Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
Feature size vs. Throughput and Yield<br />
• COO & Yields for TSS<br />
Function <strong>of</strong> feature size<br />
Standardization<br />
• Qualcomm has defined TSS feature size to standardize, improve throughput<br />
and yields; while, meeting our anticipated µ-architecture needs<br />
• Qualcomm TSS feature size requirements are relaxed compared to the data in<br />
the 2007 ITRS <strong>3D</strong> targets by<br />
Tier Thickness 2 – 10X<br />
TSV pitch/size 4 – 9X<br />
T2T pitch 7 – 10X<br />
Thomas R Toms July 16, 2008<br />
PAGE 15
Change language