industry news - Chip Scale Review
industry news - Chip Scale Review
industry news - Chip Scale Review
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
TEST PATTERNS<br />
The ‘Mainframe Mentality’ Lives On!<br />
By Paul M. Sakamoto, Contributing Editor–Test [paul.sakamoto@inovys.com]<br />
I<br />
would guess that about half of<br />
you who read this column<br />
remember the time when mainframe<br />
computers roamed the land.<br />
The closely related mini-computer<br />
was its scaled-down little brother. Aside<br />
from the fact that they were very large<br />
by today’s standards, these machines all<br />
had proprietary operating systems and<br />
programming languages.<br />
This required specialized training for<br />
the various models from different manufacturers.<br />
Additionally, the networking<br />
between these machines was very difficult<br />
and aided the growth of specialized<br />
companies to address the task.<br />
Slow to Adopt Standards<br />
The biggest reason that the <strong>industry</strong> was<br />
slow to adopt standards was that it<br />
allowed vendors to keep their customers<br />
virtually enslaved once users adopted a<br />
maker’s proprietary system.<br />
It also allowed the manufacturer to<br />
charge for a very wide variety of related<br />
goods and services that only they could<br />
provide.<br />
Fortunately, today we have standards<br />
for software, applications and networking<br />
that are applied very broadly. These<br />
standards allow the direct re-use of data<br />
and information on virtually all current<br />
computers, smart phones, PDAs, and<br />
other computing machines.<br />
My rant today is that this is not the<br />
case for ATE.<br />
3600Plus & 3700Plus<br />
More performance with<br />
fewer limitations.<br />
The 3600Plus and 3700Plus wire bonders break new ground<br />
in innovation and design. Offering you more performance,<br />
options and versatility, the Plus Series combines intuitive<br />
technology with quality and reliability:<br />
• PowerRibbon TM Option for ribbon sizes 20 mil x 4 mil to<br />
80 mil x 8 mil<br />
• Bond Process Monitoring (BPM) flags suspect bonds in<br />
real-time, stores process information for later evaluation<br />
• Active Loop Control (ALC) bondheads allow best-in-class<br />
loop control and non-destructive pulltesting<br />
• Offline Programming Tool (OPT) converts CAD files into<br />
machine process programs, maximizing machine uptime<br />
New machine capabilities for greater performance, new<br />
international offices for better service, and a new interconnect technology<br />
— Orthodyne is committed to giving customers more.<br />
10<br />
<strong>Chip</strong> <strong>Scale</strong> <strong>Review</strong> ■ March 2007 ■ [<strong>Chip</strong><strong>Scale</strong><strong>Review</strong>.com]