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INDUSTRY NEWS<br />

Taiwan Will Be the Largest<br />

Equipment Market in 2007<br />

Washington, D.C.—Taiwan will be the<br />

biggest spender for chip-making equipment<br />

in 2007, according to a report<br />

published by the U.S.-Taiwan Business<br />

Council.<br />

Semiconductor Report–Annual <strong>Review</strong><br />

2006 says that 2006 was an exceptionally<br />

strong growth year for Taiwan’s leading<br />

foundry and DRAM chipmakers, and<br />

with expanded production capabilities<br />

in 300mm wafer fabs and the establishment<br />

of new partnerships, Taiwan is<br />

poised for a record year. [us-taiwan.org]<br />

Taiwan is poised for a record year.<br />

CALENDAR<br />

APRIL<br />

10-12 IPC/JEDEC Global Conference<br />

on Lead-Free Reliability and<br />

Reliability Testing for RoHS Lead-<br />

Free Electronics, Boston, Mass.<br />

[ipc.org]<br />

24-26 SMT/Hybrid/Packaging 2007,<br />

Nuremberg, Germany<br />

[smt-exhibition.com]<br />

MAY<br />

8-10 SEMICON Singapore,<br />

Singapore [semi.org]<br />

May 29-June 1 ECTC 2007: 57th<br />

Electronics Components and<br />

Technology Conference, Reno, Nev.<br />

[ectc.net]<br />

JUNE<br />

4-6 IEEE 2007 International<br />

Interconnect Technology Conference,<br />

Burlingame, Calif. [ieee.org]<br />

13-15 PEAKS Symposium on<br />

Advanced Cleaning Technology,<br />

Whitefish, Mont. [semitool.com/peaks]<br />

JULY<br />

SEMICON West<br />

16-20 (Conference), 17-19 (Exhibits),<br />

Moscone Center, San Francisco<br />

[semi.org]<br />

Simtek Corp. Hires Hulse for Worldwide Marketing Post<br />

Colorado Springs, Colo.—Grant Hulse<br />

has joined Simtek Corp., a provider of<br />

nonvolatile SRAMs, as vice president of<br />

worldwide marketing. He joined the<br />

company from Qualcomm, where he<br />

was an RF product line manager.<br />

Hulse reports to Simtek president<br />

Harold Blomquist, and will be based in<br />

Launch your<br />

new flip-chip<br />

product in<br />

record time.<br />

assembly in BGA, ceramic, plastic,<br />

QFN, COB and MCM packages.<br />

In addition to flip-chip capability,<br />

CORWIL has outstanding wirebonding<br />

expertise for ultra-fine pitch applications<br />

in gold and aluminum wire.<br />

Contact Us At:<br />

CORWIL Technology Corporation<br />

1635 McCarthy Blvd.<br />

Milpitas, CA 95035 info@corwil.com<br />

Tel: 408-321-6404 www.corwil.com<br />

Fax: 408-321-6407 ISO 9001:2000 Registered<br />

the company’s San Diego office. He<br />

received a master’s degree in electrical<br />

engineering from Stanford University.<br />

[simtek.com]<br />

Did You Know? <strong>Chip</strong> <strong>Scale</strong> <strong>Review</strong><br />

is now offered in a digital format with a<br />

powerful search engine!<br />

COMPLEX FLIP-CHIP<br />

ASSEMBLY WITH<br />

SAME DAY TURN<br />

➢ Over 3200 bump/ball IO’s<br />

➢ Flexible Process Flows<br />

➢ Wide Material Selection<br />

➢ Gold Stud Bumping<br />

➢ Prototypes: as quick as<br />

8 hours!<br />

➢ Production: 1000’s of<br />

units per week<br />

CORWIL has developed into the premier<br />

U.S.-based packaging subcontractor with<br />

world-class wafer thinning, dicing, pick-andplace<br />

and visual<br />

inspection, plus<br />

state-of-the-art IC<br />

Since 1990 CORWIL has built its reputation providing customers with:<br />

Excellent Quality and Superior Service<br />

DSCC QML Certification<br />

MIL-PRF-38535<br />

MIL-STD-883<br />

<strong>Chip</strong> <strong>Scale</strong> <strong>Review</strong> ■ March 2007 ■ [<strong>Chip</strong><strong>Scale</strong><strong>Review</strong>.com] 21

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