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FINFET Isolation Approaches and Ramifications - SOI Industry ...

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IBM Semiconductor Research <strong>and</strong> Development Center<br />

Matching<br />

• Matching is affected by<br />

several components:<br />

– Physical variations<br />

such as line-edgeroughness<br />

– Electrical variations<br />

such as metal-gate<br />

work function<br />

variations<br />

– Doping variations<br />

subject to classic<br />

Poisson statistical<br />

variations<br />

• Undoped FinFET <strong>and</strong><br />

FD<strong>SOI</strong> are comparable<br />

calculted σΔVt (mV)<br />

40<br />

30<br />

20<br />

10<br />

IEDM 2011<br />

1.3mV-um<br />

AVT<br />

0<br />

0.00 0.01 0.02 0.03<br />

1/sqrt(LxW) (nm -1 )<br />

VLSI 2011<br />

1.5mV-um<br />

• Adding doping degrades<br />

matching<br />

FD<strong>SOI</strong><br />

FinFET<br />

FD<strong>SOI</strong> Workshop Hsinchu, Taiwan April 22, 2013

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