1 NLS-030 LOGITECH PM5 LAPPING & POLISHING MACHINE ...

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1.0 SCOPE This document establishes the procedures for lapping and polishing of silicon, GaAs, InP and other substrates in the Nanoelectronics Laboratory. 2.0 APPLICABLE DOCUMENTS Logitech logbook and maintenance log System Component Operation Manuals 3.0 MATERIALS AND EQUIPMENT Logitech <strong>PM5</strong> System Precision Jig Autofeed cylinder Glass substrate Abrasive Al2O3 powders Chemcloth, 12” in diameter Polishing Cloth fir planarization Chemlox CMP solution Chemical-resist cylinder Colloidal silica Wax-Ocon-195 Opticlear- Isopropyl Alcohol Gloves, cleanroom Cleanroom wipes Cleanroom mask 4.0 GENERAL 4.1 Logitech <strong>PM5</strong> The Logitech CMP uses abrasive slurry and chemical solution to lap and polish silicon, GaAs, InP, and other substrates in Nanoelectronics Lab. 4.2 Precision Jig The unit measures the thickness of sample during lapping, and shuts down the machine automatically after lapping the programed amount of material. 4.3 Machine Maintenance Maintaining a smooth and convex plate surface is needed to obtain uniform lapped surface. Maintaining a clean environment is necessary to obtain a uniform surface finish. To avoid scratches on the plate surface and exclude agglomerated particles, these steps are to be followed: 2
4.3.1 Pay great attention when placing test blocks and the precision jig on the lapping plates. Never make scratches or chips on the lapping plates. 4.3.2 Always clean the cylinder, stage, glass substrates and the jig thoroughly and completely whenever changing one slurry to another. 4.4 Emergency Power Shut Off PROCESS PREPARATION 4.4.1 Push in the "Stop" button which is located on the front of the machine. 5.1 Sample Mounting Before lapping, samples must be mounted on glass substrates. Samples must be mounted on the flat side of the glass substrate which is indicated by an arrow marker “∧ “ on the edge of the glass substrate. 5.1.1 Clean the glass substrates with opticlear, then alcohol, and rinse by DI water. Blow dry or wipe dry with clean room wipes. 5.1.2 Place sample on the substrate facing down. Measure the thickness of the sample by the dial micrometer on the table next to the machine. See APPENDIX Ia for the operation procedure of the dial. 5.1.3 Place the glass substrate on the hotplate and turn the temperature to 100 set point (150 for black wax). After ~10 min or when the temperature reading is 70 to 80°C, proceed to the next step. 5.1.4 Place a very small amount of wax in the center of the glass substrate with the metal spatula (stored in the tool box). For most applications the white wax, (ocon-195 in a can at the station), should be used. For very small samples or when thinning down to < 20um, the black stick wax may be used. 5.1.5 Spread the wax uniformly on an area slightly larger than the sample to be mounted. Place your sample face down on the wax and slide the sample a little bit to get uniform wax thickness with the sample ultimately centered on the substrate. 5.1.6 Apply pressure and/or weight on the sample if necessary. Weight should not be used on soft materials e.g., III-V compounds. Place a piece of filter paper on the sample and gently place the weight on the paper. Turn the hot plate off and wait for at least 20 minutes. 3
Page 1: LOGITECH PM5 LAPPING & POLISHING MA
Page 5 and 6: 6.0 PROCEDURE 5.3.4 Put the cylinde
Page 7 and 8: 7 NLS-030 6.3.5 Check if the wheels
Page 9 and 10: 7.1.5 Repeat procedures 5.3.1 to 5.
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