Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech

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Contributors

I would like to than the following people at Qualcomm who helped put this

presentation together

Arvind Chandrasekaran

Sam Gu

Rakesh Kumar

Matt Nowak

Riko Radojcic

Urmi Ray

Thomas R Toms July 16, 2008

PAGE 18

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Contributors I would like to than the following people at Qualcomm who helped put this presentation together Arvind Chandrasekaran Sam Gu Rakesh Kumar Matt Nowak Riko Radojcic Urmi Ray Thomas R Toms July 16, 2008 PAGE 18

Thank You PAGE 19

Page 1 and 2: An Assessment of 3D Interconnect, E
Page 3 and 4: Outline • Terminology • Growth
Page 5 and 6: Growth in mobile and wireless marke
Page 7 and 8: ITRS Draft Specification for 3D 30K
Page 9 and 10: TSV selection TSV Keep Out Area (KO
Page 11 and 12: Power & Ground in a TSS stack How m
Page 13 and 14: Factors that impact Tier thickness
Page 15 and 16: Feature size vs. Throughput and Yie
Page 17: Concluding remarks To improve the s
Page 21 and 22: Calculation of TSV count for 1% tie
Page 23: 300mm Equipment/Process/Materials G

Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech

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