Kelvin Contactors - BiTS Workshop

More documents

Recommendations

Info

IC Package TrendsD o w n S i z i n gdevice size, lead pitch/sizeDIP, TOSOJSOP, SSOPTSSOPLeadlessCurrent <strong>Kelvin</strong> contactortechnologiesNew technologyrequired3/28/025
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3 and 4: Burn-in & Test SocketWorkshopTechni
Page 5 and 6: Leadless Packages3/28/022
Page 7: Kelvin ContactorsKelvin contactors
Page 12 and 13: Contactor Design - Package Dimensio
Page 14 and 15: Contactor Design - FeaturesKelvin c
Page 16 and 17: Contactor Design - FeaturesKelvin c
Page 18 and 19: Contactor Design - Dual Contact Uni
Page 20 and 21: Design Evaluation - Contact Springs
Page 22 and 23: Design Evaluation - Resistance Dist
Page 24 and 25: Evaluation Results - Maximum Curren
Page 26 and 27: Evaluation Results - Temperature Ac
Page 28 and 29: ®Interconnecting at 40 GHzand Beyo
Page 30 and 31: ®Core TechnologyParicon’s Interc
Page 32 and 33: ®PariPoser ® Interconnect5
Page 34 and 35: ®Contact ResistanceContactResistan
Page 36: ®Electrical ParametersShunt Capaci
Page 39 and 40: ®Formulation DependentMaterial Pro
Page 41 and 42: ®Formulation DependentMaterial Pro
Page 43 and 44: ®PariPoser ® Components16
Page 45 and 46: ®10 GHz Test Socket18
Page 47 and 48: ®10 GHz Translation Socket20
Page 49 and 50: ®Summary Benefits of the PariPoser
Page 51 and 52: ELECTRO-CHEMICALCLEANING PROCESSMar
Page 53 and 54: TOPICS TO BE ADDRESSEDRemoval of Ti
Page 55 and 56: TIN LEAD DEPOSITSGold PlatingSolder
Page 57 and 58: ELECTRO-CHEMICAL CLEANINGPROCESSMet
Page 59 and 60:
FIGURE 1Diagram of typical plating
Page 61 and 62:
CollectionPlateELECTROCHEMICAL TRAN
Page 63 and 64:
MID-PROCESS CONTACTCONDITIONSolderR
Page 65 and 66:
BASE METAL DETECTIONA special solut
Page 67 and 68:
LEAD FREE SOLDERLead Free Solder ca
show all

Kelvin Contactors - BiTS Workshop

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?