Burn-in & Test Socket Workshop - BiTS Workshop

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Slide - 7 Instrument Set Up BiTS 2002
Slide - 8 Probing From the Back Side Probing using microprobes and a GigaTest Probe Station BiTS 2002
Page 1 and 2: Burn-in & Test Socket Workshop IEEE
Page 3 and 4: Burn-in & Test Socket Workshop Tech
Page 5 and 6: Discussion Topics ▼ Modeled Data
Page 7 and 8: Modeled Data ▼ Modeling was done
Page 9 and 10: Modeled Data - S 11 ▼ This is dat
Page 11 and 12: Modeled Data ▼ HFSS Capabilities
Page 13 and 14: Measured Data Surrogate Circuit 10
Page 15 and 16: Measured Data ▼ The 0.5 mm pitch
Page 17 and 18: Comparative Data 0 0.5mm Pitch BGA
Page 19 and 20: Equivalent Circuit Model ▼ Measur
Page 21 and 22: Equivalent Circuit Model 0.5mm Pitc
Page 23 and 24: Equivalent Circuit Model Developmen
Page 25 and 26: Conclusion ▼ For leading edge RF
Page 27 and 28: Slide - 2 Outline • Contactors
Page 29 and 30: Slide - 4 Analysis • Goal Create
Page 31: Slide - 6 Surrogate Package: Enable
Page 35 and 36: Slide - 10 Methodology • Measure
Page 37 and 38: Slide - 12 Optimized Model: Open Im
Page 39 and 40: Slide - 14 Optimized Model: Short I
Page 41 and 42: Slide - 16 Optimized Model: Loop-Th
Page 43 and 44: Slide - 18 De-Embedded Insertion an
Page 45 and 46: Slide - 20 Transient Simulation wit
Page 47 and 48: Force Measurement on Sockets and Co
Page 49 and 50: Force Issues in Test and Burn-In En
Page 51 and 52: DUT Thermal Head FMU consists of 3
Page 53 and 54: Experimentation • FMU was used fo
Page 55 and 56: Experimentation cont. • FMU was u
Page 57 and 58: Insertion Life vs. Force cont. •
Page 59 and 60: Looking Forward • Die size Transd
Page 61 and 62: Package/Die Transducer Example Die

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