Kelvin Contactors - BiTS Workshop

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Design Evaluation - Resistance Distribution300250Number of sources20015010050Contactresistancemeasurementstaken from 100DevicesMLP6x5 8leadTemperatureambient0120 140 160Contact Resistance mOhm3/28/0219
Design Evaluation - Contact ResistanceContact resistance versus number of insertions (ambient)150140Resistance mOhm13012011010090MLP6x5 8leadPIN 1PIN 2PIN 3PIN 4PIN 5PIN 6PIN 7PIN 8801 51 101 151 201 251 301 351 401 451Number of insertions x10003/28/0220
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3 and 4: Burn-in & Test SocketWorkshopTechni
Page 5 and 6: Leadless Packages3/28/022
Page 7 and 8: Kelvin ContactorsKelvin contactors
Page 11 and 12: Kelvin Contactors for Leadless Devi
Page 13 and 14: Contactor Design - Technology(mm)Pa
Page 15 and 16: Contactor Design - Features3/28/021
Page 17 and 18: Contactor Design - Socket Arrangeme
Page 19 and 20: Contactor Design - Device Positioni
Page 21: Design Evaluation - Contact Springs
Page 25 and 26: Evaluation Results - Temperature Ac
Page 27 and 28: Design Evaluation - SummaryMechanic
Page 29 and 30: ®Problem DefinitionElectronic Capa
Page 31 and 32: ®Core TechnologyAfter Several Year
Page 33 and 34: ®®Our Name6
Page 35 and 36: ®Rise TimeTDT thru1.21.00.80.60.40
Page 38 and 39: ®Resistance vs. Temperature12Therm
Page 40 and 41: ®Formulation DependentMaterial Pro
Page 42 and 43: ®Technical/Market AdvantageLPerfor
Page 44 and 45: ®Development Test Socket17
Page 46 and 47: ®10 GHz Test Socket19
Page 48 and 49: ®Production Socket21
Page 50 and 51: ®The FutureProjected CapabilityLDi
Page 52 and 53: INTERCONNECT DEGRADATIONCauses:Tin
Page 54 and 55: CURRENT METHODS FORTIN/LEAD REMOVAL
Page 56 and 57: TIN LEAD DEPOSITS4 Point Crown Pogo
Page 58 and 59: “REVERSE” PLATING PROCESSThis p
Page 60 and 61: FIGURE 2 (Socket Inverted)10
Page 62 and 63: DEPOSITS ON COLLECTION PLATECollect
Page 64 and 65: ELECTRICAL DATA8BULK RESISTANCE (Oh
Page 66 and 67: PERIODIC CLEANINGCleaning should oc
Page 68: AdvantagePROS / CONSSolder is remov

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