Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
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Power & Ground in a TSS stack<br />
How many TSV and T2T connections are required to distribute<br />
power and ground<br />
PDN TSV Requirements<br />
TSV I*R pitch<br />
TSV farm pitch<br />
200 µm<br />
Intra-Tier I*R pitch<br />
TSV farm density<br />
50/mm 2<br />
TSV farm density<br />
Low Tier Count High<br />
Thomas R Toms July 16, 2008<br />
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