Online Semi-radius Probe Tip Cleaning and Reshaping

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Contact resistance setup and measurement technique TEL P12XLN prober @ 25C, Maximum z velocity Probe – 50 micron pitch 1X25 tungsten rhenium material, 20 micron nominal tip diameter ~ 1gf/mil spring rate 50 micron overdrive from first touch (contacts were within 9 microns from first to last touch) 100 touchdowns between cleans Relative measurement – not 4 point All data “nulled” – path or bulk resistance removed 300mm wafer – 1.2 micron as deposited aluminum – blanket deposition June 3, 2007 IEEE SW Test Workshop 16
Measurement circuit • Test stimulus 10 ma forcing current – 5V clamp • Min - Max - Average data collected plus raw data • Keithley based matrix switch and source/measurement unit VI source Contact under test Return path June 3, 2007 Shorted wafer Note: actual return path pins = 24 IEEE SW Test Workshop 17
Page 1 and 2: Online Semi-radius Probe Tip Cleani
Page 3 and 4: Acknowledgements Jack Courtney John
Page 5 and 6: Why Semi-radius? Lower pad damage i
Page 7 and 8: The problem with Semi- radiused pro
Page 9 and 10: The solution Two part cleaning - in
Page 11 and 12: June 3, 2007 Typical recipes 5 -10
Page 13 and 14: Contact resistance - Elastomeric 5
Page 15: Contact resistance - dual clean JEM
Page 19 and 20: SiC clean Typical flat tip Silicon
Page 21 and 22: Sequence and motion (use animation)
Page 23 and 24: Detractor Die Size limited - effect
Page 25: 142 mm 155 mm Future work Evaluate

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