Kelvin Contactors - BiTS Workshop

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®Contact ResistanceContactResistance(Milli Ohms)THROUGH RESISTANCE CURVE252015Set 11050-3 -2 -1 0 1 2 3Normal Probability7
®Rise TimeTDT thru1.21.00.80.60.40.20.0250 300 350 400-0.2t [ps]RhoTHRU probesTHRU Mat'l. ATHRU Mat'l. BTHRU Mat'l. CTime domain response for transmitted signal8
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3 and 4: Burn-in & Test SocketWorkshopTechni
Page 5 and 6: Leadless Packages3/28/022
Page 7 and 8: Kelvin ContactorsKelvin contactors
Page 11 and 12: Kelvin Contactors for Leadless Devi
Page 13 and 14: Contactor Design - Technology(mm)Pa
Page 15 and 16: Contactor Design - Features3/28/021
Page 17 and 18: Contactor Design - Socket Arrangeme
Page 19 and 20: Contactor Design - Device Positioni
Page 21 and 22: Design Evaluation - Contact Springs
Page 23 and 24: Design Evaluation - Contact Resista
Page 25 and 26: Evaluation Results - Temperature Ac
Page 27 and 28: Design Evaluation - SummaryMechanic
Page 29 and 30: ®Problem DefinitionElectronic Capa
Page 31 and 32: ®Core TechnologyAfter Several Year
Page 33: ®®Our Name6
Page 38 and 39: ®Resistance vs. Temperature12Therm
Page 40 and 41: ®Formulation DependentMaterial Pro
Page 42 and 43: ®Technical/Market AdvantageLPerfor
Page 44 and 45: ®Development Test Socket17
Page 46 and 47: ®10 GHz Test Socket19
Page 48 and 49: ®Production Socket21
Page 50 and 51: ®The FutureProjected CapabilityLDi
Page 52 and 53: INTERCONNECT DEGRADATIONCauses:Tin
Page 54 and 55: CURRENT METHODS FORTIN/LEAD REMOVAL
Page 56 and 57: TIN LEAD DEPOSITS4 Point Crown Pogo
Page 58 and 59: “REVERSE” PLATING PROCESSThis p
Page 60 and 61: FIGURE 2 (Socket Inverted)10
Page 62 and 63: DEPOSITS ON COLLECTION PLATECollect
Page 64 and 65: ELECTRICAL DATA8BULK RESISTANCE (Oh
Page 66 and 67: PERIODIC CLEANINGCleaning should oc
Page 68: AdvantagePROS / CONSSolder is remov

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