Debris and Edge Excursions - Semiconductor Wafer Test Workshop

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Summary of Debris Filter Usage Type of Debris Filter Size Cantiliver Probing Applicable Vertical Probing/ Microspring Not an issue Edge Debris Applicable Not an issue
Acknowledgements This data was generated by the following August Technology personnel: Woo Young Han Max Guest Steve Frankeberger
Page 1 and 2: Reducing False Defects: Debris and
Page 3 and 4: Probe Mark Inspection Rectangular b
Page 5 and 6: The Challenge of Automated Probe Ma
Page 7 and 8: Throughput vs. Resolution Seconds t
Page 9 and 10: The Specific Challenge of Edge Excu
Page 11 and 12: Rogues Gallery: Images of False vs.
Page 13 and 14: Detection to Decision for Probe Mar
Page 15 and 16: Probe Mark Area Inspection Without
Page 17 and 18: Standard Deviations vs. Performance
Page 19 and 20: Defect Map Without Area Filter Fals
Page 21 and 22: Pad Areas Before & After Filter Bef
Page 23 and 24: Probe Mark Debris Filter - Edge Deb
Page 25 and 26: Method 2 - With Edge Debris Filter
Page 27: Edge Debris Filter Advantages Fast

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