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TEST PATTERNS<br />

The ‘Mainframe Mentality’ Lives On!<br />

By Paul M. Sakamoto, Contributing Editor–Test [paul.sakamoto@inovys.com]<br />

I<br />

would guess that about half of<br />

you who read this column<br />

remember the time when mainframe<br />

computers roamed the land.<br />

The closely related mini-computer<br />

was its scaled-down little brother. Aside<br />

from the fact that they were very large<br />

by today’s standards, these machines all<br />

had proprietary operating systems and<br />

programming languages.<br />

This required specialized training for<br />

the various models from different manufacturers.<br />

Additionally, the networking<br />

between these machines was very difficult<br />

and aided the growth of specialized<br />

companies to address the task.<br />

Slow to Adopt Standards<br />

The biggest reason that the <strong>industry</strong> was<br />

slow to adopt standards was that it<br />

allowed vendors to keep their customers<br />

virtually enslaved once users adopted a<br />

maker’s proprietary system.<br />

It also allowed the manufacturer to<br />

charge for a very wide variety of related<br />

goods and services that only they could<br />

provide.<br />

Fortunately, today we have standards<br />

for software, applications and networking<br />

that are applied very broadly. These<br />

standards allow the direct re-use of data<br />

and information on virtually all current<br />

computers, smart phones, PDAs, and<br />

other computing machines.<br />

My rant today is that this is not the<br />

case for ATE.<br />

3600Plus & 3700Plus<br />

More performance with<br />

fewer limitations.<br />

The 3600Plus and 3700Plus wire bonders break new ground<br />

in innovation and design. Offering you more performance,<br />

options and versatility, the Plus Series combines intuitive<br />

technology with quality and reliability:<br />

• PowerRibbon TM Option for ribbon sizes 20 mil x 4 mil to<br />

80 mil x 8 mil<br />

• Bond Process Monitoring (BPM) flags suspect bonds in<br />

real-time, stores process information for later evaluation<br />

• Active Loop Control (ALC) bondheads allow best-in-class<br />

loop control and non-destructive pulltesting<br />

• Offline Programming Tool (OPT) converts CAD files into<br />

machine process programs, maximizing machine uptime<br />

New machine capabilities for greater performance, new<br />

international offices for better service, and a new interconnect technology<br />

— Orthodyne is committed to giving customers more.<br />

10<br />

<strong>Chip</strong> <strong>Scale</strong> <strong>Review</strong> ■ March 2007 ■ [<strong>Chip</strong><strong>Scale</strong><strong>Review</strong>.com]

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