Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech

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3D TSS • Many Advantages • Many Challenges Aggressive Roadmap Process Materials Perception Technology is MANY years from High Volume Production Equipment Design Tools and Methodologies Cost An Alignment of these Challenges with real Applications 3D TSS Technology can be implemented sooner Thomas R Toms July 16, 2008 PAGE 2
Outline • Terminology • Growth in mobile and wireless markets • Capabilities vs. Application driven 3D • A TSS case study TSV selection counts/tier Si Growth Tier to Tier interconnects Si tier thickness Feature size vs. Throughput and Yield • Issues for TSS • Concluding remarks Thomas R Toms July 16, 2008 PAGE 3
Page 1: An Assessment of 3D Interconnect, E
Page 5 and 6: Growth in mobile and wireless marke
Page 7 and 8: ITRS Draft Specification for 3D 30K
Page 9 and 10: TSV selection TSV Keep Out Area (KO
Page 11 and 12: Power & Ground in a TSS stack How m
Page 13 and 14: Factors that impact Tier thickness
Page 15 and 16: Feature size vs. Throughput and Yie
Page 17 and 18: Concluding remarks To improve the s
Page 19 and 20: Thank You PAGE 19
Page 21 and 22: Calculation of TSV count for 1% tie
Page 23: 300mm Equipment/Process/Materials G

Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech

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