Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
Qualcomm's Assessment of 3D Interconnect Equipment ... - Sematech
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300mm <strong>Equipment</strong>/Process/Materials Gaps Table<br />
High – Level Module<br />
<strong>Equipment</strong><br />
Process<br />
Material<br />
Wafer crack during demount<br />
Adhesive max temperature<br />
Carrier (Mount/Demount)<br />
Lead time, cost<br />
µbump<br />
conformality<br />
Carrier material selection<br />
Number <strong>of</strong> carrier cycles<br />
Adhesive residue<br />
TSV Contact preparation<br />
CMP<br />
PECVD<br />
TTV process optimization<br />
Passivation material<br />
(stress/temperature)<br />
RDL<br />
BF Alignment<br />
Stepper resolution<br />
Planarity<br />
Polymer temperature<br />
T2T Bonding<br />
Bonding accuracy<br />
Under fill<br />
Material stack up<br />
TSS stack assembly<br />
TSS stack bumping<br />
Thomas R Toms July 16, 2008<br />
PAGE 23<br />
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