Debris and Edge Excursions - Semiconductor Wafer Test Workshop

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Debris and Edge Excursions - Semiconductor Wafer Test Workshop

Debris and Edge Excursions - Semiconductor Wafer Test Workshop

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Pad Areas Before & After Filter<br />

Before Filter:<br />

Pad #8 Fails<br />

Pad #9 Fails<br />

#8 #9<br />

After Filter:<br />

Pad #8 Passes<br />

Pad #9 Fails

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Pad Areas Before & After Filter Before Filter: Pad #8 Fails Pad #9 Fails #8 #9 After Filter: Pad #8 Passes Pad #9 Fails

Page 1 and 2: Reducing False Defects: Debris and
Page 3 and 4: Probe Mark Inspection Rectangular b
Page 5 and 6: The Challenge of Automated Probe Ma
Page 7 and 8: Throughput vs. Resolution Seconds t
Page 9 and 10: The Specific Challenge of Edge Excu
Page 11 and 12: Rogues Gallery: Images of False vs.
Page 13 and 14: Detection to Decision for Probe Mar
Page 15 and 16: Probe Mark Area Inspection Without
Page 17 and 18: Standard Deviations vs. Performance
Page 19: Defect Map Without Area Filter Fals
Page 23 and 24: Probe Mark Debris Filter - Edge Deb
Page 25 and 26: Method 2 - With Edge Debris Filter
Page 27 and 28: Edge Debris Filter Advantages Fast
Page 29 and 30: Acknowledgements This data was gene