Debris and Edge Excursions - Semiconductor Wafer Test Workshop

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Statistical Probe Mark Area Filter Advantages Easy to use – user only specifies filter threshold level Fast – filter does not reduce machine throughput Effective – debris which significantly increases the perceived probe damage area is automatically cleared Automatically adjusts to variability of probing process. A well controlled process will have a lower standard deviation, resulting in a tighter debris filter threshold Disadvantages Not effective for small debris which does not significantly increase the probe damage area but does occlude the bond pad edge is not cleared and may cause false rejects May cause escapes if one probe needle creates a significantly larger damage area than other probe needles
Probe Mark Debris Filter – Edge Debris Sample defect images All three defects caught as probe position Sample defect images cleared with edge debris filter algorithm All three defects caught as probe position initially Gradient analysis around the edge of the bond pad
Page 1 and 2: Reducing False Defects: Debris and
Page 3 and 4: Probe Mark Inspection Rectangular b
Page 5 and 6: The Challenge of Automated Probe Ma
Page 7 and 8: Throughput vs. Resolution Seconds t
Page 9 and 10: The Specific Challenge of Edge Excu
Page 11 and 12: Rogues Gallery: Images of False vs.
Page 13 and 14: Detection to Decision for Probe Mar
Page 15 and 16: Probe Mark Area Inspection Without
Page 17 and 18: Standard Deviations vs. Performance
Page 19 and 20: Defect Map Without Area Filter Fals
Page 21: Pad Areas Before & After Filter Bef
Page 25 and 26: Method 2 - With Edge Debris Filter
Page 27 and 28: Edge Debris Filter Advantages Fast
Page 29 and 30: Acknowledgements This data was gene

Debris and Edge Excursions - Semiconductor Wafer Test Workshop

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