9500 

devices features in-system programmability with more than 10,000 program/erase cycles, 36 to 

576 macrocells with 800 to 12,800 usable gates, and pin-to-pin delays as low as 5ns. Xilinx 

expects to migrate the family from a 5V 0.6μm process to a 3.3V 0.5μm process in 1997. 

The company’s newest generation of XACTstep CAE software is based on the NeoCAD core technologies and 

provides all the implementation technology required to design with Xilinx logic devices, including module 

generation, design optimization and mapping, placement and routing, timing analysis, and program file 

generation. 

In mid-1996, Xilinx introduced its LogiCore solutions, which are high-level functions that a designer can 

integrate into FPGA designs. The first LogiCore product was a PCI interface for FPGAs, the PCI LogiCore. In 

early 1997, the company announced a plan to broaden its core library through a partnership network program 

called AllianceCore. Xilinx and its third-party core partners (about 14 at the time of this writing) will work together to 

develop products based on the cores in order to ensure that the designs work in silicon and are properly tested. 

The first products will be for USB peripherals and PCMCIA cards (available in 2H97). 


Xilinx does not fabricate its own ICs, but has foundry agreements with Seiko Epson, Yamaha, IC Works, and UMC. 

In early 1994, Xilinx provided its foundry partner Seiko Epson with $42 million to help fund a wafer fab Seiko 

Epson built in Sakata, Japan. In December 1996, Xilinx announced its plans to invest up to $300 million in a new 

semiconductor manufacturing facility that is currently being constructed by Seiko Epson. The agreement calls for 

Xilinx to make incremental advanced payments in return for a specified number of wafers through 2002. 

Production at the facility, which is located in Sakata, Japan, is expected to begin in early 1998. 


• Xilinx has a second-source agreement with Harris Semiconductor for rad-hard FPGAs. 


Zilog North American Company Profiles 


Japan: Zilog, Inc. • Tokyo, Japan 

Telephone: (81) (3) 5272-0230 

1-392 

ZILOG 

Zilog, Inc. 

210 East Hacienda Avenue 

Campbell, California 95008-6600 

Telephone: (408) 370-8000 

Fax: (408) 370-8056 

Web Site: www.zilog.com 


Europe: Zilog, Inc. • Maidenhead, United Kingdom 

Telephone: (44) (1628) 392-00 

Asia-Pacific: Zilog, Inc. • Taipei, Taiwan 

Telephone: (886) (2) 741-3125 


1992 1993 1994 1995 1996 

Sales 146 203 223 265 298 

Net Income 16 27 35 43 30 



Employees 1,400 1,500 1,500 1,575 1,650 


Zilog was founded in 1974 and became a wholly owned subsidiary of Exxon by 1980. In 1985, the company 

rechartered its course to focus on application-specific market segments. In 1989, Zilog's management, 

employees, and a venture capitalist purchased the company from Exxon. Zilog became a public company in 

February 1991. 

Today, Zilog is a leader in the development, design, and manufacture of application specific standard products 

(ASSPs) for the consumer electronics, data communications, and computer peripheral markets. The company 

utilizes its Superintegration design methodology to combine cores and cells from its extensive library of 

microprocessors and controllers, DSPs, and memory and logic circuits. 


North American Company Profiles Zilog 

Europe 

9% 

Far East 

42% 

ROW 

5% 

United States 

44% 


Zilog maintains its strategy of addressing the needs of specific applications by utilizing its proprietary core and cell 

designs, which are optimized for particular applications, to design and develop new products within its target 

markets. During 1996, Zilog introduced 48 new products, 37 for the consumer product controller market, eight for 

the computer peripheral controller market, and three for the datacommunications market. 

Management 

Edgar A. Sack Chairman, President, and Chief Executive Officer 

Michael J. Bradshaw Senior Vice President, Worldwide Operations 

Thomas C. Carson Senior Vice President, Worldwide Sales, and Strategic 

Marketing Manager, Wireless and Memory Business Unit 

Sally M. Baumwell Vice President, Human Resources 

Robert E. Collins Vice President and Chief Financial Officer 

James J. Magill Vice President and General Manager, Data Communications 

Richard L. Moore Vice President, Technology 

Richard R. Pickard Vice President, General Counsel 

Alan Secor Vice President, Consumer/Peripherals 

Tom Willey Vice President, Wireless Division 


Zilog's core library includes 8-bit microcontrollers, 8-bit, 16-bit, and 32-bit microprocessors, 16-bit digital signal 

processors, serial communications controllers, and peripheral circuits. These cores are available as stand-alone 

devices or may be combined in Superintegration products. The company’s cell library consists of logic and 

memory circuits that are generally combined in Superintegration products. 

The Superintegration library and diverse product portfolio of over 800 items serve three distinct markets: data 

communications, consumer products, and intelligent peripherals. 

• For data communications applications, Zilog offers ASSPs based on its Z80 microprocessor family and 

serial communications controllers. These ASSPs are optimized for Ethernet routers, bridges, data 

switches, modems, terminals, printers, workstations, local area networks, and wide area networks. The 

company holds a leadership position in general purpose, multiprotocol controllers for the LAN and WAN 

markets. 


Zilog North American Company Profiles 

1-394 

• Based on the Z8 ® 8-bit microcontroller, Zilog offers a family of controllers for use in consumer electronics 

products such as cellular phones, audiovisual equipment, automobiles, telephone answering machines, 

household appliances, battery chargers, garage door openers, security systems, set-top boxes, interactive 

TVs, and infrared remote controls. 

• Zilog is an innovator in the addition of intelligence to computer peripheral chips using its line of Z80 ® 8-bit, 

Z180 ® 16-bit, and Z380 ® 32-bit microprocessors, and peripheral circuits. Adding intelligence to computer 

peripherals frees the central processor from micro-management tasks and upgrades the performance of 

the system. Common peripherals are printers, keyboards, monitors, pointing devices, hard disk and floppy 

disk controllers, modems, and PCMCIA bus interface products. 


Zilog, Inc. Zilog, Inc. 

2601 11th Avenue, North Extension 1401 North King Road 

Nampa, Idaho 83651 Nampa, Idaho 83651 

Telephone: (208) 466-4551 Module III 

Fax: (208) 467-9765 Cleanroom size: 30,000 square-feet (Class 1) 

Modules I and II Capacity (wafers/week): 2,500 



Wafer sizes: 100mm, 125mm Products: ASSPs, MCUs, MPUs, DSPs 

Processes: NMOS, CMOS, BiCMOS Feature sizes: 0.35μm 0.6μm, 0.8μm 

Products: ASSPs, MCUs, MPUs, DSPs 

Feature sizes: 0.6μm, 0.8μm, 1.0μm, 1.2μm 

Assembly and test operations are performed in company-owned facilities in Manila and Carmona, the Philippines. 

Contracts with outside IC fabricators Kawasaki Steel in Japan and Thesys Microelectronics in Germany, and with 

assembly houses in Malaysia, Indonesia, and China are back-up sources to the company's own operations. 


• Zilog teamed up with Analog Devices, Inc. (ADI) in early 1997, to jointly develop a new reference design for 

cordless telephones. Zilog agreed to supply DSP-based software and ADI agreed to supply RF technology to 

design a chipset for 900MHz spread spectrum cordless telephones. Production of the chipset/reference 

design is expected to take place in the second half of 1997. 

• Zilog signed an agreement with United Kingdom-based MSU Corporation to jointly develop and manufacture 

chipsets targeting the low-cost TV Internet set-top applications. As part of the agreement, MSU transferred its 

internet service processor core to Zilog. 

• Zilog licensed graphicTV (GTV) technology from TV graphics startup, Telecruz Technology, in a plan to 

develop ICs for television with high definition graphics. Zilog will integrate the GTV architecture into its Z90700 

family of TV controllers. 


North American Company Profiles Zilog 

• Zilog purchased a license in 1995 for the design and manufacture of ASSPs using Aspec Technology's highdensity 

array and embedded array technologies. 

• Zilog joined with Allegro MicroSystems and IMP in a marketing alliance. The team is marketing what they call a 

ZIA disk drive chipset—ZIA standing for Zilog, IMP, and Allegro. 

• Oak Technology and Zilog extended a joint-development and cross-license agreement to develop integrated 

circuits for mass storage applications. 

• Zilog has an agreement (formed in 1993) with Kawasaki Steel under which Zilog is licensed to manufacture, 

use, and sell the Kawasaki KC80, an enhanced high-performance version of the Z80 8-bit microprocessor. 

Additionally, the companies are developing new Superintegration products that use the KC80 core. 

• Zilog and Catalyst entered into a cross-licensing agreement in 1993 under which Zilog gained access to 

Catalyst's flash technology and Catalyst gained the right to develop products using Zilog's Z8 one-timeprogrammable 

(OTP) microcontroller family. The two companies then expanded their alliance to jointly develop 

flash memories. 


Zoran North American Company Profiles 


1-396 

ZORAN 

Zoran Corporation 

2041 Mission College Boulevard, Suite 255 


Telephone: (408) 986-1314 

Fax: (408) 986-1240 

Web Site: www.zoran.com 


Asia: Zoran Microelectronics Ltd. • Haifa, Israel 

Telephone: (972) (4) 854-5777 • Fax: (972) (4) 855-1550 


1992 1993 1994 1995 1996 

Sales 7 5 8 23 44 

Net Income (3) (8) (5) 1 2 




Zoran Corporation, first incorporated in 1981, and reincorporated in 1986, develops and markets integrated 

circuits and software for digital video and audio compression and decompression applications. The company’s ICs 

are used in a wide variety of products, such as professional and consumer video editing systems, PC-based and 

stand-alone video CD systems, DVD players, digital audio systems, filmless digital cameras, and printers/scanners. 

Prior to 1991, Zoran derived the substantial majority of its revenues from digital filter processors (DFPs) and vector 

signal processors (VSPs), which are DSP-based ICs used for image enhancement and processing, principally in 

military, industrial, and medical applications. In 1989, the company repositioned its business to utilize its expertise 

in DSP technology to develop and market video and audio compression circuits. In mid-1994, Zoran discontinued 

DFP and VSP product lines. 

Zoran has a strong core expertise in DSP technology, including digital filtering and frequency domain processing. 

Its strategy centers on building partnerships with innovative marketing and manufacturing companies and 

targeting high-volume, high-performance applications, such as multimedia computing and consumer video and 

audio systems. 


North American Company Profiles Zoran 

In October 1996, Zoran entered the software compression market through its acquisition of CompCore 

Multimedia, Inc., a leading provider of digital audio and video MPEG-1 and MPEG-2 decoding technologies and 

products. The acquisition has broadened Zoran’s product offering to include MPEG cores and software 

compression products particularly for the PC-based DVD market. 

MPEG-1 

9% 

Management 

Software 

14% 

Other 

4% 

Audio 

34% 

JPEG 

39% 


United States 

26% 

Europe 

31% 

Pacific Rim 

43% 


Uzia Galill Chairman 

Levy Gerzberg, Ph.D. President and Chief Executive Officer 

George Haber Executive Vice President 

Ami Kraft Vice President, Finance, and Chief Financial Officer 

Paul Goldberg Vice President, Business Solutions 

Isaac Shenberg Vice President, Sales and Marketing 

Meir Tsadik Vice President, Research and Development, and Chief Operating Officer 

Sorin Cismas Chief Scientist 

Alexander Sinar Director, Manufacturing 


Zoran’s IC products include JPEG codecs, MPEG video decoders, Dolby AC-3 and MPEG audio decoders, and 

PCI multimedia controllers. The company is the leading supplier of JPEG ICs and support devices for the 

consumer and PC markets. 

Additionally, Zoran is the leading supplier of Dolby Digital (AC-3) devices. Its third-generation Dolby AC-3/MPEG-2 

digital audio processors was introduced in late 1996. The ZR38600 processor uses only 75 percent of the 

processors power for audio decoding, leaving the remaining 25 percent available for product differentiation. The 

device is targeted at home theater, DVD, and consumer multimedia applications. 

Most of Zoran’s devices are fabricated using 0.6μm and 0.8μm CMOS technologies. 


Zoran North American Company Profiles 


For the fabrication of its wafers, Zoran has foundry agreements with Fujifilm Microdevices, Motorola, TSMC, and 

Tower Semiconductor. 


• In late 1996, Zoran announced an agreement with Toshiba which stated that Toshiba would use Zoran’s Dolby 

digital two-channel AC-3/MPEG audio processor in a DVD chipset. 

• In 1995, Zoran signed a four-year agreement with Tower Semiconductor under which Tower will supply 

specified quantities of wafers to Zoran. 

• Siemens and Zoran announced in 1995 they would collaborate on the development and marketing of 

multimedia ICs for PC and consumer electronics applications. 

• Dolby Laboratories formed a long-term joint technology partnership with Zoran in August 1992. The 

partnership involves the development of low-cost ICs for multi-channel digital audio for motion-picture 

soundtracks and consumer media. 

• Zoran has the marketing rights to JPEG chips produced by the company’s Japanese partner, Fujifilm. 

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North American Company Profiles

North American Company Profiles - Smithsonian - The Chip Collection

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