Burn-in & Test Socket Workshop - BiTS Workshop

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Insertion Life vs. Force Vendor Insertions ave ohms Vendor Insertions ave ohms A Low 22.02 D Low 23.37 18 g/p 25 k 22.04 16 g/p 25 k 22.75 50 k 22.10 50 k 22.70 75 k 22.09 75 k 22.57 B (1) Low 23.11 E Low 22.24 12 g/p 25 k 23.27 25 g/p 25k 22.10 50 k 22.93 50k 22.34 75 k 22.68 75k 22.30 96 k 22.14 C Low 22.82 F Low 22.25 17 g/p 40 k 22.04 16 g/p 25 k 22.47 80 k 22.16 50 k 22.30 75 k 22.38 Jan 10, 2002 Force Measurement on Sockets & Contactors 10
Insertion Life vs. Force cont. • Insertions were done at a greater force then first series of insertions. – ~3 to 4 g/p depending on initial required force • Vendor D had pin failures at this higher force Vendor Insertions ave ohms B (1) Low 23.11 15 g/p 30 k 23.41 50 k 23.21 70 k 23.21 D Low 22.57 19 g/p 25 k 22.73 40 k 22.40 E Low 22.24 28 g/p 25k 26.67 75k 26.35 Jan 10, 2002 Force Measurement on Sockets & Contactors 11
Page 1 and 2:
Burn-in & Test Socket Workshop IEEE
Page 3 and 4:
Burn-in & Test Socket Workshop Tech
Page 5 and 6: Discussion Topics ▼ Modeled Data
Page 7 and 8: Modeled Data ▼ Modeling was done
Page 9 and 10: Modeled Data - S 11 ▼ This is dat
Page 11 and 12: Modeled Data ▼ HFSS Capabilities
Page 13 and 14: Measured Data Surrogate Circuit 10
Page 15 and 16: Measured Data ▼ The 0.5 mm pitch
Page 17 and 18: Comparative Data 0 0.5mm Pitch BGA
Page 19 and 20: Equivalent Circuit Model ▼ Measur
Page 21 and 22: Equivalent Circuit Model 0.5mm Pitc
Page 23 and 24: Equivalent Circuit Model Developmen
Page 25 and 26: Conclusion ▼ For leading edge RF
Page 27 and 28: Slide - 2 Outline • Contactors
Page 29 and 30: Slide - 4 Analysis • Goal Create
Page 31 and 32: Slide - 6 Surrogate Package: Enable
Page 33 and 34: Slide - 8 Probing From the Back Sid
Page 35 and 36: Slide - 10 Methodology • Measure
Page 37 and 38: Slide - 12 Optimized Model: Open Im
Page 39 and 40: Slide - 14 Optimized Model: Short I
Page 41 and 42: Slide - 16 Optimized Model: Loop-Th
Page 43 and 44: Slide - 18 De-Embedded Insertion an
Page 45 and 46: Slide - 20 Transient Simulation wit
Page 47 and 48: Force Measurement on Sockets and Co
Page 49 and 50: Force Issues in Test and Burn-In En
Page 51 and 52: DUT Thermal Head FMU consists of 3
Page 53 and 54: Experimentation • FMU was used fo
Page 55: Experimentation cont. • FMU was u
Page 59 and 60: Looking Forward • Die size Transd
Page 61 and 62: Package/Die Transducer Example Die
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