PRiMELiNE - Roth & Rau AG

PRiMELiNE CdTe Laser Cluster (80 MW)
CdTe Thin Film PV Modules have been recognized as the markets
most cost efficient solution for PV applications. To support cost
efficient, proven processing, Roth & Rau CTF Solar offers processing
clusters and tools for all thin film PV module customers
worldwide that can be seamlessly integrated into new production
lines as well as into existing fabrication lines. The Roth & Rau CTF
Solar chosen cluster design provides to the customer specific
process knowledge combined with suitable process equipment
and processing materials, project management and equipment
startup in order to enhance product quality and module efficiencies.
All PRiMELiNE CdTe Clusters are capable of processing standard
module sizes of 1200 x 1600 mm (other dimensions on
request), with a throughput of > 60 modules per hour. Basis for the
design of all PRiMELiNE CdTe Cluster Tools is the innovative yet
proven PRiMELiNE CdTe Turnkey production line.
The PRiMELiNE CdTe Laser Cluster contains three Laser Scribers
for P1, P2, P3 cuts and a Laser Edge Deletion tool. Equipment
selection is optimized for use on CdTe. Although the individual
tools of the Laser Tool cluster are spread inside the sequential
tool layout of a thin film production line, customers can benefit
from this tool package as all tools are matched with respect to
performance and specification for optimized utilization of active
module surface area.
Thin film PV modules require several special processing steps in
order to generate a pattern of multiple PV sub cells that needs to
be very precise, as well as a fast and reliable layer removal without
damaging the substrate itself for preparation of the backend
edge sealing process. Therefore the application of laserbased
tools is just a logical consequence, as laser tools are known as
precise and powerful machining tools.
Laser Scribers for P1, P2, P3 cuts
These laser systems are used for scribing of the thin-films of conductive
and semi-conductive materials on large substrates to produce
stripes of defined width parallel to the substrate´s long or
short edge depending on the modules' cell orientation. The position
of each P1, P2, and P3 scribe is shifted by a small distance in
order to connect all sub cells serially to each other. To guarantee
for minimal distances between P1 and P2 resp. P3 cuts both P2
and P3 laser use a dynamic line tracking mechanism; this feature
provides for optimized active cell areas and - in total - for high
module efficiencies. The number and width of the individual sub
cells are optimized for a maximum utilization of active module surface.
The Scribing tools are programmable; to achieve sufficient
throughput each Scribing tool is equipped with several pulsed
lasers, and each laser beam is split into several cutting beams.
In accordance with the layer composition each tool's laser
wavelength is adapted; used laser wavelengths are 532 nm resp.
1064 nm. Damage of underlying layers is avoided, which is of special
importance for P2 and P3 cuts: Both cuts are not allowed to
cut into the underlying TCO layer. All laser tools use a dynamic,
active focusing for excellent scribing process
Key features:
Throughput > 60 substrates/h
Module size up to 1200 x 1600 mm
Scribing line width 35 - 70 m,
Line-to-line distance 5 - 15 mm
(adjustable per software setting)
Multiple processing beams, depending
on specific requirements
Air bearings to guide laser axis‘
Massive granite processing table
for optimum accuracy
Dynamic focusing (optional)
Dynamic line tracking (optional)
Integrated laser fumes exhaust
and filtration system
Integrated P1 and P2 input substrate cooling