Debris and Edge Excursions - Semiconductor Wafer Test Workshop

More documents

Recommendations

Info

See More at Higher Resolutions 5µm 2µm 1µm ….but takes more inspection time
Throughput vs. Resolution Seconds to Inspect Preferred resolution 2000 1800 1600 1400 1200 1000 800 600 400 200 0 Inspection time increases approximately by square of pixel resolution Preferred inspection time 1um 2um 3um 5um Typical compromise
Page 1 and 2: Reducing False Defects: Debris and
Page 3 and 4: Probe Mark Inspection Rectangular b
Page 5: The Challenge of Automated Probe Ma
Page 9 and 10: The Specific Challenge of Edge Excu
Page 11 and 12: Rogues Gallery: Images of False vs.
Page 13 and 14: Detection to Decision for Probe Mar
Page 15 and 16: Probe Mark Area Inspection Without
Page 17 and 18: Standard Deviations vs. Performance
Page 19 and 20: Defect Map Without Area Filter Fals
Page 21 and 22: Pad Areas Before & After Filter Bef
Page 23 and 24: Probe Mark Debris Filter - Edge Deb
Page 25 and 26: Method 2 - With Edge Debris Filter
Page 27 and 28: Edge Debris Filter Advantages Fast
Page 29 and 30: Acknowledgements This data was gene

Debris and Edge Excursions - Semiconductor Wafer Test Workshop

Create successful ePaper yourself

Delete template?

Save as template?