Debris and Edge Excursions - Semiconductor Wafer Test Workshop

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The Effect of Simply Detecting “Defects” (Anomalies) Inspection Inspection Time: 5 minutes Results: 5x Total number of defects: Approximate Review Time: 14400 2 hours 20 minutes Fast inspection Unacceptable review time
Detection to Decision for Probe Mark Inspection Statistical Probe Mark Area Filter <strong>Debris</strong> Filter for <strong>Edge</strong>
Page 1 and 2: Reducing False Defects: Debris and
Page 3 and 4: Probe Mark Inspection Rectangular b
Page 5 and 6: The Challenge of Automated Probe Ma
Page 7 and 8: Throughput vs. Resolution Seconds t
Page 9 and 10: The Specific Challenge of Edge Excu
Page 11: Rogues Gallery: Images of False vs.
Page 15 and 16: Probe Mark Area Inspection Without
Page 17 and 18: Standard Deviations vs. Performance
Page 19 and 20: Defect Map Without Area Filter Fals
Page 21 and 22: Pad Areas Before & After Filter Bef
Page 23 and 24: Probe Mark Debris Filter - Edge Deb
Page 25 and 26: Method 2 - With Edge Debris Filter
Page 27 and 28: Edge Debris Filter Advantages Fast
Page 29 and 30: Acknowledgements This data was gene

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