Debris and Edge Excursions - Semiconductor Wafer Test Workshop

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Parameters for Area Filter <strong>Test</strong> <strong>Wafer</strong> size: 8-inch Inspected die: 713 Die size: 5897um x 6349um Pads/die: 38 Max. area: 25% Std. Devs: 1.1
Defect Map Without Area Filter False “too big” defects from debris Probe “Too Big” Pass
Page 1 and 2: Reducing False Defects: Debris and
Page 3 and 4: Probe Mark Inspection Rectangular b
Page 5 and 6: The Challenge of Automated Probe Ma
Page 7 and 8: Throughput vs. Resolution Seconds t
Page 9 and 10: The Specific Challenge of Edge Excu
Page 11 and 12: Rogues Gallery: Images of False vs.
Page 13 and 14: Detection to Decision for Probe Mar
Page 15 and 16: Probe Mark Area Inspection Without
Page 17: Standard Deviations vs. Performance
Page 21 and 22: Pad Areas Before & After Filter Bef
Page 23 and 24: Probe Mark Debris Filter - Edge Deb
Page 25 and 26: Method 2 - With Edge Debris Filter
Page 27 and 28: Edge Debris Filter Advantages Fast
Page 29 and 30: Acknowledgements This data was gene

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