industry news - Chip Scale Review
industry news - Chip Scale Review
industry news - Chip Scale Review
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LINTEC’S TECHNOLOGIES<br />
➤ LE Tape SD type (Heat cureless)<br />
➤ LE Tape EW type (Wire-Embedded)<br />
➤ LE Tape ES type (Die-bonding to Substrate)<br />
➤ LC Tape (Wafer back surface protection film)<br />
➤ UV Dicing Tape for Thin Wafer<br />
➤ Anti Static UV Dicing Tape for Packages<br />
➤ Wafer mounting systems<br />
➤ UV irradiation systems<br />
➤ And more<br />
USA Subsidiary:<br />
LINTEC ADVANCED TECHNOLOGIES (USA) INC.<br />
4629 E. Chandler Blvd., Suite 110<br />
Phoenix, AZ 85048 USA<br />
Tel: +1.480.966.0784<br />
Email: Info@lintec-usa.com<br />
www.lintec-usa.com<br />
Complete turnkey<br />
solutions for...<br />
FLIP CHIP DIE SORTING<br />
innovative concept<br />
sorting of dice<br />
from 0.5x0.5 to 7.0x7.0 mm<br />
high speed of up to 10,000 uph<br />
incl. flip and full inspection time<br />
highest accuracy<br />
of up to ± 30 µm<br />
bare dice sorting (WLCSP) into<br />
different packages such as<br />
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TECURITY<br />
R<br />
DS 10000<br />
- Complete Solutions setting the new Standards<br />
FCM 10000/FLEX<br />
FLIP CHIP DIE BONDING<br />
innovative concept<br />
handling of dice from 0.3x0.3 to 7.0x7.0 mm<br />
high speed of up to 10,000 uph<br />
incl. flip and full inspection/testing time<br />
highest accuracy of up to ± 25 µm<br />
applications for RFID, IC module<br />
packages like Smart Card etc.<br />
Mühlbauer, Inc.<br />
725 Middle Ground Boulevard<br />
Newport News, VA 23606-2512<br />
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Fax: +1 757 873 0485<br />
Email: info@muhlbauer.com<br />
Internet:www.muhlbauer.com<br />
42<br />
<strong>Chip</strong> <strong>Scale</strong> <strong>Review</strong> ■ March 2007 ■ [<strong>Chip</strong><strong>Scale</strong><strong>Review</strong>.com]
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