Kelvin Contactors - BiTS Workshop

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COPYRIGHT NOTICE• The papers in this publication comprise the proceedings of the 2002BiTS Workshop. They reflect the authors’ opinions and are reproduced aspresented , without change. Their inclusion in this publication does notconstitute an endorsement by the BiTS Workshop, the sponsors, or theInstitute of Electrical and Electronic Engineers, Inc.· There is NO copyright protection claimed by this publication. However,each presentation is the work of the authors and their respectivecompanies: as such, proper acknowledgement should be made to theappropriate source. Any questions regarding the use of any materialspresented should be directed to the author/s or their companies.
Burn-in & Test SocketWorkshopTechnical ProgramSession 8Wednesday 3/06/02 10:30AMNew Products“Kelvin Contacting Solutions For Leadless Device Types”Gerhard Gschwendtberger - Multitest Elektronische Systeme GmbH“Interconnecting At 40 GHz and Beyond”Roger Weiss, PhD - Paricon Technologies Corporation“Electro-chemical Cleaning Process”Erik Orwoll - Nu Signal LLC
Page 1: Burn-in & TestSocket WorkshopIEEEMa
Page 5 and 6: Leadless Packages3/28/022
Page 7 and 8: Kelvin ContactorsKelvin contactors
Page 11 and 12: Kelvin Contactors for Leadless Devi
Page 13 and 14: Contactor Design - Technology(mm)Pa
Page 15 and 16: Contactor Design - Features3/28/021
Page 17 and 18: Contactor Design - Socket Arrangeme
Page 19 and 20: Contactor Design - Device Positioni
Page 21 and 22: Design Evaluation - Contact Springs
Page 23 and 24: Design Evaluation - Contact Resista
Page 25 and 26: Evaluation Results - Temperature Ac
Page 27 and 28: Design Evaluation - SummaryMechanic
Page 29 and 30: ®Problem DefinitionElectronic Capa
Page 31 and 32: ®Core TechnologyAfter Several Year
Page 33 and 34: ®®Our Name6
Page 35 and 36: ®Rise TimeTDT thru1.21.00.80.60.40
Page 38 and 39: ®Resistance vs. Temperature12Therm
Page 40 and 41: ®Formulation DependentMaterial Pro
Page 42 and 43: ®Technical/Market AdvantageLPerfor
Page 44 and 45: ®Development Test Socket17
Page 46 and 47: ®10 GHz Test Socket19
Page 48 and 49: ®Production Socket21
Page 50 and 51: ®The FutureProjected CapabilityLDi
Page 52 and 53:
INTERCONNECT DEGRADATIONCauses:Tin
Page 54 and 55:
CURRENT METHODS FORTIN/LEAD REMOVAL
Page 56 and 57:
TIN LEAD DEPOSITS4 Point Crown Pogo
Page 58 and 59:
“REVERSE” PLATING PROCESSThis p
Page 60 and 61:
FIGURE 2 (Socket Inverted)10
Page 62 and 63:
DEPOSITS ON COLLECTION PLATECollect
Page 64 and 65:
ELECTRICAL DATA8BULK RESISTANCE (Oh
Page 66 and 67:
PERIODIC CLEANINGCleaning should oc
Page 68:
AdvantagePROS / CONSSolder is remov
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