Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
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Factors that impact Tier thickness<br />
• TSV 1 st with a constant aspect ratio<br />
Resistance<br />
Capacitance/KOA<br />
Cost<br />
Yield<br />
• Thin tier handling<br />
Cost<br />
Yield<br />
?<br />
?<br />
?<br />
? ? ?<br />
?<br />
?<br />
25µm?<br />
There are various “?” that must be determined before the<br />
optimum tier thickness can be selected<br />
To be conservative Qualcomm is targeting thicker (50 µm<br />
minimum) vs. the thinner tier that shall be available for<br />
TSS products<br />
50µm?<br />
Thickness<br />
Thomas R Toms July 16, 2008<br />
PAGE 13
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