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Embedded Computing Design - OpenSystems Media

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Because Infiniband can incorporate other fabrics, it can efficiently connect storage and<br />

communications networks and server clusters together, while delivering an I/O infrastructure<br />

that will produce the efficiency, reliability, and scalability that data centers demand.<br />

Unlike Ethernet, Infiniband requires little to no processor load, making it better suited<br />

for data-intensive applications. Also, it enables the processor to share memory, although<br />

systems incorporating this fabric still suffer from slower processing speeds.<br />

The PCI Express approach<br />

PCI Express, originally introduced by Intel in 2001 as 3GIO (3rd Generation I/O), was<br />

designed to provide higher bandwidth and faster speed as well as to address chip-to-chip<br />

connections, out-of-the box connections, and add-on-card connections. It consists of<br />

multiple, point-to-point serial connections called lanes that can be used to create an I/O<br />

interconnect with a linearly-scalable bandwidth.<br />

PCI Express also enables processors to<br />

share some system resources, such as<br />

memory, increasing the functionality of<br />

the overall system.<br />

The StarFabric standard<br />

Also an extremely popular switch fabric,<br />

StarFabric was originally developed by<br />

StarGen. The organization now tasked<br />

with the development and promotion<br />

of this standard is the StarFabric Trade<br />

Association (www.starfabric.org), also<br />

a nonprofit, open membership industry<br />

group.<br />

StarFabric is an open interconnect standard<br />

that provides high levels of scalability,<br />

performance, and availability in a wide<br />

range of systems. It supports multiple<br />

classes of traffic for added flexibility and<br />

enhancements to systems while leveraging<br />

existing standards-based software and<br />

hardware investments.<br />

As with Infiniband and PCI Express,<br />

StarFabric enables the resources of a<br />

system to be shared, including memory,<br />

which enables the load on the processor<br />

to be greatly reduced.<br />

RapidIO…the future fabric<br />

of choice<br />

RapidIO, the last of the open interconnect<br />

standards that we’ll discuss, was designed<br />

to be compatible with the most popular<br />

integrated communications processors,<br />

host processors, and networking digital<br />

signal processors.<br />

According to the RapidIO Trade<br />

Association (www.rapidio.org), it is a<br />

high-performance, packet-switched,<br />

interconnect technology that addresses the<br />

embedded industry’s need for reliability,<br />

increased bandwidth, and faster bus<br />

speeds in an intrasystem interconnect. The<br />

RapidIO interconnect allows chip-to-chip<br />

and board-to-board communications at<br />

performance levels scaling to ten gigabits<br />

per second and beyond.<br />

RapidIO has had some significant advancements<br />

take place over the past few<br />

months. In December 2003, the International<br />

Standards Organization (ISO)<br />

and the International Electrotechnical<br />

Committee (IEC) ratified the RapidIO 1.2<br />

interconnect specification as ISO/IEC DIS<br />

18372. To date, RapidIO is the only one<br />

of the over 60 switch fabrics currently<br />

available to receive this designation.<br />

RSC #26 @ www.embedded-computing.com/rsc<br />

The ratification of a standard by ISO<br />

(www.iso.ch) requires that both vendors<br />

and end users of the technology develop<br />

the standard in an open forum that fosters<br />

26 / Summer 2004 <strong>Embedded</strong> <strong>Computing</strong> <strong>Design</strong>

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