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There is, however, still room for
improvement, says Stermer, who offers
these examples:
• Ease of work-holder set-up, specifically
for thin leadframes and substrate
handling, currently requiring
many assists and adjustment
• Drifting balls, inconsistent looping
The Windows-based operating system is
“much more user-friendly” compared to
older versions. Yet, Stermer says the
software is unstable, and the process
portability function should be
enhanced. Additionally, many new
parameters are offered only within hidden
screens.
Curtis Escobar, senior process engineer
at CORWIL Technology Corp., a Milpitas,
Calif.-based IC assembler, has some
thoughts about wire bonders, as well.
Current fine-pitch capability with
tight tolerances for bonding force, the
ultrasonics and placement accuracy are
particularly helpful, says
Escobar, for bonding to MEMS,
low-k, thin-layer- and “fragile
structure” die.
Improvement Needed
Troublesome features with wire
bonders, says Escobar, include
mechanical clearance issues, with
increasingly complex and multilevel
packages, PWBs, and so forth.
Also problematic are wire
supply spooling and feed.
“When is the fully automatic
self-wire-threading wire bonder
coming? Escobar ponders.
Wire bonding is both an academic
and practical issue to Dr.
Herbert Reichl of Fraunhofer
IZM, Berlin, Germany.
Worthy of praise, says Prof.
Reichl, is the strong development
trend toward user interfaces
that are intuitive.
Orthodyne’s 3700 Plus is a dual-head, ultrasonic bonder
available as a wedge, ribbon or wire unit.
Chip Scale Review ■ March 2007 ■ [ChipScaleReview.com] 31