PcB - High Frequency Electronics

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High Frequency Design PCB Probing High Frequency PCB Probing with Fixture Removal for Multi- Port Devices By Heidi Barnes, Jose Moreira, Mike Resso, and Robert Schaefer We will explore how to provide robust high frequency multi-port measurements of PCB structures. Modern day printed circuit boards (PCBs) have easily met the challenge of 10 GHz high frequency designs and now push well beyond 40 GHz. Higher complexities of mixed signal devices and increasing densities of sub-millimeter pitch packaging creates a significant multi-port design challenge that is often difficult to verify or troubleshoot with existing measurement calibration techniques. Full characterization of a signal path is easily done with a high frequency Vector Network Analyzer, but making the fixture connection from the large coaxial inputs of a VNA to the planar PCB substrate is not a trivial problem at high frequencies [1]. The presence of crosstalk in the multi-port fixture connections and the issues in designing relevant PCB probe calibration standards can easily create a roadblock to acquiring accurate measurements of a PCB footprint or signal path. This article will explore the use of an optimized probe to PCB interposer technique along with simplified calibrations with de-embedding to provide robust high frequency multi-port measurements of PCB structures. Even with the best of calibration techniques, one cannot calibrate out a fixture that has losses that exceed the sensitivity of the measurement instrument. Utilizing a commercially available 40 GHz probe to connect to a PCB does not guarantee a full 40 GHz connection. It is important to understand the need for a controlled impedance transition from the probe tip to the planar PCB structure to minimize signal degradation and improve accuracies in calibrating out the fixture. Since the performance of the probe depends on how the connection is made to the PCB it is necessary to create calibration standards that incorporate this same electro-mechanical interface for accurate removal of the fixture effects. Standard Through-Reflect-Multiple Lines (TRL) techniques have historically been the method of choice for calibration standards on PCB, however, when implementing this in a multi-port system it can become very time consuming and prone to human error [2]. Utilizing adapter removal techniques to individually characterize each of the probes based on one TRL calibration can greatly speed up this task. The end result with S-parameters for each probe fixture enables simple and flexible de-embedding of the fixture effects from the measurement or replacement of damaged probes without repeating a TRL calibration. Newer calibration techniques using 2x through Automatic Fixture Removal (AFR) algorithms Figure 1 • Example PCB with BGA via field for signal path characterization. 24 High Frequency Electronics
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Page 1 and 2: ALSO PUBLISHED ONLINE: www.highfreq
Page 3 and 4: 3-year warranty applies to rack-mou
Page 5 and 6: COMPLIANT 90° SPLITTERS 5 MHz to 8
Page 8 and 9: EDITORIAL Vol. 11 No. 8, August 201
Page 10 and 11: MEETINGS & EVENTS Conferences Augus
Page 12 and 13: MEETINGS & EVENTS vides an introduc
Page 14 and 15: IN THE NEWS Raytheon Company was aw
Page 16 and 17: IN THE NEWS College of Technology a
Page 18 and 19: High Frequency Products FEATURED PR
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Page 23 and 24: QUALITY, PERFORMANCE AND RELIABILIT
Page 25: The Difference Starts with the Cabl
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Page 46 and 47: Design Notes & Market Reports Femto
Page 48 and 49: High Frequency Products NEW PRODUCT
Page 54 and 55: Product Highlights Isolator RFMW an
Page 59 and 60: COMPLIANT POWER SPLITTERS COMBINERS
Page 61 and 62: Product Highlights Detector RLC Ele
Page 63 and 64: Product Highlights LTE App Notes Th
Page 65 and 66: Product Highlights FPGA Software Na
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