Nano-Or Presentation

Nano-Or’s 3DScope2000 

Assorted measurements and applications 

April 2004 Confidential / Proprietary 

1

The 3DScope2000 

Providing, high speed, 

high accuracy 3D 

measurement and 

imaging, with the 

operation friendliness 

of a white light 

microscope. 


2

The 3DScope2000 System 

• High-accuracy Z axis 

measurement – equivalent to 

phase shift interferometers 

+ 

• No sensitivity to vibration 

• No scanning 

• No sensitivity to focus variations 

• Same foot print as microscope 

• Fast set-up – fast measurement 

• Short operation learning curve 

• High-End White light microscope 

• Multiple objectives 

• Bright and dark field 

• Optical quality eye piece 

• Colored CCD 

• Filters, polarizers 

• Optional motorized capabilities 

Stage 

Auto-focus 

Turret 

• Automated sample handling 

• Unified system 

• Automation 

• Production floor compliance 

• Integration with peripheral test 

and measurement equipment 


3

3DScope2000 Performance Specification Highlights 

Parameters Value 

Z axis resolution 

Z axis absolute accuracy 

Z axis measurement range 

FOV measurement time 

1 nm 

5 nm (typical) 

Up to 7 µm and within few 

times objective depth of field. 

50 µm in development 

≤ 7 sec 

Objectives Magnification 5x, 10x, 20x, 50x, 100x 

FOV [mm] 1.0, 0.5, 0.24, 0.1, 0.05 

Optical lateral resolution [µm] 3.5, 1.2, 0.8, 0.5, 0.4 

Pixel footprint [µm] 1.6, 0.8, 0.4 , 0.2, 0.08 

Depth of field [µm] 65, 7, 3, 1, 0.8 


4

Getting familiar with the 

operating screen 


5

Accept 

The height map is actually a matrix 

where every pixel represents an element 

on the sample. The color represents the 

height, according to the upper color bar. 

These are the 

analysis tools. 

One can choose 

a tool and 

analyze the data 

Software 

leveling 

Pressing the “profile” 

button” allows the operator 

to draw a line by marking 

two points and get the 

profile along the line. 

The numbers beside the 

color bar define the height 

range (upper and lower 

limits) of the sample 

measured in nanometer. 

3D presentation by selecting an 

area in the height map 

While the upper color bar is fixed and represent the 

entire height of the measurement, the lower one 

can be either shrunk or slid so that the height map 

colors span between the numbers displayed at the 

ends of that bar. This is a zoom in the Z axis where 

one can see more details in the Z axis. 

Height difference between 

two areas 

Surface analysis 


6

Assorted measurements 

of various applications 


7

Field of view 1mm 

Accelerometer’s membrane for 

automotive application 

A profile along the marked line 


8


Mirror Array 

3D presentation of the marked area 

Chrome and Nickel over Silicon 


9


Mirror Array, activated to 

various heights 


10

Field of view 250µm 

MEMS Cantilevers 

A 3D presentation 


11


Copper plating on a patterned wafer 

3D presentation 


12

Height difference between 

two areas of a copper 

plated patterned wafer 

A height difference between the two 

marked zones 


13


Surface quality and 

roughness analysis of a 

copper plated patterned wafer 

Calculated on the marked area 


14

Probes’ marks on pads 

A profile along the marked line 


15

Copper pad 


SiO 2 

Copper Dishing 

3D presentation 


16


Roll-off of a Copper 

Deposited Wafer 


17


EPI Wafer Roll-Off 


18


EPI Wafer Alignment Target 


19


Metalization Characterization 


20


Metalization Characterization 

500 C 


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Direct Write of Copper 


22

Thank You 

Nano-Or Technologies 

1 Yodfat St. 

Lod 71291, Israel 

Tel: +972 8 9282801 

Fax: + 972 8 9282805 


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