Burn-in & Test Socket Workshop - BiTS Workshop

More documents

Recommendations

Info

COPYRIGHT NOTICE • The papers in this publication comprise the proceedings of the 2002 BiTS Workshop. They reflect the authors’ opinions and are reproduced as presented , without change. Their inclusion in this publication does not constitute an endorsement by the BiTS Workshop, the sponsors, or the Institute of Electrical and Electronic Engineers, Inc. · There is NO copyright protection claimed by this publication. However, each presentation is the work of the authors and their respective companies: as such, proper acknowledgement should be made to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author/s or their companies.
Burn-in & Test Socket Workshop Technical Program Session 5 Tuesday 3/05/02 1:00PM Modeling, Analysis and Characterization “Electrical Modeling And Contactor Performance In A RF System” Jim Adley - Johnstech International Corporation Eric Leung - Johnstech International Corporation Jeff Sherry - Johnstech International Corporation “Leaded 2mm Contactors: Measuring And Modeling To 10 GHz” Tom Strouth - GigaTest Labs Orlando Bell - GigaTest Labs Gary Otonari - GigaTest Labs Eric Bogatin - GigaTest Labs Jeff Sherry - Johnstech International Corporation “Force Measurement On Sockets And Contactors” Richard Block - Advanced Micro Devices Rafiq Hussain - Advanced Micro Devices
Page 1: Burn-in & Test Socket Workshop IEEE
Page 5 and 6: Discussion Topics ▼ Modeled Data
Page 7 and 8: Modeled Data ▼ Modeling was done
Page 9 and 10: Modeled Data - S 11 ▼ This is dat
Page 11 and 12: Modeled Data ▼ HFSS Capabilities
Page 13 and 14: Measured Data Surrogate Circuit 10
Page 15 and 16: Measured Data ▼ The 0.5 mm pitch
Page 17 and 18: Comparative Data 0 0.5mm Pitch BGA
Page 19 and 20: Equivalent Circuit Model ▼ Measur
Page 21 and 22: Equivalent Circuit Model 0.5mm Pitc
Page 23 and 24: Equivalent Circuit Model Developmen
Page 25 and 26: Conclusion ▼ For leading edge RF
Page 27 and 28: Slide - 2 Outline • Contactors
Page 29 and 30: Slide - 4 Analysis • Goal Create
Page 31 and 32: Slide - 6 Surrogate Package: Enable
Page 33 and 34: Slide - 8 Probing From the Back Sid
Page 35 and 36: Slide - 10 Methodology • Measure
Page 37 and 38: Slide - 12 Optimized Model: Open Im
Page 39 and 40: Slide - 14 Optimized Model: Short I
Page 41 and 42: Slide - 16 Optimized Model: Loop-Th
Page 43 and 44: Slide - 18 De-Embedded Insertion an
Page 45 and 46: Slide - 20 Transient Simulation wit
Page 47 and 48: Force Measurement on Sockets and Co
Page 49 and 50: Force Issues in Test and Burn-In En
Page 51 and 52: DUT Thermal Head FMU consists of 3
Page 53 and 54:
Experimentation • FMU was used fo
Page 55 and 56:
Experimentation cont. • FMU was u
Page 57 and 58:
Insertion Life vs. Force cont. •
Page 59 and 60:
Looking Forward • Die size Transd
Page 61 and 62:
Package/Die Transducer Example Die
show all

Burn-in & Test Socket Workshop - BiTS Workshop

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?