Burn-in & Test Socket Workshop - BiTS Workshop

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Modeled Data ▼ 0.5 mm pitch BGA model from an AutoCAD file 5
Modeled Data - S 11 ▼ This is data from the HFSS model of return loss by the actual 0.5 mm BGA structure tested by Giga<strong>Test</strong> Labs 0 -5 -10 -15 Return Loss (dB) -20 -25 -30 -35 -40 -45 HFSS 0.5mm Pitch Adjacent BGA Contact Model Optimum Load Board Layout of HFSS 0.5mm Pitch Adjacent BGA Contact Model -50 1 2 3 4 5 6 7 8 9 10 Frequency (GHz) 6
Page 1 and 2: Burn-in & Test Socket Workshop IEEE
Page 3 and 4: Burn-in & Test Socket Workshop Tech
Page 5 and 6: Discussion Topics ▼ Modeled Data
Page 7: Modeled Data ▼ Modeling was done
Page 11 and 12: Modeled Data ▼ HFSS Capabilities
Page 13 and 14: Measured Data Surrogate Circuit 10
Page 15 and 16: Measured Data ▼ The 0.5 mm pitch
Page 17 and 18: Comparative Data 0 0.5mm Pitch BGA
Page 19 and 20: Equivalent Circuit Model ▼ Measur
Page 21 and 22: Equivalent Circuit Model 0.5mm Pitc
Page 23 and 24: Equivalent Circuit Model Developmen
Page 25 and 26: Conclusion ▼ For leading edge RF
Page 27 and 28: Slide - 2 Outline • Contactors
Page 29 and 30: Slide - 4 Analysis • Goal Create
Page 31 and 32: Slide - 6 Surrogate Package: Enable
Page 33 and 34: Slide - 8 Probing From the Back Sid
Page 35 and 36: Slide - 10 Methodology • Measure
Page 37 and 38: Slide - 12 Optimized Model: Open Im
Page 39 and 40: Slide - 14 Optimized Model: Short I
Page 41 and 42: Slide - 16 Optimized Model: Loop-Th
Page 43 and 44: Slide - 18 De-Embedded Insertion an
Page 45 and 46: Slide - 20 Transient Simulation wit
Page 47 and 48: Force Measurement on Sockets and Co
Page 49 and 50: Force Issues in Test and Burn-In En
Page 51 and 52: DUT Thermal Head FMU consists of 3
Page 53 and 54: Experimentation • FMU was used fo
Page 55 and 56: Experimentation cont. • FMU was u
Page 57 and 58: Insertion Life vs. Force cont. •
Page 59 and 60:
Looking Forward • Die size Transd
Page 61 and 62:
Package/Die Transducer Example Die
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