Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
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Calculation <strong>of</strong> TSV count for 1% tier growth<br />
KOA assumptions<br />
TSV KOA = 2X TSV area<br />
TSV KOA shape is circular<br />
Ignores standard cell step size<br />
TSV KOA = 0.5 * pi * (TSV diameter) 2<br />
1% <strong>of</strong> 1mm 2 = 10,000µm 2<br />
TSV count = 10,000/TSV KOA<br />
For example using the 2008 ITRS TSV diameters:<br />
TSV diameter: 1.4 – 2.2µm<br />
Small TSV KOA = 0.5 * pi * (1.4µm) 2 = 3.078µm 2<br />
Small TSV count = 10000/3.078 = 3248<br />
Large TSV KOA = 0.5 * pi * (2.2µm) 2 = 7.603µm 2<br />
Large TSV count = 10000/7.603 = 1315<br />
Thomas R Toms July 16, 2008<br />
PAGE 21<br />
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