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Scientific Advisory Board - Erich Schmid Institute

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ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE<br />

Complex Materials<br />

Several aspects of our wide variety of materials have been discussed in previous sections,<br />

especially dual-phase and complex phase steels, damage tolerant materials (see section<br />

deformation, fatigue, fracture) and nanocrystalline bulk materials (see next section Synthesis<br />

of Bulk nano-materials and composites by Severe plastic deformation), which could be as<br />

well listed here. other material systems we study intensively are thin film structures, which<br />

are scientifically interesting due to the numerous internal interfaces that significantly influence<br />

the film and film/substrate properties. in this section we want to highlight our recent research<br />

achievements concerning adhesion and fracture of brittle and ductile films on compliant<br />

substrates, spanning from metal/polymer to ceramic/metal systems.<br />

Advances in Fragmentation Testing of Thin Films<br />

the reliability of flexible electronics depends upon the ability of metal thin films, both brittle<br />

and ductile, to bend and stretch with the supporting polymer substrate while maintaining<br />

mechanical and electrical integrity. experiments to measure these behaviors are mostly based<br />

on fragmentation testing. A key element to fragmentation testing is the detection of the fracture<br />

strain or stress. this detection can be easily performed with an optical microscope or scanning<br />

electron microscope while straining (in situ). Brittle films or coatings will form channel cracks<br />

perpendicular to the straining direction and channel cracks are easy to detect, thus failure is<br />

also easily determined. However, ductile films, such as Au, cu, or Ag (all materials being used<br />

as conduction carrying elements in flexible electronics) plastically deform before channel cracks<br />

are observed. the localized plastic deformation, or necks (necking), are the first sign of yield in<br />

the film and are hard to observe with om or Sem. the implementation of fragmentation testing<br />

with atomic force microscopy (Afm) is a solution that allows for the detection of initial film yield<br />

and measurement of the deformation density and channel crack density as a function of strain.<br />

necking and channel cracks are observed using height images and the difference in surface<br />

profiles (fig. 13). the technique works well when there is a specific criterion to define a channel<br />

crack versus localized deformation (necking). Brittle films match Sem experiments very well<br />

while ductile films do not. the greatly improved height resolution of the Afm compared to the<br />

Sem is the reason for this discrepancy. these results lead one to believe that fragmentation<br />

Fig . 13 a) AFM height image at 2% strain with the surface profile and necks indicated by<br />

the white arrows. b) Surface profiles at 2% and 15% strain. c) AFM height image at 15%<br />

strain of the same area as (a) with the surface profile and channel cracks indicated with black<br />

arrows and the position of necks with white arrows and circled areas indicate where a neck has<br />

become a channel crack. Note the ~x2 difference in height scales in a) and c).<br />

page 28 <strong>Scientific</strong> RepoRt 2012

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