Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
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ITRS Draft Specification for <strong>3D</strong><br />
30K<br />
TSV/mm 2 vs. Year at 1% TSV KOA<br />
Source:<br />
INTERNATIONAL TECHNOLOGY ROADMAP<br />
FOR SEMICONDUCTORS<br />
2007 EDITION<br />
INTERCONNECT page 46<br />
TSV count<br />
25K<br />
20K<br />
15K<br />
10K<br />
5K<br />
Year:<br />
1315 – 3248 TSV/mm 2<br />
Small TSV<br />
Large TSV<br />
2007 2008 2009 2010 2011 2012 2013 2014 2015<br />
Acceptable TSV Densities<br />
Thomas R Toms July 16, 2008<br />
PAGE 7<br />
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